Claims (1)
1316605 ί舞石月 修(更)正本 十、申請專利範圍: 1. -種被動式測試雜,用以測試具有複數個待測點之待測物,將訊號傳遞 至測試機,該被動式測試治具包括有: 一上板裝置,係由至少三片板材與板材間之銅柱間隔塊堆疊而成,該 上板裝置對應於該待測物之複數個待測點位置預設有針孔; 下板裝置,對應於該上板裝置之針孔位置預設有通孔; 複數個探針,各探針係一體成形製作而成之單件式探針,分別容置於 該上板裝置之針孔内,該每一探針設有一第一端點及一第二端點,該第 # 二端點穿設入該下板裝置之通孔; 一底板裝置,置於該下板裝置異於上板裝置之一侧;以及 一彈性組件,設於該下板裝置與底板裝置之間,藉此,當待測物置於 該上板裝置受測施壓時,藉該彈性組件之撓曲位移而給予該複數個探針 緩衝。 2. 依據巾請專概15帛丨項所狀鶴摘·H步包含有複數個導 線谷设㈣下板|置,每__導線設有—上端點,該上端點係、電性連接於該 探針之第二端點。 φ 3’依據申請專利範圍第2項所述之被動式測試治具,其中該導線上端點進-步電性連接-具有凹陷部的導持元件,以供探針之第二端點導持定位。 4. 依據中請專概圍第3綱狀被動式觀治具,其巾該導線上端點與導 持元件之電性連接方式係為焊接。 5. 依據巾4專概邮1賴狀被動式職治具,其找下板裝置之通孔 係為垂直通孔。 6·依據申請專利範圍第1項所述之被動式測試治具,其中該下板裝置之通孔 係具有傾斜之角度。 7·依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之針孔 係為垂直通孔。 15 1316605 8. 依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之針孔 係具有傾斜之角度。 9. 依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之板材 針孔係為同心。 10. 依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之板 材針孔具有錯位(offset)之設定。 11·依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之板 材針孔具有相同之孔徑。 12. 依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之板 材針孔接近該下板裝置之板材針孔孔徑略小於遠離該下板裝置之板材針孔 孔徑。 13. 依據申請專利範圍第1項所述之被動式測試治具,其中該上板裝置之板 材針孔接近該下板裝置之板材針孔孔徑略大於遠離該下板裝置之板材針孔 孔徑。 14. 依據申請專利範圍第1項所述之被動式測試治具,其中該待測物係選自 印刷電路板裸板、已黏著電性元件之印刷電路板、半導體元件及晶圓之任 意者。 15. 依據申請專利範圍第1項所述之被動式測試治具,其中該下板裝置底部 設有自動導持定位該彈性組件之複數個凹孔。 16. 依據申請專利範圍第丨項所述之被動式測試治具,其中該底板裝置頂部 設有自動導持定位該彈性組件之複數個凹孔。 17. 依據申請專利範圍第丨項所述之被動式測試治具,其中該彈性組件係為 複數個彈簧。 18·依據申請專利範圍第丨項所述之被動式測試治具,其中該彈性組件係為 複數個彈片。 19.依據申請專利範圍第1項所述之被動式測試治具,其中該彈性組件係為 1316605 橡膠。 20.依據申請專利範圍第丨項所述之被動式測試治具,其中該底板裝置進一 步設置複數個穿孔,供複數個導線穿設之。 21.—種被動式測試治具製作方法,包括有: 提供-上板裝置’係由至少二片板材與板制之銅柱_塊堆疊而 成,該上板裝置對應於該待測物之複數個待測點位置預設有針孔; 提供一下板裝置,對應於該上板裝置之針孔位置預設有通孔;1316605 ί舞石月修 (more) 正本10, the scope of application for patents: 1. - Passive test miscellaneous, used to test the object with a plurality of points to be tested, the signal is transmitted to the test machine, the passive test fixture includes The upper plate device is formed by stacking at least three pieces of plate and the copper column spacer between the plates, and the upper plate device is provided with pinholes corresponding to the plurality of points to be tested of the object to be tested; Corresponding to the pinhole position of the upper plate device, a through hole is pre-positioned; a plurality of probes, each probe is integrally formed and formed into a single-piece probe, respectively, is received in the pinhole of the upper plate device Each of the probes is provided with a first end point and a second end point, the second end of the second end is inserted into the through hole of the lower plate device; and a bottom plate device is disposed on the lower plate device different from the upper plate a side of the device; and an elastic component disposed between the lower plate device and the bottom plate device, whereby when the object to be tested is placed under pressure of the upper plate device, the flexural displacement of the elastic member is given The plurality of probes are buffered. 2. According to the towel, please refer to the 15th item. The H step contains a plurality of wire valleys (4) lower plate|set, each __ wire has an upper end point, and the upper end point is electrically connected to The second end of the probe. Φ 3' according to the passive test fixture of claim 2, wherein the lead is electrically connected to the end point - a guiding member having a recess for guiding the second end of the probe . 4. According to the middle of the article, the third aspect of the passive view fixture is designed. The electrical connection between the end point of the wire and the guiding element is welded. 5. According to the towel 4, the pass-through device is a vertical through hole. 6. The passive test fixture of claim 1, wherein the through hole of the lower plate device has an inclined angle. 7. The passive test fixture of claim 1, wherein the pinhole of the upper plate device is a vertical through hole. 15 1316605 8. The passive test fixture of claim 1, wherein the pinhole of the upper plate device has an oblique angle. 9. The passive test fixture of claim 1, wherein the plate hole of the upper plate device is concentric. 10. The passive test fixture of claim 1, wherein the plate pinhole of the upper plate device has an offset setting. 11. The passive test fixture of claim 1, wherein the plate pinholes of the upper plate device have the same aperture. 12. The passive test fixture of claim 1, wherein the plate pinhole of the upper plate device has a pinhole aperture that is closer to the lower plate device than the plate pinhole aperture away from the lower plate device. 