11錄doc 九、發明說明： 【發明所屬之技術領域】 本發明是關於利用雷射光的耔十、Λ 方”別是關於具有適當的結二 111°Te eaM)表面污染物的乾式淨化系統0。/411 doc nin. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a dry purification system using a surface light contaminant of a laser beam with a suitable junction of zero and ΛM. /4
半導體測試是-觀賴社程，以判騎過組裝工 成的每辨導體元件的質量好壞。為了—次測試完大 置的半導體it件，我們使賴試座板(⑽ket b⑽d)，而上 述測試座㈣表面配有大量的測試座，從而分刺試每個 元件。 圖1圖示了用於半導體元件電器試驗的常用測試座板 100。這種測試座板100的尺寸（長寬）在5〇〇x5〇〇mm以 上，按照半導體元件的測試工程分為Burn In B〇ard和 Hi-Fix board 兩大類。 如圖1所示’測试座板100，尤其是Hi-Fix board的 兩側配有把手104 ’為工作人員輸送board提供方便。而 且’上述測試座板100上有索引孔(lndex H〇le)l〇5，作為 製作精密版的基準，通常在測試座板1〇〇的特定位置精密 地加工形成上述索引孔105。上述測試座板1〇〇的上部中 央配有大量測試座102a、102b、102c，以便於測試半導體 元件’一個測試座板100上的上述測試座l〇2a、102b、102c 數量可以達到64個、128個、256個，最多可以裝配512 131 lM^doc 個。 測試座l〇2a、102b、102c如圖1所示，按照半導體 元件的形態可分為以下三大類。第一種測試座1〇2a:與半 導體元件接觸的電接觸部l〇3a呈雙線(Dual line)形態；第 二種測試座102b :接觸部103b呈四線(Quad line)形態；第 二種測5式座l〇2c .接觸部103c呈格子排列(Grid Array)形 態。 雙線形態的測試座l〇2a ’主要用來測試s〇P(SmallThe semiconductor test is - look at the process, to judge the quality of each component of the conductor that has been assembled by the assembly. In order to test the large semiconductor parts, we test the seat plate ((10) ket b(10)d), and the test seat (4) has a large number of test seats on the surface, so that each component is tested. Figure 1 illustrates a conventional test shoe 100 for electrical testing of semiconductor components. The test stand 100 has a size (length and width) of 5 〇〇 x 5 〇〇 mm or more, and is classified into Burn In B〇ard and Hi-Fix board according to the test engineering of the semiconductor component. As shown in Figure 1, the test seat panel 100, and in particular the two sides of the Hi-Fix board, is provided with a handle 104' for the convenience of the worker transporting the board. Further, the test seat plate 100 has an index hole (lndex H〇le) l5, and as a reference for producing a precision plate, the index hole 105 is usually precisely formed at a specific position of the test seat plate 1〇〇. A plurality of test sockets 102a, 102b, and 102c are disposed in the upper center of the test stand 1〇〇 to facilitate testing of the semiconductor component. The number of the test pads 10a, 102b, and 102c on a test socket 100 can be up to 64. 128, 256, can be assembled up to 512 131 lM^doc. As shown in Fig. 1, the test sockets 10a, 102b, and 102c can be classified into the following three types according to the form of the semiconductor element. The first test socket 1〇2a: the electrical contact portion 103a in contact with the semiconductor element is in a dual line form; the second test socket 102b: the contact portion 103b is in a quad line form; The measurement type 5 block l〇2c. The contact portion 103c has a Grid Array form. The two-wire test stand l〇2a ’ is mainly used to test s〇P (Small
Outline Package)、TSOP(Thin Small Outline Package)、 SOJ(Small Outline T-type Package)等元件，這些半導體元 件的導線架(lead frame)均呈現雙線形態。四線形態的測試 座 102b，用來測試 QFP(Quad Hat Package)、QOP (Quad Outline Package)等元件，這些半導體元件的導線架均呈現 四線形態。第三種格子排列形態的測試座l〇2c，主要用來 測試最近備受矚目的 BGA(Ball Grid Array)、μ BGA(micro Ball Grid Array)' CSP(Chip Scale Package) > BOC(Board On 鲁Chip)等元件，這些元件均為半導體元件形態。 利用上述測試座102a、102b、102c進行的半導體元 件的電氣試驗，是根據半導體元件的形態，元件分別裝在 相應的測試座102a、102b、102c的狀態下實施。無數元件 在持續不斷的測試過程中，其與半導體元件及測試座 102a、102b、102c的接觸部被污染。 如上所述，如果插座表面的接觸部被污染，接觸電阻 (contact resistance)會增加，進而對品質優良的半導體元件 1311 ^#Pif d〇〇 進行測試時，因為污染而接觸不好，從而被認定為電氣不 良。最終，由抑絲面_部的料，在半導體 造製程中至關重要的產量(Yield)會減少。為了防止產量減 低的現象，定期清洗插座表面的接觸部，是—項非常重要 、過去’為了淨化半導體測試座板的插座表面接觸部， 者晶^測試用探針卡表面，卫作人員用柔軟的刷子Outline Package), TSOP (Thin Small Outline Package), SOJ (Small Outline T-type Package) and other components, the lead frames of these semiconductor elements are in a two-wire form. The four-wire test stand 102b is used to test components such as QFP (Quad Hat Package) and QOP (Quad Outline Package). The lead frames of these semiconductor components are in a four-wire form. The third type of grid test block l〇2c is mainly used to test the recently-recognized BGA (Ball Grid Array), μ BGA (micro Ball Grid Array) 'CSP (Chip Scale Package) > BOC (Board On Components such as Lu Chip, these components are in the form of semiconductor components. The electrical test of the semiconductor elements by the test sockets 102a, 102b, and 102c is carried out in a state in which the components are mounted in the respective test sockets 102a, 102b, and 102c in accordance with the form of the semiconductor elements. Innumerable components The contacts with the semiconductor components and test pads 102a, 102b, 102c are contaminated during ongoing testing. As described above, if the contact portion on the surface of the socket is contaminated, the contact resistance is increased, and when the semiconductor element 1311^#Pif d〇〇 having excellent quality is tested, the contact is not good due to contamination, and thus it is recognized that Poor for electrical. Eventually, the yield that is critical in the semiconductor manufacturing process will be reduced by the material of the silk-supplement. In order to prevent the phenomenon of reduced output, it is very important to clean the contact surface of the socket surface regularly. In the past, in order to clean the contact surface of the socket of the semiconductor test socket, the surface of the probe card for the crystal test was soft. Brush
