TWI316832B - An apparatus of connecting tape flexible copper clad laminates and a method thereof - Google Patents

An apparatus of connecting tape flexible copper clad laminates and a method thereof Download PDF

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TWI316832B
TWI316832B TW95123640A TW95123640A TWI316832B TW I316832 B TWI316832 B TW I316832B TW 95123640 A TW95123640 A TW 95123640A TW 95123640 A TW95123640 A TW 95123640A TW I316832 B TWI316832 B TW I316832B
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film
tape
type
layer
thermosetting
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TW95123640A
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Chinese (zh)
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TW200803656A (en
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Chia Huang Chang
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Thinflex Corp
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Description

1316832 九、發明說明: 【發明所屬之技術領域】 本發明是有關於-種軟性電路板,且特別是有關於一 種捲帶式膜料之接合設備。 、. 【先前技術】 . 軟性印刷電路板因具有良好的可撓性,已經被廣泛地 應用於如筆記型電腦、行動電話、個人數位助理及數位相 Φ 冑等'肖費性電子產品。隨著消費性電子產品逐漸走向輕薄 短小的趨勢,軟性印刷電路板也朝向使用更輕薄的聚醯亞 胺銅箔層積板發展。 習知的軟性印刷電路板之製造方法,主要是在聚醯亞 f層之表面上貼合銅箔,#以熱滾壓纟來形成聚醯亞胺銅 名積層板。由於聚醯亞胺銅箔積層板之製造過程中,必需 要經過高溫烤箱,其溫度約高於35〇〇c以上,來進行熱滾 堅& «膜料,例如聚醯亞胺層或銅箔層,快消耗完時, • 必須先降低烤箱溫度以更換新的膜料。待新膜料換料完成 後,再重新升溫以便進行接續之膜料熱滾壓合之製程。因 此二只要當任一捲膜料使用完時,#必須重複烤箱降溫與 升之作業。然而,此升/降溫過程不僅十分費時,而且操 ^不易。再者,在換料完成後’由於烤箱内之溫度必須升 溫至熱滾壓合的溫度時才能進行後續製程,因此在這段期 間中位於咼溫烤箱内之膜料,因其熱穩定性不佳而無法使 用’進而浪費許多膜料。 有鑑於此,通常會利用蓄料裝置内之滾輪組的位置調 5 1316832 整,一方面維持膜料朝向高溫烤箱之輸送速度,另一方面 將待耗盡之膜料末端放置於一承載台上,以利於進行兩膜 料之接合作業。請參照第丨圖,係繪示一種習知捲帶式膜 料於接合時之剖面結構示意圖。先將兩膜料1〇〇、1〇2輸送 至承載台上,然後以一裁斷裝置101裁切先輸出的膜料1〇〇 之末端100a,也就是將快耗盡之膜料1〇〇裁切掉。接著, 分別於待接合之兩膜料1〇〇、1〇2的兩端上放置熱塑性聚醯 亞胺104a、l〇4b,並且在熱塑性聚醯亞胺1〇4a、1〇4b上再 放置一銅片106。然後,熱壓合銅片1〇6、熱塑性聚醯亞胺 l〇4a、1〇4b與兩膜料1〇〇、1〇2,以完成兩膜料1〇〇、1〇2 之接〇。如此一來,於免停機的情況下,則能將兩膜料接 合在一起° 然而,上述之方法有一難處在於,由於此方法是先裁 切掉快耗盡之膜料1 00及新補進之膜料丨〇2重疊之部分, 使兩膜料100及102間保持一適當之間距;接著在兩膜料 1〇〇、102之兩端的銜接處上貼合兩片熱塑性聚醯亞胺 1〇4a、104之後,再利用銅片106來接合兩膜料100、1〇2。 所以以銅片106接合膜料100、1〇2的作業具有兩個接點, 分別接合膜料100及102。若膜料1〇〇及1〇2未能保持一適 當之間距甚至疊置’則會產生鋼106接合於同-膜料之 上而導致失敗。另外,銅片106與膜料100及102間的相 對位置必須對準,膜料1〇〇及1〇2間的位置也必須對準, 因此,基於三種材料間均有位置需對準的要求,在銅片與 膜料間或是膜料與膜料間易生對不準的問題。一旦任兩者 間為精確地對準,則將導致後續壓膜製程的失敗,進而影 1316832 3產时良率。再者’由於上述方法是使用銅片以及兩片熱 塑性聚纏亞胺,因此不僅會大幅提高材料成本,而且其所 耗費的操作時間也相當長,操作便利性也不高。 因此需要一種改良的捲帶式膜料之接合方法與設備, 以解決上述之問題。1316832 IX. Description of the Invention: [Technical Field] The present invention relates to a flexible circuit board, and more particularly to a bonding apparatus for a tape-type film material. [Previous Technology] Flexible printed circuit boards have been widely used in notebook computers, mobile phones, personal digital assistants, and digital phase Φ 因 because of their good flexibility. As consumer electronics are moving toward thinner and lighter, flexible printed circuit boards are also moving toward the use of thinner and lighter polyimide laminates. The conventional method for manufacturing a flexible printed circuit board mainly comprises laminating a copper foil on the surface of the polyfluorene layer, and forming a polytheneimide copper-clad laminate by hot rolling. Due to the manufacturing process of the polyimide foil copper laminate, it must pass through a high temperature oven and its temperature is higher than 35 〇〇c to carry out hot rolling & «film material, such as polyimine layer or copper. The foil layer, when it is almost exhausted, • The oven temperature must be lowered to replace the new film. After the refueling of the new film material is completed, the temperature is re-heated to carry out the process of the