13. The passive test fixture of claim 1, wherein the plate pinhole of the upper plate device has a pinhole aperture that is closer to the lower plate device than the plate pinhole aperture away from the lower plate device. 14. The passive test fixture of claim 1, wherein the object to be tested is selected from the group consisting of a printed circuit board bare board, a printed circuit board to which an electrical component has been bonded, a semiconductor component, and a wafer. 15. The passive test fixture of claim 1, wherein the lower plate device is provided with a plurality of recessed holes for automatically guiding and positioning the elastic component. 16. The passive test fixture of claim 2, wherein the bottom plate device is provided with a plurality of recessed holes for automatically positioning the elastic component. 17. The passive test fixture of claim 3, wherein the elastic component is a plurality of springs. 18. A passive test fixture according to the scope of the patent application, wherein the elastic component is a plurality of elastic pieces. 19. The passive test fixture of claim 1, wherein the elastic component is 1316605 rubber. 20. The passive test fixture of claim 3, wherein the bottom plate device further provides a plurality of perforations for the plurality of wires to pass through. 21. A passive test fixture manufacturing method, comprising: providing - an upper plate device is formed by stacking at least two sheets of sheet metal and a copper column of a plate, the upper plate device corresponding to the plurality of objects to be tested a pinhole is pre-positioned at a position to be measured; a lower plate device is provided, and a through hole is pre-positioned corresponding to a pinhole position of the upper plate device;
提供複數個探針,各探針係一體成形製作而成之單件式探針,分別容 置於該上板裝置之針孔内,該每-探針設有一第—端點及一第二端點, 該第二端點穿設入該下板裝置之通孔; 提供一底板裝置,置於該下板裝置異於上板裝置之一側;以及 置 提供-彈性組件,設於該下板裝置與底板裝置之間,藉此,當待測物 於該上板裝置受猶麟’藉轉性組件之撓曲位料 探針緩衝。 '•做双似 性連接於該探針之第二端點 22.依據申請專利範圍第21項所述之被動式測試治具製作方法,進一牛勺人 有複數個導線容設於該τ板裝置,每—導線設有—上翻,該上端^^電3 23.讎_料__ 22項讀動摘>韻具製作枝 上端點進-步電性連接-具有凹陷部的導持元件,·探針之第、-端點導 24.依據申請專利範圍第23項所述之被動式測試治具製作方法,政 上端點與導持元件之電性連接方式係為焊接。 ’、該導線 ’其中該下板 ’其中該下板 25依據申請專利範圍帛^項所述之被動式測試治*製作方法 裝置之通孔係為垂直通孔。 26.依據申請專利範圍帛Μ項所狀被動式測試治具製作方法 裝置之通孔係具有傾斜之角度。 / 17 1316605 27. 依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之針孔係為垂直通孔》 28. 依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之針孔係具有傾斜之角度。 29·依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之板材針孔係為同心。 3〇_依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之板材針孔具有錯位(offset)之設定。 ® 31.依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裳置之板材針孔具有相同之孔徑。 32·依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之板材針孔接近該下板裝置之板材針孔孔徑略小於遠離該下板裝置之 板材針孔孔徑。 33·依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該上板 裝置之板材針孔接近該下板裝置之板材針孔孔徑略大於遠離該下板裝置之 板材針孔孔徑。 • 34.依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該待測 物係選自印刷電路板裸板、已姆電性元件之印刷電路板、半導體元件及 晶圓之任意者。 35. 依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該下板 裝置底部設有自動導持定位該彈性組件之複數個凹孔。 36. 依據中請專利範圍第21項所述之被動式職治具製作方法,其中該底板 裝置頂部設有自動導持定位該彈性組件之複數個 凹孔。 37. 依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該彈性 組件係為複數個彈簧。 38. 依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該彈性 1316605 組件係為複數個彈片。 39·依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該彈性 組件係為橡膠。 4〇·依據申請專利範圍第21項所述之被動式測試治具製作方法,其中該底板 裝置進一步設置複數個穿孔,供複數個導線穿設之。 41.一種測試機,係使用至少一個以上之被動式測試治具以測試具有複數個 待測點之待測物’其特徵在於該被動式測試治具包括有: 一上板裝置,係由至少三片板材與板材間之銅柱間隔塊堆疊而成,該 上板裝置對應於該待測物之複數個待測點位置預設有針孔; 一下板裝置,對應於該上板裝置之針孔位置預設有通孔; 複數個探針’各探針係一體成形製作而成之單件式探針,分別容置於 該上板裝置之針孔内,該每一探針設有一第一端點及一第二端點,該第 一端點穿設入該下板裝置之通孔; 一底板裝置,置於該下板裝置異於上板裝置之一側;以及Providing a plurality of probes, each probe is integrally formed into a single-piece probe, which is respectively received in a pinhole of the upper plate device, and each probe is provided with a first end point and a second end An end point, the second end is inserted into the through hole of the lower plate device; a bottom plate device is disposed, the lower plate device is disposed on a side of the upper plate device; and the providing-elastic component is disposed under the Between the plate device and the bottom plate device, thereby, when the object to be tested is buffered by the deflection bit probe of the Yulin's borrowing component. '•Double-like connection to the second end of the probe 22. According to the method for manufacturing a passive test fixture according to claim 21 of the patent application, a person having a plurality of wires is accommodated in the τ plate device Each wire is provided with up-turning, the upper end is ^3 electric 3 23. 