ush)淨化&座表面或探針卡表面，或者從相關測試裝置 ^卸下測試座板或探針卡之後’採用化學濕式淨化的方法 清除污染物。 可是，引起探針卡或測試座板接觸部污染的物質，有 組成半導體元件導線架的錫或絡等物質，這些物質在測試 過程中持續接觸測試座板接觸部，並緊緊地貼附於物體表 面’所以利用刷子的物理進化方法的效果並不理想。 …、如果彻另外—種淨化方法-化學濕式淨化法，必須 式裝置上卸下探針卡或職座板等，所以比較麻煩。 春s、利用化學濕式淨化法，會排放大量的污廢水，引起 %境㈣。因此，我們還需要處理這些污廢水。 我=迫切需要的—種淨化方法是，不需從相關裝置上 二下洗/爭對象，如用來測試晶片（wafer)上的半導體元件的 罙針卡或者用來測試package的測試座板等，也能夠迅 速有效地清除洗淨對象的污染物的方法。 【發明内容】 本發明的目的是提供一種乾式淨化裝置，該乾式淨化 I311^pifdoc 裝置利用光能一雷射光，有效地清除洗淨對象的污染物， 尤其是半導體測試座接觸部表面的污染物。 本發明的目的具體如下：用雷射光束照射洗淨對象， 特別是整個半導體測試座板，根據該雷射光束全面清除洗 淨對象表面的污染物；同時，準確無誤地排列洗淨對象， k而最大化淨化效率；另外，更有效地清除淨化過程中或 經過淨化之後，在洗淨對象表面產生粉塵等污染物 ;而且， 鲁，雷射光束變成更適合半導體測試座淨化的形態及/或能 昼丄度特別疋利用非常有利於半導體測試座淨化的雷射 光實施乾式淨化。 ^本領域具有通常知識者，可以結合附圖和後述的最佳 貫施例更加突出上述本發明的目的和各種優點。 …為了達成上述目的，本發明的乾式淨化系統包括：雷 ^•光电生裝置’產生雷射光束；#射光束傳輸裝置，傳送 ^上f雷㈣發生錢產生的雷射光束；訪光束照射震Ush) Purify & mount surface or probe card surface, or remove the test seat or probe card from the relevant test device ^ Use chemical wet cleaning to remove contaminants. However, the substance causing contamination of the contact portion of the probe card or the test seat plate has a substance such as tin or a cord which constitutes a lead frame of the semiconductor element, and these materials continuously contact the contact portion of the test seat plate during the test, and are closely attached to the contact portion. The surface of the object 'so the effect of the physical evolution method using the brush is not ideal. ..., if the other method of purification - chemical wet cleaning method, the probe card or the seat plate is removed from the necessary device, so it is troublesome. Spring s, using chemical wet purification method, will discharge a large amount of sewage, causing the situation (4). Therefore, we also need to deal with these sewage. I = urgently needed - a purification method is that there is no need to wash/consider objects from the relevant devices, such as the 罙 pin card used to test the semiconductor components on the wafer or the test slab used to test the package. A method of quickly and effectively removing contaminants from the object to be cleaned. SUMMARY OF THE INVENTION It is an object of the present invention to provide a dry purification apparatus that utilizes light energy-laser light to effectively remove contaminants from cleaning objects, particularly contaminants on the surface of semiconductor test socket contacts. . The object of the present invention is specifically as follows: irradiating a cleaning object with a laser beam, in particular, the entire semiconductor test seat board, and completely removing the contaminants on the surface of the cleaning object according to the laser beam; and simultaneously arranging the cleaning object accurately, k And to maximize the purification efficiency; in addition, more effective in the purification process or after purification, on the surface of the cleaning object to generate dust and other pollutants; and, Lu, the laser beam becomes more suitable for the purification of semiconductor test benches and / or The ability to perform dry cleaning is particularly useful with laser light that is highly conducive to semiconductor test stand purification. The above-described objects and various advantages of the present invention will be more apparent from the accompanying drawings and the appended claims. In order to achieve the above object, the dry purification system of the present invention comprises: a laser generating device that generates a laser beam; a beam transmitting device that transmits a laser beam generated by the thunder (four) generating money;
能:周^通過上述雷射光束傳輸裝置傳送的雷射光束形 心’亚對洗淨對象照射已經過調㈣雷射光束。 置你的乾式淨化系統最好包括掃料置，該掃目苗裝 光束照射裝置在上述洗淨對象上移動，從而 。正述辑射光束照射I置的雷射光束照射位置。 ==位於上述雷射光束照射裝置=防; …、射洗乎對象表面的雷射光束洩漏。 本發明的乾式淨化系統最好包括集塵器，該集塵器以 131 職 d〇c 吸入=式清除洗淨對象表面的污染物。 置射出S3式^喷氣裝置，該喷氣I 本發明的乾表面的污染物。 置，其中集塵‘吸入方^取好包括集塵器與喷氣裝 而喷氣裝置射出H道洗淨對象表面的污染物， 物。1中清除洗淨縣表面的污毕 染物:巾上返集塵器能夠捕集被上述喷氣裝置清除^亏 塵器式獅包括雷射光束屏蔽物、集 束照射壯晋雷射光束屏蔽物位於上述雷射光 漏;集:器以::方:ί:射Ϊ淨對象表面的雷射光錢 fff出南麼氣體，以清除洗淨對象表面的污染物。上述 射光部和上述喷氣裳置的氣體喷射部置於上述雷 上述賀氣裝置清除的污染物。 饭 籲杨明的乾式淨化系統最好包括安放洗淨對象的淨 化口（stage)，以及具備導向器（guide)的承載裝置，該承载 裝置把上述淨化台引導至上述雷射光照射裝置的下部。 本务明的上述雷射光發生裝置，可以使用波長為 1·06μιη或者200〜li〇〇nm的Nd : YAG雷射光，最好使用 波長為5 3 2nm的已經過頻率調和(freqUency harm〇nic)的 Nd . YAG雷射光。此外’在本發明中，上述雷射光束的 每個脈衝能量最好是l〇mJ〜2000 mj，上述雷射光束的每低 I3116#lpifdoc 脈衝寬度為1〜1000奈秒（nano second,毫微秒）。 上述雷射光束傳輸裝置包括：傳送管和置於上述傳送 管内的至少一個反射鏡。而上述雷射光束傳輸裝置最好由 傳送管和置於上述傳送管内的多個反射鏡組成’其中上述 傳送管是通過多個旋轉軸形成多個關節。 上述雷射光束照射裝置最好由雷射光束放大部、雷射 光束形態s周整部和聚束部組成。其中，雷射光束放大部負 貝放大由上述雷射光束傳輸裝置傳送的雷射光束；雷射光 束形態調整部使經過放大的雷射光束變成所要的形態；聚 束部對經過對經過調整的雷射光束進行聚束，從而得到進 化所需要的具有足夠的能量密度的雷射光束。此時，上述 雷射光束放大部最好根據凹鏡和凸鏡的組合，將雷射光束 放大為〜5.5倍。上述雷射光束形態調整部最好包括吸 =光罩’該吸收光罩使雷射光束以長方形的形態穿透，同 f吸收剩餘雷射光束。上述聚束部最好包括可上下調整的 =光透鏡對雷射光束進行聚束，從 對象表面。^倍率放大並顯科化前後的洗淨 位置上:===置淨對象的特定 洗淨=上面的索引孔，並以該二相機抽攝 上述承載裝置具備從淨化台面向鏡面延伸的加 131164^if.d〇c 強件，而上述加強件的端部最好配有輪子。 在本發明中，上述洗淨對象最好是半導體測試座板及 其上面的插座接觸部。 貫施方式】 下面’結合附圖詳細的說明本發明的最佳實施例。在 下面的實施例附圖中’洗淨對象包括但不限於半導體測試 座板及上面的插座接觸部，晶片測試用探針卡等也可以 為洗淨對象。 •圖2是概略地圖示本發明的一個實施例中對半導體測 试座進行乾洗的乾式淨化系統模式圖。圖3圖示了圖2中 乾式淨化系統的主要部位，是用雷射光束照射洗淨對象的 雷射光束照射裝置模式圖。圖4洗淨對象—半導體測試板 裝入乾式系統的承載裝置模式圖。 如圖2所不，本實施例的乾式淨化系統丨包括：雷射 光發生裝置20、雷射光束傳輸裝置3〇、雷射光束照射裝置 40和掃瞄裝置50等。而且，這些裝置2〇、3〇、40、50均 籲受到系統内綜合控制器10的控制。 在本實施例中’雷射光發生裝置20產生雷射光束b， 以清除洗淨對象，尤其是測試座板1〇〇上的測試座102的 污染物。作為淨化測試座102的雷射光源，Nd : YAG雷 射光比較適合，用於淨化測試座102的雷射光束的每個脈 衝能量以10mJ〜2000mJ之間為宜。雷射光束的脈衝寬度 (pulse width)以1〜1〇〇〇奈秒之間為好，雷射光波長可以適 用兩種：一個是Nd : YAG雷射光中基本波長為 12 1311264心 1.06μιη(=1〇64ηιη)的波長，另一個是通過頻率調和 (frequency harmonic)產生的 532nm 波長。 雷射光束傳輸裝置30的作用是，將由雷射光發生裝 置20產生的雷射光束B傳送到測試板1 〇〇上被污染的插 座位置。從雷射光發生裝置20上產生的雷射光束，通過雷 射光束傳輸裝置30的多個反射鏡34中位於入口處的初始 反射鏡34引入至雷射光束傳輸裝置30内部。 在本實施例中’雷射光束傳輸裝置30形成由多個旋 轉轴35和多個反射鏡34組成的人工關節臂(articulated arm) 形態，每個旋轉軸35附近均裝配了反射鏡34，從而根據 雷射光束的反射，可遠程傳送雷射光束。此時，為了確保 充分的自由·度’最好使用一般由7個旋轉軸35和7個反射 鏡34組成的人工關節臂，上述旋轉軸％内部也最好裝配 了精密轴承。