continuous film rolling process. Therefore, as long as any roll film is used up, #The oven must be repeated for cooling and lifting. However, this rise/lower temperature process is not only time consuming, but also difficult to operate. Furthermore, after the refueling is completed, the subsequent process can be carried out because the temperature in the oven must be raised to the temperature of the hot rolling press, so the film material located in the oven during this period is not thermally stable due to its thermal stability. It is too good to use 'and thus waste a lot of film. In view of this, the position of the roller set in the accumulator is usually adjusted to 5 1316832, on the one hand, the conveying speed of the film to the high temperature oven is maintained, and on the other hand, the end of the film to be depleted is placed on a carrying platform. In order to facilitate the bonding work of the two film materials. Referring to the drawings, a schematic cross-sectional view of a conventional tape-and-reel film is shown. First, the two membrane materials 1〇〇, 1〇2 are transported to the loading platform, and then the cutting end 101 of the first output film 1 is cut by a cutting device 101, that is, the film material which is quickly depleted is 1〇〇. Cut off. Next, thermoplastic polyimides 104a, 104b are placed on both ends of the two films 1 〇〇, 1 〇 2 to be joined, and then placed on the thermoplastic polyimide 〇 4a, 1 〇 4b. A copper sheet 106. Then, the copper sheet 1〇6, the thermoplastic polyimide 〇4a, 1〇4b and the two film materials 1〇〇, 1〇2 are thermocompressed to complete the connection of the two film materials 1〇〇 and 1〇2. . In this way, in the case of no-stop, the two membrane materials can be joined together. However, one of the difficulties of the above method is that, since the method is to cut off the rapidly depleted film material 1 00 and the new supplement The overlap of the film material 丨〇2 maintains a proper distance between the two film materials 100 and 102; then, two thermoplastic polyimides are bonded to the joints of the two film materials 1 and 102 at both ends. After the crucibles 4a and 104, the copper sheets 106 are used to join the two films 100 and 1〇2. Therefore, the work of bonding the film 100, 1 〇 2 with the copper sheet 106 has two joints, and the film materials 100 and 102 are bonded, respectively. If the film materials 1〇〇 and 1〇2 fail to maintain an appropriate distance or even overlap, then the steel 106 is bonded to the same film to cause failure. In addition, the relative positions between the copper sheets 106 and the film materials 100 and 102 must be aligned, and the positions between the film materials 1 and 2 must also be aligned. Therefore, based on the requirements of the positional alignment between the three materials, , the problem between the copper sheet and the film material or between the film material and the film material. Once there is a precise alignment between the two, it will lead to the failure of the subsequent lamination process, which in turn will affect the yield of 1316832. Furthermore, since the above method uses a copper sheet and two sheets of thermoplastic polyamidimide, not only the material cost is greatly increased, but also the operation time required is long and the operation convenience is not high. There is therefore a need for an improved method and apparatus for joining tape and reel film materials to solve the above problems.

【發明内容】 因此本發明的目的就是在提供一種捲帶式膜料之接合SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a tape-like film joint.

