1316833 九、發明說明： 【發明所屬之技術領域】 本發明係關於浸沾塗佈裝置。 【先前技術】 於電路基板之製程中，一般係使用浸沾塗佈裝置。例 如，日本特開平10 — 256703號公報（專利文獻υ所記載 之裝置即如此。於該公報之裝置中，將感光性光阻液填充 至槽中，使電路基板浸沾光阻液，再從液面拉起，而於基 板表面形成塗佈膜。一般而言，光阻液含有揮發性溶劑成 分。此外，於該公報之裝置中，升降構件係配置於槽之上 方，垂降機構設於升降構件，複數個基板間隔配置，且各 基板垂降於垂降機構。垂降機構由夹頭所構成，可夾住各 基板，使其垂降。而升降構件利用促動器下降及上升，使 各基板浸沾光阻液’並從液面拉起。 於此情形時，畲各基板完全被拉起，於基板之下緣附 近，光阻液從各基板脫淨，其被確實脫淨很重要。為了達 成此效果，當光阻液從各基板脫淨時，必須將各基板以相 當低的速度拉起。其理由係因為光阻液之表面張力。當各 基板從液面被拉起時，因表面張力作用於光阻液，其後， 於此狀態下脫淨光阻液，因此，光阻液不易從各基板被脫 淨。此外，如前所述，複數個基板係間隔配置，但因為了 使裝置小型化，故需使基板之間隔儘可能地縮小。因此， 溶劑成分揮發後，所揮發之成分進入各基板間 ，而不易排 1316833 出，於各基板間，溶劑成分不易從光阻液揮發。此亦為光 阻液不易被脫淨之因素之一。因此，當光阻液自各基板脫 淨時，為了確實脫淨，必須以相當低之速度拉起各基板。 結果，使脫淨時間變得極長，效率明顯惡化。實際上，各 基板約以0.2mm/Sec之速度被拉起，而脫淨時間長達6〇〜 8〇sec。在此，所謂脫淨時間係指從脫淨開始至脫淨結束所 需之時間。1316833 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a dip coating apparatus. [Prior Art] In the process of circuit board, a dip coating apparatus is generally used. For example, Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The surface is pulled up to form a coating film on the surface of the substrate. Generally, the photoresist contains a volatile solvent component. Further, in the apparatus of the publication, the lifting member is disposed above the groove, and the descending mechanism is disposed at the lift The member has a plurality of substrates arranged at intervals, and each of the substrates hangs down on the sag mechanism. The sag mechanism is constituted by the chuck, and the substrates can be clamped to descend, and the lifting member is lowered and raised by the actuator. Each substrate is immersed in a photoresist solution and pulled up from the liquid surface. In this case, the substrates are completely pulled up, and the photoresist liquid is removed from the respective substrates near the lower edge of the substrate, and it is important to be surely removed. In order to achieve this effect, when the photoresist is removed from each substrate, each substrate must be pulled up at a relatively low speed because of the surface tension of the photoresist. When the substrates are pulled up from the liquid surface. Due to surface tension It is used in a photoresist, and thereafter, the photoresist is removed in this state, so that the photoresist is not easily removed from each substrate. Further, as described above, a plurality of substrates are arranged at intervals, but Since the device is miniaturized, the interval between the substrates needs to be reduced as much as possible. Therefore, after the solvent component is volatilized, the volatilized component enters between the substrates, and is not easily discharged, and the solvent component is not easily volatilized from the photoresist liquid between the substrates. This is also one of the factors that the photoresist liquid is not easily removed. Therefore, when the photoresist liquid is removed from each substrate, in order to be surely removed, the substrates must be pulled up at a relatively low speed. It becomes extremely long and the efficiency is obviously deteriorated. In fact, each substrate is pulled up at a speed of 0.2 mm/Sec, and the de-cleaning time is as long as 6 〇 8 〇 sec. Here, the so-called de-cleaning time means taking off The time from the start of the net to the end of the decontamination.