Energy: The laser beam shape transmitted by the above-mentioned laser beam transmitting device is irradiated to the object to be over-adjusted (four). Preferably, the dry cleaning system includes a sweeping device that moves the beam illuminating device over the cleaning object. The laser beam irradiation position where the spot beam is irradiated with I is described. == Located in the above-mentioned laser beam irradiation device = anti-proof; ..., laser beam leakage from the surface of the object. Preferably, the dry cleaning system of the present invention includes a dust collector that removes contaminants from the surface of the object to be cleaned by suction. An S3 type jet device is placed which is a contaminant of the dry surface of the present invention. Set, in which the dust collection ‘inhalation party 取 includes the dust collector and the jet device, and the jet device emits the pollutants on the surface of the H-cleaning object. 1 to remove the stained material on the surface of the washing county: the dust collector on the towel can be trapped by the above-mentioned jet device to remove the dust lion, including the laser beam shield, and the cluster irradiation laser beam shield is located above. Laser light leakage; Set: The device is:: Square: ί: The laser light on the surface of the net object is fff out of the gas to remove the pollutants on the surface of the object. The light projecting portion and the gas jet portion of the air jet are placed in the above-mentioned pollutants removed by the above-mentioned gas boosting device. The dry cleaning system of Yu Yangming preferably includes a cleaning stage for placing the cleaning object, and a carrying device having a guide that guides the cleaning station to the lower portion of the laser light irradiation device. The above-mentioned laser light generating device of the present invention can use Nd:YAG laser light having a wavelength of 1·06 μm or 200 to li 〇〇 nm, preferably using a frequency reconciliation with a wavelength of 5 3 2 nm (freqUency harm〇nic). Nd. YAG laser light. Further, in the present invention, each of the above-mentioned laser beams preferably has a pulse energy of l〇mJ to 2000 mj, and each of the above-mentioned laser beams has a pulse width of 1 to 1000 nanoseconds per nanometer (nano second). second). The above laser beam transmitting device comprises: a conveying pipe and at least one mirror placed in the conveying pipe. Preferably, the above-mentioned laser beam transmitting means is composed of a conveying pipe and a plurality of mirrors disposed in the above-mentioned conveying pipe. The above-mentioned conveying pipe is formed by a plurality of joints through a plurality of rotating shafts. Preferably, the above-described laser beam irradiation means is composed of a laser beam amplifying portion, a laser beam pattern s, a full circumference portion, and a bunching portion. Wherein the laser beam amplifying portion negatively amplifies the laser beam transmitted by the laser beam transmitting device; the laser beam shape adjusting portion changes the amplified laser beam into a desired form; and the bunching portion is adjusted The laser beam is bunched to obtain a laser beam with sufficient energy density required for evolution. At this time, it is preferable that the laser beam amplifying portion enlarges the laser beam to ?5.5 times in accordance with the combination of the concave mirror and the convex mirror. Preferably, the laser beam shape adjusting portion includes a suction mask </ RTI> which absorbs the laser beam in a rectangular shape and absorbs the remaining laser beam. Preferably, the bunching portion includes a vertically adjustable optical lens that focuses the laser beam from the surface of the object. ^ Magnification magnification and display before and after the cleaning position: ===Special cleaning of the net object = the index hole above, and the above-mentioned carrying device with the two cameras has a mirror extending from the clean bench facing the mirror 131164 ^if.d〇c Strong, and the ends of the above-mentioned stiffeners are preferably equipped with wheels. In the present invention, the cleaning object is preferably a semiconductor test board and a socket contact portion thereon. BEST MODE FOR CARRYING OUT THE INVENTION The following is a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings. In the drawings of the following embodiments, the object to be cleaned includes, but is not limited to, a semiconductor test socket and an upper socket contact portion, and a wafer test probe card or the like may be a cleaning object. Fig. 2 is a schematic view schematically showing a dry cleaning system for dry cleaning a semiconductor test stand in an embodiment of the present invention. Fig. 3 is a view showing the main part of the dry cleaning system of Fig. 2, which is a schematic view of a laser beam irradiation apparatus for irradiating a cleaning object with a laser beam. Figure 4 Washing Object—Semiconductor Test Board A schematic diagram of the load bearing unit loaded into the dry system. As shown in Fig. 2, the dry cleaning system 本 of the present embodiment includes a laser light generating device 20, a laser beam transmitting device 3, a laser beam irradiating device 40, and a scanning device 50. Moreover, these devices 2, 3, 40, 50 are all controlled by the integrated controller 10 in the system. In the present embodiment, the laser light generating device 20 generates a laser beam b to remove the contaminants of the cleaning object, particularly the test socket 102 on the test shoe 1 . As the laser light source for purifying the test socket 102, Nd:YAG laser light is suitable, and each pulse energy of the laser beam for purifying the test socket 102 is preferably between 10 mJ and 2000 mJ. The pulse width of the laser beam is preferably between 1 and 1 nanosecond. The wavelength of the laser light can be applied to two types: one is Nd: YAG laser light has a fundamental wavelength of 12 1311264 heart 1.06 μιη (= The wavelength of 1〇64ηιη) and the other is the 532 nm wavelength generated by frequency harmonics. The laser beam