1307262 九、發明說明： 【發明所屬之技術領域】 種真空密封 本發明係關於一種熱傳導結構，尤關於 且利用内容液體傳熱之熱傳導結構。 【先前技術】 構。 請參閱第四圖，揭露有一既有的主動循環式水冷結 既有的主動循環式水冷結構大多歸-產生熱量的晶 片（90)上’其包括有一接觸於該晶片（9㈠且具 入液口（ 8 1 )與出液σ ( 8 2 )的水箱（8 〇 )，^ 水箱（"）的入液口（81)與出液口（82)上：二 別裝設有一輸液營n 5丨μ 8 3 )，該輸液管（8 3 )係連_ :-幫_(圖中未示）’使-液體不停的自入液 U灌注進入該水箱（80)，同時自出液口（82 ^ 出該水箱（8 Ω、，並u_嫌丄 < j排 量。8〇)藉此帶走該晶片（9〇)所產生的熱 然而該既有的主動循環式水冷結構 破壞晶片（9 〇 )以；5 $日 此因為漏水而 愈々 該晶片（9 ◦)週邊的電子开株·^ 電路，需要非常注意設備的保養與檢查，造==或 便與麻煩。 k成使用上的不 構。“閱第五圖，揭露有-既有的密閉水冷式熱傳導結 種 為避免上述主動循環式水冷結構的缺點，另有 1307262 有的密閉水冷式熱傳導結構，其一 置有散熱液體…、 捃閉且於其内部容 m ( 7 〇 )的金屬水箱本體 (86)上形成有一 "6)，該本體 面（86… 接觸…熱晶片（90)的平 使用該既有的密閉水冷式熱傳導結構 液體（7〇)卟拥Ψ 係藉由散熱 …、較向的特性快迷吸收來自曰 的埶量，輿腺日日片（9 0 ) 的”、、里#將所吸收的熱量藉由散熱液體（ 核散布於該本體（8 6)的其 抓 在曰Kron、 以促進散熱的效果，· 日日 9 〇 )產生的熱量較大，使.、田声妒一士 :90)的散熱液體（7〇)吸取更多的熱量而發生 =化’進而形成氣泡（71)在液面處釋出，另提供一 額外的散熱效果。 但是該密閉水冷式熱傳導結構僅有在晶片（9 〇 )所 產生的熱量足以使局部的散熱液體（7 ◦)達到7 〇 ^以 上時’才能夠形成氣泡（7 i )而增進散熱效果，顯見且 在使用方面有一待改善之處。 【發明内容】 有鑒於上述既有的密閉水冷式熱傳導結構待改善之 處，本發明之目的在於提供一在低溫即可增強散熱效果的 熱傳導結構。 為達到上述目的’本發明所採取之技術手段係令本發 明之熱傳導結構包括有： 一密閉金屬水箱，其形成有一吸收前述晶片熱量的底 1307262 出至少一空氣塔；該等空氣塔係連 面，且於其頂部向上凸 通於該水箱内部； 散‘’、、液體’係谷置於前述水箱内部，且該散熱液體 之體積恰使其液面位於該水箱的空氣塔處，且將空氣技中 未被該散熱液體所填滿的部分係施以抽氣負壓處理，^空 氣塔中呈-負壓或近似真空的狀態； 料’係塗佈於前述水箱底面與該晶片之間，其係 用以提兩塗佈處的傳熱效率，使晶片所產生的熱量，能夠 更有效的藉由4塗料傳導到該水箱内部的散熱液體，使散 熱液^在低溫即可產生氣泡，進而提供額外的散熱效果； 其中該塗料之成分，如美國專利US 5,814,392所揭 露包括有一溶劑、一膠體以及一建構孔隙之微粒物質； 該塗料係呈液態或半液態。 刖述塗料之膠體係黏著該微粒物質且可溶於該溶劑 中，該微粒物質/膠體的比例係每公撮膠體含2-15公克 微粒物質’同時該溶液佔全體85_98%。1307262 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat conducting structure, and more particularly to a heat conducting structure utilizing heat transfer of a content liquid. [Prior Art] Structure. Please refer to the fourth figure, which discloses an existing active circulating water-cooled junction. The active circulating water-cooling structure mostly returns to the heat-generating wafer (90), which includes a contact with the wafer (9 (1) and has a liquid inlet ( 8 1 ) with the water tank (8 )) of the effluent σ ( 8 2 ), ^ the inlet port (81) and the liquid outlet (82) of the water tank ("): two infusion tanks are installed.丨μ 8 3 ), the infusion tube (8 3 ) is connected to the _:-help _ (not shown) to allow the liquid to continuously perfuse the liquid U into the water tank (80), while the liquid outlet (82 ^ out of the water tank (8 Ω, and u_ 丄 丄 < j displacement. 8 〇) to take away the heat generated by the wafer (9 〇), but the existing active circulating water-cooled structure damage The wafer (9 〇) is used for the 5 日 日 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 The above is not constructed. "Look at the fifth picture, revealing that there are existing closed water-cooled heat conduction types to avoid the shortcomings of the above-mentioned active circulating water-cooled structure, and another 1307262 A hermetic water-cooled heat-conducting structure, which is provided with a heat-dissipating liquid, is closed, and has a "6) formed on a metal water tank body (86) having a m (7 〇) inside thereof, the body surface (86...contacting...heating The wafer (90) is flattened using the existing closed water-cooled heat-conducting structure liquid (7〇). The heat is absorbed by the heat-absorbing system, and the relative characteristics are quickly absorbed. 