此外，當各基板從液面被拉起時，基板上之光阻液因 重力作用，使光阻液沿著各基板垂下，而有下降之傾向。 因此，無法確實形成塗佈膜，其厚度無法保持均勻。 、、 ，浸沾塗佈裝置之情形時，不限於電路基板及光阻 给對於其他之塗佈對象物及塗佈液’亦可使對象物浸沾 二=，、並從液面拉起，而於對象物表面形成塗佈膜，但 ，有脫淨時間及塗佈膜厚度之均勻化之問題。 起，、θ 塗佈對象物次沾塗佈液，並從液面拉 脫淨表面形成塗一塗佈裝置中，將 厚度保持另—目的在於:確實形成塗佈媒，並使 【專利文獻1】曰本特開平10 —2567〇3號公報。 【發明内容】 依據此發明’ t塗佈對象物完全錄起時，藉由氣流 1316833 ^生機構產生氣流，使氣流作用於自對象物脫淨（瀝乾)之 塗饰潘、 蓮藉由氣流而使溶劑成分揮發。 機於較佳實施例中，當對象物從液面拉起時，藉由產生 攻構^生氣流，使氣流作用於對象物上之塗佈液，藉由氣 止吏/奋劑成分揮發。其後，至少於對象物完全被拉起為 夺續產生乱々IL，使氣流作用於被脫淨之塗佈液。Further, when the respective substrates are pulled up from the liquid surface, the photoresist liquid on the substrate causes the photoresist liquid to hang down along the respective substrates due to gravity, and tends to decrease. Therefore, the coating film cannot be surely formed, and the thickness thereof cannot be kept uniform. In the case of the dip coating device, the substrate and the photoresist are not limited to the other application object and the coating liquid, and the object may be dipped, and pulled out from the liquid surface. On the other hand, a coating film is formed on the surface of the object, but there is a problem that the cleaning time and the thickness of the coating film are uniformized. The coating object is immersed in the coating liquid, and the coating surface is pulled from the liquid surface to form a coating application device, and the thickness is kept for the purpose of: forming a coating medium surely, and [Patent Document 1] 】 曰本特开平10-2567〇3 bulletin. SUMMARY OF THE INVENTION According to the invention, when the object to be coated is completely recorded, the airflow is generated by the airflow 1316833, and the airflow acts on the coated pan and lotus which are removed (drained) from the object by the airflow. The solvent component is volatilized. In a preferred embodiment, when the object is pulled up from the liquid surface, the coating liquid which acts on the object by the air current is generated by the attack, and the gas/deodorant component is volatilized by the gas. Thereafter, at least the object is pulled up to cause the smashing IL to cause the airflow to act on the removed coating liquid.
此外，產生機構具有空氣吸入口。空氣係沿著液面流 ，破空氣吸入口所吸入，藉由空氣而產生氣流。 於槽之兩側或周圍中’空氣吸入口最好配置於對應液 面之高度位置練其為下方之位置。 此外’產生機構具有空氣吹出口。空氣吹出口係朝 下配置於槽之上方。因此’空氣從空氣吹出口被吹出， 沿著對象物下降，藉由空氣而產生氣流。 此外，升降構件配置於槽之上方，垂降機構設於升降 構件’對象物垂降於_機構，升降構件藉由促動器下降 及上升，使對象物浸沾塗佈液，並從液面拉起。此外，於 升降構件形成空氣吹出口，當對象物從液面拉起時，於對 象物之上端附近’空氣從空氣吹出口吹出。 產生機構亦可使用噴出惰性氣體之機構，藉由惰性氣 體產生氣流。 ' 【實施方式】 以下，說明本發明之實施例。 圖1係為本發明之浸沾塗佈裝置之側視圖。於此裝置 1316833 中，塗佈液係填充於槽1，塗佈對象物2、其 從液面拉起，而於對象物2/又，塗佈液，並 少 表面形成塗佈犋。對象你9 係由電路基板所構成。塗錢為感級光崎 性溶劑成分。此外’於此裝置中，升降構件3配^^ 之上方。升降構件3係由機械臂所構成，安裝:槽^ 沿著柱4升降。此外，垂_構5設於機械臂3 可 所示，複數個基板2 _配置，各基板2 =Further, the generating mechanism has an air suction port. The air is drawn along the liquid surface and sucked into the air intake port to generate air flow by the air. Preferably, the air suction port on either side or around the groove is disposed at a position corresponding to the height of the corresponding liquid surface. Further, the generating mechanism has an air blowing port. The air outlet is disposed above the groove downward. Therefore, the air is blown out from the air blowing port, descends along the object, and generates air by the air. Further, the elevating member is disposed above the groove, and the descending mechanism is provided on the elevating member 'the object hangs down on the _ mechanism, and the elevating member is lowered and raised by the actuator to immerse the object with the coating liquid and from the liquid surface Pull up. Further, the air ejecting port is formed in the elevating member, and when the object is pulled up from the liquid surface, air is blown from the air blowing port near the upper end of the object. The generating mechanism can also generate