TW200804627A - The method of manufacturing electroformed metal structure with micro porous array by laser ablation process - Google Patents

The method of manufacturing electroformed metal structure with micro porous array by laser ablation process Download PDF

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TW200804627A
TW200804627A TW95124411A TW95124411A TW200804627A TW 200804627 A TW200804627 A TW 200804627A TW 95124411 A TW95124411 A TW 95124411A TW 95124411 A TW95124411 A TW 95124411A TW 200804627 A TW200804627 A TW 200804627A
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metal layer
laser
stripping
array
micro
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TW95124411A
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Chinese (zh)
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TWI322835B (en
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Chun-You Lin
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Micro Base Technology Corp
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Abstract

The present invention relates to the method of manufacturing electroformed metal structure with micro porous array by laser ablation process. This method includes the following steps : (1) supply a substrate body to form a deposited metal layer on its surface; (2) form plural ablated pores with predefined width by using a laser beam emitted from a laser generator to ablate the predefined ablation area of the deposited metal layer; (3) use the deposited metal layer as the starting area of electroform to form the electroformed metal layer having a thickness less than half of the predefined width at the surface and the side wall which is the interface of deposited metal layer and ablated pores; (4) separate the electroformed metal layer from the deposited metal and the substrate body to form a electroformed metal structure with micro porous array.

Description

200804627 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種以電鑄製程製作具有微穿孔陣列之 金屬結構之技術’特別是關於一種以雷射剝除製程製作具 有微穿孔陣列之電鑄金屬結構之方法。 【先前技術】200804627 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a technique for fabricating a metal structure having a microperforated array by an electroforming process, particularly relating to a method for fabricating a microperforated array by a laser stripping process A method of casting a metal structure. [Prior Art]

查具有微穿孔陣列之電鑄金屬結構,見於中華民國% 年、11月揭示之中華民國專利公開第谓271號之發明專利 「液體噴霧裝置」。該液體嘴霧裝置係具有貯液部,用以貯 存液體;振動源,將貯液部之液體供給到前端部;以及筛 孔構件,具有多個微細穿孔配置頂接於振動源之前端部端 面,經由振動源及筛孔構件之振動作用使貯部之液體霧化。 揭不於上述專利之篩孔構件係以電鑄技術形成,而宜係 具有微穿孔陣列之電轉金屬結構。 ........ ,構類似於上述篩孔構件之具有微穿孔陣列之結構, 用於噴墨印表機之墨水®、醫藥或美容藥水之喷霧器、 及顏色染料墨水喷液器等。而以、 予而以白知技術製作微穿孔陣列 糸子在有·⑴基板材以感應耦合電漿蝕 刻製作微穿孔結構;⑺㈣亞胺^ . ./、水(ICP)姓 以(p yimide)高分子薄膜 境結構;以及(3)利用圓柱狀之光阻凸 塊、、,。構之電鑄方法製作微穿絲構等方法。 另外,具有微穿料狀金輕 揚聲器及耳機等的整w i再力應用於麥克風、 枝專的耳曰過慮之音頻調整功用 5 200804627 場所產生之電磁波方面。其製作方法係有:(1)金屬材料以 乾式或溼式蝕刻製作微穿孔金屬結構;(2)聚醯亞胺 (polyimide)高分子薄膜以雷射鑽孔製作微穿孔結構,輔 以塗佈或滲雜導電材料;以及(3)利用圓柱狀之光阻凸塊結 構之電鑄方法製作微穿孔金屬結構等方法。 【發明内容】 本發明所欲解決之技術問題:Investigating an electroformed metal structure with a micro-perforated array, as disclosed in the Republic of China in November and November, the invention patent "Liquid Spraying Device" of the Republic of China Patent Publication No. 271. The liquid mist device has a liquid storage portion for storing a liquid, a vibration source for supplying the liquid of the liquid storage portion to the front end portion, and a mesh member having a plurality of fine perforation configurations for abutting the end surface of the vibration source The liquid of the reservoir is atomized by the vibration of the vibration source and the mesh member. The mesh member not disclosed in the above patent is formed by electroforming technology, and is preferably an electrically conductive metal structure having a microperforated array. ........ Structure with micro-perforation array similar to the above-mentioned mesh member, ink® for inkjet printer, sprayer for medical or cosmetic syrup, and color dye ink spray And so on. And the micro-perforated array of scorpions made by Baizhi technology is made of (1) base plate by inductively coupled plasma etching to make micro-perforated structure; (7) (4) imine ^ . . . , water (ICP) surnamed (p yimide) high Molecular film structure; and (3) using a cylindrical photoresist block, , . The electroforming method of the structure produces a micro-threading structure and the like. In addition, the whole w i with the micro-gear-shaped gold light speaker and earphones is applied to the microphone and the special deaf earphones for the adjustment function of the sound. 5 200804627 The electromagnetic wave generated by the place. The manufacturing method comprises the following steps: (1) preparing a micro-perforated metal structure by dry or wet etching of a metal material; (2) preparing a micro-perforated structure by laser drilling with a polyimide polymer film, supplemented by coating. Or a permeable conductive material; and (3) a method of fabricating a micro-perforated metal structure by an electroforming method using a cylindrical photoresist structure. SUMMARY OF THE INVENTION The technical problem to be solved by the present invention is as follows:

揭示於中華民國公開第508271號發明專利篩孔構件 之各微細穿孔各具有一入液端與一喷液端,因其製程所致, 該入液端與該喷液端係為不平滑之結構,而其半徑之變化 亦不為漸變之形式。具有此類型微細穿孔之篩孔構件易肇 生之問題即是,液體由該入液端經該微細穿孔自該喷液端 喷出時,極易產生喷液不均之情況。並且,亦極不易掌其 喷液情況及喷液效果的一致性。另外,上述專利並未揭示 該種具有微穿孔陣列電鑄金屬結構之詳細製程流程,致習 於此項技術者亦不能得知其製程方法。 再者,以習知技術製作應用於喷液裝置之微穿孔結構 中,ICP蝕刻具有成本昂貴之缺點,而以高分子材製成之 篩孔構件具有使用壽命較短之缺點。利用圓柱狀之光阻凸 塊結構之電鑄方法製作微穿孔結構,存在著圓柱狀光阻凸 塊結構擁有水平方向尺寸精度(critical dimension)以及垂 直方向尺寸精度(total thickness variation)之問題而影響 微穿結構之孔徑精度。 200804627 另外,製作應用於音頻調整及抵抗電磁波方面亦存在 缺點’而以高分子製作微穿孔結構再輔以塗佈或 珍料電材料製程,亦增加製程之繁複性及耗費成本/ 因此,本發明之主要目的即是提供一種以_ 程製作具有微穿孔陣列之f轉金屬結構之方法 = 具有微細穿孔_狀電鑄金屬結構之方法,更具作 即製作微穿孔結構為平滑結構,且具一:°Each of the fine perforations disclosed in the invented patented mesh member of the Republic of China Publication No. 508271 has a liquid inlet end and a liquid discharge end, and the liquid inlet end and the liquid discharge end are not smooth due to the process. And the change in its radius is not in the form of a gradient. The problem that the mesh member having such fine perforation is easy to be produced is that when the liquid is ejected from the liquid discharge end through the fine perforation from the liquid discharge end, uneven liquid discharge is likely to occur. Moreover, it is also extremely difficult to handle the spray condition and the consistency of the spray effect. In addition, the above patent does not disclose a detailed process flow for such a micro-perforated array electroformed metal structure, and the method of the process is not known to those skilled in the art. Further, in the microperforation structure applied to the liquid ejecting apparatus by the conventional technique, ICP etching has the disadvantage of being expensive, and the mesh member made of a polymer material has a drawback of a short service life. The micro-perforation structure is fabricated by electroforming of a cylindrical photoresist structure, and there is a problem that the cylindrical photoresist structure has a horizontal dimension and a vertical thickness variation. The aperture accuracy of the micro-piercing structure. 200804627 In addition, there are also shortcomings in the production of audio adjustment and resistance to electromagnetic waves. The fabrication of micro-perforated structures by polymers is supplemented by the process of coating or precious materials, which also increases the complexity and cost of the process. The main purpose of the invention is to provide a method for fabricating a f-transferred metal structure having a microperforated array by a method of forming a fine perforated-shaped electroformed metal structure, and more preferably forming a microperforated structure as a smooth structure, and having a :°