transmitting device 30 functions to transmit the laser beam B generated by the laser light generating device 20 to the contaminated socket position on the test board 1. The laser beam generated from the laser light generating device 20 is introduced into the inside of the laser beam transmitting device 30 through the initial mirror 34 at the entrance of the plurality of mirrors 34 of the laser beam transmitting device 30. In the present embodiment, the 'laser beam transmitting device 30 is formed in the form of an artificial articulated arm composed of a plurality of rotating shafts 35 and a plurality of mirrors 34, each of which is equipped with a mirror 34, thereby The laser beam can be transmitted remotely depending on the reflection of the laser beam. At this time, in order to secure a sufficient degree of freedom, it is preferable to use an artificial joint arm generally composed of seven rotating shafts 35 and seven mirrors 34, and it is preferable that the above-mentioned rotating shaft % is equipped with a precision bearing.
项嗖萆射无末得輸裝且〜〜田π巧术乜，视N 光束照射裝置4G内。上述雷射光束照射裝置仙的 通果升降裝置47隨著z轴升降，同時用雷射光 面;^核座1〇2表面，利用該雷射光束對測試座102表 置置47會自_整雷射光束照較 這種變化 1 高度發生變化時，有效地應對 先走i 斤示，上述雷射光束照射裝置40由雷射 邛46 έ大部42、雷射光束形_整部44和雷射光束聚束 ::最好全部使用上述三個部= t疋根據用途可以只用其中的一部份。 13 131職。c 再看圖2,雷射光束照射裝置40與掃瞄裝置50連接， 雷射光束照射裝置40根據該掃瞄裝置％的驅動移至X軸 及Y軸，通過這一過程可以淨化測試板座10〇上的大量插 座102。具體如下：上述掃瞄裝置50在承載雷射光束照射 裝置40的狀態下，將該雷射光束照射裝置40移至X軸及 Y軸’並對測試座板100進行全面的掃瞄，以此淨化所有 插座102。此時’上述掃瞄裝置50最好是龍門起重架(Gantry) 形態的結構，最好是通過伺服電動機(Servo Motor)驅動。 鲁 上述掃瞄裝置5〇上裝配視頻顯示器52，由該視頻顯 示器52獲取淨化前後的插座表面的圖像，並以高倍率放大 和顯示該圖像’以便工作人員監控洗淨對象（或插座）的 淨化情況。 此外，本實施例的乾式淨化系統1還包括排列識別裝 置60 ’該排列識別裝置60利用照相機及/或傳感器等，識 別測試座板100在淨化台82(Cleaning Stage)上的正確位 置。在本實施例中，由排列識別裝置60識別測試座板100 籲在淨化台82上的正確位置，其作用是，用照相機拍攝測試 座板100的特定位置’並在綜合控制器10上計算該測試座 板100離基準位置的距離’當掃猫裝置50進行掃瞒時，為 其補正位置值。如上所述，被照相機識別到的測試座板1 〇〇 的特疋·位置’最好疋大部分在測試座板100上精密形成的 索引孔105 (見圖1)。 在本實施例中’上述雷射光發生裝置20、掃目苗裂置 5〇、雷射光束照射裝置40的升降裝置47、視頻顯示器<52 14 13116狐 doc 以及排列劇裝置60 ’均受顺式淨化系統丨_综合控 制器10的精密控制。 工 下面結合圖3’對上述光束照射裝i4〇做進一步詳細 的說明。 ' 在本實施例中，雷射光束照射襄置4〇包括：雷射光 束放大部42、雷射光束形態調整部44和 46。雷射光束放大部42包括凹鏡42a和凸;射= 大從雷射光束傳輸裝置30(見圖2)引入的激光束B的大 小，通過凹凸鏡的光學作用，將雷射光束放大至12〜55 倍左右。被放大的雷射光束，使掃瞄裝置迅速進行雷射光 束掃瞄(scanning)，從而實現快速淨化。 雷射光束形態調整部44使圓形雷射光束變成長方 形’以使掃瞒裝置進行精密的掃瞎。一般使用具備長方形 孔的雷射光束吸收光罩44a，只讓圓形光束中心穿透吸收 光罩44a，其餘部分被吸收光罩他吸收掉，從而形成長 方形雷射光束。 鲁 雷射光束聚束部46使用凸鏡46a，以便於得到插座 102淨化所需要的足夠雷射光束聚束部46利用凸鏡4知， 對雷射光束形態調整部44上形成的長方形雷射光束進行 ^束’從而得到足夠大小的雷射光束能量密度(J/cm2)。此 ’上述凸鏡46a最好使用柱面凸透鏡(cyIindrical c〇nvex lens)以此改變上述凸鏡偏的位f ’調整到達插座體 表面的雷射光束大小，通過這一調整，有效地調整雷射光 束的能量密度。 15 1311 备鎮doc 、，在淨化過程中，由雷射光束照射裝置40射出的雷射 光束打到插座102表面，造成散射或反射而外露。為了抑 制或最小化這種現象，本實施例的乾式淨化系 雷射光束屏蔽物72。該雷射光束屏蔽物72採用有效吸收 雷射光束的材料製成，並形成圓形或方形箱子形態，該雷 射光束屏蔽物72最好裝在雷射光束照射裝置4〇的下部。 本實施例的乾式淨化系統1由喷氣裝置76和集塵器 鲁74組成，從而有效、永久地清除淨化過程中產生的污染 ，一粉塵，上述噴氣裝置76包括氣體供應源76a、氣體流 量控制器76b和喷嘴型氣體噴射部76c。其中，上述氣體 喷射部76c對測試座板100噴射從氣體供應源76a經過氣 體流量控制器74b流出的氣體，從而清除測試座板10〇上 的污染物。上述集塵器7 4的作用是：補集並永久清除從測 5式座板100上清除的粉塵狀態的污染物，該集塵部包括： 吸附污染物的集塵部；連結到集塵部，吸附污染物的吸入 泵74a。此時，上述集塵部74b和氣體喷射部76c最好襞 •入上述，射光束屏蔽物72 β。上述屏蔽物72、集塵器Μ 以及=氣裝置76’除了具有防雷射光及清除污染物等本身 的功月b之外’還有防止粉塵污染週邊環境，以保護雷射光 束照射裝置40的光㈣統的優點。 下面芩考圖4，具體說明洗淨對象，最好是對將測試 座板100準確地排列到清洗位置的承載裝置8〇做進一 細的說明。 一般測試座板的大小非常大而重，如長寬lm 以上， 16 131 l264,6d〇c 重里達到50kg以上。因此，我們要求一種承載裝置8〇， 將制试座板100引入本實施例的乾式淨化系統i内部。如 圖4所不，如果淨化台82隨著導向器84滑出（Sliding)系 統1外側’工作人員就抓住測試座板100的把手104 (見 圖1) ’在滑出系統丨外側的淨化台82上安置測試座板 100。之後，把淨化台82重新推入系統内，當測試座板 裝入(loading)安全的清洗位置，就利用雷射光對插座進行 清洗。 隹_上述抽屜式承載方法，將大而重的測試座板1〇〇安全 輕易地裝入清洗領域，從而實施穩定的淨化工程。這樣裝 入的測試座板1GG多少有—些位置誤差，此時裝入系統i ^的排列識職置6G識咖彳試座板lGG的準確位置，並計 异位置块差，為了實施插座淨化而進行雷射光束掃目苗時， 將自動補償誤差。而且，將測試座板1〇〇放入滑動淨化台 82 % ’為了輕易地裝入臺座(stage)8〇，同時防止因測試座 f 100的重量而可能發生臺座8G下垂的現象，肢在淨化 ❿σ 82下部裝配有輪子82b的加強件82a。 根據上述本發明的一個實施例，不需要拆钟插座，利 用雷射光就能迅速有效且不產生任何廢水，以乾洗方式清 除裝在半導體測試座板上的插座接觸部表面的污染物，= 時適用於實際半導體IC元件的製造與測試工程。 圖5概略地圖示本發明的另—實施例的乾式淨化系 統，圖6放大圖示了部分乾式淨化系統。 如圖5所示，本實施例的乾式進化系、統1〇〇也包括： 17 131 難。c 雷射光束發生裝置120、雷射光束傳輸裝置130、雷射光束 照射裝置140以及雷射光束掃瞄裝置150等，這些裝置 120、130、140、150 均裝在框架 11〇 上。 具體如下：把上述雷射光束發生裝置120直接裝在框 架110上，並依次連接雷射光束傳輪裝置130、雷射光束 照射裝置140及雷射光束掃瞄裝置150的狀態下，在框架 110上直接連接雷射光束傳輸裝置130，以此上述裝置 120 ' 130、140、150全部裝入框架11〇内，實現—體化。 鲁而且，上述框架110的底面裝配傳送裝置18〇，這樣工作 人員能自由地輸送上述框架110，而這些框架1丨〇的自由 輸送’使上述各個裝置120、130、140、150接近或遠離洗 淨對象’上述這些裝置120、130、140、150是在裝入框架 的狀態下產生、傳輸、照射和掃瞄雷射光束。 上述輸送裝置180可以形成輪子結構、輸送軌道結構 或其他結構’根據本發明的最佳實施例’上述輸送裝置18〇 使用輪子，最好是使用直徑在50mm以上的輪子。此時， 籲輸送裝置最好安裝輪子和制動器（brake)，以免本實施例的 乾式淨化系統100隨意地移動。進而在上述框架11〇上裝 配把手117’以幫助與其形成一體的乾式淨化系統的輸送。 上述雷射光束發生裝置120由以下幾個部分組成：產 生雷射光束的雷射光震盪器121;向上述雷射光震盈器121 提=高壓電力的供電裝置122 ;恆定維持雷射光束的^雷射 光展盪β 121溫度的雷射光冷卻器123 ;全面控制供電裝 置122、雷射光震盪器121及冷卻器ι23的综合控制器124。 I311M6fd〇c 工 同時，上述框架110的上側安梦 作人員輪人參數，執行各種清洗二 反112 ’以便 不，但是上述操作面板H2具備多個於、^圖中未圖 關，為了給上述綜合控制器124發 文丑或輪入開 便工作人員在上述綜合控制器上輪;連接，以 要的各種信號。 工程所需 而且’上述框架110的下Α SWitch)1 14。在本實施例中，上述腳踏間關:踏開關（foot ►综合控制器m上，工作人員用腳踩就能到上述 光束的照射開關(On-Off)。也就是t兒，作雷射 開關114更方便地將雷射光束的震 j腳踏 控制器124上。 專送至上述綜合 先事123採用水冷式，其作用是：避免 洗淨對象口為雷射光溫度的上生而受損。本實施例的乾式 淨化系統⑽’整體上形成通過輸送裝置⑽輸送的社構。 所以’上述雷射光冷卻器123帛好採用將内部循環冷媒（特 >別是過冷水）用於雷射光冷卻的循環式，而不是將從外部 引入的冷媒用於雷射光冷卻。 雷射光束傳财置13G製作成人1關節臂⑽culated arm)开;^悲，忒人工關節臂由多個旋轉軸135和反射鏡134 組成。此時，每個旋轉軸附近裝配相對應的反射鏡，根據 雷射光束的反射，可以遠程輪送雷射光束。 圖6中圖不了本實施例的雷射光束照射裝置14〇，與 原有技術一樣，雷射光束照射裝置也由雷射光束放大部 19 131 l264f6.doc 142、雷射光束形態調整部144和雷射光束聚束部146組 成。但是在本實施例中，雷射光束照射裝置14〇形成直角 結構。因此’為了改變雷射光束的照射方向，在雷射光束 照射裝置140上裝配了反射鏡l46a。 雷射光束照射裝置140的末端裝配傳感器149，該傳 感器149感應到雷射光束照射裝置14〇與相對的任何—個 底面接觸，並向圖5中的綜合控制器124發送感應信 但只有感應到上述接觸才能發出雷射光束B。 # 在上述傳感器149的作用之下，解除了雷射光束的任 意照射及雷射光束的外露對工作人員造成的危險。在本實 細例中，上述傳感益149感應到底面，及下述雷射光束掃 瞄裝置150的滑動件152表面與雷射光束照射裝置14〇互 相接觸，並將感應信號發送到綜合控制器上，只有感應到 上述接觸，雷射光束才照射洗淨對象。上述傳感器14^ =是利用磁力的近程傳感器，或者是利用光線的光傳感 器，或者根據重力只會感應到下行方向的重力傳感器。〜 • 雷射光束_裝置15G是對雷射光束進行掃;的部 分，從而全面淨化洗淨對象一探針卡或測試座，該雷射 束掃瞄裝置由平行移至X-y軸的滑動件152、引導^滑 件152進行滑動的導向夾具154 _。此日夺，上述^ 152連接到雷射光束照射裝置140的末端，而上述導向 具154則裝在測試座板的基座等任意部分。 〃 根據本發明的最佳實施例，工作人員可以通過用 動雷射光束照射裝置140的手動操作及根據手動操作使滑 20 I31164i6fd〇c 動件152水平滑動的方法，水平輸送上述雷射光束照射裝 置140,其輸送方向是向父軸和γ轴的二維平面自由掃目苗 雷射光束的方向。