a gas flow by an inert gas using a mechanism that ejects an inert gas. [Embodiment] Hereinafter, an embodiment of the present invention will be described. Figure 1 is a side view of the dip coating apparatus of the present invention. In the apparatus 1316833, the coating liquid is filled in the tank 1, and the object 2 to be coated is pulled up from the liquid surface to form a coating liquid on the object 2/and the coating liquid, and a coating crucible is formed on the surface. The object you 9 is made up of circuit boards. The money is the solvent component of the sensory level. Further, in this device, the elevating member 3 is disposed above. The lifting member 3 is composed of a robot arm, and the mounting: the groove ^ is raised and lowered along the column 4. In addition, the vertical structure 5 is provided on the robot arm 3, and a plurality of substrates 2 _ are arranged, and each substrate 2 =
5。垂降機構5由夾頭所構成’可失住各基板2，使其:機構 此外，促動H係使用滾珠螺桿及驅動馬達，滚珠 於柱4，螺合於機械臂3 ’驅動馬達則連結於滚珠^臧 因此，藉由驅動馬達使滾珠螺桿旋轉，可使機械臂3下 及上升，可使各基板2浸沾光阻液，並從液面拉起。 此外，當各基板2完全拉起時，於基板2之下緣附近， 光阻液從各基板2被脫淨，但於此裝置中，當各美板2、皮 完全拉起時，於槽1之液面附近中，藉由氣流產生機構^ 生氣流。因此，氣流作用於從各基板2脫淨之塗佈液，藉 由氣流而使溶劑成分揮發。 9 此外，於此裝置中，當各基板2從液面被拉起時，於 基板2之表面附近中，藉由產生機構產生氣流。因此，氣 流作用於基板2上之光阻液’藉由氣流使溶劑成分揮發。 其後，至少至各基板2完全被拉起為止，持續產生氣流， 使氣流作用於被脫淨之光阻液。 例如，於此實施例中’產生機構具有空氣吸入口 6。 而於槽1之兩側中，空氣吸入口 6配置於對應液面之高产 1316833 位置，空氣吸入口 6為朝橫向，且互為相對。其相對之方 向為與基板2之排列方向成直角之方向，空氣吸入口 6朝 各基板2間開口。此外，鼓風機7連接至導管或軟管8， 再連接至空氣吸入口 6，空氣沿著液面及各基板2流動， 而被空氣吸入口 6所吸入，送至鼓風機7，藉由空氣而產 生氣流。5. The hoisting mechanism 5 is constituted by a chuck, and the substrate 2 can be lost, and the mechanism is: the H-system uses a ball screw and a drive motor, and the ball is screwed to the column 4, and is screwed to the arm 3' drive motor to connect Therefore, by rotating the ball screw by the drive motor, the arm 3 can be raised and raised, and the substrate 2 can be immersed in the photoresist and pulled up from the liquid surface. Further, when the respective substrates 2 are completely pulled up, the photoresist liquid is removed from the respective substrates 2 in the vicinity of the lower edge of the substrate 2, but in this device, when the respective plates 2 and the skin are completely pulled up, the grooves are formed. In the vicinity of the liquid level of 1 , the air flow is generated by the air flow generating mechanism. Therefore, the gas flow acts on the coating liquid which is removed from each of the substrates 2, and the solvent component is volatilized by the gas flow. Further, in this apparatus, when each of the substrates 2 is pulled up from the liquid surface, an air current is generated by the generating mechanism in the vicinity of the surface of the substrate 2. Therefore, the photoresist (the photoresist) acting on the substrate 2 volatilizes the solvent component by the gas flow. Thereafter, at least until the respective substrates 2 are completely pulled up, airflow is continuously generated, and the airflow acts on the removed photoresist liquid. For example, in this embodiment, the generating mechanism has an air suction port 6. On both sides of the tank 1, the air suction port 6 is disposed at a high-production 1316833 position corresponding to the liquid surface, and the air suction port 6 is oriented in the lateral direction and opposed to each other. The opposing direction is a direction at right angles to the direction in which the substrates 2 are arranged, and the air suction port 6 is opened between the substrates 2. Further, the blower 7 is connected to the duct or the hose 8, and is connected to the air suction port 6, and the air flows along the liquid surface and the respective substrates 2, is sucked by the air suction port 6, is sent to the blower 7, and is generated by the air. airflow.