端,該入液端與該喷液端係為不等;徑,且各 :㈣化為自半徑較大者漸縮變化至半徑較小者:方 本务明解決問題之技術手段·· 本=爲解決f知技術之問題所採用之技 種”射剝除製程製作具有微穿孔陣列之電鑄全ίThe end of the liquid inlet end and the liquid discharge end are different; the diameter: and each: (4) is gradually changed from a larger radius to a smaller radius: the technical means to solve the problem. = The technique used to solve the problem of knowing the technology. "The stripping process is made by electroforming a micro-perforated array."

:::方法,包括下列步驟:提供-基材本體,並於其表 面形成一沉積金屬層;以一帝、 除該沉積金屬声之、阳—矣卜、雷射光束剝 定寬度之剝二5 域,以形成複數個具有-預 1表:乃同’以該沉積金屬層為電鑄起始區域,於 二=積金,該些剥除孔洞分界之側壁形成二 兩斧入二:.、4預疋見度—半之電鑄金屬層;以及,使該 微穿孔陣狀電私屬結構。材本體刀“成具有 本發明之較佳實施例中’更包括以 束進行調制形成剝除雷射光束之步驟,並且更包括:= 200804627 沉積金屬層之表面形成—鈍化 金層層與沉積金屬層之分離。另/驟,以利於後續電禱 基材本體係可為玻璃^ 脈衝式雷射產生器,且該 了為玻喊板、⑪基板、高分子材基板之-。 本發明對照先前技術之功效: 相較於現有技術,本發 微穿孔陣列之電禱金屬結構製程製作具有 出具有微穿孔結構_之1 且精密製備 構具有半徑互不相等1=屬結構’其中各微穿孔結 之半徑變化Α自本y Λ魏端’且各微穿孔結構 =本發明之製程方法製備出之具有微二 屬吉構之微細穿孔係為平滑之結構,應用㈣液穿^ 達成喷液均句且掌握其嘴液效果的一致 生之電磁波。 、心功用及抵抗音圈磁場所產 【實施方式】 立凊參閱弟-圖,其係顯示本發明之雷射剝除裝 思圖。如圖所示,本發明 ν、 束W…裔1發射-雷射光 ΐ光束ΐ 經—光罩2之調制而形成-剝除雷 除先束,亚且以該剝除雷射光束L,對-加工件3進行剝 請參閱第二圖至第七圖,其係顯示本發明以雷射剝除 8 200804627 衣程製作具麵穿孔陣職鱗 各步驟之結構示意圖,並請同時夫_方法較佳實施例 發明以雷射剝除製程製 穿=圖,其係顯示本 ,程圖。如圖所示,本鱗金,之 製程製作具有微穿孔陣列 雷射剝除 為本方法)。 王屬、,口構之方法(以下簡稱The ::: method comprises the steps of: providing a substrate body and forming a deposited metal layer on the surface thereof; and removing the stripping width of the laser beam, the anode, the laser beam, and the stripping width of the laser beam 5 domains, to form a plurality of having - pre-1 table: the same as the deposition of the metal layer as the electroforming starting region, in the second = accumulation, the stripping of the sidewalls of the stripping holes form two axes into two: 4 pre-viewing—half of the electroformed metal layer; and, making the microperforated array of electrical structures. The material body blade "in the preferred embodiment of the invention" further comprises the steps of modulating the beam to form a stripped laser beam, and further comprising: = 200804627 surface formation of the deposited metal layer - passivation gold layer and deposition metal Separation of layers. Another/step to facilitate the subsequent electro-pray substrate. The system can be a glass pulsed laser generator, and the glass plate, the 11 substrate, the polymer substrate - the present invention The efficacy of the technology: Compared with the prior art, the micro-perforation array of the electric prayer metal structure process has a micro-perforated structure _1 and the precision fabrication has a radius unequal to each other 1 = genus structure 'where each micro-perforation knot The radius change is from the y Λ Wei end 'and each micro-perforated structure = the micro-permanent micro-perforation system prepared by the process method of the present invention is a smooth structure, and the application of (4) liquid-through ^ to achieve a liquid spray sentence And the electromagnetic wave that is consistent with the effect of the mouth liquid. The function of the heart function and the resistance of the voice coil magnetic field [Embodiment] 立凊 Refer to the brother-picture, which shows the laser stripping device of the present invention. , the present invention ν, beam W... idiot 1 emission-laser beam ΐ — — 调制 调制 调制 调制 调制 调制 调制 调制 调制 调制 调制 调制 光 调制 调制 调制 光 光 光 调制 调制 光 调制 调制 调制 调制 调制 调制 调制 调制 调制 调制 调制 调制 调制 调制 调制 调制 调制For the stripping, please refer to the second to seventh figures, which are schematic diagrams showing the steps of the steps of the laser stripping 8 200804627 for the production of the surface-punched array scales of the present invention, and the invention is also invented. The laser stripping process is used to form the punch-through pattern, which shows the plan and the process chart. As shown in the figure, the process of making the scale gold has a micro-perforated array laser stripping method. Method (hereinafter referred to as