0) The ",, ## will absorb the heat generated by the heat-dissipating liquid (the core is scattered on the body (8 6), which is caught in the 曰Kron to promote heat dissipation, · 9 〇 日) Large, so., Tian Shengyi: 90) The heat-dissipating liquid (7〇) absorbs more heat and then becomes 'chemical' and then forms bubbles (71) to be released at the liquid level, providing an additional heat dissipation effect. . However, the closed water-cooled heat conduction structure can only form bubbles (7 i ) to increase the heat dissipation effect when the heat generated by the wafer (9 〇) is sufficient to cause the local heat-dissipating liquid (7 ◦) to reach 7 〇 ^ or more. And there is room for improvement in terms of use. SUMMARY OF THE INVENTION In view of the above-mentioned existing sealed water-cooled heat conduction structure to be improved, it is an object of the present invention to provide a heat conduction structure which can enhance the heat dissipation effect at a low temperature. In order to achieve the above object, the technical means adopted by the present invention is such that the heat conducting structure of the present invention comprises: a sealed metal water tank formed with a bottom 1307262 absorbing the heat of the wafer; at least one air tower; the air towers are connected And protruding upwardly from the top of the tank to the inside of the water tank; the diffused '', liquid' valley is placed inside the water tank, and the volume of the heat-dissipating liquid is such that the liquid level is located at the air tower of the water tank, and the air is The portion of the technology that is not filled with the heat-dissipating liquid is subjected to suction negative pressure treatment, and the air tower is in a state of -negative pressure or near vacuum; the material is applied between the bottom surface of the water tank and the wafer, It is used to improve the heat transfer efficiency of the two coatings, so that the heat generated by the wafer can be more effectively transmitted to the heat-dissipating liquid inside the water tank by the 4 coating material, so that the heat-dissipating liquid can generate bubbles at a low temperature, and further Providing an additional heat-dissipating effect; wherein the composition of the coating, as disclosed in US Pat. No. 5,814,392, includes a solvent, a colloid, and a particulate material that constructs the pores; Or semi-liquid. The gum system of the coating adheres to the particulate material and is soluble in the solvent. The particulate matter/colloid ratio is 2-15 grams of particulate matter per centimeter colloid' while the solution is 85-98% of the total.
月J it/谷劑係選自下列包括丙酮、Fc_72、以及FC-87 的群組。 月J过·;谷劑係異丙醇（i sopropy 1 a 1 coho 1 )。 月】述’谷劑係甲基乙基鲷（me thy 1 e thy 1 ketone )。 月〗述膠體係聚合物（polymer )。 月）述躍'體係選自下列包括紫活化膠（violet activated glUe)以及環氧膠（epoxy glue，即epoxy resin環氧樹 脂）的群組。 6 1307262 :述膠體係-可傳熱的環氧化物 :迷膠體係一可刷擦的陶究膠。 刖述微粒物質選自下列包括金屬 0 月’J述微粒物質選自下列包括銀 石的群組。 』述彳政粒物質選自下列包括碎屑狀微粒、圓球狀微 粒、以及不規則狀微粒的群組。The monthly J it/troche is selected from the group consisting of acetone, Fc_72, and FC-87. Month J over; the trough is isopropanol (i sopropy 1 a 1 coho 1 ). Month] The gluten is methyl 鲷 (me thy 1 e thy 1 ketone ). The month of the gel system polymer (polymer). The month) system is selected from the group consisting of violet activated glUe and epoxy glue (epoxy resin). 6 1307262 : Gel system - heat transferable epoxide: a gelatin system, a brushable ceramic. The particulate matter selected from the group consisting of the following is a group of particulate matter selected from the group consisting of silverstone. The granules are selected from the group consisting of crumb-like particles, spherical granules, and irregular particles.