此外，產生機構具有空氣吹出口 9。空氣吹出口 9係 朝下，形成於機械臂3，並配置於槽1之上方。機械臂3 具有中空室10，空氣吹出口 9連通至中空室10。此外， 鼓風機11連接至濾網12，再連接至導管或管13，而連接 至中空室10，藉由鼓風機11吹出空氣，該空氣通過濾網 12供應至中空室10，並由空氣吹出口 9吹出。此外，空 氣沿著各基板2下降，並沿著液面流動，而被空氣吸入口 6所吸入。濾網12係由HEPA濾網或ULPA濾網所構成。 導管或管13可於上下方向伸縮。因此，當機械臂3下降 及上升時，藉此可使導管或管13伸縮而不會產生問題。 因此，此裝置中，於各基板2從液面被拉起時，因表 面張力作用於光阻液，其後，於此狀態下脫淨光阻液，但 當各基板2被完全拉起時，於槽1之液面附近，藉由空氣 吸入口 6及空氣吹出口 9而產生氣流。因此，氣流作用於 被脫淨之光阻液，並藉由氣流而使溶劑成分揮發。此外， 於各基板2間產生氣流，於各基板2間，亦藉由氣流使溶 劑成分揮發。對於揮發之溶劑成分，藉由氣流而將其排 出。結果，於光阻液從各基板2被脫淨時，可迅速地使溶 1316833 劑成分揮發，而光阻液容易從各基板2被脫淨。Further, the generating mechanism has an air blowing port 9. The air blowing port 9 is formed downward on the robot arm 3 and disposed above the groove 1. The robot arm 3 has a hollow chamber 10, and the air blowing port 9 communicates with the hollow chamber 10. Further, the blower 11 is connected to the screen 12, is connected to the duct or tube 13, and is connected to the hollow chamber 10, and the air is blown by the blower 11, which is supplied to the hollow chamber 10 through the screen 12, and is blown by the air outlet 9. Blow it out. Further, the air descends along the respective substrates 2, flows along the liquid surface, and is sucked by the air suction port 6. The screen 12 is constructed of a HEPA filter or a ULPA filter. The catheter or tube 13 can be expanded and contracted in the up and down direction. Therefore, when the robot arm 3 is lowered and raised, the duct or the tube 13 can be expanded and contracted without causing a problem. Therefore, in this apparatus, when each of the substrates 2 is pulled up from the liquid surface, the surface tension acts on the photoresist liquid, and thereafter, the photoresist liquid is removed in this state, but when the respective substrates 2 are completely pulled up, In the vicinity of the liquid surface of the tank 1, an air flow is generated by the air suction port 6 and the air blowing port 9. Therefore, the gas flow acts on the photoresist which is removed, and the solvent component is volatilized by the gas flow. Further, a gas flow is generated between the respective substrates 2, and the solvent components are volatilized by the gas flow between the substrates 2. The volatile solvent component is discharged by a gas flow. As a result, when the photoresist liquid is removed from each of the substrates 2, the solvent component 13501833 can be quickly volatilized, and the photoresist liquid can be easily removed from each of the substrates 2.
