TWI316605B - Passive test fixture, method of fabricating the same and test machine - Google Patents

Passive test fixture, method of fabricating the same and test machine Download PDF

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Publication number
TWI316605B
TWI316605B TW96102090A TW96102090A TWI316605B TW I316605 B TWI316605 B TW I316605B TW 96102090 A TW96102090 A TW 96102090A TW 96102090 A TW96102090 A TW 96102090A TW I316605 B TWI316605 B TW I316605B
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Taiwan
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plate device
pinhole
test fixture
upper plate
passive
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TW96102090A
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Chinese (zh)
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TW200831903A (en
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Wan Ting Lu
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Hbc Technology Co Ltd
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  • Testing Of Individual Semiconductor Devices (AREA)

Description

1316605 九、發明說明: 【發明所屬之技術領域】 ’特別指 本發明係有關於-種測試治具、測試治具製作方法及測試機 測試機之被動式測試治具設置有彈性組件構件者。 【先前技術】 —一般具有減麟泰之待_在完成線路佈職,為了要確定 ==:=導通’通常必須予以測試,在通過測試後, ί tit f知之測試治具,是_容餅測試治 觸具有概赌_讀_ (諸如频封裝件或 c #),祕順該制物訊號線路是否可以正常導通。狹傳統測 面無法提高探針的密度來_測物高密度待測點以及待測點 :的產4勢’另-方面,也無法將戦治具的體積製成相當細 二=就體積限制將治具強迫小型化時,相對的治具開模費用亦會非 叩貝導致顧成本提高。為了解決此問題,台灣專利第3難0號及第 奶號分別揭露-種電路板測試用治具構造改良,台灣專利第5纖號 及第530945號提出—種可提高職紐之治具,之後台灣專 57221〇 娜—種可重覆仙之測試治具。細,前述之先前技術雖然成 功則4治具在開模或提高待測點測試密度的缺點,卻未解決如何提 ^探針密度的_轉_試效益_姐。因此,如何可以提昇在測試 治具上之探針的密度,得以因應具有複數個制點之酬物日益微小的趨 勢’乃為業界-亟待解決的問題。 6 1316605 【發明内容】 為了解決上述先前技術之問題,本發明提供一種被動式測試治具,可 以用以測試諸如積體電路封裝件、半導體IC等具有複數個訊號輸入/輸出 (Input/〇u_,則制點之制物,並龍麟遞調試機。進一步來 說此種被喊職治具包财—上域置、—下板裝置、複數個探針、一 底板裝置和彈性組件。其中之上板裝置係由多層板材與板材間之間的隔 鬼相互堆疊@且在上板裝置對應於待測物之複數個制點位置,預 設有針孔。在訂«置,舰於上域置的針隸置,職有通孔。另 二卜,設置有複數個探針’分別容置於上板裝置的針孔内,且進一步地將每 -探針設置有-第-端點及—第二端點,並且使其第二端點穿設入下板裝 置的通孔巾再者n底板裝置和—彈性組件,該底板裝置設於該下 板裝置異於上板裝置之—側,且該雜組件設置於下板裝置與底板裝置之 間,令鋼物置於上板裝置受顺猶,可藉由此雜組件之撓曲位移而 給予複數個探針緩衝。 因此本發明之主要目的在於提供一種具有彈性組件的被動式測試治 具,用以提昇測試治具探針的配置密度。 、本發明之另一目的在於提供一種具有彈性組件的被動式測試治具,藉 乂因應待雜間距微小化(Finepiteh)及高佈線密度之測試需要。 本發月之另一目的在於提供一種具有彈性組件的被動式測試治具之製 作方法,用以提昇測試治具探針的配置密度。 本發明之另一目的在於提供一種具有彈性組件的被動式測試治具之製 方法藉以因應待測物間距微小化(Finepitch)及高佈線密度之測試需 要。 .1316605 • 性組件〗5。該彈性組件〗5可以由複數個彈簧所組成,或是由複數個彈片所 組成,當然,也可利用橡膠的撓曲特質,做為此種彈性組件15的元件。此 外,底板裝置進一步設置有複數個穿孔142,亦可供上述的複數個導線 16穿設之。1316605 IX. Description of the invention: [Technical field to which the invention pertains] ‘Specially, the present invention relates to a test fixture, a test fixture manufacturing method, and a tester. The passive test fixture of the tester is provided with an elastic component member. [Prior technology] - generally have the need to reduce Lintai _ in the completion of the line, in order to determine ==: = conduction 'usually must be tested, after passing the test, ί tit f know the test fixture, is _ 容 饼 test The rule has a gambling _read _ (such as a frequency package or c #), and it is clear whether the signal line of the product can be normally turned on. Narrow traditional measuring surface can not increase the density of the probe _ measuring high-density to-be-measured point and the point to be measured: the production potential of 4, 'other-side, can not make the volume of the sputum fixture quite fine two = on the volume limit When the fixture is forced to be miniaturized, the relative cost of mold opening will also increase the cost. In order to solve this problem, Taiwan