此時，上述滑動件152在導向夾具154 的導向槽内部滑動。 μ 蒼考圖5及圖6，利用本實施例的乾式淨化系統1〇〇 的淨化工程依次說明如下。首先，滑動件152將可滑動的 導向夾具丨54安放到洗淨對象―測試座或探針卡上，然後 將雷射光束照射裝置140的末端固定在滑動件152上。接 著，根據傳感益149的感應確認雷射光束照射裝置14〇和 滑動件152的接觸狀態’若識別到上述接觸，工作人員則 ，下腳踏開關114 ’用雷射光束照射洗淨對象，從而實施 淨化工程。此時’在操作上述腳踏開關之前，可通過操作 面板112輸入淨化所需要的各種命令。 接:來，在實施上述淨化工程之前，㈣乾式淨化系 統遠離洗淨對象，工作人員就利用輸送裝置18〇將乾 式淨化系統1GG輸送至㈣實施雷射光淨化的位置，之後 工作人員制動器控制整個乾式淨化系統的運行。 本發明的乾式淨化系统1〇〇，不需要拆卸探針卡及測 試座板，雷射光錢㈣迅速有效且不發生任何廢 ^ ’對晶片用探針卡及package用測試座表面接觸部的污 染物進行乾式淨化。 上述内谷，、疋s兒明了本發明的一個最佳實施例，本發 人員應該知道，在不改變本發明要點的情況下， 本發明疋可以修改和變更的。 21 131 l2_d〇c 如上所述，本發明的乾式淨化裝置利用雷射光，非常 迅速地清除洗淨對象的污染物，同時可以實現乾式淨化， 也就是說，在清除污染物的過程中，不產生污廢水等二次 污染物。 /本心明的乾式淨化裝置，尤其是適合半導體測試座板 的，爭化’目為不需要拆卸測試座，與利用軟刷子(blush)的 原有的淨化方法相比，很大程度上提高了測試座的淨化能 刀，從而提高測試效率，節省高額的生產費用。 .另外，本發明的乾式淨化裝置與原有的化學濕式淨化 法相比’不需要拆卸測試座，非常迅速地實施淨化，由於 洗淨自動化過程簡單，在半導體元件的製作等量產工程 中，很大程度上提高了生產效率。 此外，根據本發明，工作人員能夠通過框架上的輸送 裝置，使乾式淨化系統輕易地接近測試裝置，並輕 理和維修上述乾式淨化系統。 * 再者’根據本發明’只有雷射光束照射裝置與洗淨 籲象相對驗態下村騎雷㈣束。所以，事細免工作 人員受到雷射光束的傷害。 【圖式簡單說明】 100 圖1圖示了用於半導體元件電器試驗的常用測試座板 圖2是概略地圖示本發明的-個實施例中對半導體測 试座進行乾洗的乾式淨化系統模式圖。 、 圖3圖示了圖2中乾式淨化系統的主要部位，是用雷 22 131 lM§.d〇c 射光束照射洗淨對象的雷射光束照射裝置模式圖。 圖4洗淨對象—半導體測試板裝入乾式糸統的承載裝 置模擬圖。 圖5概略地圖示本發明的另一實施例的乾式淨化系 統。 圖6放大圖示了部分乾是淨化系統。 【主要元件符號說明】 φ 1:乾式淨化系統 10 :綜合控制器 20 :雷射光發生裝置 30 :雷射光束傳輸裝置 34 :反射鏡 " 35 :旋轉軸 40 :雷射光束照射裝置 42 :雷射光束放大部 • 42a :凹鏡 42b :凸鏡 44 :雷射光束形態調整部 44a :吸收光罩 46 :雷射光束聚束部 46a ··凸鏡 47 :升降裝置 23 ΒΙΙό^ρ^ 50 :掃瞄裝置 52 :視頻顯示器 60 :排列識別裝置 72 :雷射光束屏蔽物 74 :集塵器 74a :吸入泵 74b :集塵部 76 :喷氣裝置 76a :氣體供應源 76b :氣體流量控制器 76c :喷嘴型氣體喷射部 80 :承載裝置 82 :淨化台 82a :加強件 82b :輪子 84 :把手 100 .測試座板 102 :插座 102a、102b、102c :測試座 103a、103b、103c :接觸部 104 :把手 105 ··索引孔 24 pif.doc 110 :框架 112 :操作面板 114 :腳踏開 117 :把手 120 :雷射光束發生裝置 121 :雷射光震盪器 122 :供電裝置 123 :雷射光冷卻器 124 :綜合控制器 Π0 :雷射光束傳輸裝置 134 :反射鏡 135 :旋轉軸 140 :雷射光束照射裝置 142 :雷射光束放大部 144 :雷射光束形態調整部 146 :雷射光束聚束部 146a :反射鏡 149 :傳感器 150 :雷射光束掃瞄裝置 152 :滑動件 154 :導向夾具 180 :輸送裝置 25 13 1 1 646pif.doc B :雷射光束The item is shot at the end of the 4G. The above-mentioned laser beam irradiation device sen's fruit lifting device 47 moves up and down along the z-axis, and simultaneously uses a laser beam surface; the surface of the core seat 1〇2, and the test beam 102 is placed on the surface of the test socket 102 by the laser beam. When the height of the beam changes more than the change 1 height, the laser beam irradiation device 40 is partially illuminated by the laser beam 46, the laser beam shape _ the whole portion 44 and the laser beam. Beam bunching: It is best to use all three of the above sections = t疋 Only one of them can be used depending on the application. 13 131 positions. c. Referring again to Fig. 2, the laser beam irradiation device 40 is connected to the scanning device 50, and the laser beam irradiation device 40 is moved to the X-axis and the Y-axis according to the driving of the scanning device %, and the test plate holder can be purified through this process. A large number of sockets 102 on the 10th floor. Specifically, the scanning device 50 moves the laser beam irradiation device 40 to the X-axis and the Y-axis ' in a state where the laser beam irradiation device 40 is carried, and performs a comprehensive scan on the test seat plate 100. Purify all outlets 102. At this time, the scanning device 50 is preferably in the form of a Gantry, and is preferably driven by a servo motor (Servo Motor). A video display 52 is mounted on the scanning device 5, and an image of the surface of the socket before and after purification is obtained by the video display 52, and the image is enlarged and displayed at a high magnification so that the worker monitors the cleaning object (or socket). Purification situation. Further, the dry cleaning system 1 of the present embodiment further includes an arrangement identifying means 60' which recognizes the correct position of the test seat panel 100 on the cleaning stage 82 by means of a camera and/or a sensor or the like. In the present embodiment, the alignment recognition device 60 recognizes the correct position of the test seat panel 100 on the clean bench 82, which functions to capture a specific position of the test seat panel 100 with a camera and calculate the same on the integrated controller 10. The distance of the test seat plate 100 from the reference position is corrected for the position value when the sweeping device 50 performs the broom. As described above, the characteristic position of the test seat plate 1 识别 recognized by the camera is preferably a majority of the index holes 105 (see Fig. 1) precisely formed on the test seat plate 100. In the present embodiment, 'the above-described laser light generating device 20, the sweeping seedling 5 〇, the lifting device 47 of the laser beam illuminating device 40, the video display <52 14 13116 fox doc, and the arranging device 60' are all subject to The purification system 丨 _ the precise control of the integrated controller 10. The beam irradiation device i4 will be described in further detail below with reference to Fig. 3'. In the present embodiment, the laser beam irradiation unit 4 includes a laser beam amplifying portion 42, and laser beam shape adjusting portions 44 and 46. The laser beam amplifying portion 42 includes a concave mirror 42a and a convex surface; the size of the laser beam B introduced from the laser beam transmitting device 30 (see Fig. 2) is large, and the laser beam is amplified to 12 by the optical action of the concave-convex mirror. ~55 times or so. The amplified laser beam allows the scanning device to quickly perform laser beam scanning for rapid cleaning. The laser beam shape adjusting portion 44 turns the circular laser beam into a rectangular shape to allow the broom device to perform a precise broom. A laser beam absorbing mask 44a having a rectangular aperture is generally used to