TWI308952B - Heat pipe and method for making the same - Google Patents

Heat pipe and method for making the same Download PDF

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Publication number
TWI308952B
TWI308952B TW93127589A TW93127589A TWI308952B TW I308952 B TWI308952 B TW I308952B TW 93127589 A TW93127589 A TW 93127589A TW 93127589 A TW93127589 A TW 93127589A TW I308952 B TWI308952 B TW I308952B
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Taiwan
Prior art keywords
heat pipe
nano
substrate
working fluid
micro
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TW93127589A
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Chinese (zh)
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TW200609480A (en
Inventor
Ga-Lane Chen
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Hon Hai Prec Ind Co Ltd
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Priority to TW93127589A priority Critical patent/TWI308952B/en
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Description

1308952 九、發明說明: 【發明所屬之技術領域】 本發明係關於熱管及其製備方法。 【先前技術】 熱管係依靠自身内部工作流體相變實現導熱之導熱元件,其具有高導 熱性、優良等溫性等優良特性,導熱效果好,應用廣泛。 近年來電子技術迅速發展,電子器件之高頻、高速以及積體電路之密 集及微型化’使得單位容積電子器件發熱量劇增,熱管技術以其高效、緊 湊以及靈活可靠等特點’適合解決目前電子器件因性能提升所衍生之散熱 問題。 … 請參閱第一圖,典型熱管10由管殼11、吸液芯12(毛細結構)以及密封 於官内之工作流體13組成。熱管丨〇之製作通常先將管内抽成真空後充以適 當工作流體13,使緊貼管内壁之吸液芯12中充滿工作流體13後加以密封。 熱官10之一端為蒸發段l〇a(加熱段),另一端為冷凝段1〇b(冷卻段),根據 應用需要可在蒸發段10a與冷凝段l〇b之間設置絕熱段。當熱管1〇蒸發段1〇a 叉熱時吸液芯12中工作流體13蒸發氣化形成蒸氣ι4,蒸氣μ在微小壓力差 作用下流向熱管10之冷凝段l〇b,凝結成工作流體13並放出熱量15,工作流 體13再靠毛細作用沿吸液芯12流回蒸發段1〇a。如此循環,熱量15由熱管忉 之条發段10a不斷地傳至冷凝段i〇b,並被冷凝段1〇b一端之冷源吸收。 熱管10在實現導熱過程中,包含以下六個相互關聯之主要過程: (1) 熱量15從熱源通過熱管管殼11和充滿工作流體丨3之吸液芯12 給工作流體13 ; ^ (2) 工作液體13在蒸發段1 〇a内液—氣分介面上蒸發; (3) 蒸氣14從蒸發段1 〇a流到冷凝段1 〇b ; (4) 瘵氣14在冷凝段l〇b内氣-液分介面上凝結;1308952 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat pipe and a method of preparing the same. [Prior Art] A heat pipe is a heat-conducting element that realizes heat conduction by a phase change of its internal working fluid, and has excellent characteristics such as high heat conductivity, excellent isothermality, good heat conduction effect, and wide application. In recent years, the rapid development of electronic technology, the high frequency, high speed of electronic devices and the intensive and miniaturization of integrated circuits have caused the heat generation per unit volume of electronic devices to increase dramatically. The heat pipe technology is characterized by its high efficiency, compactness, flexibility and reliability. Thermal issues due to performance improvements in electronic devices. ... Referring to the first figure, a typical heat pipe 10 is composed of a casing 11, a wick 12 (capillary structure), and a working fluid 13 sealed in the office. The heat pipe is usually made by vacuuming the inside of the pipe and then filling it with a suitable working fluid 13, so that the wick 12 which is in close contact with the inner wall of the pipe is filled with the working fluid 13 and sealed. One end of the heat official 10 is an evaporation section l〇a (heating section), and the other end is a condensation section 1〇b (cooling section), and an adiabatic section can be disposed between the evaporation section 10a and the condensation section l〇b according to application requirements. When the heat pipe 1〇 evaporation section 1〇a fork heats, the working fluid 13 in the wick 12 vaporizes and vaporizes to form a vapor ι4, and the vapor μ flows to the condensation section l〇b of the heat pipe 10 under a slight pressure difference, and condenses into a working fluid 13 The heat is discharged 15 and the working fluid 13 flows back along the wick 12 to the evaporation section 1〇a by capillary action. In this cycle, the heat 15 is continuously transmitted from the strip section 10a of the heat pipe to the condensation section i〇b, and is absorbed by the cold source at one end of the condensation section 1〇b. The heat pipe 10 includes the following six main processes associated with each other during the heat conduction process: (1) The heat 15 is supplied from the heat source through the heat pipe casing 11 and the wick 12 filled with the working fluid 丨3 to the working fluid 13; ^ (2) The working fluid 13 evaporates on the liquid-gas interface in the evaporation section 1 〇a; (3) the vapor 14 flows from the evaporation section 1 〇a to the condensation section 1 〇b; (4) the helium 14 is in the condensation section l〇b Coagulation on the gas-liquid interface;