件3 Π;;圖牛所Γ首先提供一基材本體31作為該加工 1卞J <基底(步驟1〇1),該其 / 石夕基板等硬質基板,亦可為二二,可為玻璃基板、 三圖所示,於該基材本體3〗7 軟f基板。如第 心卜… 士成方法係可為物理氣相沉積(P則 或化學氣相沉積(CVD)等技術。 :第四圖所示,以該雷射產生器i發射—雷射光束L 3 ’亚且以該光罩2對該雷射光束L進行調制(步 心104),而該光罩2具有至少—透光區域21與至少一阻 二區域22 ’牙透過該透光區域21之雷射光束l即形成該 剝除雷射光束L,。本方法即以該剝除雷射光束l,投射向該 沉積金騎32之較剝除區域(步驟1()5),並以該剝除 雷射光束L,在該沉積金屬層32之選定剝除區域進行剝除 以形成複數個具有一預定寬度w之剝除孔洞33 (步驟 106) 〇 如第五圖所示,進行鈍化製程使沉積金屬層32之各 表面形成一鈍化膜34 (步驟107)。再如第六圖所示,將該 沉積金屬層32通以電流,並以該鈍化膜34為電鑄起始區 9 200804627 域’於该純化膜34之表面形成一電鑄金屬層35(步驟l〇8), 且該電鑄金屬層35亦形成於該些剝除孔洞33之孔洞側壁 331 〇 由於該基材本體31係為不導電之材料所製成,故該 電鑄金屬層35僅由導電之鈍化膜34沉積。本方法並控制 該電鑄金屬層35之成長量,使該電鑄金屬層%形成於該The first substrate body 31 is provided as the substrate 1 (step 1〇1), and the hard substrate such as the stone substrate can also be two or two, which can be The glass substrate and the three figures show that the substrate body 3 is a soft f substrate. Such as the first heart... The method of the Shicheng method can be physical vapor deposition (P or chemical vapor deposition (CVD) and other technologies.: As shown in the fourth figure, the laser generator i is emitted - the laser beam L 3 The laser beam L is modulated by the mask 2 (step 104), and the mask 2 has at least a light-transmitting region 21 and at least one resisting region 22' through which the light-transmitting region 21 passes. The laser beam l forms the stripping laser beam L. The method is to strip the laser beam l and project to the stripping region of the depositing gold rider 32 (step 1 () 5), and Stripping the laser beam L, stripping the selected stripping regions of the deposited metal layer 32 to form a plurality of stripping holes 33 having a predetermined width w (step 106), as shown in the fifth figure, performing a passivation process The surface of the deposited metal layer 32 is formed into a passivation film 34 (step 107). As shown in the sixth figure, the deposited metal layer 32 is subjected to an electric current, and the passivation film 34 is used as an electroforming starting region 9 200804627 The field 'forms an electroformed metal layer 35 on the surface of the purification film 34 (step 〇8), and the electroformed metal layer 35 is also formed on the strips The electroformed metal layer 35 is deposited only by the conductive passivation film 34 except that the substrate side wall 331 of the hole 33 is made of a non-conductive material. The method controls the electroformed metal layer 35. The amount of growth, so that the electroformed metal layer is formed in the