allow only the center of the circular beam to penetrate the absorbing mask 44a, and the remainder is absorbed by the absorbing mask to form a rectangular laser beam. The Luray beam bunching portion 46 uses the convex mirror 46a to obtain sufficient laser beam focusing portion 46 required for the cleaning of the socket 102. The convex mirror 4 is used to form a rectangular laser beam formed on the laser beam shape adjusting portion 44. The beam is beamed to obtain a laser beam energy density (J/cm2) of sufficient size. The above-mentioned convex mirror 46a preferably uses a cylindrical convex lens (cyIindrical c〇nvex lens) to change the position of the convex mirror to be adjusted to adjust the size of the laser beam reaching the surface of the socket body, and the adjustment is effective to adjust the lightning beam. The energy density of the beam. 15 1311 Prepare the town doc, in the purification process, the laser beam emitted by the laser beam irradiation device 40 hits the surface of the socket 102, causing scattering or reflection to be exposed. In order to suppress or minimize this phenomenon, the dry cleaning of the present embodiment is a laser beam shield 72. The laser beam shield 72 is made of a material that effectively absorbs the laser beam and forms a circular or square box shape. The laser beam shield 72 is preferably mounted in the lower portion of the laser beam irradiation device 4''. The dry purification system 1 of the present embodiment is composed of a jet device 76 and a dust collector 74 to effectively and permanently remove the pollution generated during the purification process, a dust, and the jet device 76 includes a gas supply source 76a and a gas flow controller. 76b and the nozzle type gas injection portion 76c. Here, the gas ejecting portion 76c ejects the gas flowing from the gas supply source 76a through the gas flow controller 74b to the test shoe 100, thereby removing contaminants on the test seat 10b. The function of the dust collector (7) is to supplement and permanently remove the pollutants in the dust state removed from the type 5 seat plate 100. The dust collecting portion includes: a dust collecting portion for adsorbing pollutants; and connecting to the dust collecting portion a suction pump 74a that adsorbs contaminants. At this time, it is preferable that the dust collecting portion 74b and the gas ejecting portion 76c incorporate the above-described beam shielding material 72?. The shield 72, the dust collector Μ, and the gas device 76' have the function of preventing the dust from polluting the surrounding environment in addition to the lightning protection and the removal of the pollutants themselves, etc., to protect the laser beam irradiation device 40. The advantages of light (four) system. Referring now to Figure 4, the cleaning object will be specifically described, and it is preferable to provide a detailed description of the carrying device 8 which accurately arranges the test seat plate 100 to the cleaning position. Generally, the size of the test seat plate is very large and heavy, such as longer than lm, 16 131 l264, and 6d〇c reaches 50kg or more. Therefore, we require a carrier device 8 to introduce the test stand 100 into the interior of the dry cleaning system i of the present embodiment. As shown in Fig. 4, if the clean bench 82 slides out of the system 1 with the guide 84, the worker grasps the handle 104 of the test seat plate 100 (see Fig. 1). A test seat plate 100 is placed on the table 82. Thereafter, the clean bench 82 is pushed back into the system, and the socket is cleaned by the laser light when the test seat plate is loaded into a safe cleaning position.隹 The above-mentioned drawer type carrying method allows a large and heavy test seat plate to be safely and easily loaded into the cleaning field, thereby implementing a stable purification process. The test seat board 1GG thus loaded has some position errors. At this time, the position of the system i ^ is placed in the exact position of the 6G espresso test stand lGG, and the position difference is calculated, in order to implement the socket cleaning. When the laser beam is scanned, the error will be automatically compensated. Moreover, the test seat plate 1〇〇 is placed in the slide cleaning table 82%' in order to easily fit the stage 8〇, while preventing the pedestal 8G from sagging due to the weight of the test stand f 100, the limb A reinforcing member 82a of the wheel 82b is fitted to the lower portion of the purge ❿σ 82. According to an embodiment of the present invention described above, it is not necessary to remove the clock socket, and the laser light can be quickly and effectively utilized without any waste water, and the pollutants on the surface of the socket contact portion mounted on the semiconductor test socket are removed by dry cleaning. Suitable for manufacturing and testing engineering of actual semiconductor IC components. Fig. 5 schematically illustrates a dry purification system of another embodiment of the present invention, and Fig. 6 is an enlarged view of a partial dry purification system. As shown in FIG. 5, the dry evolution system and the system 1 of the present embodiment also include: 17 131 Difficult. c Laser beam generating device 120, laser beam transmitting device 130, laser beam irradiating device 140, and laser beam scanning device 150, etc., these devices 120, 130, 140, 150 are mounted on the frame 11A. Specifically, the laser beam generating device 120 is directly mounted on the frame 110, and the laser beam transmitting device 130, the laser beam irradiating device 140, and the laser beam scanning device 150 are sequentially connected to the frame 