Patent No. 3 Difficult No. 0 and No. Milk No. disclose the improvement of the structure of the test fixture for circuit boards, and the Taiwan Patent No. 5 and No. 530945 propose a kind of fixture that can improve the job. After that, Taiwan specializes in 57221 〇娜--a test can be repeated. Fine, although the foregoing prior art is successful, the 4 fixture has the disadvantage of opening the mold or increasing the test density of the point to be tested, but it does not solve the problem of how to improve the probe density. Therefore, how to increase the density of the probes on the test fixtures, and to respond to the increasingly small trend of the multiple points of the industry, is an industry-critical problem. 6 1316605 SUMMARY OF THE INVENTION In order to solve the above problems of the prior art, the present invention provides a passive test fixture which can be used to test a plurality of signal inputs/outputs (Input/〇u_, such as an integrated circuit package, a semiconductor IC, etc. Then the production of the point, and Longlin hand debugging machine. Further said that this type of squad is equipped with a wealthy - upper domain, - lower plate device, multiple probes, a bottom plate device and elastic components. The upper plate device is stacked by the ghost between the multi-layer plate and the plate, and the pin-hole is pre-positioned at a plurality of dot positions corresponding to the object to be tested on the upper plate device. The needle is placed in a position with a through hole. In addition, a plurality of probes are disposed respectively, which are respectively accommodated in the pinholes of the upper plate device, and further each probe is provided with a -th-end point and a second end point, and having the second end thereof threaded into the through-hole towel of the lower plate device and the n-bottom device and the elastic member, the bottom plate device being disposed on the side of the lower plate device different from the upper plate device And the miscellaneous component is disposed between the lower plate device and the bottom plate device The steel object is placed on the upper plate device to be subjected to a plurality of probe buffers by the deflection displacement of the miscellaneous components. Therefore, the main object of the present invention is to provide a passive test fixture having an elastic component for lifting The configuration density of the test probe is tested. Another object of the present invention is to provide a passive test fixture having an elastic component, which is required for testing the pitch pitch and high wiring density. Another object of the present invention is to provide a method for manufacturing a passive test fixture having an elastic component for improving the configuration density of the test fixture probe. Another object of the present invention is to provide a passive test fixture having an elastic component. The method is required to test the distance between the object to be tested (Finepitch) and the high wiring density. .1316605 • Sexual component〗 5. The elastic component can be composed of a plurality of springs or a plurality of shrapnel. Of course, the flexural properties of the rubber can also be utilized as components of such an elastic component 15. In addition, the bottom plate device further There are a plurality of perforations 142 is set, also for the above-mentioned plurality of conductors 16 disposed through.