些剝除孔洞33孔洞側壁331之沉積厚度t,小於該預定寬 度w之一半(步驟1〇9)。 ' 如第七圖所示,本方法使該電鑄金屬層35與該沉積 金屬層32及該基材本體31分離(步驟11〇),而形成具有 微穿孔陣列之電鑄金屬結構4 (步驟m )。 本方法於實際應用時,除了可使用搭配光罩之光罩式 雷射產生器,亦可使用不需搭配光罩使用之直寫式雷射產 生益。而該雷射產生器之雷射光束發射方式,係可為連續 式雷射’亦可以脈衝式雷射。 、 δ月食阅祕圍興弟十圖,其係分別顯示本發明以帝 剝除製程製作具有微穿孔陣列電鑄金屬結構之方法: 之電鑄金屬結構之立體圖及其1(MG剖視圖。如圖所= 該電鑄金屬層35形叙料金屬結構4具有 與-第二表面42,該電鑄金屬結構 、面 結構-其中該«孔結構43位於該第 第一開孔431,其係具有-第-開孔半徑,而軸I:: 構:3位於該第一具有-第二開孔43二 一弟二開孔半徑。 ,、你具' 200804627 亚且,該第一開孔半徑係大於 該微穿孔結構43之半河1孔’亚且 第二開孔半徑。另半徑漸縮變化至該 …其係伴隨本發明二表二=細人結構 電鑄金屬結構之方法,具有微穿孔陣列 生。 方法亚依據该沉積金屬層32之厚度而產 帝f參閱第十一圖與第十三圖’如圖所示,此一實施例 構4之結構設計大致上與前-實施例相同, =之構件乃標示相同之元件編號,以資對應 在於该沉積金屬層32之厚度為極薄,而 凹入結構則依據該沉積金屬層32之厚度而產生面42之 由以上較佳貫施例,本於明夕丨、/ + & 穿孔陣列之電禱金屬結構除,具有微 具有微穿孔結構陣列之電鑄金屬結構, ,互不相等之入液端與噴液端,且二= =變化為自半純大者_變化至半徑較小者。:且, 由於以本發明之製程方法製備出之具有睡士 屬結構之微細穿孔係為平滑之結構,應用二二=金 可輕易達成喷液均勻且掌握其噴液效果的—致性<。衣日守’ ,由上述之本發明實施例可知,本發明確具 利恥值。惟以上之實施例說明,僅爲本發明 P 龍明,凡習于此項技術者當可依據本發明之上述 :二:::他種種之改良及變化。然而這些依據本發明實 &例所作的種種改良及變化,當仍屬於本發明之發明= 200804627 及界疋之專利範圍内。 【圖式簡單說明】 第一圖係顯示本發明之雷射剥除裝置之示意圖· 第二圖至第七圖係顯示本發明較佳實施例 意圖; 、”構The deposition thickness t of the sidewalls 331 of the stripping holes 33 is less than one half of the predetermined width w (steps 1 and 9). As shown in the seventh figure, the method separates the electroformed metal layer 35 from the deposited metal layer 32 and the substrate body 31 (step 11A) to form an electroformed metal structure 4 having a microperforated array (steps) m). In this application, in addition to the reticle type laser generator with a reticle, it is also possible to use a direct-write laser that does not need to be used with a reticle. The laser beam emission mode of the laser generator can be either continuous laser or pulsed laser. , δ 食 阅 秘 围 围 围 围 围 兴 , , , , , , , , δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ 十 十 十 十 十 十 十 十 十 十 十 十 十Figure = the electroformed metal layer 35-shaped metal structure 4 has a - second surface 42, the electroformed metal structure, the surface structure - wherein the «hole structure 43 is located in the first opening 431, which has - the first opening radius, and the axis I:: structure: 3 is located in the first having the second opening 43 and the second opening aperture radius. , , you have ' 200804627 亚, the first opening radius a radius larger than the half hole of the micro-perforated structure 43 and a second opening radius. The other radius is gradually changed to the same as the method of the present invention, which has a micro-perforation along with the method of electroforming a metal structure of the fine human structure. The method is based on the thickness of the deposited metal layer 32. Referring to the eleventh and thirteenth drawings, the structural design of the fourth embodiment is substantially the same as that of the previous embodiment. The component of = is labeled with the same component number to correspond to the deposited metal layer 32. The thickness is extremely thin, and the recessed structure generates the surface 42 according to the thickness of the deposited metal layer 32. The above preferred embodiment is based on the electric prayer metal structure of the 穿孔 丨, / + & perforated array. An electroformed metal structure having an array of micro-perforated structures, which are unequal between the liquid inlet end and the liquid discharge end, and the second == change is from semi-pure to larger _ change to a smaller radius. The fine perforation system with the structure of the sleeping genus prepared by the method of the invention has a smooth structure, and the application of the second and second gold can easily achieve the uniformity of the liquid spray and grasp the effect of the liquid discharge effect. It can be seen from the above embodiments of the present invention that the present invention has a shame value. However, the above embodiments are merely illustrative of the present invention, and those skilled in the art can use the above-mentioned invention: :: various improvements and variations of the invention. However, various modifications and variations made in accordance with the present invention are still within the scope of the invention of the invention = 200804627 and the patents of the boundary. [Simplified illustration] The figure shows the laser stripping device of the present invention Schematic diagrams of the second embodiment to the seventh embodiment show preferred embodiments of the present invention;

