TWI317162B - - Google Patents

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Publication number
TWI317162B
TWI317162B TW095102097A TW95102097A TWI317162B TW I317162 B TWI317162 B TW I317162B TW 095102097 A TW095102097 A TW 095102097A TW 95102097 A TW95102097 A TW 95102097A TW I317162 B TWI317162 B TW I317162B
Authority
TW
Taiwan
Prior art keywords
electrode
led
layer
eutectic
flip
Prior art date
Application number
TW095102097A
Other languages
English (en)
Chinese (zh)
Other versions
TW200729438A (en
Original Assignee
Huga Optotech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huga Optotech Inc filed Critical Huga Optotech Inc
Priority to TW095102097A priority Critical patent/TW200729438A/zh
Publication of TW200729438A publication Critical patent/TW200729438A/zh
Application granted granted Critical
Publication of TWI317162B publication Critical patent/TWI317162B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
TW095102097A 2006-01-19 2006-01-19 Package structure of flip chip light emitting diode and the package method thereof TW200729438A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095102097A TW200729438A (en) 2006-01-19 2006-01-19 Package structure of flip chip light emitting diode and the package method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095102097A TW200729438A (en) 2006-01-19 2006-01-19 Package structure of flip chip light emitting diode and the package method thereof

Publications (2)

Publication Number Publication Date
TW200729438A TW200729438A (en) 2007-08-01
TWI317162B true TWI317162B (https=) 2009-11-11

Family

ID=45073327

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102097A TW200729438A (en) 2006-01-19 2006-01-19 Package structure of flip chip light emitting diode and the package method thereof

Country Status (1)

Country Link
TW (1) TW200729438A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI478319B (zh) * 2010-07-20 2015-03-21 晶元光電股份有限公司 整合式發光裝置及其製造方法
TWI495160B (zh) * 2011-12-15 2015-08-01 錸鑽科技股份有限公司 覆晶式發光二極體及其製法與應用

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI473299B (zh) * 2011-12-15 2015-02-11 Ritedia Corp 覆晶式發光二極體及其製法與應用

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI478319B (zh) * 2010-07-20 2015-03-21 晶元光電股份有限公司 整合式發光裝置及其製造方法
TWI495160B (zh) * 2011-12-15 2015-08-01 錸鑽科技股份有限公司 覆晶式發光二極體及其製法與應用

Also Published As

Publication number Publication date
TW200729438A (en) 2007-08-01

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Legal Events

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MK4A Expiration of patent term of an invention patent