合金、以及陶瓷的 銅、鋁、鐵、以及鑽 群組 前述微粒物質的個別微粒尺寸在50 y m以下。 前述微粒物質的個別微粒尺寸在8-12// m以下。 前述微粒物質的個別微粒尺寸係1 -3 g m。 前述微粒物質在1公撮膠體之中約含有15公克以下。 前述微粒物質在1公撮膠體之中約含有1 〇公克以下。 前述微粒物質在1公撮膠體之中約含有5公克以下。 前述微粒物質在1公撮膠體之中約含有3.75公克以 下。Alloys, as well as ceramics of copper, aluminum, iron, and drill groups The individual particle sizes of the aforementioned particulate matter are below 50 μm. The individual particle size of the aforementioned particulate matter is 8-12/m or less. The individual particle size of the aforementioned particulate matter is 1-3 g. The above particulate matter contains about 15 g or less in 1 cm of colloid. The above particulate matter contains about 1 gram or less in 1 metric colloid. The above particulate matter contains about 5 g or less in 1 cm of colloid. The above particulate matter contained about 3.75 grams or less in a 1 metric colloid.
前述微粒物質在1公撮膠體之中約含有2公克。 前述塗料之溶劑、膠體以及微粒物質之間的比例係 10ml:0. lmi:0. 2-1. 5g，亦即 1〇 公撮：〇. 1 公撮：〇. 2-1. 5 公克。 前述塗料之溶劑、膠體以及微粒物質之間的比例係 10inl:0，liiil: i.5g〇 前述塗料之溶劑、膠體以及微粒物質之間的比例係 85-98%(v/v): 〇.5-2%(v/v): 1.5-15%(w/v)。 7 1307262 前述微粒物質選自下列包括銀屑、鑽石微粒以及銅微 粒的群組。 使用本創作之熱傳導結構時，該塗料增加了核沸騰 (nucleate boiling)的區域、降低所需的起啟始過熱 (superheat )、以及提高核沸騰熱傳遞係數（heat transfer coefficient)與臨界熱通量（critical heat f lux ’ CHF) 〇 因此，該晶片所產生的熱量係有效的藉由該塗料傳導 到該水箱内部的散熱液體，使散熱液體在低溫即可產生氣 泡’因該等氣泡係散熱液體吸取大量的熱量而發生相變化 的結果，能夠更有效的傳導熱量；此時該等氣泡在前述位 於空氣塔之液面處釋出，另可進行高效率的散熱以排除前 述晶片所產生的熱量’以在低溫增強散熱效果。 【實施方式】 請參閱第-至三圖，分別揭露有本發明第一實施例之 使用示意側視圖、使用示意局部剖面圖及使用示意立體 圖。 本發明第一實施例之熱傳導結構係用以傳導一曰片 (9 〇 )所產生的熱量，且提供-散熱效果；本實施::之 熱傳導結構包括有··-密閉金屬水 體（7 0 )以及一塗料（2 ◦);其中.〇 )、-散熱液 該水箱（i 0)係一長方形箱體 述晶片熱量的底面（11)， 八肜成有一吸收前 氣塔（12);該等空氣塔（：其頂部向上凸出複數空 〈1 2 )係連通於該水箱（工 8 1307262 〇 )内部； 該散熱液體（7 0 )係容置於前述水箱（丄内部， 且該散熱液體（7 0 )之體積恰使其液面位於該水箱（工 〇)的空氣塔（12)處，且將空氣塔（12)中未被該 散熱液體（7 0 )所填滿的部分係施以抽氣負壓處理，使 空氟塔（12)中呈一負壓或近似真空的狀態； 該塗料（2 0 )係塗佈於前水箱（丄〇 )底面（丄工） 與該晶片（9 0 )之間，其係用以提高塗佈處的傳熱效率， 使晶片（90)所產生的熱量，能夠更有效的藉由該塗料 (2 0 )傳導到該水箱（i 〇 )内部的散熱液體（7 〇 )， 使散熱液體（7 0 )在低溫即可產生氣泡（7 i )，進而 提供額外的散熱效果； 該塗料（2 0 )之成分包括有一溶劑（圖中未示）、 膠體（圖中未不）以及一建構孔隙之微粒物質（圖中未 不），該塗料（2 0 )係、呈液態或半液態，且在本實施例 中，該溶劑、膠體以及微粒物質之間的比例係 UmlJ. irol:1. 5g ’亦即1〇公撮：〇 ^公撮：i 5公克； 其中該溶劑係異丙醇，該膠體係可傳熱之環氧膠，該微粒 物質係為個別微粒尺寸在5 〇以m以下的銀屑。 使用本實施例之熱傳導結構時，該晶片（9 〇 )所產 生的熱量係有效的藉由該塗料（2 )傳導到該水箱（1 )内邛的散熱液體（7 〇)，使散熱液體（7〇)在低 二即可產生氣泡（71)，因該等氣泡（71)係散熱液 (7 〇 )吸取大量的熱量而發生相變化的結果，能夠更 9 1307262 有效的傳導熱量；此時马堃€、治广 吋孩等氣泡（7 1 )在前述位於空氣 塔（1 2)之液面處釋屮，玄可·、社 出 另了進仃尚效率的散熱以排除 前述晶片（90)所產生的熱量。 由上所述可瞭解本發明具體構造及使用方法，利用該 '纟料（2 0)改善該水箱（1 0 )與晶片（9 0 )之間的 . ㈣導效率’其確可提供-在低溫即可増強散㈣果的熱 傳導結構。 根據本發明可作之不同修正及變化對於熟悉該項技術 籲者而言均顯然不會偏離本發明的範圍與精神。雖然本發明 已敘述特定的較佳具體事實，必須瞭解的是本發明不應被 不當地限制於該等特定具體事實。在實施本發明之已述模 式方面，對於所屬領域中具有通常知識者而言顯而易知之 不同修正亦被涵蓋於申請專利範圍之内。 【圖式簡單說明】 第一圖：係本發明第一實施例之使用示意侧視圖。 籲第二圖：係本發明第-實施例之使用示意局部剖面 圖。 第一圖·係本發明第一實施例之使用示意立體圖。 第四圖：係一既有的主動循環式水冷結構。 第五圖：係一既有的密閉水冷式熱傳導結構。 【主要元件符號說明】 (丄〇)水箱 （11)底面 10 1307262 (1 2 )空氣塔 （2 (7 Ο )散熱液體 （7 (8 0 )水箱 （8 (8 2 )出液口 （8 (86)金屬水箱本體（8 (9 0 )晶片 0 )塗料 1 )氣泡 1 )入液口 3 )輸液管 6 1 )平面The aforementioned particulate matter contained about 2 g in a 1 mm colloid. The ratio of the solvent, colloid, and particulate matter of the above coating is 10 ml: 0. lmi: 0. 