於此裝置之情形時’光阻液容易從各基板2被脫淨， 於被脫淨時，即使以較高之速度拉起各基板2，光阻液亦 可確實被脫淨。因此’可大幅縮短脫淨時間。如前所述’ 以往各基板2約以〇.2mm/sec之速度被拉起，其脫淨時間 達60〜80sec。另一方面，於此裝置中，於發明者之實驗 中，確認各基板2即使以約2mm/sec之速度拉起，光阻液 亦可確實被脫淨。因此’光阻液從各基板2被脫淨時，各 基板2可以約2mm/sec之速度拉起。此時，脫淨時間可縮 短至4〜lOsec之時間。 此外，於此裝置中，於各基板2從液面被拉起時，重 力作用於基板2上之光阻液，而在此同時，於基板2之表 面附近，藉由空氣吸入口 6及空氣吹出口 9而產生氣流。 因此，氣流剌於基板2上之紐液，藉由氣流使溶劑成 分揮發。當溶劑成分-旦揮發，藉此光阻液被黏液化，其 後’即使重力作用於基板2上之光阻液，光阻液亦不會沿 著各基板2向下垂降。因此，可確實形成塗佈膜 均勾膜厚。树明权實射，亦確騎各面 被拉起時，若使氣流仙於基板2上之光 ^ 形成塗佈膜，並保持均勻膜厚。 幻』磾只 此外，當纽液沿著各基板2垂_，受㈣ 為基板2上端附近之塗佈膜，其厚度可曰取大者 於此裝置之情形時，空氣吹出口 9 =大幅減少，而 首先’藉由驅動馬達及滾珠螺桿使機械臂 1316833 9下降，而使各基板2浸沾塗佈液。其後，藉由驅動馬達 及滾珠螺桿使機械臂3及空氣吹出口 9上升，使各基板2 從液面被拉起。因此，於基板2之上端附近，空氣由空氣 吹出口 9被吹出，而吹附於塗佈液。因此，特別是於基板 2之上端附近，溶劑成分有效地揮發。因此，可確實形成 塗佈膜，其厚度不會大幅減少。In the case of this device, the photoresist liquid is easily removed from the respective substrates 2, and even when the substrates 2 are pulled up at a high speed when being removed, the photoresist liquid can be surely removed. Therefore, the de-cleaning time can be greatly shortened. As described above, in the past, each of the substrates 2 was pulled up at a speed of about 2 mm/sec, and the removal time was 60 to 80 sec. On the other hand, in this apparatus, in the experiment of the inventors, it was confirmed that even if the substrate 2 was pulled up at a speed of about 2 mm/sec, the photoresist liquid was surely removed. Therefore, when the photoresist liquid is removed from each of the substrates 2, each of the substrates 2 can be pulled up at a speed of about 2 mm/sec. At this time, the de-cleaning time can be shortened to a time of 4 to 10 sec. Further, in this apparatus, when each of the substrates 2 is pulled up from the liquid surface, gravity acts on the photoresist liquid on the substrate 2, and at the same time, near the surface of the substrate 2, the air intake port 6 and the air The air outlet is generated by blowing the air outlet 9. Therefore, the gas stream is smashed on the substrate 2, and the solvent component is volatilized by the gas stream. When the solvent component evaporates, whereby the photoresist is liquefied, and thereafter, even if gravity acts on the photoresist on the substrate 2, the photoresist does not fall down the respective substrates 2. Therefore, it is possible to surely form a coating film having a thick film thickness. Shumingquan actually shoots, and when riding on all sides, if the air is drawn on the substrate 2, a coating film is formed, and a uniform film thickness is maintained. In addition, when the liquid is hanged along the respective substrates 2, and (4) is the coating film near the upper end of the substrate 2, the thickness of the film can be taken as large as in the case of the device, and the air blowing port 9 is greatly reduced. First, the mechanical arm 1316833 9 is lowered by the drive motor and the ball screw, and the substrate 2 is immersed in the coating liquid. Thereafter, the robot arm 3 and the air blowing port 9 are raised by the drive motor and the ball screw, and the respective substrates 2 are pulled up from the liquid surface. Therefore, near the upper end of the substrate 2, air is blown out by the air blowing port 9, and is blown to the coating liquid. Therefore, particularly in the vicinity of the upper end of the substrate 2, the solvent component is effectively volatilized. Therefore, the coating film can be surely formed, and the thickness thereof is not greatly reduced.
