1305552 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種以電鑄製程製作金屬結構之技術， 、表疋關於—種以抬舉製程製作微穿孔電鑄金屬結構之方 法及其結構。 乃 【先前技術】 • …、有U牙孔陣列之電鑄金屬結構，見於中華民國91 「V躺月揭不之中華民國專利公開第508271號之發明專利 ::嘴霧裝置」。該液體噴霧裝置係具有貯液部，用以，宁 振動源，將貯液部之液體供給到前端部；以及筛 牛’具有多個微細穿孔配置頂接於振動源之前端部端 。’=振_及“構件之振動作用使貯部之液體霧 俜A呈IT 述專利之筛孔構件係以電鑄技術形成，而其 …”、”有微穿孔陣列之電鑄金屬結構。 、 φ :構類似於上述筛孔構件之具有微穿孔陣列之結構， 糸心用於噴墨印表機之 s 土〜比西樂或吳谷樂水之喷霧器、 :色=墨水喷液器等。而以習知技術製作微穿孔陣列之 作矜穿1=有’⑴基板材以感應耦合電漿（icp)蝕刻製 射鑽孔製作微穿农έ士错， ^门刀于潯胰以雷 以及（3)利用圓柱狀之光阻凸塊結 構之電㈣法製作彳„孔結卿方法。 風、】H具有微穿孔陣列之金屬結構，亦應用於麥克 耳益及耳機等的聲音過濾之音頻調整功用及抵抗音圈 5 !3〇5552 磁场所產生之電磁波方面。其製作方法係有：⑴金屬材料 以感應_合電漿（ICP)餘刻製作微穿孔金屬結構；⑺聚酿 亞胺（polyimide )高分子薄膜以雷射鑽孔製作微穿孔結 構’辅以塗佈或滲雜導電材料；以及(3)利用圓柱狀之光阻 凸塊結構之電鑄方法製作微穿孔金屬結構等方法。 【發明内容】</ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; [Prior Art] • ..., electroformed metal structure with U-hole array, found in the Republic of China 91 "V lays down the invention patent of the Republic of China Patent No. 508271: mouth mist device". The liquid atomizing device has a liquid storing portion for supplying a liquid to the front end portion of the liquid portion, and a plurality of fine perforated portions for abutting the end portion of the vibration source. '=Vibration_ and the vibration of the member make the liquid smog A of the reservoir into the IT. The patented mesh member is formed by electroforming technology, and its...", an electroformed metal structure with a microperforated array. Φ: a structure having a microperforation array similar to the above-mentioned mesh member, and is used for an inkjet printer, a soil sprayer, a color sprayer, an ink sprayer, etc. Micro-perforation arrays are fabricated by conventional techniques. 1=There is a '(1) base plate with inductively coupled plasma (icp) etched and drilled to make micro-wearing farmer's mistakes. ^The doorknife is in the pancreas and thunder and 3) The method of making a hole-forming method using the electric (four) method of a cylindrical photoresist structure. Wind, H has a metal structure with a micro-perforated array, and is also applied to the audio adjustment function of the sound filtering of the microphone and headphones, and the electromagnetic wave generated by the magnetic field of the voice coil 5!3〇5552. The manufacturing method comprises the following steps: (1) making a micro-perforated metal structure by using a metal-based material (ICP); (7) preparing a micro-perforated structure by laser drilling with a polyimide polymer film. a cloth or a permeable conductive material; and (3) a method of fabricating a micro-perforated metal structure by an electroforming method using a cylindrical photoresist structure. [Summary of the Invention]
本發明所欲解決之技術問題： 揭示於中華民國公開第5〇8271號發明專利篩孔構件之 各微細穿孔各具有-人液端與—喷液端，因其製程所致，該 入液端與該喷液端係為不平滑之結構’而其半徑之變化亦不 ，漸變之形式。具有此類型微細穿孔之篩孔構件易肇生之問 題即是，液體由該人液端經該微細穿孔自該喷液端喷出時， 極易產生喷液不均之情況。並且，亦極不易掌其喷液情況及 «效果的-致性。另外，上述專利並未揭示該種具有微穿 孔陣列電鑄金屬結構之詳細製程流程，致習於此項技術 不能得知其製程方法。 再者，以習知技術製作應用於喷液裝置之微穿孔 闕具有成本昂貴之缺點，而以高分子材製成之筛 孔構件具妓料命較短之缺點。彻陳狀之光阻凸塊結 構之電鑄方法f作微穿孔結構，存在著圓柱狀光阻凸塊Μ 擁有水平方向尺寸精度（criticaI dimension)以及垂直方口向 尺寸精度（她itlnck順—„)之問題而影響微穿結構 -Ϊ305552 另外’製作應用於音頻調整及抵抗電磁波方面亦存在 有如上之缺點，而以其八 本抓'皆 回刀子製作微穿孔結構再輔以塗佈或 _導電倾製程’亦增加製程之繁複性及耗費成本。 二此入本务明之主要目的即是提供一 種具有微穿孔陣 列之電鑄金屬結構，並係 穿孔結構具有-人液端構陣列，其中各微 徑’且各微穿孔結構之半徑變化為自半徑較大 者漸縮變化至半徑較小者。 干〃杈人 本發明之另^一目的pfj η h 孔電鑄金屬結構之方法，種以抬舉製程製作微穿 電铸金屬結構之方法。4衣作具有微細穿孔洞陣列之 結構Sr之又；目的即是提供一種製作微穿孔電鑄金屬 結構。/ 4作具有精確孔徑精度之電鑄微穿孔金屬 • 本發明解決問題之技術手段： 本發明爲解決習知技術之問題所採用之技術手段 楗t、一種以抬舉製程製作 ’、 括下列步驟··於—基材本〜穿^電^屬結構之方法，包 材料層之待移除區形成材料層，·去除該 材本體及唁材ϋ 、V 土材本體之陣列；於該基 層亚去除該材料層表 去除树抖 矣品π 〇、曰 > 積4屬層’以於該基材本體之 表面形成具有複數個穿孔孔润之才^體之 洞具有一預定办痒. 償盘屬層，且各穿孔孔 -— 見X n儿積金屬層表面與該些穿孔孔洞 7 1305552 分界之側壁形成-電鑄金屬層，且該電禱金屬層形成於該 些穿孔孔洞之孔洞側壁處之沉積厚度係小於該預定寬度之 一半以形成具有微穿孔陣列之電鑄金屬結構。 