110. The laser beam transmitting device 130 is directly connected to the upper portion, so that the above devices 120', 130, 140, and 150 are all loaded into the frame 11A to realize the body-forming. Further, the bottom surface of the frame 110 is equipped with a conveyor 18 〇 so that the worker can freely transport the frame 110, and the free transport of the frames 1 使 allows the respective devices 120, 130, 140, 150 to approach or away from washing. The net objects 'the above-mentioned devices 120, 130, 140, 150 generate, transmit, illuminate and scan the laser beam in a state of being loaded into the frame. The above-described conveying device 180 may form a wheel structure, a conveying track structure or other structure. According to a preferred embodiment of the present invention, the above-described conveying device 18 uses wheels, preferably wheels having a diameter of 50 mm or more. At this time, it is preferable to attach the wheel and the brake to the conveying means to prevent the dry cleaning system 100 of the present embodiment from moving at will. Further, a handle 117' is attached to the frame 11'' to assist in the transport of the dry cleaning system integrated therewith. The above-mentioned laser beam generating device 120 is composed of the following parts: a laser light oscillator 121 that generates a laser beam; a power supply device 122 that supplies high voltage power to the laser light detector 121; and a laser beam that constantly maintains the laser beam A laser light cooler 123 that illuminates the β 121 temperature; a comprehensive controller 124 that comprehensively controls the power supply device 122, the laser light oscillator 121, and the cooler ι23. I311M6fd〇c At the same time, the upper side of the above-mentioned frame 110 is used as a human wheel parameter, and various cleaning and reversing 112' are performed, so that the above operation panel H2 has a plurality of icons in the figure, in order to give the above-mentioned comprehensive The controller 124 sends a ugly or round-in staff to the wheel on the above-mentioned integrated controller; the connection is to various signals. Engineering required and 'lower SWitch of the above frame 110'. In this embodiment, the pedaling is turned off: the foot switch (foot ► integrated controller m, the staff can use the foot to reach the above-mentioned beam illumination switch (On-Off). That is, the child, for the laser The switch 114 more conveniently transmits the laser beam to the pedal controller 124. The above-mentioned integrated priest 123 is water-cooled, and its function is to prevent the cleaning object from being damaged by the laser light temperature. The dry purification system (10) of the present embodiment integrally forms a structure transported by the transport device (10). Therefore, the above-described laser light cooler 123 is preferably used for using internal circulating refrigerant (especially > supercooled water) for laser light. Cooling cycle type, instead of the refrigerant introduced from the outside for laser light cooling. Laser beam transmission 13G to make adult 1 joint arm (10) culated arm); ^ sorrow, 忒 artificial joint arm by multiple rotating axes 135 and The mirror 134 is composed of. At this time, a corresponding mirror is assembled near each of the rotating shafts, and the laser beam can be remotely rotated according to the reflection of the laser beam. The laser beam irradiation device 14A of the present embodiment is not shown in Fig. 6. As in the prior art, the laser beam irradiation device is also composed of a laser beam amplifying portion 19 131 l264f6.doc 142, a laser beam shape adjusting portion 144, and The laser beam bunching portion 146 is composed of. However, in the present embodiment, the laser beam irradiation device 14 is formed into a right angle structure. Therefore, in order to change the irradiation direction of the laser beam, the mirror 114a is mounted on the laser beam irradiation device 140. The end of the laser beam illuminating device 140 is equipped with a sensor 149 which senses that the laser beam illuminating device 14 is in contact with any of the opposite bottom surfaces and sends a sensing signal to the integrated controller 124 of FIG. 5 but only senses The above contact can emit the laser beam B. # Under the action of the above sensor 149, any exposure of the laser beam and exposure of the laser beam are relieved of danger to the worker. In the present embodiment, the sensing benefit 149 is sensed to the bottom surface, and the surface of the slider 152 of the laser beam scanning device 150 described below is in contact with the laser beam irradiation device 14〇, and the sensing signal is sent to the integrated control. On the device, only the above contact is sensed, and the laser beam is irradiated to the object to be cleaned. The above sensor 14^ is a proximity sensor using a magnetic force, or a light sensor using light, or a gravity sensor that senses only the downward direction according to gravity. ~ • Laser beam _ device 15G is the portion that sweeps the laser beam; thereby purifying the cleaning object a probe card or test cradle that is moved parallel to the slider 152 of the Xy axis And guiding the sliding member 152 to slide the guiding fixture 154 _. In this case, the above-mentioned ^ 152 is connected to the end of the laser beam irradiation device 140, and the above-mentioned guide 154 is attached to any portion such as the base of the test seat plate. 