1304242 玫、發明說明： 【發明所屬之技術領域】 一 本發明係㈣—種半導體元件測試用之測試裝置，特別 是一種用於該測試裝置之測試銜接基板。 【先前技術] 「般半導體㈣（如球格陣列（BGA)元件）在製造完 成後眉i過一測試步驟以確保其品質，該測試步驟通常 係利用-自動分類機（Handler)來達成。該自動分類機 包括-測試機台（Tester)、―電路^載板（LQadB〇ard)、 一測試座（S0cket)及一測試銜接基板（δ〇_ Base)。 該測試銜接基板係用謂_待測試半導體元件定位至該 測4座▲私路承載板係用以承接該測試座，該電路承載 板具有t子電]^，以透過該測試座而與該半導體元件電氣 連接。該測試機台係用以承接該電路承載&，且接受該電 路承載板傳來之測試訊號。由於該自動分類機係自動化進 行測試，因A，定纟該半導體元件之測試銜接基板便顯得 重要。 參考圖1 ’顯示習用測試銜接基板i之立體示意圖，該 測試銜接基板1係位於測試座2之上，其具有一開口 u， 咸開口 11暴露該測試座2，以將該待測試半導體元件3 定位至該測試座2。 參考圖2 ’顯示待測試半導體元件3被帶入習用測試銜 接基板1 <示意圖。當該自動分類機置放該待測試半導體 7C件3時，其疋位並不是每次都十分準確，也就是說該待1304242 Mei, invention description: [Technical field of the invention] A invention (4) - a test device for testing semiconductor components, in particular, a test adapter substrate for the test device. [Prior Art] "General Semiconductor (4) (such as a Ball Grid Array (BGA) component) has passed a test step to ensure its quality after manufacturing is completed. This test step is usually achieved by using an -Automatic Handler. The automatic sorting machine includes a tester, a circuit board (LQadB〇ard), a test stand (S0cket), and a test adapter substrate (δ〇_Base). The test semiconductor component is positioned to the test 4 seat ▲ private circuit carrier board for receiving the test socket, the circuit carrier board has a t sub-electrode to electrically connect to the semiconductor component through the test socket. It is used to receive the circuit bearing & and accept the test signal from the circuit carrier board. Since the automatic sorting machine is automatically tested, it is important to determine the test connection substrate of the semiconductor component because of A. 1 ' shows a schematic view of the conventional test connection substrate i, which is located above the test stand 2, has an opening u, and the salty opening 11 exposes the test stand 2 to the half to be tested The body member 3 is positioned to the test stand 2. Referring to Fig. 2' shows the semiconductor element 3 to be tested being brought into the conventional test adapter substrate 1 < schematic view. When the automatic sorter places the semiconductor 7C to be tested 3, Bits are not very accurate every time, that is to say
0\87\87141.DOC *6- 1304242 測4半導體元件3並無法每次都可以很精準地被置入該 開口 1 1 rV·· — u内’因此會發生待測試半導體元件3之角落碰撞 到成'則試銜接基板1之角落之情事，如圖中之區域A所 π，因而造成待測試半導體元件3之損壞及增加機台校正 之頻率。 、因此，有必要提供一創新且富進步性的測試銜接基板， 以解決上述問題。 【發明内容】 二本發明之主要目的係提供一種半導體元件測試用之測 j街接基板，以用於一自動分類機中，並將一待測試半導 月旦7〇件疋位至一測試座，該測試銜接基板包括：一 接基板本體及-導引裝置^測試銜接基板本❹有至^： -"口。該導引裝置係置於該第一開口内，並且有一 弟二開口 ’以容置該半導體㈣，該第二開口係由四㈣ 精此’當該自動分類機置放該待測試半導體元件的過程 中’如果其^位並不準確時，待測試半導體元件之角落备 石亚撞到該斜面，然後順著該斜面被導人該第二開口，而: 會造成待測試半導體元件之損$ 、 性。 钡壞，且可増加機台之穩定 側：所界定，每一該内侧壁皆具有一向外傾斜之斜面，使 茲弟二開口形成一由上而下漸行縮小之構形。 L貫施方式0\87\87141.DOC *6- 1304242 Measure 4 semiconductor component 3 can not be placed into the opening 1 1 rV·· - u very accurately every time 'Therefore, the corner collision of the semiconductor component 3 to be tested occurs When it is reached, the situation of connecting the corners of the substrate 1 is as shown in the area A of the figure π, thereby causing damage to the semiconductor component 3 to be tested and increasing the frequency of the machine calibration. Therefore, it is necessary to provide an innovative and progressive test connection substrate to solve the above problems. SUMMARY OF THE INVENTION The main object of the present invention is to provide a j-segment substrate for testing semiconductor components for use in an automatic sorting machine, and clamp a semi-conducting moon-shaped device