、(5)熱罜15從氣—液分介面通過吸液芯12、工作液體13犮管殼π傳给A(5) The heat enthalpy 15 is transmitted from the gas-liquid interface through the wick 12, the working fluid 13 犮 the shell π to the A

源; T 咖⑹在吸液幻2内由於毛細作用使冷凝後之工作流體丨3回流到蒸發段Source; T coffee (6) in the liquid absorbing magic 2 due to capillary action, the condensed working fluid 丨3 is returned to the evaporation section

Claims (1)

1308952 &ϊ, 12. 2 0 十、申請專利範圍: 1. 一種熱官,其包括一中空管殼及密封於管殼内之工作流體,其中該管殼 内壁形成有複數均勻排列之微小凹陷,該微小凹陷之直徑、深度具有奈 米級尺寸’每相鄰兩個微小凹陷之間距為奈米級尺寸,其具有毛細作用。 2. 如申請專利範圍第1項所述之熱管,其十該微小凹陷之軸向截 形、V形、U形、弧形或梯形。 3. 如申清專利fc圍第1項所述之熱管,其中該微小凹陷直徑、深度以及相 鄰兩凹陷之間距範圍均為2〜50奈米。 4. 如申請專利範圍第3項所述之熱管,其中該微小凹陷直徑與凹陷之 優選為10〜40奈米。 5. 如巾請專概圍第1項所述之婦,其巾該管㈣壁上形成有—声太 粉體材料。 s不'、 6. 如申請專利麵第5項所述之鮮,其巾該奈米粉體材料包括二氧化 矽、三氧化二鋁或其組合。 7. 如申請專利範圍第5項所述之熱管,其中該奈米粉體材料厚度為卜加奈 米。 不 8·如申請專利範圍第5項所述之熱管,其中該奈米粉體材料厚度為m奈 米。 75 9. 如申請專利範圍第1項所述之熱管,其中該工作流體包括純水、氨水 曱醇、丙1¾、庚烧。 卞 10. 如2請專利範圍第9項所述之熱管’其中該工作流體進—步包括懸浮方 液態工作流體中之導熱材料微粒。 心' 11. 如^青專利範圍第10項所述之熱管,其中該導熱材料微粒包括銅粉… 米石反官、奈米碳球或内部填充有奈米級銅粉之奈米碳管、奈米碳球。 12. -種熱管製備方法,其包括步驟:提供一基片;於基片—表 數财凹陷,該微小凹陷之直徑、深度具有奈米級尺寸,每相鄰兩侧 主、凹陷之間距為奈米級尺寸;將基片成型成管狀,使形成有微小凹陷 管之内表面;縣内抽成真空,再填充適量碎流體,最後於 10 1308952 13.如申請專利範圍第 銘'鐵或不鏽鋼。 9>V2>]2 %修(更)正替換頁 12項所述之熱管製備方法,其中基片材質包括銅、1308952 &ϊ, 12. 2 0 10. Patent application scope: 1. A thermal officer comprising a hollow casing and a working fluid sealed in the casing, wherein the inner wall of the casing is formed with a plurality of evenly arranged fine The depression has a diameter and a depth having a nanometer size 'the distance between each adjacent two minute depressions is a nanometer size, which has a capillary action. 2. The heat pipe according to claim 1, wherein the micro-recess is axially truncated, V-shaped, U-shaped, curved or trapezoidal. 3. The heat pipe of claim 1, wherein the diameter, depth and the distance between the adjacent depressions are both 2 to 50 nm. 4. The heat pipe according to claim 3, wherein the diameter and the depression of the micro-recess are preferably 10 to 40 nm. 5. If you want to cover the towel, please refer to the woman mentioned in the first item. The tube (4) has a sound-like powder material on the wall. s No, 6. The fresh-skinned material as described in claim 5, wherein the nano-powder material comprises cerium oxide, aluminum oxide or a combination thereof. 7. The heat pipe of claim 5, wherein the nano-powder material has a thickness of buckner. The heat pipe of claim 5, wherein the nano-powder material has a thickness of m nanometer. 75. The heat pipe of claim 1, wherein the working fluid comprises pure water, ammonia sterol, C13, and gamma.