圍;同時社的赠,對㈣^關,颇肋限定本發明之權利範 因此其他未麟本發明本技術領域之專門人士應可明瞭及實施, 含在下述之申請專利範圍中:之精神下所完成的等效改變或修飾,均應包The gift of the Society; the gift of the Society, and the rights of the Society, and the scope of the invention are defined by the experts in the technical field of the present invention, which should be understood and implemented in the following patent scope: The equivalent changes or modifications completed should be included

13 -1316605 【圖式簡單說明】 第一圖為一示意圖,係本發明提出之被動式測試治具。 第二圖為一示意圖,係本發明提出之被動式測試治具製作方法。 第三圖為一示意圖,係本發明提出之具有被動式測試治具之測試機。 【主要元件符號說明】13 -1316605 [Simplified description of the drawings] The first figure is a schematic diagram, which is a passive test fixture proposed by the present invention. The second figure is a schematic diagram showing a method for manufacturing a passive test fixture proposed by the present invention. The third figure is a schematic diagram of a test machine with a passive test fixture proposed by the present invention. [Main component symbol description]

被動式測試治具 10 上板裝置 11 針孔 111 銅柱間隔塊 112 下板裝置 12 通孔 121 下板裝置底部凹孔 122 探針 13 第一端點 131 第二端點 132 底板裝置 14 底板裝置頂部凹孔 141 穿孔 142 彈性組件 15 導線 16 上端點 161 導持元件 162 測試機 30Passive test fixture 10 Upper plate device 11 Pinhole 111 Copper column spacer block 112 Lower plate device 12 Through hole 121 Lower plate device bottom recess 122 Probe 13 First end point 131 Second end point 132 Base plate device 14 Base plate device top Recessed hole 141 Perforation 142 Elastic component 15 Conductor 16 Upper end point 161 Guide element 162 Test machine 30

Claims (1)

1316605 ί舞石月 修(更)正本 十、申請專利範圍: 1. -種被動式測試雜,用以測試具有複數個待測點之待測物,將訊號傳遞 至測試機,該被動式測試治具包括有: 一上板裝置,係由至少三片板材與板材間之銅柱間隔塊堆疊而成,該 上板裝置對應於該待測物之複數個待測點位置預設有針孔; 下板裝置,對應於該上板裝置之針孔位置預設有通孔; 複數個探針,各探針係一體成形製作而成之單件式探針,分別容置於 該上板裝置之針孔内,該每一探針設有一第一端點及一第二端點,該第 # 二端點穿設入該下板裝置之通孔; 一底板裝置,置於該下板裝置異於上板裝置之一侧;以及 一彈性組件,設於該下板裝置與底板裝置之間,藉此,當待測物置於 該上板裝置受測施壓時,藉該彈性組件之撓曲位移而給予該複數個探針 緩衝。 2. 依據巾請專概15帛丨項所狀鶴摘·H步包含有複數個導 線谷设㈣下板|置,每__導線設有—上端點,該上端點係、電性連接於該 探針之第二端點。 φ 3’依據申請專利範圍第2項所述之被動式測試治具,其中該導線上端點進-步電性連接-具有凹陷部的導持元件,以供探針之第二端點導持定位。 4. 依據中請專概圍第3綱狀被動式觀治具,其巾該導線上端點與導 持元件之電性連接方式係為焊接。 5. 依據巾4專概邮1賴狀被動式職治具,其找下板裝置之通孔 係為垂直通孔。 6·依據申請專利範圍第1項所述之被動式測試治具,其中該下板裝置之通孔 係具有傾斜之角度。 7·依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之針孔 係為垂直通孔。 15 1316605 8. 依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之針孔 係具有傾斜之角度。 9. 依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之板材 針孔係為同心。 10. 依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之板 材針孔具有錯位(offset)之設定。 11·依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之板 材針孔具有相同之孔徑。 12. 依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之板 材針孔接近該下板裝置之板材針孔孔徑略小於遠離該下板裝置之板材針孔 孔徑。 13. 依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之板 材針孔接近該下板裝置之板材針孔孔徑略大於遠離該下板裝置之板材針孔 孔徑。 14. 依據申請專利範圍第1項所述之被動式測試治具,其中該待測物係選自 印刷電路板裸板、已黏著電性元件之印刷電路板、半導體元件及晶圓之任 意者。 15. 依據申請專利範圍第1項所述之被動式測試治具,其中該下板裝置底部 設有自動導持定位該彈性組件之複數個凹孔。 16. 依據申請專利範圍第丨項所述之被動式測試治具,其中該底板裝置頂部 設有自動導持定位該彈性組件之複數個凹孔。 17. 依據申請專利範圍第丨項所述之被動式測試治具,其中該彈性組件係為 複數個彈簧。 18·依據申請專利範圍第丨項所述之被動式測試治具,其中該彈性組件係為 複數個彈片。 19.依據申請專利範圍第1項所述之被動式測試治具,其中該彈性組件係為 1316605 橡膠。 20.依據申請專利範圍第丨項所述之被動式測試治具,其中該底板裝置進一 步設置複數個穿孔,供複數個導線穿設之。 21.—種被動式測試治具製作方法,包括有: 提供-上板裝置’係由至少二片板材與板制之銅柱_塊堆疊而 成,該上板裝置對應於該待測物之複數個待測點位置預設有針孔; 提供一下板裝置,對應於該上板裝置之針孔位置預設有通孔;1316605 ί舞石月修 (more) 正本10, the scope of application for patents: 1. - Passive test miscellaneous, used to test the object with a plurality of points to be tested, the signal is transmitted to the test machine, the passive test fixture includes The upper plate device is formed by stacking at least three pieces of plate and the copper column spacer between the plates, and the upper plate device is provided with pinholes corresponding to the plurality of points to be tested of the object to be tested; Corresponding