於本發明之較佳實施例中，該基材本體係可為玻璃基 板、石夕基板或南分子材基板，而該材料層係為一光阻層。 亚且’本發明更於該模具結構之沉積金屬層表面形成有一 銳化膜，以利於後續之脫模步驟。 • /本發明更提供—種具有微穿轉列之電鑄金屬結構， 〃係具有-第-表面、—第二表面與複數個微穿孔結構， f微穿孔結構於該第—表面具有„[開孔半徑，且於該 弟二表面具有一第二開孔半經，其特徵在於該第一開孔^ 從大於該第二開孔半徑’並且各微穿孔結構之半徑係由該 第一開孔半徑漸縮變化至該第二開孔半徑。 本發明對照先前技術之功效：The technical problem to be solved by the present invention is as follows: each of the fine perforations of the invention patent hole member disclosed in the Republic of China Publication No. 5,8271 has a human liquid end and a liquid discharge end, and the liquid inlet end is caused by the process thereof. The structure of the liquid spray end is not smooth, and the radius does not change, and the form of the gradation. The problem that the mesh member having such a fine perforation is easy to be produced is that when the liquid is ejected from the liquid end through the fine perforation, the liquid discharge unevenness is liable to occur. Moreover, it is also extremely difficult to handle the liquid spray situation and the effect of the effect. In addition, the above patent does not disclose a detailed process flow for such an electroformed metal structure having a micro-perforation array, and it is not known in the art that the process method is known. Further, the microperforation used in the liquid ejecting apparatus by the prior art has the disadvantage of being expensive, and the sieve member made of a polymer material has the disadvantage of a short crutches. The electroforming method of the photoresist-like bump structure is a micro-perforated structure, and there are cylindrical photoresist bumps Μ with horizontal dimension accuracy (criticaI dimension) and vertical square port size accuracy (she itlnck shun-„ The problem affects the micro-piercing structure - Ϊ305552. In addition, there are some shortcomings in the application of audio adjustment and anti-electromagnetic waves, and the eight perforated knives are made into micro-perforated structures and then coated or _conductive. The process of dumping also increases the complexity and cost of the process. The main purpose of this process is to provide an electroformed metal structure with a micro-perforated array, and the perforated structure has an array of human liquid end structures, in which each micro The diameter 'and the radius of each microperforated structure is changed from a larger radius to a smaller radius. The method of the invention is another method of pfj η h hole electroforming metal structure of the invention. The method for manufacturing a micro-through electroformed metal structure is as follows: 4 is a structure Sr having a fine perforated hole array; the purpose is to provide a micro-perforated electroformed metal structure. Electroformed micro-perforated metal with precise aperture precision. Technical means for solving the problem of the present invention: The technical means adopted by the present invention to solve the problems of the prior art 、t, a method for making a lifting process, includes the following steps: The method of forming a material structure of the substrate, the material layer to be removed, forming a material layer, removing the material body and the array of the material of the material ϋ, V, and removing the material layer from the base layer The table removes the tree 矣 〇, 曰 积 积 积 积 积 以 以 以 以 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该Each of the perforated holes - see the surface of the X n erected metal layer and the sidewalls of the perforated holes 7 1305552 form an electroformed metal layer, and the