to be tested to a test stand. The test connection substrate comprises: a connection substrate body and a guiding device ^ test connection substrate to the ^: -" mouth. The guiding device is disposed in the first opening, and has a second opening 'to accommodate the semiconductor (4), the second opening is four (four) fine. When the automatic sorting machine places the semiconductor component to be tested During the process, if the position of the semiconductor component is not accurate, the corner stone of the semiconductor component to be tested hits the slope, and then the second opening is guided along the slope, and the damage of the semiconductor component to be tested is caused. , sex. It is smashed and can be added to the stable side of the machine: as defined, each of the inner side walls has an outwardly inclined slope, so that the two openings form a top-down configuration. L consistent way
O:\87\8714I.DOC 1304242 7之上，其包括： 42 ° 測試銜接基板本體41及一導引裝置 、該測試銜接基板本體41具有一第一開P 411，以容置 泛導引裝置42。孩導引裝置42係置於該第-開口 411内， 在本貝她例中$導W裝置42之四個外側壁421與該測試 銜接基板本體41之四個内側壁412相密合，且利用螺絲 5將该導引裝置42鎖固於該測試銜接基板本體41上，然 而在耳他應財，可以利用其他方式將該㈣裝置42固、 走於遠測试銜接基板本體4 1内。 该導引裝置42具有一第二開口 422，當該導引裝置 鎖固於該測試銜接基板本體41上之後暴露該測試座7, 且用於將待測試半導體元件6定位至該測試座7。在本實 施例中’該第二開口 4 2A、 2係為万形外觀且由四個内側壁 423所界定，而在其他應用+，該第二開口可以其他外形 主現。孩導引裝置42之四個角落更包括一貫穿結構似， 其係用以提供該導引裝置42之角落與該半導體元件之角 落間之間隙’在本實施例中，該貫穿結構似係為圓形外 觀。 參考圖4’其顯示待測試半導體元件6被帶人本發明第 一實施例之測試銜接基板4之示意圖。該導引裝置“之 每-内側壁423具有一向外傾斜之斜面（_) 424，使 該第二開口 422形成-由上而下漸行縮小之外觀。當該自 動分類機置放該待測試半導體元件6的過程中，如果其定 位並不準確時，待測試半導體元件6之角落會碰撞到該斜Above the O:\87\8714I.DOC 1304242 7, which comprises: a 42 ° test adapter substrate body 41 and a guiding device, the test adapter substrate body 41 having a first opening P 411 for receiving the pan guiding device 42. The child guiding device 42 is disposed in the first opening 411, and in the example of the present invention, the four outer side walls 421 of the guiding device 42 are in close contact with the four inner side walls 412 of the test engaging substrate body 41, and The guiding device 42 is locked to the test engaging substrate body 41 by means of the screw 5. However, in the other hand, the (4) device 42 can be fixed and walked in the distal test engaging substrate body 41 by other means. The guiding device 42 has a second opening 422 which is exposed after the guiding device is locked on the test adapter substrate body 41 and is used to position the semiconductor component 6 to be tested to the test socket 7. In the present embodiment, the second opening 4 2A, 2 is a 10,000-shaped appearance and is defined by four inner side walls 423, while in other applications +, the second opening can be present in other shapes. The four corners of the child guiding device 42 further include a through structure for providing a gap between the corner of the guiding device 42 and the corner of the semiconductor component. In this embodiment, the through structure is Round appearance. Referring to Fig. 4', there is shown a schematic diagram of the test interposer substrate 4 of the first embodiment of the present invention to be tested. Each of the inner side walls 423 of the guiding device has an outwardly inclined slope (_) 424, so that the second opening 422 forms an appearance which is gradually reduced from top to bottom. When the automatic sorter is placed to be tested In the process of the semiconductor component 6, if the positioning thereof is not accurate, the corner of the semiconductor component 6 to be tested may collide with the oblique