設備’適用於一種新的捲帶式膜料之接合製程。本發明不 僅可以於免停機的狀態下,接合兩膜料,更能降低材料成 本。再者’本發明能提高接合膜料之對準率,進而提升產 品良率。 新的捲帶式膜料之接合製程係採用單點接合的方式來 銜接新舊膜料,在舊膜料末端上貼合—熱塑性聚酿亞胺 膜’再與新膜料做熱壓合。若膜料的上層或下層為熱塑性 聚醯亞胺膜’則運用新膜料上方或下方既有之熱塑性聚酿 亞胺膜直接與舊膜料壓合。新的捲帶式膜料之接合製程僅 需對準新舊膜料且無須制㈣,使製㈣化、成本降低 且良率提高。 低佩 +赞明之上述 J入肤竹您接合製程,提出一種 捲帶式關之接合設備。上述之接合設傷包含承載台、敎 =置以及裁斷裝置。其中,承載台係用以承載第二膜料: 熱壓裝置設置於承巷A的)_古 m , 糸戟口的上方,用以熱壓合第一膜料與第 二膜料。裁斷裝置可為單獨的裝置或是亦可設置於承載台 之上,且裁斷裝置純置於熱壓裝置與第—膜料供料輪之 7 1316832 間,以於進行熱壓合製程之後裁切第一膜料,進而完成第 —膜料與第二膜料之接合。 在本發明一較佳實施例,第-膜料或第二膜料可以由 金屬箱、熱固性聚醯亞胺層以及熱塑性聚醯亞胺層所組成 聚酿亞胺金屬箱積層板,並且利用此熱塑性聚醢亞胺膜來 接合兩膜料。或者,第—膜m膜料也可以由金屬箱 與熱塑性聚醯亞胺層所組成。 根據本發明之另一目的,提出一種捲帶式膜料之接合 方法。首先,於接合設備中之承载台上放置待接合之第二 膜料。接著’移動承載台使第—膜料位於第二膜料的上方, 再以熱壓裝置熱壓合第一膜料與第二膜料。之後,移動裁 斷裝置至熱壓裝置與第一膜料供料輪之間,以將第一膜料 安置於裁斷裝置之上以裁切第一膜料,進而完成第一膜料 與第二膜料之接合。 接合設備中之裁斷裝置亦可設置於承載台之上’當移 ㈣載台使第-膜料位於第二膜料的上方時,第一膜:亦 同時安置於裁斷裝置之上且裁斷裝置係設置於熱壓襄置舆 第膜料供料輪之間。在熱壓裝置熱壓合第一膜料與第二 膜料之後’於裁斷裝置裁切第一膜料’進而完成第一膜料 與第二膜料之接合。 其中,第一膜料或第二膜料可以由金屬箔、熱固性聚 胺層以及熱塑性聚酿亞胺層所組成聚酿亞胺金屬箱積 層板’並且利用此熱塑性聚醯亞胺膜來接合兩臈料。或者, 第1料或第二媒料可以由金屬箱與熱塑性聚醯亞胺層所 組成。 8 1316832 熱2=::另實施例中,更可以依需求在進行 一 削,於第一膜料或第第二膜料之末端上貼合 一…塑性聚酿亞胺膜。在此較佳實施例中,第-膜料與第 -膜料可以為金屬ρ或者,卜膜料與第二膜料也可以 由熱固性聚醯亞胺層與金屬箱所組成。The equipment 'is suitable for a new joining process for tape and reel type film. The invention can not only join the two film materials in the state of no downtime, but also reduce the material cost. Furthermore, the present invention can improve the alignment ratio of the bonding film material, thereby improving the yield of the product. The new tape-and-roll film joining process uses a single-point bonding method to join the new film and the old film material, and the thermoplastic polyimide film is bonded to the new film material. If the upper or lower layer of the film is a thermoplastic polyimide film, the thermoplastic polyimide film above or below the new film is directly pressed against the old film. The new roll-to-roll film joining process only needs to be aligned with new and old film materials and does not need to be manufactured (4) to make the system (4), reduce the cost and improve the yield. Low Pei + praise the above J into the bamboo you join the process, propose a tape-type joint device. The above joint damage includes a carrying table, a 敎= setting, and a cutting device. Wherein, the carrying platform is used to carry the second film material: the hot pressing device is disposed on the upper part of the roadway A, the upper part of the mouth, for thermally pressing the first film material and the second film material. The cutting device can be a separate device or can be placed on the carrying platform, and the cutting device is placed between the hot pressing device and the first film feeding wheel 7 1316832 for cutting after the hot pressing process. The first film material further completes the bonding of the first film material and the second film material. In a preferred embodiment of the present invention, the first film or the second film may be composed of a metal case, a thermosetting polyimide layer, and a thermoplastic polyimide layer, and the material is utilized. A thermoplastic polyimide film is used to join the two films. Alternatively, the first film m film may also be composed of a metal box and a thermoplastic polyimide layer. According to another object of the present invention, a joining method of a tape-type film material is proposed. First, a second film to be joined is placed on a stage in the joining apparatus. Next, the moving stage causes the first film to be positioned above the second film, and the first film and the second film are thermally pressed together by a hot pressing device. Thereafter, moving the cutting device between the hot pressing device and the first film feeding wheel to place the first film on the cutting device to cut the first film, thereby completing the first film and the second film Bonding of materials. The cutting device in the joining device may also be disposed on the carrying platform. When the (four) carrier moves the first film over the second film, the first film is also placed on the cutting device and the cutting device is It is disposed between the hot pressing device and the first film feeding wheel. After the hot pressing device thermally presses the first film and the second film, the first film is cut by the cutting device to complete the bonding of the first film and the second film. Wherein, the first film or the second film may be composed of a metal foil, a thermosetting polyamine layer and a thermoplastic polyimide layer; and the thermoplastic polyimide film is used to join the two films. Unexpected. Alternatively, the first material or the second medium may be composed of a metal box and a thermoplastic polyimide layer. 8 1316832 Heat 2=:: In another embodiment, a cutting can be carried out as needed, and a plastic polyimine film is attached to the end of the first film or the second film. In the preferred embodiment, the first film and the first film may be metal ρ or the film and the second film may be composed of a thermosetting polyimide layer and a metal case.