electric metal layer is formed at the sidewall of the hole of the perforated hole Less than one half of the predetermined width to form an electroformed metal structure having a microperforated array. In a preferred embodiment of the present invention, the substrate may be a glass substrate, a stone substrate or a southern molecular material substrate, and the material Layer system A photoresist layer. The present invention further forms a sharpening film on the surface of the deposited metal layer of the mold structure to facilitate the subsequent demolding step. • / The present invention further provides an electroforming with micro-transformation a metal structure, the lanthanide has a -first surface, a second surface and a plurality of microperforated structures, and the f microperforated structure has a [opening radius] on the first surface and a second opening on the surface of the second surface The semi-period is characterized in that the first opening ^ is larger than the second opening radius ' and the radius of each micro-perforated structure is gradually changed from the first opening radius to the second opening radius. The present invention compares the efficacy of the prior art:
镇冬屬I於見有技術，本發明之以抬舉製程製作微穿孔電 二槿陲、。構之方法，係可製備出具有精確孔徑精度微穿孔 不相等之入液端與噴液端，有半徑互 較大者漸縮變化至半徑較小者，並且，由於本發明 =穿孔陣列之電鑄金屬結構之微細穿孔The town of Winter is a technology known in the art, and the present invention uses a lifting process to produce micro-perforated electricity. The method of constructing can prepare the liquid inlet end and the liquid discharge end which have unequal micro-perforations with precise aperture precision, and the radius has a larger radius to gradually change to a smaller radius, and, due to the invention, the electric power of the perforated array Fine perforation of cast metal structure
構，應用於喷液裝置時，可+ γ A ''D 液效果的—致性。 凡易達心液均勾且掌握其嘴 1305552 【實施方式】 請參閱第—圖至第八圖，其係顯示本發明以 製作微穿孔電轉全屬处据—+ +氣矛王 ^屬、、、口構之方法較佳實施例各步驟之結構 同時參閱第九圖，其係顯示本發明以抬舉製 發明將進-步揭亍=法流程圖。如圖所示，本 方法（以下簡稱為本方法）。 傅之 圖所不’百先提供—基材本體1 (步驟101)， 為 ==丄係'為玻璃基板，板等硬質基材，亦可 體11表面=寺軟質基材。如第二圖所示，於該基材本 之表面形成—村料声2 ιλ〇、 用中，竽姑料Μ 〇 > " 力“ 102)。本發明於實際應 咳材^ / S係、可為高分子材製成之光阻層，而形成 潰=層2之方式係可為旋轉塗佈法（SpinC〇atmg)或浸 3具二=二提供一光罩3 (步驟叫而該光罩 黃光微影技術透過該光罩3 ^ 32 ’接著以 ι〇4)後，去除該透头Λ 層進行曝光（步驟 (步驟105)，、而㈣品乂 31底下材料層2之曝光區域 光區域，使域32Μ材料層2之未曝 列。吏邊存之材枓層2形成突出於該基材本體！之陣 形成該基材本體1及該材料層2之表面 氣相j二驟1〇6),而該形成方法係™ …（）或化學氣相沉積（咖）等技術。 1305552 ^所示’去除該材料層2且同時去除形成於該 =之/積金屬層4 (步驟⑽），而保㈣成於該基材本 J二上之沉積金屬層4 ’以於該基材本體！之表面形成且 有稷數個穿孔孔洞41之笋人 ^ .. ^ 之/儿積金屬層4,且各穿孔孔洞41 ，、有一預定寬度w (步驟] 程⑴讀p—)」 上述之步驟即為「抬舉製 如第六圖所示’進行鈍化製程使沉積金屬層4之各表 純化膜5 (步驟則，再如第七圖所示’以該沉 4為電鑄起始層’進行電缚製程使該純化膜$之 ==穿孔軸分界之侧壁處411形成一電铸金屬 :广11〇)，且该電鑄金屬層6形成於該些穿孔孔洞 -八孔洞侧壁處411之沉積厚度（係小於該預定寬度w之 -刀 — 〇 P由於該基材本體1係為不導電之材料所製成，故該電 鑄金屬層6僅由導電之鈍化膜 6 . 便"玄电鑄金屬層6形成旦有 ^個穿孔之微結構，並藉以控制該些微穿孔之孔^大 如第八圖所示，本方法進行 m入厘μ 1 進订脱膜使该電禱金屬層6與 積=層4、該銳化膜5及該基材本體丨分離卿 112)成具有微穿孔陣列之電鑄金屬結# 61 (步驟 舉圖與第十一圖，其係分別顯示本發明以抬 牛h衣作U牙孔電鑄金屬結構之方法所製作之電鑄金屬 1305552 結構之立體圖及其1M1斷面圖。如圖所示，該電禱金屬 層6形成之電鑄金屬結構61具有一第一表面61丨與一第二 表面612 禱金屬結構61並具有複數個微穿孔結構 62，其中該微穿孔結構62位於該第一表面6ιι亘有一第一 開孔⑵’其係具有-第-開孔半徑…而該微穿孔結構 =位於該第二表面612具有—第二開孔奶，其係具有一 弟一開孔半徑r2。 ，並且，該第一開孔半徑rl係大於該第二開孔半徑 r，亚且該微穿孔結構62之半徑係由該第—開孔半徑η 化至該第二開孔半徑…另外，該第二表面州具 穿結構63 ’其係伴隨本發明以抬舉製程製作微 屬結構之方法，錄據咖積金屬層4之厚度 一r例之以:參閱第十一圖與第十四圖’如圖所示，此 例21 結構4之結構設計大致上與前一實施 例相同，故相同之槎件π妙__ 庫。1…乃払不相同之元件編號，以資對 異在於該沉積金屬層32之厚度為極薄，而該第 ^產:。⑶人結構44係依據該沉積金屬層32之厚度 製作微穿孔Γ貫施例可知，本發明之以抬舉製程 精〜穿孔社：直-結構之方法，係可製備出具有高孔徑 了月度微穿孔結構陣列之電 之利用價值。 屬、、、。構’亚確實具有產業上 明，，僅爲切^料實施例說 _凡白于此項技術者當可依據本發明之上述實施例說明 1305552 而這些依據本發明實施例 於本發明之發明精神及界 而作其他種種之改良及變化。然 所作的種種改良及變化，當仍屬 疋之專利範圍内。 【圖式簡單說明】 第一圖至第八圖係顯示本發明 立 乃知彳土貫施例各步驟之結構示 忍圖， •帛九圖係顯示本發明以抬舉製程製作微穿孔電鑄金屬結構 之方法流程圖； 第十圖係顯示本發明具有微細穿孔洞陣列之電鱗金屬結構 之立體圖一； 第十一圖係顯示第十圖之u_u斷面之剖視圖； 第十一圖係顯示本發明具有微細穿孔洞陣列之電鑄金屬結 構之立體圖二； 第十二圖係顯示第十二圖之13-13斷面之剖視圖； • 第十四圖係顯示第十三圖中A圖示部分之擴大視圖。 