2-1. 5 g, that is, 1 〇 撮: 〇. 1 撮: 〇. 2-1. 5 gram. The ratio between the solvent, the colloid and the particulate matter of the aforementioned coating is 10inl:0, liiil: i.5g, the ratio between the solvent, the colloid and the particulate matter of the aforementioned coating is 85-98% (v/v): 〇. 5-2% (v/v): 1.5-15% (w/v). 7 1307262 The aforementioned particulate matter is selected from the group consisting of silver shavings, diamond particles, and copper microparticles. When using the heat transfer structure of the present invention, the coating increases the area of nucleate boiling, reduces the required superheat, and increases the heat transfer coefficient and critical heat flux. (critical heat f lux ' CHF) 〇 Therefore, the heat generated by the wafer is effective to transfer the heat-dissipating liquid to the inside of the water tank by the coating, so that the heat-dissipating liquid can generate bubbles at a low temperature. As a result of the phase change caused by the absorption of a large amount of heat, the heat can be more effectively conducted; at this time, the bubbles are released at the liquid level at the air tower, and heat can be efficiently dissipated to eliminate the heat generated by the wafer. 'To enhance the heat dissipation effect at low temperatures. [Embodiment] Referring to Figures 1-3, a schematic side view, a schematic partial cross-sectional view, and a schematic perspective view of a first embodiment of the present invention are respectively disclosed. The heat conduction structure of the first embodiment of the present invention is for conducting heat generated by a cymbal (9 〇) and providing a heat dissipation effect; the present embodiment: the heat conduction structure includes a closed metal water body (7 0 ) And a coating (2 ◦); wherein 〇), - heat sink, the water tank (i 0) is a rectangular box body of the bottom surface of the wafer heat (11), the gossip into an absorption front gas tower (12); The air tower (the top of which protrudes upward from the complex space <1 2 ) is connected to the inside of the water tank (Worker 13 1307262 ;); the heat dissipating liquid (70) is housed inside the water tank (the inside of the tank, and the heat dissipating liquid ( The volume of 7 0 ) is such that the liquid level is located at the air tower (12) of the water tank (the working chamber), and the portion of the air tower (12) that is not filled with the heat-dissipating liquid (70) is applied. The suction negative pressure treatment causes the empty fluorine column (12) to be in a state of negative pressure or near vacuum; the coating (20) is applied to the bottom surface of the front water tank (丄) and the wafer (9) Between 0), it is used to improve the heat transfer efficiency at the coating, so that the heat generated by the wafer (90) can be more effectively utilized. The material (2 0 ) is radiated to the heat dissipating liquid (7 〇) inside the water tank (i 〇), so that the heat dissipating liquid (70) can generate bubbles (7 i ) at a low temperature, thereby providing an additional heat dissipating effect; The composition of 20) includes a solvent (not shown), a colloid (not shown), and a particulate material (not shown) which is constructed in a liquid or semi-liquid state. And in this embodiment, the ratio between the solvent, the colloid, and the particulate matter is UmlJ. irol: 1. 