O:\87\87I4I.DOC 1304242 面424，然後順著該斜面424被導入該第二開口 422，而 不會造成待測試半導體元件6之損壞，且可增加機台之穩 定性。 該斜面424相對於垂直方向之高度略小於該導引裝置 42之厚度，使得該内側壁423之下方保留一小段垂直部 分425，該垂直部分425係於當該半導體元件6完全被置 入該第二開口 422後用以頂抵該半導體元件6之角落，增 加其卡合之力量。 在本實施例中，該測試銜接基板本體41與該導引裝置 42係為兩個可分離之元件。在其他應用中，該測試銜接 基板本體41與該導引裝置42係一體成型。 參考圖5,顯示根據本發明第二實施例之導引裝置82 之俯視示意圖，本實施例之導引裝置82與第一實施例之 導引裝置42大致相同，不同處僅為，該導引裝置82上之 貫穿結構826係為方形外觀。 上述實施例僅為說明本發明之原理及其功效，並非限制 本發明’因此習於此姑 、技術 < 人士對上述實施例進行修改及 變化仍不脫本發明乏接# , ^ 申。本發明之權利範圍應如後述 申請專利範圍所列。 【圖式簡單說明】 圖1顯示習用測試銜接基板之立體示意圖； 圖2顯示一待測試触 板之示意圖； g件被帶人習用測試銜接 圖 3顯不根據本發明第一 實施例之測試銜接基板之立The face 424 of O:\87\87I4I.DOC 1304242 is then introduced into the second opening 422 along the slope 424 without causing damage to the semiconductor component 6 to be tested, and the stability of the machine can be increased. The height of the slope 424 with respect to the vertical direction is slightly smaller than the thickness of the guiding device 42 such that a small vertical portion 425 is retained below the inner sidewall 423. The vertical portion 425 is when the semiconductor component 6 is completely inserted into the first surface. After the two openings 422 are used to abut the corners of the semiconductor component 6, the force of the clamping is increased. In the present embodiment, the test adapter substrate body 41 and the guiding device 42 are two separable components. In other applications, the test engagement substrate body 41 is integrally formed with the guide device 42. Referring to FIG. 5, there is shown a top plan view of a guiding device 82 according to a second embodiment of the present invention. The guiding device 82 of the present embodiment is substantially the same as the guiding device 42 of the first embodiment, except that the guiding is only The through structure 826 on the device 82 has a square appearance. The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Therefore, it is to be understood that the above-described embodiments may be modified and changed without departing from the invention. The scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic perspective view showing a conventional test engagement substrate; FIG. 2 is a schematic view showing a touch panel to be tested; g is taken by a custom test interface; FIG. 3 is not shown in accordance with the first embodiment of the present invention. Substrate
O:\87\8714I.DOC 1304242 體分解示意圖； 圖4顯不一待測試半導體元件被帶入本發明第一實施 例之測試_絲之示_;及 圖5顯示根據本發明第二實施例之導引裝置之俯視示 【圖式元件符號說明】 2測試座 3待測試半導體元件 424斜面 425垂直部分 426貫穿結構 5螺絲 6待測試半導體元件 7測試座 1習用測試銜接基板 11開口 4第一實施例之測試銜接基板 41測試銜接基板本體 411第一開口 412内側壁 42導引裝置 421外側壁 422第二開口 423内側壁 82第二實施例之導引裝置 826貫穿結構 O:\87\87141.DOC -10-O:\87\8714I.DOC 1304242 body decomposition diagram; FIG. 4 shows that the semiconductor component to be tested is brought into the test of the first embodiment of the present invention; and FIG. 5 shows the second embodiment according to the present invention. The top view of the guiding device [illustration of the symbol of the diagram element] 2 test socket 3 semiconductor component to be tested 424 bevel 425 vertical portion 426 through the structure 5 screw 6 to be tested semiconductor component 7 test socket 1 custom test adapter substrate 11 opening 4 first The test adapter substrate 41 of the embodiment tests the adapter substrate body 411 the first opening 412 the inner side wall 42 the guiding device 421 the outer side wall 422 the second opening 423 the inner side wall 82 the second embodiment of the guiding device 826 through the structure O: \ 87 \ 87141 .DOC -10-