第八圖=示本發明以雷射剝除製程製作具有微穿孔陣列 兒鑄金屬結構之方法流程圖; J 第九圖=本發明具有微穿孔陣列之電鑄金屬結構之立 =十圖係顯示第九圖中1(MG斷面之剖視圖; 第十—圖軸示本發❹有微穿孔陣列之電鑄金屬 一貫施例之立體圖; ^十二圖係顯示第十—圖中12_12斷面之剖視圖; 弟十二圖係'顯示第十二圖中A圖示部分之擴大視圖。 【主要元件符號說明】 2 3 31 32 33 331 雷射產生器 光罩 加工件 基材本體 沉積金屬層 剝除孔洞 孔洞侧壁 12 200804627Figure 8 is a flow chart showing a method for fabricating a metal structure having a microperforated array by a laser stripping process according to the present invention; J ninth graph = the electroformed metal structure having a microperforated array of the present invention = ten graph display In the ninth figure, 1 (a cross-sectional view of the MG section; the tenth-axis shows a perspective view of the electroformed metal of the present invention with a micro-perforated array; ^12 shows the section of the tenth-figure 12_12 Sectional view; Twelve diagrams' shows an enlarged view of the portion of the diagram in Figure 12. [Main component symbol description] 2 3 31 32 33 331 Laser generator mask processing workpiece substrate body deposition metal layer stripping Hole hole sidewall 12 200804627

34 純化膜 35 電鑄金屬層 4 電每金屬結構 41 第一表面 42 第二表面 43 微穿孔結構 431 第一開孔 432 第二開孔 44 凹入結構 L 雷射光束 L, 剝除雷射光束 t 沉積厚度 w 預定寬度34 Purified film 35 Electroformed metal layer 4 Electrical per metal structure 41 First surface 42 Second surface 43 Microperforated structure 431 First opening 432 Second opening 44 Concave structure L Laser beam L, stripping laser beam t deposition thickness w predetermined width