【主要元件符號說明】 1 基材本體 2 材料層 3 光罩 31 透光區域 32 阻光區域 4 沉積金屬廣 — 12 1305552 41 411 5 6 61 611 612 • 62 621 622 63 rl r2 t w 穿孔孔洞 孔洞侧壁處 鈍化膜 電鑄金屬層 電每金屬結構 第一表面 第二表面 微穿孔結構 第一開孔 第二開孔 凹入結構 第一開孔半徑 第二開孔半徑 預定寬度 沉積厚度 13Structure, when applied to the liquid spray device, can be + γ A ''D liquid effect.凡易达心液 hooks and grasps its mouth 1305552 [Embodiment] Please refer to the first to eighth figures, which show the invention to make micro-perforation electric transfer all-inclusive data - + + gas spear king ^, The structure of the steps of the preferred embodiment of the preferred embodiment is also referred to the ninth figure, which shows that the invention will be further improved by the method of lifting the invention. As shown in the figure, this method (hereinafter referred to as the method). The figure of Fu is not provided by the first substrate (step 101), and the ==丄 system is a hard substrate such as a glass substrate or a plate, and the surface of the body 11 can be a soft substrate. As shown in the second figure, the surface of the substrate is formed - the sound of the village material 2 ιλ〇, in use, 竽 Μ Μ 〇 〇 &>" force "102). The present invention should actually cough material ^ / S The system can be a photoresist layer made of a polymer material, and the method of forming the collapse layer 2 can be a spin coating method (SpinC〇atmg) or a dip 3=2=2 to provide a mask 3 (step is called After the reticle yellow lithography technology passes through the reticle 3^32' and then ι〇4), the enamel layer is removed for exposure (step (step 105), and (4) the exposed area of the material layer 2 under the 乂31 The light region is such that the domain 32 is not exposed to the material layer 2. The layer 2 of the material layer is formed to protrude from the substrate body to form a matrix gas phase of the substrate body 1 and the material layer 2 1〇6), and the forming method is a technique such as TM ... () or chemical vapor deposition (coffee). 1305552 ^ Show 'removing the material layer 2 and simultaneously removing the metal layer 4 formed on the = (step (10)), and (4) the deposited metal layer 4' formed on the substrate of the substrate is formed on the surface of the substrate body! and has a plurality of perforated holes 41. ^ / / The metal layer 4, and each of the perforated holes 41, has a predetermined width w (step) (1) read p -)" The above steps are "lifting system as shown in the sixth figure" passivation process to deposit Each surface of the metal layer 4 is purified film 5 (step, and as shown in the seventh figure, 'the sink 4 is an electroforming starting layer' is subjected to an electrical binding process to make the purified film $== the sidewall of the perforation axis boundary The portion 411 forms an electroformed metal: 11 Å), and the electroformed metal layer 6 is formed at the thickness of the perforated hole-eight-hole sidewall 411 (the knives are smaller than the predetermined width w- The substrate body 1 is made of a non-conductive material, so the electroformed metal layer 6 is only made of a conductive passivation film 6. The thin metal layer 6 of the electroformed metal layer 6 has a perforated microstructure. The pores for controlling the microperforations are as large as shown in the eighth figure, and the method performs the method of removing the film into the film to make the metal layer 6 and the layer 4, the sharpening film 5 and the substrate. The body is separated into the electroformed metal junction #61 having a microperforated array (steps are shown in FIG. 11 and FIG. 11 respectively, which show the present invention to raise the cow h A perspective view of a structure of an electroformed metal 1305552 made by a method for electroforming a metal structure of a U-hole, and a 1M1 cross-sectional view thereof. As shown, the electroformed metal structure 61 formed by the electric metal layer 6 has a first surface. 