to the pinhole position of the upper plate device, a through hole is pre-positioned; a plurality of probes, each probe is integrally formed and formed into a single-piece probe, respectively, is received in the pinhole of the upper plate device Each of the probes is provided with a first end point and a second end point, the second end of the second end is inserted into the through hole of the lower plate device; and a bottom plate device is disposed on the lower plate device different from the upper plate a side of the device; and an elastic component disposed between the lower plate device and the bottom plate device, whereby when the object to be tested is placed under pressure of the upper plate device, the flexural displacement of the elastic member is given The plurality of probes are buffered. 2. According to the towel, please refer to the 15th item. The H step contains a plurality of wire valleys (4) lower plate|set, each __ wire has an upper end point, and the upper end point is electrically connected to The second end of the probe. Φ 3' according to the passive test fixture of claim 2, wherein the lead is electrically connected to the end point - a guiding member having a recess for guiding the second end of the probe . 4. According to the middle of the article, the third aspect of the passive view fixture is designed. The electrical connection between the end point of the wire and the guiding element is welded. 5. According to the towel 4, the pass-through device is a vertical through hole. 6. The passive test fixture of claim 1, wherein the through hole of the lower plate device has an inclined angle. 7. The passive test fixture of claim 1, wherein the pinhole of the upper plate device is a vertical through hole. 15 1316605 8. The passive test fixture of claim 1, wherein the pinhole of the upper plate device has an oblique angle. 9. The passive test fixture of claim 1, wherein the plate hole of the upper plate device is concentric. 10. The passive test fixture of claim 1, wherein the plate pinhole of the upper plate device has an offset setting. 11. The passive test fixture of claim 1, wherein the plate pinholes of the upper plate device have the same aperture. 12. The passive test fixture of claim 1, wherein the plate pinhole of the upper plate device has a pinhole aperture that is closer to the lower plate device than the plate pinhole aperture away from the lower plate device. 13. The passive test fixture of claim 1, wherein the plate pinhole of the upper plate device has a pinhole aperture that is closer to the lower plate device than the plate pinhole aperture away from the lower plate device. 14. The passive test fixture of claim 1, wherein the object to be tested is selected from the group consisting of a printed circuit board bare board, a printed circuit board to which an electrical component has been bonded, a semiconductor component, and a wafer. 15. The passive test fixture of claim 1, wherein the lower plate device is provided with a plurality of recessed holes for automatically guiding and positioning the elastic component. 16. The passive test fixture of claim 2, wherein the bottom plate device is provided with a plurality of recessed holes for automatically positioning the elastic component. 17. The passive test fixture of claim 3, wherein the elastic component is a plurality of springs. 18. A passive test fixture according to the scope of the patent application, wherein the elastic component is a plurality of elastic pieces. 19. The passive test fixture of claim 1, wherein the elastic component is 1316605 rubber. 20. The passive test fixture of claim 3, wherein the bottom plate device further provides a plurality of perforations for the plurality of wires to pass through. 