5g', that is, 1〇公撮:〇^公撮: i 5g; wherein the solvent is isopropanol The glue system can transfer heat to the epoxy glue, and the particulate matter is silver chips having an individual particle size of 5 〇 or less. When the heat conduction structure of the embodiment is used, the heat generated by the wafer (9 〇) is Effectively, the heat-dissipating liquid (7 〇) is transmitted to the water tank (1) by the coating material (2), so that the heat-dissipating liquid (7〇) can generate bubbles (71) at the lower two, because the bubbles (71) ) The result is that the heat sink (7 〇) absorbs a large amount of heat and changes phase, which can be more 9 1307262 The heat of conduction; at this time, the bubbles (7 1 ) of the horses, the gongs and the children (7 1 ) are released at the liquid level of the air tower (1 2), and the Xuanke·she has another heat sink. In order to eliminate the heat generated by the aforementioned wafer (90). The specific configuration and use method of the present invention can be understood from the above, and the 'tank (20) is used to improve the between the water tank (10) and the wafer (90). (d) Conductivity 'which does provide - a heat transfer structure that can be dissipated at a low temperature. The different modifications and variations that can be made in accordance with the present invention are apparent to those skilled in the art without departing from the invention. Scope and spirit. Although the present invention has been described in terms of specific preferred embodiments, it should be understood that the invention should not be Various modifications that are obvious to those of ordinary skill in the art are also intended to be included within the scope of the claims. BRIEF DESCRIPTION OF THE DRAWINGS First FIG.: is a schematic side view showing the use of the first embodiment of the present invention. 2 is a schematic partial cross-sectional view showing the use of the first embodiment of the present invention. First Fig. is a schematic perspective view showing the use of the first embodiment of the present invention. The fourth picture: an existing active circulating water-cooled structure. Figure 5: An existing closed water-cooled heat transfer structure. [Main component symbol description] (丄〇) Water tank (11) bottom surface 10 1307262 (1 2 ) Air tower (2 (7 Ο) heat-dissipating liquid (7 (8 0) water tank (8 (8 2) liquid outlet (8 ( 86) metal water tank body (8 (90) wafer 0) paint 1) bubble 1) liquid inlet 3) infusion tube 6 1) plane
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