雠 _ material __ 22 readings and picking > rhyme making branches on the end of the step - step electrical connection - with a concave portion of the guiding element The probe is connected to the end point. 24. According to the method for manufacturing a passive test fixture according to claim 23, the electrical connection between the political end point and the guiding member is soldering. The through hole of the wire </ RTI> in which the lower plate </ RTI> the lower plate 25 is in accordance with the scope of the patent application is a vertical through hole. 26. Passive test fixture manufacturing method according to the scope of the patent application The through hole of the device has an inclined angle. / 17 1316605 27. The passive test fixture manufacturing method according to claim 21, wherein the pinhole of the upper plate device is a vertical through hole. 28. Passive test according to claim 21 of the patent application scope The jig manufacturing method, wherein the pinhole of the upper plate device has an inclined angle. The method of manufacturing a passive test fixture according to claim 21, wherein the plate hole of the upper plate device is concentric. The method of manufacturing a passive test fixture according to claim 21, wherein the plate pinhole of the upper plate device has an offset setting. The method of manufacturing a passive test fixture according to claim 21, wherein the plate hole of the upper plate has the same aperture. The method for manufacturing a passive test fixture according to claim 21, wherein the pinhole of the plate of the upper plate device is close to the pinhole of the plate of the lower plate device is slightly smaller than the hole diameter of the plate hole away from the lower plate device. . The method for manufacturing a passive test fixture according to claim 21, wherein the pinhole of the plate of the upper plate device is close to the pinhole of the plate of the lower plate device is slightly larger than the hole diameter of the plate hole away from the lower plate device. . The method for manufacturing a passive test fixture according to claim 21, wherein the object to be tested is selected from the group consisting of a bare printed circuit board, a printed circuit board of a component, a semiconductor component, and a wafer. Any one. The passive test fixture manufacturing method according to claim 21, wherein the bottom of the lower plate device is provided with a plurality of concave holes for automatically guiding and positioning the elastic component. 36. The method of manufacturing a passive work tool according to claim 21, wherein the bottom of the bottom plate device is provided with a plurality of concave holes for automatically guiding and positioning the elastic component. 37. The passive test fixture manufacturing method according to claim 21, wherein the elastic component is a plurality of springs. 38. The passive test fixture manufacturing method according to claim 21, wherein the elastic 1316605 component is a plurality of elastic pieces. 39. A method of making a passive test fixture according to claim 21, wherein the elastic component is rubber. 4. The passive test fixture manufacturing method according to claim 21, wherein the bottom plate device further comprises a plurality of perforations for a plurality of wires to pass through. 41. A test machine for testing at least one passive test fixture to test a test object having a plurality of points to be tested, wherein the passive test fixture comprises: an upper plate device comprising at least three pieces a copper column spacer between the plate and the plate is stacked, the upper plate device is provided with a pinhole corresponding to a plurality of points to be tested of the object to be tested; a lower plate device corresponding to the pinhole position of the upper plate device a plurality of through-holes are provided; a plurality of probes are formed by integrally forming a single-piece probe, which are respectively received in pinholes of the upper plate device, and each probe is provided with a first end a second end point, the first end point is inserted into the through hole of the lower plate device; a bottom plate device disposed on the side of the lower plate device different from the upper plate device;
該上板裝置受測施餅,繼組件之撓雜移傾複數個 緩衝。The upper plate device is subjected to the measurement of the cake, and the buffer is repeatedly buffered by the components.