由上述本發明較佳實施例可知,應用本發明不 ,無需要再増設接合的銅片,而免除大量銅片㈣耗,更 能減少材料成本。再者’由於本發明是利用單點接合的方 式,先以熱壓裝置來熱壓合兩膜料,接著再裁切先輸出的 膜料,也就是將快耗盡之膜料之末端裁切掉。如此一來, 則能提高接合膜料之對準率,進而提升積層板的產品良 率,並且降低不必要的膜料之浪費。除此之外,應用本發 明之方法可以節省接合時間。 【實施方式】 本發明係提供-種捲帶式膜料之接合裝置及其方法, 其係應用於製造-軟性電路板,以於膜料使用將盡時可 以在免停機的狀態下,直接利用熱壓合製程來接合兩膜 料,並且裁切先輸出的膜料,以完成兩膜料之接合。 新的捲帶式膜料之接合製程係採用單點接合的方式來 銜接新舊膜料,在舊膜料末端上貼合—熱塑性聚酿亞胺 膜,再與新膜料做熱壓合。若膜料的上層或下層為熱塑性 聚酿亞胺膜,則運用新膜料上方或下方既有之熱塑性聚酿 亞胺膜直接與舊膜料壓合。新的捲帶式膜料之接合製程僅 需對準新舊膜料且無須使用銅n,使製程簡化、成本降低 9 1316832 且良率提高。It can be seen from the above preferred embodiment of the present invention that the application of the present invention does not require the copper piece to be joined, thereby eliminating the need for a large amount of copper (4) and reducing the material cost. Furthermore, since the present invention utilizes a single-point bonding method, the two film materials are first heat-pressed by a hot pressing device, and then the film material that is output first is cut, that is, the end of the film material that is quickly depleted is cut. Drop it. As a result, the alignment ratio of the bonding film can be improved, thereby improving the product yield of the laminated board and reducing the waste of unnecessary film material. In addition to this, the bonding time can be saved by applying the method of the present invention. [Embodiment] The present invention provides a bonding device for a tape-type film material and a method thereof, which are applied to a manufacturing-flexible circuit board, so that the film material can be directly utilized in a state of no downtime when the film material is used up. The hot press process is used to join the two film materials, and the film material that is output first is cut to complete the joining of the two film materials. The new tape-and-roll film joining process uses a single-point bonding method to join the old and new film materials, and the thermoplastic film of the old film material is bonded to the end of the old film material, and then heat-pressed with the new film material. If the upper or lower layer of the film is a thermoplastic polyimide film, the existing thermoplastic film can be directly pressed against the old film using the existing thermoplastic film. The new tape-and-roll film joining process requires only alignment of new and old film materials and eliminates the need for copper n, which simplifies the process and reduces the cost of 9 1316832 and improves yield.