21. A passive test fixture manufacturing method, comprising: providing - an upper plate device is formed by stacking at least two sheets of sheet metal and a copper column of a plate, the upper plate device corresponding to the plurality of objects to be tested a pinhole is pre-positioned at a position to be measured; a lower plate device is provided, and a through hole is pre-positioned corresponding to a pinhole position of the upper plate device; 提供複數個探針,各探針係一體成形製作而成之單件式探針,分別容 置於該上板裝置之針孔内,該每-探針設有一第—端點及一第二端點, 該第二端點穿設入該下板裝置之通孔; 提供一底板裝置,置於該下板裝置異於上板裝置之一側;以及 置 提供-彈性組件,設於該下板裝置與底板裝置之間,藉此,當待測物 於該上板裝置受猶麟’藉轉性組件之撓曲位料 探針緩衝。 '•做双似 性連接於該探針之第二端點 22.依據申請專利範圍第21項所述之被動式測試治具製作方法,進一牛勺人 有複數個導線容設於該τ板裝置,每—導線設有—上翻,該上端^^電3 23.讎_料__ 22項讀動摘&gt;韻具製作枝 上端點進-步電性連接-具有凹陷部的導持元件,·探針之第、-端點導 24.依據申請專利範圍第23項所述之被動式測試治具製作方法,政 上端點與導持元件之電性連接方式係為焊接。 ’、該導線 ’其中該下板 ’其中該下板 25依據申請專利範圍帛^項所述之被動式測試治*製作方法 裝置之通孔係為垂直通孔。 26.依據申請專利範圍帛Μ項所狀被動式測試治具製作方法 裝置之通孔係具有傾斜之角度。 / 17 1316605 27. 依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之針孔係為垂直通孔》 28. 依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之針孔係具有傾斜之角度。 29·依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之板材針孔係為同心。 3〇_依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之板材針孔具有錯位(offset)之設定。 ® 31.依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裳置之板材針孔具有相同之孔徑。 32·依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之板材針孔接近該下板裝置之板材針孔孔徑略小於遠離該下板裝置之 板材針孔孔徑。 33·依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之板材針孔接近該下板裝置之板材針孔孔徑略大於遠離該下板裝置之 板材針孔孔徑。 • 34.依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該待測 物係選自印刷電路板裸板、已姆電性元件之印刷電路板、半導體元件及 晶圓之任意者。 35. 依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該下板 裝置底部設有自動導持定位該彈性組件之複數個凹孔。 36. 依據中請專利範圍第21項所述之被動式職治具製作方法,其中該底板 裝置頂部設有自動導持定位該彈性組件之複數個 凹孔。 37. 依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該彈性 組件係為複數個彈簧。 38. 依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該彈性 1316605 組件係為複數個彈片。 39·依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該彈性 組件係為橡膠。 4〇·依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該底板 裝置進一步設置複數個穿孔,供複數個導線穿設之。 41.一種測試機,係使用至少一個以上之被動式測試治具以測試具有複數個 待測點之待測物’其特徵在於該被動式測試治具包括有: 一上板裝置,係由至少三片板材與板材間之銅柱間隔塊堆疊而成,該 上板裝置對應於該待測物之複數個待測點位置預設有針孔; 一下板裝置,對應於該上板裝置之針孔位置預設有通孔; 複數個探針’各探針係一體成形製作而成之單件式探針,分別容置於 該上板裝置之針孔内,該每一探針設有一第一端點及一第二端點,該第 一端點穿設入該下板裝置之通孔; 一底板裝置,置於該下板裝置異於上板裝置之一側;以及Providing a plurality of probes, each probe is integrally formed into a single-piece probe, which is respectively received in a pinhole of the upper plate device, and each probe is provided with a first end point and a second end An end point, the second end is inserted into the through hole of the lower plate device; a bottom plate device is disposed, the lower plate device is disposed on a side of the upper plate device; and the providing-elastic component is disposed under the Between the plate device and the bottom plate device, thereby, when the object to be tested is buffered by the deflection bit probe of the Yulin's borrowing component. '•Double-like connection to the second end of the probe 22. According to the method for manufacturing a passive test fixture according to claim 21 of the patent application, a person having a plurality of wires is accommodated in the τ plate device Each wire is provided with up-turning, the upper end is ^3 electric 3 23. 雠 _ material __ 22 readings and picking &gt; rhyme making branches on the end of the step - step electrical connection - with a concave portion of the guiding element The probe is connected to the end point. 