61丨 and a second surface 612 are fused to the metal structure 61 and have a plurality of micro-perforation structures 62, wherein the micro-perforation structure 62 is located on the first surface 6ι with a first opening (2)' having a -first-opening radius The microperforated structure = located on the second surface 612 has a second apertured milk having a radius of opening r2. And the first opening radius rl is greater than the second opening radius r, and the radius of the micro-perforated structure 62 is η from the first opening radius to the second opening radius... In addition, the The second surface state wearing structure 63' is accompanied by the method of the present invention for fabricating a microgen structure by an elevation process, and the thickness of the metal layer 4 is recorded as follows: see the eleventh and fourteenth drawings. As shown in the figure, the structural design of the structure 4 of this example 21 is substantially the same as that of the previous embodiment, so that the same components are the same. 1... is a different component number, in that the thickness of the deposited metal layer 32 is extremely thin, and the first production: (3) The human structure 44 is formed according to the thickness of the deposited metal layer 32. It can be seen that the method of the present invention can be used to prepare a monthly micro-perforation with a high aperture. The value of the use of electrical arrays. Genus, ,,. The structure of the invention is indeed industrially known, and is merely an embodiment of the invention. The person skilled in the art can explain 1305552 according to the above embodiment of the present invention, and these embodiments of the present invention are based on the inventive spirit of the present invention. And other improvements and changes in the world. However, all the improvements and changes made are still within the scope of the patent. BRIEF DESCRIPTION OF THE DRAWINGS The first to eighth figures show the structure of the steps of the various embodiments of the present invention. The nine-nine diagram shows that the present invention produces micro-perforated electroformed metal by a lift process. FIG. 11 is a perspective view showing a scale metal structure of the present invention having a fine perforated hole array; FIG. 11 is a cross-sectional view showing a u_u section of the tenth figure; A perspective view of an electroformed metal structure having a fine perforated hole array; a twelfth view showing a cross-sectional view taken along line 13-13 of the twelfth figure; and a fourteenth drawing showing a portion of the figure A in the thirteenth figure Expanded view. [Main component symbol description] 1 Substrate body 2 Material layer 3 Photomask 31 Light-transmitting region 32 Light-blocking region 4 Deposited metal - 12 1305552 41 411 5 6 61 611 612 • 62 621 622 63 rl r2 tw Perforated hole hole side Wall passivation film electroformed metal layer electricity per metal structure first surface second surface microperforated structure first opening second opening concave structure first opening radius second opening radius predetermined width deposition thickness 13