之電性連接方式係為焊接。 45·依據申請專利範圍第41項所述之測試機 直通孔。 ’其中該下板裝置之通孔係為垂 1316605 46. 依據申請專利範圍第41項所述之測試機,其中該下板裝置之通孔係具有 傾斜之角度。 47. 依據申請專利範圍第41項所述之測試機,其中該上板裝置之針孔係為垂 直通孔。 48. 依據申請專利範圍第41項所述之測試機,其中該上板裝置之針孔係具有 傾斜之角度。 49·依據申請專利範圍第41項所述之測試機,其中該上板裝置之板材針孔係 為同心。 ® 50·依據申請專利範圍第41項所述之測試機,其中該上板裝置之板材針孔具 有錯位(offset)之設定。 51·依據申請專利範圍第41項所述之測試機,其中該上板裝置之板材針孔具 有相同之孔徑。 52. 依據申請專利範圍第41項所述之測試機,其中該上板裝置之板材針孔接 近該下板裝置之板材針孔孔徑略小於遠離該下板裝置之板材針孔孔徑。 53. 依據申請專利範圍第41項所述之測試機,其中該上板裝置之板材針孔接 近該下板裝置之板材針孔孔徑略大於遠離該下板裝置之板材針孔孔徑。 鲁 54.依據申請專利範圍第41項所述之測試機,其中該待測物係選自印刷電路 板裸板、已黏著電性元件之印刷電路板、半導體元件及晶圓之任意者。 55. 依據申請專利範圍第41項所述之測試機,其中該下板裝置底部設有自動 導持定位該彈性組件之複數個凹孔。 56. 依據申請專利範圍第41項所述之測試機,其中該底板裝置頂部設有自動 導持定位該彈性組件之複數個凹孔。 57. 依據申請專利範圍第41項所述之測試機,其中該彈性組件係為複數個彈 簧。 58. 依據申請專利範圍第41項所述之測試機,其中該彈性組件係為複數個彈 片。 20 1316605 59. 依據申請專利範圍第41項所述之測試機,其中該彈性組件係為橡膠。 60. 依據申請專利範圍第41項所述之測試機,其中該底板裝置進一步設置複 數個穿孔,供複數個導線穿設之。The electrical connection is soldering. 45. Test machine through-hole according to item 41 of the patent application. The through hole of the lower plate device is a vertical angle. The test machine according to claim 41, wherein the through hole of the lower plate device has an inclined angle. 47. The test machine of claim 41, wherein the pinhole of the upper plate device is a vertical through hole. 48. The test machine of claim 41, wherein the pinhole of the upper plate device has an oblique angle. 49. The test machine of claim 41, wherein the plate pinholes of the upper plate device are concentric. The test machine according to claim 41, wherein the plate pinhole of the upper plate device has an offset setting. 51. The test machine of claim 41, wherein the plate pinhole of the upper plate device has the same aperture. 52. The testing machine of claim 41, wherein the plate pinhole of the upper plate device is adjacent to the lower plate device and the pinhole aperture of the plate is slightly smaller than the pinhole aperture of the plate away from the lower plate device. 53. The testing machine of claim 41, wherein the plate pinhole of the upper plate device is adjacent to the lower plate device and the pinhole aperture of the plate is slightly larger than the pinhole aperture of the plate away from the lower plate device. The testing machine of claim 41, wherein the object to be tested is selected from the group consisting of a bare printed circuit board, a printed circuit board to which an electrical component has been bonded, a semiconductor component, and a wafer. 55. The testing machine of claim 41, wherein the bottom of the lower plate device is provided with a plurality of recessed holes for automatically guiding and positioning the elastic component. The testing machine of claim 41, wherein the bottom of the bottom plate device is provided with a plurality of recessed holes for automatically guiding and positioning the elastic component. 57. The test machine of claim 41, wherein the elastic component is a plurality of springs. 58. The test machine of claim 41, wherein the elastic component is a plurality of elastics. The test machine of claim 41, wherein the elastic component is rubber. 60. The test machine of claim 41, wherein the bottom plate device is further provided with a plurality of perforations for a plurality of wires to be threaded through.
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