卞 10. The heat pipe of claim 9, wherein the working fluid advance comprises a thermally conductive material particle in the suspended liquid working fluid. 11. The heat pipe according to claim 10, wherein the heat conductive material particles comprise copper powder... a rice stone counter-actuator, a nano carbon ball or a carbon nanotube filled with a nano-sized copper powder, Nano carbon ball. 12. A method for preparing a heat pipe, comprising the steps of: providing a substrate; and in the substrate-table number sag, the diameter and depth of the micro-depression have a nanometer size, and the distance between the main and the concave sides of each adjacent side is Nano-size; the substrate is formed into a tubular shape so that the inner surface of the micro-recessed tube is formed; the county is evacuated and filled with a proper amount of crushed fluid, and finally at 10 1308952. 13. As claimed in the patent specification, 'iron or stainless steel . 9>V2>] 2% repair (more) is the replacement method of the heat pipe according to the item 12, wherein the substrate material comprises copper, 14. 如申請專利範圍第12項所述之熱管製備方法,其中在基片_表面上 小友小凹陷之方法包括奈米壓印。 成 15. 如申明專利範圍第丨2項所述之熱管製備方法,其中奈米壓 驟:製模及壓印。 i栝步 16·如申請專利範圍第15項所述之熱管製備方法,其中壓印方法為熱壓印。 17.=申請專利範圍第12項所述之熱管製備方法,其中於基片—表面上形成 複數微小凹陷後,再於該表面上形成一層奈米粉體材料。 /14. The method of preparing a heat pipe according to claim 12, wherein the method of small depression on the substrate_surface comprises nanoimprinting. 15. The method for preparing a heat pipe according to claim 2, wherein the nanocompression is: molding and imprinting. The method of preparing a heat pipe according to claim 15, wherein the embossing method is hot stamping. 17. The heat pipe preparation method according to claim 12, wherein a plurality of micro-pits are formed on the surface of the substrate, and then a layer of nano-powder material is formed on the surface. / 18·如申#專利範圍第17項所述之熱管製備方法,其中該奈米粉 二氧切、三氧化二减其組合。 19·如申請翻難抓項所述之歸製備絲,其巾該奈錄體材料厚度 為1〜20奈米。 20·如申$翻範_12項所述之鮮製備絲,其帽基#成型成管狀之 方法包括將基片卷起並焊接。The heat pipe preparation method according to Item 17, wherein the nano powder is dioxic and trioxide reduced in combination. 19. If the application of the refractory item is as follows, the thickness of the material is 1 to 20 nm. 20. The method of forming a tubular base into a tubular shape according to the method of claim 12, comprising rolling the substrate and welding. 1111
TW93127589A 2004-09-10 2004-09-10 Heat pipe and method for making the same TWI308952B (en)

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TWI308952B true TWI308952B (en) 2009-04-21

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