請參照第2圖及第3圖,其繪示依照本發明一較佳實 施例的一種捲帶式膜料之接合裝置的結構示意圖。在第2 圖中,接合設備200包含承載台202、熱壓裝置2〇4以及裁 斷裝置206。其中,承載台202係用以承載第二膜料216, 並使第一膜料208位於第二膜料216之上。。 上述之熱壓裝置204設置於承載台2〇2的上方,且位 於第一膜料208之上方’用以熱壓合第一膜料2〇8與該第 二膜料216。裁斷裝置206可為單獨的裝置或是亦可設置於 承載台202之上,且其係設置於熱壓裝置2〇4與第一膜料 供料輪203之間。在本發明之一較佳實施例中,裁斷裝置 206為-單獨裝置’以於進行熱壓合製程之後裁切第一膜料 208,進而完成第一膜料2〇8與第二膜料216之接合。在本 發明之-較佳實施例中,裁斷裝置2G6較佳為―裁刀,例 如,滑動式裁刀。 其中 216較佳分別為第一 第一膜料208舆第二膜料 聚醯亞胺金屬羯積層板與第二聚醯亞胺金屬羯積層板,其 係預先製備好之單層金屬的積層板。且第一膜料旗係由 與第-金職跡熱固性聚醢亞胺層212以及熱塑性聚酿 亞胺層214所組成,而第二膜料216係由與第二金屬箔⑽ 以及熱固性聚酿亞胺層31G所組成’並且利用此熱塑性聚 醯亞胺膜214來接合第—膜料細與第二膜料。 其甲’上述進行熱麼合時之溫度與塵力則依所選用之 熱塑性聚醯亞胺膜的材料特性而定。本發明之—較佳實施 例中,熱壓合的溫度較佳為·Dc至32代,熱廢合的愿力 1316832 較佳為 20 kg/cm3 至 40 kg/cm3 β 接著,將待接合之第__ 弟一臈枓216放置在接合設備200 中之承載台202上之後,较t 7 曼移動承載台202使第一膜料218 位於苐二膜料216的上方。妹从 ® ^ ^ 然後,如第3圖所示,再以熱 &quot; …壓合第—膜料2〇8與第二膜料216。由於第一 膜料208具有一執勉,w:取** ’’’、 ^醯亞胺層214,所以可以利用埶塑 ,聚酿亞胺層214將部分之第—膜料與第二膜料’、’216 :貼在-起。最後,移動裁斷裝置裏至熱壓裝置2〇4與 膜料供料輪203之間,以將第一膜料2〇 裝置細之上,以裁切第_膜料鄭如此—來,則可3 第一膜料208與第二臈料216之接合。 在本發明之另一較佳實施例中,接合設備中之裁斷裝 置亦可設置於承載台之上,當移動承載台使第一膜料位於 第二膜料的上方時,第一膜料亦同時安置於裁斷裝置之 上。在熱壓裝置熱Μ合第-膜料與第二膜料之後,於裁斷 裝置裁切第-膜料’進而完成第—膜料與第二膜料之接合。 或者’更可依需求在進行熱壓合製程之前,於第二膜 料之起始端上貼合-熱塑性聚醯亞胺膜。請參照第4圖, 其緣示依照本發明另—較佳實_的-種捲帶式膜料之接 合裝置的結構示意圖。在第4圖中,接合設備2〇〇更包含 一熱塑性聚醯亞胺膜貼合裝置2〇7 ’用以於第二膜料216 之起始端上貼合一熱塑性聚醯亞胺膜214,以利於後續之熱 壓合製程。其中’上述之第一膜料2〇8與第二膜料214較 佳分別為第一金屬箔與第二金屬箔。或者,第一膜料208 也可以由第一熱固性聚醯亞胺層與第一金屬箔所組成(未 11 1316832 繪示),帛二膜料可以由第二熱固性聚醯亞胺層肖—第二金 屬f自所組成(未繪示),但並不用以限定本發明之範圍。 因此,由上述本發明較佳實施例可知,應用本發明不 僅無需要再增設接合的鋼片,而免除大量銅片的消耗更 能減少材料成本。再者’由於本發明是利用單點接合的方 式,先以熱壓裝置來熱壓合兩膜料’接著再裁切先輸出的 膜料’也就是將快耗盡之膜料之末端裁切b如此一來, 則能提㊄接合膜料之對準率,進而提升積層板的產品良 率,並且降低不必要的膜料之浪費。除此之外,應用本發 明之方法可以節省接合時間。 雖然本發明已以較佳實施例揭露如上,然其並非用以 限定本發明,任何熟習此技藝者,在不脫離本發明之精神 和範圍内,當可作各種之更動與潤飾,因此本發明之保護 fe圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂,所附圖式之詳細說明如下: 第1圖,係系會示一種習知捲帶式膜料於接合時之結構 示意圖。 第2圖及第3圖’其繪示依照本發明一較佳實施例的 一種捲帶式膜料之接合裝置的結構示意圖。 第4圖’騎示依照本發明另—較佳實施例的一種捲 f式膜料之接合裝置的結構示意圖。 12 1316832 【主要元件符號說明】 100a :膜料之末端 101 ··裁斷裝置 104a、104b:熱塑性聚醯亞胺200 :接合裝置 106 :銅片 204 :熱壓裝置 203 :第一膜料供料輪 208 :第一膜料 202 :承載台 210 :第一金屬箔 熱固性聚醢亞胺層 第二膜料 第二金屬箱 206 :裁斷裝置 212 : 207 :熱塑性聚醯亞胺膜貼合216 : 裝置 218 : 214 :熱塑性聚醯亞胺膜Referring to Figures 2 and 3, there is shown a schematic structural view of a joining device for a tape-and-reel film according to a preferred embodiment of the present invention. In Fig. 2, the joining apparatus 200 includes a carrying table 202, a hot pressing device 2〇4, and a cutting device 206. The loading platform 202 is configured to carry the second film 216 and the first film 208 is located above the second film 216. . The above-mentioned hot pressing device 204 is disposed above the carrying table 2〇2 and above the first film 208 for thermally pressing the first film 2〇8 and the second film 216. The cutting device 206 can be a separate device or can be disposed on the carrier 202 and disposed between the hot pressing device 2〇4 and the first film supply wheel 203. In a preferred embodiment of the present invention, the cutting device 206 is a separate device for cutting the first film 208 after performing the thermocompression process, thereby completing the first film 2〇8 and the second film 216. Engagement. In the preferred embodiment of the invention, the cutting device 2G6 is preferably a "knife", such as a sliding cutter. Wherein 216 is preferably a first first film 208, a second film material, a polyimide film and a second polyimide layer, which are pre-prepared single-layer metal laminates. . And the first film flag consists of a thermosetting polyimine layer 212 and a thermoplastic polyimide layer 214, and the second film 216 is composed of a second metal foil (10) and a thermosetting polymer. The imine layer 31G is composed of 'and the thermoplastic film polyimide film 214 is used to bond the first film