1313

Claims (1)

200804627 、申請專利範圍: 之電鱗金屬結 L種以雷射剝除製程製作具有微穿孔陣列 構之方法,包括下列步驟: (a) 提供一基材本體; (b) 於该基材本體之表面形成—沉積金屬層; 積金屬層 ⑷以一雷射產生器發射一雷射光束投射:該沉 之選定剝除區域; 該沉積金屬層之選定剝除區域進行剝 寬度;/成複數個剝除孔洞,且各剝除孔洞具有一預定 (e)=“積金屬層為電鑄起始區域,於該沉積金屬層之 積金屬難些剝除孔洞分界之側壁形成 伽I I層,且該電鑄金屬層形成於該些剝除孔洞 1 土之沉積厚度係小於該預定寬度之一半· .⑴金屬層與該沉積金屬層及該騎本體分離, /成具有微穿孔陣列之電鑄金屬結構。 利犯_ 1項所述之以雷射剝除製程製作具有 t陣列之電轉金屬結構之方法,其中步驟⑻之基材 本體係玻璃基板、石夕基板、高分子材基板之一。 3’ 請專利範圍f 1項所述之以雷射剝除製程製作具有 U牙孔陣列之電鑄金屬結構之方法,其巾該雷射產生器 14 200804627 係 直寫式雷射產生器。 4.專利範圍第1項所述之以f射剝除製程製作呈有 =:=鱗_之方法,其中該雷射產生、器 該雷射料騎_^^步We)t更包細—光罩對 % 5.:;=利範圍第1項所述之以雷射剝除_^ =孔=之電鑄金屬.結構之方法,其中 = 括於该沉積金屬層之表面形成一銳化膜之步驟。 6.作具有 係為一連續構之方法,其中該雷射產生器 •如申凊專利範圍第1項所、+、 … 微穿孔陣列之電鱗金屬^ ^射剝除製程製作具有 係為一脈衝式雷射產生器 °構之方法,其中該雷射產生器 15200804627, the scope of the patent application: The method for fabricating a micro-perforated array by a laser stripping process comprises the following steps: (a) providing a substrate body; (b) providing a substrate body a surface-deposited metal layer; a metal layer (4) emitting a laser beam by a laser generator: a selected stripping region of the sink; a stripping width of the selected stripping region of the deposited metal layer; Except for the holes, and each stripping hole has a predetermined (e) = "the metal layer is an electroforming starting region, and the metal of the deposited metal layer is difficult to strip the sidewall of the hole to form a gamma II layer, and the electricity is formed. The cast metal layer is formed on the stripping holes 1 and the deposited thickness of the soil is less than one half of the predetermined width. (1) The metal layer is separated from the deposited metal layer and the riding body, and is formed into an electroformed metal structure having a microperforated array. The method for producing an electro-rotation metal structure having a t-array according to the laser stripping process described in the above, wherein the substrate of the step (8) is one of the glass substrate, the stone substrate, and the polymer substrate. A method for fabricating an electroformed metal structure having a U-hole array by a laser stripping process as described in the patent scope f1, wherein the laser generator 14 200804627 is a direct-write laser generator. The method of the f-spraying process described in the first item of the range is to produce a method with =:=scales, wherein the laser is generated, and the laser is mounted on the _^^step We)t. % 5.:;= The method of laser stripping _^ = hole = electroformed metal as described in item 1 of the benefit range, wherein = step of forming a sharpening film on the surface of the deposited metal layer 6. A method for fabricating a continuous structure, wherein the laser generator, such as the first paragraph of the patent scope of the application, +, ... the micro-perforation array of the scale metal ^ ^ stripping process has a system A pulsed laser generator method, wherein the laser generator 15
TW95124411A 2006-07-04 2006-07-04 The method of manufacturing electroformed metal structure with micro porous array by laser ablation process TW200804627A (en)

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