〃 In accordance with a preferred embodiment of the present invention, the worker can horizontally deliver the laser beam by horizontally illuminating the slide beam illumination device 140 and manually sliding the slide 20 I31164i6fd〇c 152 according to manual operation. The device 140 is oriented in such a direction as to freely sweep the beam of the laser beam toward the two-dimensional plane of the parent axis and the gamma axis. At this time, the slider 152 slides inside the guide groove of the guide jig 154. Fig. 5 and Fig. 6, the purification process using the dry purification system 1 of the present embodiment will be sequentially explained as follows. First, the slider 152 mounts the slidable guide jig 54 to the cleaning object - test stand or probe card, and then fixes the end of the laser beam irradiation device 140 to the slider 152. Next, the contact state of the laser beam irradiation device 14A and the slider 152 is confirmed based on the sensing of the sensor 149. If the contact is recognized, the worker lowers the foot switch 114' to irradiate the object with the laser beam. Thereby implementing purification engineering. At this time, various commands required for purification can be input through the operation panel 112 before the above-described foot switch is operated. In addition, before the implementation of the above purification project, (4) the dry purification system is away from the cleaning object, the staff uses the conveying device 18〇 to transport the dry cleaning system 1GG to (4) the position where the laser light purification is performed, and then the worker brake controls the entire dry type. The operation of the purification system. The dry cleaning system of the present invention eliminates the need to disassemble the probe card and the test seat plate, and the laser light (4) is quick and effective and does not cause any waste of contamination of the wafer probe card and the test seat surface contact portion of the package. The material is dry cleaned. It is to be understood that the present invention may be modified and altered without departing from the spirit and scope of the invention. 21 131 l2_d〇c As described above, the dry cleaning apparatus of the present invention uses laser light to remove the pollutants of the object to be cleaned very quickly, and at the same time, dry purification can be realized, that is, in the process of removing pollutants, no generation occurs. Secondary pollutants such as sewage. / Ben Xinming's dry purification device, especially for semiconductor test slabs, is arguing that there is no need to disassemble the test seat, which is greatly improved compared with the original purification method using a soft brush (blush). The test bench's purification tool can improve test efficiency and save high production costs. In addition, the dry purification device of the present invention does not require disassembly of the test seat and performs purification very quickly, compared with the original chemical wet purification method. Since the cleaning automation process is simple, in the production of semiconductor components and the like, Greatly improved production efficiency. Further, according to the present invention, the worker can easily access the test device by the dry cleaning system through the conveying means on the frame, and lightly and repair the above dry cleaning system. * Further, according to the present invention, only the laser beam irradiation device and the cleaning image are in the opposite state of the village riding the thunder (four) beam. Therefore, it is necessary to avoid the injury of the laser beam by the staff. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a common test shoe for semiconductor component electrical test. FIG. 2 is a schematic diagram showing a dry cleaning system mode for dry cleaning a semiconductor test stand in an embodiment of the present invention. Figure. Fig. 3 is a schematic view showing the main part of the dry cleaning system of Fig. 2, which is a schematic diagram of a laser beam irradiation apparatus for irradiating a cleaning object with a beam of Ray 21 131 lM §.d〇c. Figure 4: Washing object—A simulation diagram of the semiconductor test board loaded into the dry system. Fig. 5 schematically illustrates a dry purification system of another embodiment of the present invention. Figure 6 is an enlarged view of a portion of the dry system. [Description of main component symbols] φ 1: dry purification system 10: integrated controller 20: laser light generating device 30: laser beam transmitting device 34: mirror " 35: rotating shaft 40: laser beam irradiation device 42: Ray Beam amplifying unit • 42a: concave mirror 42b: convex mirror 44: laser beam shape adjusting unit 44a: absorption mask 46: laser beam focusing portion 46a · · convex mirror 47: lifting device 23 ΒΙΙό^ρ^ 50 : Scanning device 52: video display 60: alignment identification device 72: laser beam shield 74: dust collector 74a: suction pump 74b: dust collecting portion 76: air jet device 76a: gas supply source 76b: gas flow controller 76c: Nozzle type gas injection portion 80: carrier device 82: cleaning station 82a: reinforcement member 82b: wheel 84: handle 100. test seat plate 102: sockets 102a, 102b, 102c: test sockets 103a, 103b, 103c: contact portion 104: handle 105 · Index hole 24 pif.doc 110 : Frame 112 : Operation panel 114 : Foot opening 117 : Handle 120 : Laser beam generating device 121 : Laser oscillator 122 : Power supply device 123 : Laser cooler 124 : General Controller Π0: laser beam transmission device 134: mirror 135: rotation axis 140: laser beam irradiation device 142: laser beam amplifying portion 144: laser beam shape adjusting portion 146: laser beam focusing portion 146a: mirror 149: sensor 150: laser beam Scanning device 152: Slider 154: Guide jig 180: Conveying device 25 13 1 1 646pif.doc B: Laser beam