24. According to the method for manufacturing a passive test fixture according to claim 23, the electrical connection between the political end point and the guiding member is soldering. The through hole of the wire </ RTI> in which the lower plate </ RTI> the lower plate 25 is in accordance with the scope of the patent application is a vertical through hole. 26. Passive test fixture manufacturing method according to the scope of the patent application The through hole of the device has an inclined angle. / 17 1316605 27. The passive test fixture manufacturing method according to claim 21, wherein the pinhole of the upper plate device is a vertical through hole. 28. Passive test according to claim 21 of the patent application scope The jig manufacturing method, wherein the pinhole of the upper plate device has an inclined angle. The method of manufacturing a passive test fixture according to claim 21, wherein the plate hole of the upper plate device is concentric. The method of manufacturing a passive test fixture according to claim 21, wherein the plate pinhole of the upper plate device has an offset setting. The method of manufacturing a passive test fixture according to claim 21, wherein the plate hole of the upper plate has the same aperture. The method for manufacturing a passive test fixture according to claim 21, wherein the pinhole of the plate of the upper plate device is close to the pinhole of the plate of the lower plate device is slightly smaller than the hole diameter of the plate hole away from the lower plate device. . The method for manufacturing a passive test fixture according to claim 21, wherein the pinhole of the plate of the upper plate device is close to the pinhole of the plate of the lower plate device is slightly larger than the hole diameter of the plate hole away from the lower plate device. . The method for manufacturing a passive test fixture according to claim 21, wherein the object to be tested is selected from the group consisting of a bare printed circuit board, a printed circuit board of a component, a semiconductor component, and a wafer. Any one. The passive test fixture manufacturing method according to claim 21, wherein the bottom of the lower plate device is provided with a plurality of concave holes for automatically guiding and positioning the elastic component. 36. The method of manufacturing a passive work tool according to claim 21, wherein the bottom of the bottom plate device is provided with a plurality of concave holes for automatically guiding and positioning the elastic component. 37. The passive test fixture manufacturing method according to claim 21, wherein the elastic component is a plurality of springs. 38. The passive test fixture manufacturing method according to claim 21, wherein the elastic 1316605 component is a plurality of elastic pieces. 39. A method of making a passive test fixture according to claim 21, wherein the elastic component is rubber. 4. The passive test fixture manufacturing method according to claim 21, wherein the bottom plate device further comprises a plurality of perforations for a plurality of wires to pass through. 41. A test machine for testing at least one passive test fixture to test a test object having a plurality of points to be tested, wherein the passive test fixture comprises: an upper plate device comprising at least three pieces a copper column spacer between the plate and the plate is stacked, the upper plate device is provided with a pinhole corresponding to a plurality of points to be tested of the object to be tested; a lower plate device corresponding to the pinhole position of the upper plate device a plurality of through-holes are provided; a plurality of probes are formed by integrally forming a single-piece probe, which are respectively received in pinholes of the upper plate device, and each probe is provided with a first end a second end point, the first end point is inserted into the through hole of the lower plate device; a bottom plate device disposed on the side of the lower plate device different from the upper plate device; 該上板裝置受測施餅,繼組件之撓雜移傾複數個 緩衝。