material to the second film material. The temperature and dust force at which the above-mentioned heat is combined depends on the material properties of the thermoplastic polyimide film to be used. In the preferred embodiment of the present invention, the thermocompression temperature is preferably from Dc to 32 generations, and the heat-to-healing force of 1313832 is preferably from 20 kg/cm3 to 40 kg/cm3 β. After the first 216 is placed on the carrier 202 in the bonding apparatus 200, the first film 218 is positioned above the second film 216 than the t7 mann mobile carrier 202. Sister from ® ^ ^ Then, as shown in Figure 3, press the first film 2〇8 and the second film 216 with heat &quot;. Since the first film 208 has a stub, w: ** '', ^ 醯 imine layer 214, so the smelting can be utilized, the polyimine layer 214 will be part of the first film and the second film Material ', '216: posted on - from. Finally, the moving cutting device is moved between the hot pressing device 2〇4 and the film feeding wheel 203 to make the first film 2 device finely cut to cut the first film material. 3 The first film 208 is joined to the second material 216. In another preferred embodiment of the present invention, the cutting device in the bonding apparatus may also be disposed on the carrying platform. When the moving loading platform causes the first film to be located above the second film, the first film is also At the same time, it is placed on the cutting device. After the hot pressing device thermally kneads the first film and the second film, the first film is cut by the cutting device to complete the bonding of the first film and the second film. Alternatively, the thermoplastic polyimide film may be attached to the beginning of the second film before the thermal compression process. Referring to Fig. 4, there is shown a schematic view of the structure of a joining device for a film-type film material according to another embodiment of the present invention. In FIG. 4, the bonding apparatus 2 further includes a thermoplastic polyimide film bonding apparatus 2'7' for attaching a thermoplastic polyimide film 214 to the starting end of the second film 216, In order to facilitate the subsequent thermal compression process. Preferably, the first film 2〇8 and the second film 214 are preferably a first metal foil and a second metal foil, respectively. Alternatively, the first film 208 may also be composed of a first thermosetting polyimide layer and a first metal foil (not shown in 11 1316832), and the second film may be composed of a second thermosetting polyimide layer. The secondary metal f is composed of itself (not shown), but is not intended to limit the scope of the invention. Therefore, it can be seen from the above preferred embodiment of the present invention that the application of the present invention not only eliminates the need to add a joined steel sheet, but also eliminates the consumption of a large amount of copper sheets and further reduces the material cost. Furthermore, since the present invention utilizes a single-point bonding method, the two film materials are first heat-pressed by a hot pressing device, and then the film material that is first output is cut, that is, the end of the film material that is quickly depleted is cut. b In this way, the alignment ratio of the five bonding film materials can be raised, thereby improving the product yield of the laminated board and reducing unnecessary waste of the film material. In addition to this, the bonding time can be saved by applying the method of the present invention. While the present invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The protection shall be subject to the definition of the patent application scope attached to it. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; Schematic diagram of the membrane material at the time of joining. 2 and 3 are schematic views showing the structure of a joining device for a tape-and-reel film according to a preferred embodiment of the present invention. Fig. 4 is a schematic view showing the structure of a joining device of a roll-type film according to another preferred embodiment of the present invention. 12 1316832 [Description of main component symbols] 100a: End of film 101. · Cutting device 104a, 104b: Thermoplastic polyimide II: Bonding device 106: Copper sheet 204: Hot pressing device 203: First film feeding wheel 208: first film 202: carrier 210: first metal foil thermosetting polyimide layer second film second metal box 206: cutting device 212: 207: thermoplastic polyimide film bonding 216: device 218 : 214 : Thermoplastic polyimide film

1313

Claims (1)

1316832 年]月^日衝/更)正替换f 十、申請專利範園: 1. 一種捲帶式膜料之接合設備,係應用於製造—軟性 電路板,包含: 一承載台,用以承載一第二膜料並使一第一膜料位於 該第二膜料之上; 一熱壓裝置,設置於該承載台之上以熱壓合該第一膜 料與該第二膜料;以及 一裁斷裝置,設置於該熱壓裝置與該第一臈料之供料 輪之間’以於進行該熱壓合製程之後裁切該第—骐料。 2. 如申請專利範圍第1項所述之捲帶式膜料之接合設 備’其中該熱壓合的溫度為280oC至320°C。 3. 如申請專利範圍第1項所述之捲帶式臈料之接合設 備其中e亥熱壓合的麼力為20 kg/cm3至40 kg/cm3。 4·如申請專利範圍第i項所述之捲帶式膜料之接合設 備,其中該第一财斗依序包含一第-金屬羯、―第―熱固 性聚醯亞胺層與一熱塑性聚醯亞胺層,該第二膜料包:一 第二金屬箔與一第二熱固性聚醯亞胺層。 3 5.如申請專利範圍第4項所述之捲帶式㈣之接人吸 備、、中該第-膜料t之該熱塑性聚醯亞胺層係與該第二 14 膜料中之該第二熱固性聚醯亞胺層貼合 6. 如申請專利範圍第1項所述之捲帶相料之接合設 備’更包含-熱塑性聚醯亞胺膜貼合裝置,用以貼合一熱 塑性聚醯亞胺膜於該第二膜料之起始端上。 7. 如申請專利範圍第6項所述之捲帶相料之接合設 備’其中該熱塑性聚醯亞胺膜係位於該第—膜料與該 膜料之間。 、μ — 8.如申請專利範圍第6項所述之捲帶式膜料之接合設 備,其中該第一膜料係一第一金屬箱’該第二膜料係一第 9.如申請專利範圍第8項所述之捲帶式膜料之接合設 備’其中該第一金屬箔及該第二金屬箔係一銅箔。 # 1〇· Μ請專利_第6項所述之捲帶式膜料之接合 :二其中該第一膜料包含一第一熱固性聚醯亞胺層盥- 二-:屬落,且該第二膜料包含_第二熱固性聚 與一第二金屬箔。 人#11.如申請專利範圍第10項所述之捲帶式膜料之接 合設備’其中該熱塑性聚醯亞胺膜係位於該第一膜料中之 該第-熱固性聚醯亞胺層與該第二膜料中之該第二熱固性 15 1316832 丨止替換f 聚醯亞胺層之間 設二中 13. __ 種捲帶式臈料之接合方法,在虛 性電路板,包含: t按°方法,係應用於製造一軟 貼合一第一膜料於一第二膜料之上; 熱壓合該第一膜料與該第二媒料;以及 成#Ϊ切ΐ第—膜料於進行該熱祕合之步驟之後,以完 Ζ第一膜料與該第二膜料之接合。 14. 合方法, 如申請專利範圍第!3項所述之捲帶式骐料之接 其中該熱壓合的溫度為280〇C至320°C。 W㈣請專利範圍第13項所述之捲帶式膜料之接 去,其中該熱壓合的壓力為2〇 kg/cm3至4〇 kg/em3。 合j6.如_請專利範圍第13項所述之捲帶式臈料之接 去其中s亥第一膜料依序包含一第一金屬箔、一第一 =固性聚醯亞胺層與—熱塑性聚醯亞胺層,該第二臈料包 3第二金屬箔與一第二熱固性聚醯亞胺層。 人17·如申請專利範圍第16項所述之捲帶式膜料之接 ''方法,其中該第一膜料中之該熱塑性聚醯亞胺層係與岑 16 1316832 二熱固性聚醯亞胺層貼合 第二膜料中之該第 18 ^ ^ 合方法,請專利範圍帛13帛所述之捲帶式膜料之接 更包含貼合一熱塑性聚醯亞胺膜於該第二膜料 起始端上於進行該熱壓合之步驟之前。 、’ 19. &gt;申請專利範圍第以項所述之捲帶式膜料之接 去’纟中該第一膜料係一第一金屬箔,該第二膜料係 弟一金屬箔。 瓜 &gt; 申請專利範圍第18項所述之捲帶式膜料之接 :法’丨中該第一膜料包含一第一熱固性聚醯亞胺層與 ::-:屬領,且該第二媒料包含—第二熱固性聚酿亞胺 層與一第二金屬箔。 2U申請專利範圍第20項所述之捲帶式膜料之接 :方法,其中該熱塑性聚醯亞胺膜係位於該第一膜料中之 =第-熱固性聚醯亞胺層與該第二膜料中之該第二熱固性 I酿亞胺層之間。 171316832] month ^ day rush / more) is replacing f. Applying for patent garden: 1. A tape-type film material joining device, which is applied to manufacturing-soft circuit board, comprising: a carrying platform for carrying a second film and a first film on the second film; a hot pressing device disposed on the carrier to thermally press the first film and the second film; A cutting device is disposed between the hot pressing device and the supply wheel of the first dip material to cut the first dip material after performing the thermal compression bonding process. 2. The joining device of the tape-and-reel film according to claim 1, wherein the thermocompression temperature is 280 ° C to 320 ° C. 3. The joining device of the tape-type tanning material according to the first aspect of the patent application, wherein the e-healing pressure is 20 kg/cm3 to 40 kg/cm3. 4. The joining device of the tape-and-reel film according to item i of claim 1, wherein the first hopper comprises a first-metal ruthenium, a -20th thermosetting polyimine layer and a thermoplastic polymer The imide layer, the second film package: a second metal foil and a second thermosetting polyimide layer. 