圖3係為其他實施例。於此實施例中，於槽1之兩側 中，空氣吸入口 6配置於較液面為下。此外，空氣吸入口 6為朝上開口。其他之構成與圖1之實施例相同。因此， 空氣沿液面流動，而被空氣吸入口 6所吸入，再送至鼓風 機，藉由空氣而產生氣流。此外，藉由氣流使溶劑成分揮 發，所揮發之成分被吹出，而其比重較空氣為重。因此， 於圖3之裝置之情形時，因於槽1之兩侧中，藉由比重使 揮發成分下降，而可有效地吸入，故較佳。 如圖4所示，將風扇14及濾網15收納於箱16，並將 空氣吹出口 17形成於箱16，再將其配置於機械臂3之上 方。亦可考慮藉由風扇14吹出空氣，使其通過濾網15， 而由空氣吹出口 17吹出。 此外，於各實施例中，於槽1之兩側，將空氣吸入口 6配置於對應液面之高度位置或較其為下之位置，但亦可 於槽1之周圍，將吸入口配置於對應液面之高度位置或較 其為下之位置。 產生機構亦可使用喷出惰性氣體之機構，藉由惰性氣 體產生氣流。 11 1316833 於此裝置中，不限於基板2及光阻液，對於除此外之 塗佈對象物及塗佈液，亦可使對象物浸沾塗佈液，再從液 面拉起，而於對象物表面形成塗佈膜。 【圖式簡單說明】 圖1係本發明之實施例之側視圖。 圖2係顯不圖1之基板與風扇之關係之前視圖。 圖3係其他實施例之側視圖。Figure 3 is a further embodiment. In this embodiment, on both sides of the tank 1, the air suction port 6 is disposed below the liquid level. Further, the air suction port 6 is open upward. The other constitution is the same as that of the embodiment of Fig. 1. Therefore, the air flows along the liquid surface, is sucked by the air suction port 6, and is sent to the air blower to generate air flow by the air. Further, the solvent component is volatilized by the gas flow, and the volatilized component is blown out, and its specific gravity is heavier than air. Therefore, in the case of the apparatus of Fig. 3, it is preferable that the volatile components in the both sides of the tank 1 are lowered by the specific gravity, so that they can be effectively sucked. As shown in Fig. 4, the fan 14 and the screen 15 are housed in the tank 16, and the air outlet 17 is formed in the tank 16, and is placed above the robot arm 3. It is also conceivable that the air is blown by the fan 14 to pass through the screen 15 and blown out by the air outlet port 17. Further, in each of the embodiments, the air intake port 6 is disposed at a height position of the corresponding liquid surface or a lower position on both sides of the groove 1, but the suction port may be disposed around the groove 1 Corresponds to the height position of the liquid surface or the position below it. The generating mechanism can also generate a gas flow by an inert gas using a mechanism that ejects an inert gas. 11 1316833 In the device, the substrate 2 and the photoresist are not limited to the coating object and the coating liquid, and the object may be immersed in the coating liquid and pulled up from the liquid surface. A coating film is formed on the surface of the object. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view of an embodiment of the present invention. Figure 2 is a front elevational view showing the relationship between the substrate and the fan of Figure 1. Figure 3 is a side elevational view of another embodiment.
圖4係其他實施例之側視圖。 元件符號說明： 1 槽 2 對象物（基板） 3 升降構件(機械臂) 4 柱 5 垂降機構 6 空氣吸入口 7 鼓風機 8 導管或軟管 9 空氣吹出口 10 中空室 11 鼓風機 12 濾網 13 導管或管 12 1316833 14 風扇 15 丨慮網 16 箱 17 空氣吹出口Figure 4 is a side elevational view of another embodiment. Description of component symbols: 1 Slot 2 Object (substrate) 3 Lifting member (mechanical arm) 4 Column 5 Dropping mechanism 6 Air suction port 7 Blower 8 Catheter or hose 9 Air outlet 10 Hollow chamber 11 Blower 12 Filter 13 Catheter Or tube 12 1316833 14 fan 15 care network 16 box 17 air blow outlet