The upper plate device is subjected to the measurement of the cake, and the buffer is repeatedly buffered by the components. 之電性連接方式係為焊接。 45·依據申請專利範圍第41項所述之測試機 直通孔。 ’其中該下板裝置之通孔係為垂 1316605 46. 依據申請專利範圍第41項所述之測試機,其中該下板裝置之通孔係具有 傾斜之角度。 47. 依據申請專利範圍第41項所述之測試機,其中該上板裝置之針孔係為垂 直通孔。 48. 依據申請專利範圍第41項所述之測試機,其中該上板裝置之針孔係具有 傾斜之角度。 49·依據申請專利範圍第41項所述之測試機,其中該上板裝置之板材針孔係 為同心。 ® 50·依據申請專利範圍第41項所述之測試機,其中該上板裝置之板材針孔具 有錯位(offset)之設定。 51·依據申請專利範圍第41項所述之測試機,其中該上板裝置之板材針孔具 有相同之孔徑。 52. 依據申請專利範圍第41項所述之測試機,其中該上板裝置之板材針孔接 近該下板裝置之板材針孔孔徑略小於遠離該下板裝置之板材針孔孔徑。 53. 依據申請專利範圍第41項所述之測試機,其中該上板裝置之板材針孔接 近該下板裝置之板材針孔孔徑略大於遠離該下板裝置之板材針孔孔徑。 鲁 54.依據申請專利範圍第41項所述之測試機,其中該待測物係選自印刷電路 板裸板、已黏著電性元件之印刷電路板、半導體元件及晶圓之任意者。 55. 依據申請專利範圍第41項所述之測試機,其中該下板裝置底部設有自動 導持定位該彈性組件之複數個凹孔。 56. 依據申請專利範圍第41項所述之測試機,其中該底板裝置頂部設有自動 導持定位該彈性組件之複數個凹孔。 57. 依據申請專利範圍第41項所述之測試機,其中該彈性組件係為複數個彈 簧。 58. 依據申請專利範圍第41項所述之測試機,其中該彈性組件係為複數個彈 片。 20 1316605 59. 依據申請專利範圍第41項所述之測試機,其中該彈性組件係為橡膠。 60. 依據申請專利範圍第41項所述之測試機,其中該底板裝置進一步設置複 數個穿孔,供複數個導線穿設之。The electrical connection is soldering. 45. Test machine through-hole according to item 41 of the patent application. The through hole of the lower plate device is a vertical angle. The test machine according to claim 41, wherein the through hole of the lower plate device has an inclined angle. 47. The test machine of claim 41, wherein the pinhole of the upper plate device is a vertical through hole. 48. The test machine of claim 41, wherein the pinhole of the upper plate device has an oblique angle. 49. The test machine of claim 41, wherein the plate pinholes of the upper plate device are concentric. The test machine according to claim 41, wherein the plate pinhole of the upper plate device has an offset setting. 51. The test machine of claim 41, wherein the plate pinhole of the upper plate device has the same aperture. 52. The testing machine of claim 41, wherein the plate pinhole of the upper plate device is adjacent to the lower plate device and the pinhole aperture of the plate is slightly smaller than the pinhole aperture of the plate away from the lower plate device. 53. The testing machine of claim 41, wherein the plate pinhole of the upper plate device is adjacent to the lower plate device and the pinhole aperture of the plate is slightly larger than the pinhole aperture of the plate away from the lower plate device. The testing machine of claim 41, wherein the object to be tested is selected from the group consisting of a bare printed circuit board, a printed circuit board to which an electrical component has been bonded, a semiconductor component, and a wafer. 55. The testing machine of claim 41, wherein the bottom of the lower plate device is provided with a plurality of recessed holes for automatically guiding and positioning the elastic component. The testing machine of claim 41, wherein the bottom of the bottom plate device is provided with a plurality of recessed holes for automatically guiding and positioning the elastic component. 57. The test machine of claim 41, wherein the elastic component is a plurality of springs. 58. The test machine of claim 41, wherein the elastic component is a plurality of elastics. The test machine of claim 41, wherein the elastic component is rubber. 60. The test machine of claim 41, wherein the bottom plate device is further provided with a plurality of perforations for a plurality of wires to be threaded through. 21twenty one
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