3 5. The tape-receiving type of the tape-receiving type (4) of claim 4, the thermoplastic polyimide layer of the first film material t, and the second film material of the second film material The second thermosetting polyimine layer is bonded. 6. The bonding device of the tape and phase material according to claim 1 further comprises a thermoplastic polyimide film laminating device for attaching a thermoplastic polymer. The quinone imine film is on the beginning of the second film. 7. The joining device of the reel of the tape according to claim 6, wherein the thermoplastic polyimide film is located between the first film and the film. The bonding device of the tape-type film material according to the sixth aspect of the invention, wherein the first film material is a first metal case, the second film material is a ninth. The joining device of the tape-type film material according to the item 8, wherein the first metal foil and the second metal foil are a copper foil. #1〇· 专利 专利 专利 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The second film comprises a second thermoset poly and a second metal foil. The joining device of the tape-type film material according to claim 10, wherein the thermoplastic polyimide film is located in the first film and the first thermosetting polyimide layer and The second thermosetting 15 1316832 in the second film is replaced by a f-polyimine layer disposed between two layers of 13. __ tape-type coating material, on the virtual circuit board, including: t ° method is applied to manufacture a soft-bonding first film on a second film; thermally pressing the first film and the second medium; and forming a #Ϊ切ΐ-film After the step of performing the heat bonding, the bonding of the first film to the second film is completed. 14. Combined methods, such as the scope of patent application! The tape winding type described in the above is the temperature of the hot pressing of 280 ° C to 320 ° C. W (4) The tape-type film material described in the thirteenth patent range is selected, wherein the thermocompression pressure is from 2 〇 kg/cm 3 to 4 〇 kg/em 3 . J6. For example, the tape-type dip material described in Item 13 of the patent scope is followed by the first film of the first film, a first metal-solid polyimine layer and a thermoplastic polyimide layer comprising a second metal foil and a second thermosetting polyimide layer. The method of claim 1 , wherein the thermoplastic polyimide layer in the first film and the 热16 1316832 di-thermosetting polyimine The layer is bonded to the 18th film in the second film, and the tape-type film material described in the patent scope 帛13帛 further comprises a thermoplastic polyimide film attached to the second film. The starting end is before the step of performing the thermocompression. The 19.1 &gt; application of the tape-type film material described in the scope of the patent application is the first metal foil, and the second film is a metal foil. The melon&gt; application of the tape-type film material described in claim 18: the first film comprises a first thermosetting polyimine layer and::-: a collar, and the first The two materials comprise a second thermosetting polyimide layer and a second metal foil. 2U. The method of claim 2, wherein the thermoplastic polyimide film is located in the first film, the first thermosetting polyimide layer and the second Between the second thermoset I-imine layers in the film. 17
TW95123640A 2006-06-29 2006-06-29 An apparatus of connecting tape flexible copper clad laminates and a method thereof TWI316832B (en)

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