1303970 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種散熱器之導風結構，尤其是指一種利 用一蓋體與該導風罩之主殼體以可旋轉方式配合，以利於將該 散熱器從主機板上拆卸下或將該散熱器組裝於主機板上。 【先前技術】 修現今我們的生活正邁入一個電子產業蓬勃發展的資 訊時代’各種由計算機所衍生之高科技產品、電子設備 ▲ 發展飛快迅速’為人們的日常生活帶來了莫大的便利 - 性’然而’隨著當前各種電子科技的不斷研發與精進， • 相關電子產品之研發理念’係以走向高頻率、高速度之 資料處理模式，並以輕、薄、短、小之外觀造型為其發 鲁 I主軸，當電子產品之機殼縮小後，將使得其内部之晶 片尺寸逐漸朝向微形化，如此之設計理念，卻造成電子 元件的發熱密度越來越高。 又’早期於電腦内部之電路設計極為簡單，其應用 程式少，u作速度也較為緩慢，因此，電腦系統在運 作上較不會因高溫熱而造成失控或當機，甚至是内部元 件之燒毁，通常僅在中央處理ϋ上加個散熱風扇即可， 6 1303970 而現今電腦在功能上對記憶體的容量需求越來越大，運 真的速度也愈來愈快’造成整個系統的工作溫度亦相對 提高，此外，符合上述之產品潮流及方便性上，機殼的 外型設計也愈來愈小，使得機殼内的熱氣往往無法順利 排出，於是「高溫」已成為造成電腦當機，甚至損毁之 主要因素。 因此，對於電子產品相關之散熱方式，可說是當前 電子資相關業者’決定其產品的穩定性與市場競爭力 之重要的因素之一，換言之，電子產品之散熱功能與效 果’乃是當前資訊業界主要探討之課題，亦為決定其產 品穩定性良窳之重要因素，例如：在整個電腦系統中， 其中央處理器（central process unit，簡稱CPU)不僅 是一核心元件，也是作動最為忙碌的元件，亦是該電腦 糸統中最耗電之元件，因此，若電腦的溫度太高，將合 降低它的執行效率，嚴重時還可能造成當機，故，若中 央處理器保持在低溫的環境中，電腦執行效率將會處於 較佳的狀恶’當機的機會就會減少很多，然而中央處理 為散熱效果之好壞’係取決於散熱器（Cpu Cooler)的好 壞、中央處理器與散熱器之間的介質，以及中央處理器 7 1303970 與週遭空氣是否能對流等因素。為增加空氣之對流，以 • 增進散熱之效果，該散熱器均設有一散熱風扇，通常該 散熱風扇大多安裝於中央處理單元的垂直上方，但亦有 為降低該散熱器的高度，業界亦有將該散熱風扇設置於 散熱器的一侧邊，與中央處理器呈垂直夾角設置，具體 可參閱第一圖所示，該散熱器1包括一導風罩10，該導 • 風罩10呈中空設置，用以容設散熱鰭片11，且導風罩 10 —侧組設有一散熱風扇12,該散熱器1組設於主機板 (未圖示）上，並且與安裝於主機板上的中央處理單元 - (未圖示）貼合，從而吸收該中央處理單元所產生的熱 量，並藉由散熱風扇12的吹動，而迅速將該中央處理單 元工作時產生的熱量帶走，從而令該中央處理單元的工 作、溫度在正常的溫度範圍内。 同時為保證該散熱器1的底面與中央處理單元緊密 接觸以保證良好的吸熱效果，該散熱器1通常藉由一螺 絲（未圖示）與主機板上的對應螺孔（未圖示）鎖合， 而將該散熱器1固定於主機板上，在具體實施時，通常 該導風罩10與該中央處理單元相對的表面設有一螺孔 (未圖示），而在導風罩10遠離中央處理單元的表面設 8 1303970 有一通孔100，同時該散熱鰭片u與該導風罩10侧面 形成缺口（未圖示），如此藉由一螺絲起子穿過通孔 及缺口’而將螺絲鎖固於導風罩10的螺孔與主機板的螺 孔内，而令該散熱器i與中央處理單元緊密接觸。但是， 上述之結構存在如下不足之處··當將該散熱H1組設於 主機板上或從主機板上拆卸時，由於該散熱鰭片U的高 度車乂同，會檔住操作者的視線，從而不易將螺絲起子對 準螺、、、糸從而景>響組裝與拆卸的效率；同時，因該散熱 -曰片11擋住#作者的視線，螺絲起子的末端可能碰撞該 散熱鰭片11的邊緣，會令其變形，而影響散熱效果。 有寥於此’實有必要提供—種散熱器之導風結構， 其此夠克服散熱鰭片高度之影響，而可令操作者很便捷 地將螺絲起子油技散_之獅料，從而便於將 該政熱②組裝於域板上，或從主機板上拆卸下來。 【發明内容】 因此’本發明的目的就是提供—種散熱器之導風結 構，其㈣克服散_片高度之影響，而可令操作者很 便捷地將螺絲起子與固^該散熱器之螺絲對準，從而便 於將該散熱器組I於主機板上，或從主機板上拆卸下來。 1303970 為達成上述目的，本發明係提供一種散熱器之導風 結構，該散熱n組設於電子裝置發熱糾之表面，用以 散發該發熱器件工作時產生的熱量，該散熱器包括一導 風罩，該導風罩包括—主殼體與樞接於該域體-側的 蓋體，且該蓋體與主殼體之另_側分職有相互配合之 卡扣部與扣合部，且該主殼體呈中空設置，其内部容設 有散熱鰭片’且該導風罩—側之外表面組設有—散熱風 羽另該主双體與發熱益件相對之底壁四角處開設有 螺孔，並與主機板之螺孔對應，而該散熱鰭片對應該螺 孔形成缺口，如此當將該散熱器組裝於主機板上，或從 主機板上拆卸下來時’可掀開蓋體，使用螺絲起子自該 缺口而將鎖固該散熱器的螺絲鎖合或解鎖。 相較於習知技術，本發明彻將導風罩料為一主 设體與該主殼體樞接之蓋體結構，並利用^於主殼體與 蓋體另-側之卡扣部與扣合部扣合或解扣，而將該蓋體 相對該主殼翻合或打開，如此在將該散鮮組裝於主 機板上，或從主機板上拆卸下來時，打開該蓋體，如此 將該散熱鰭片對應該螺孔的缺口露出，如此使用者在使 用螺絲起子自該缺π *將鎖固該散熱㈣螺_合或解 1303970 鎖時，可以避免該散熱鰭片高度之影響，可以令操作者 很清楚地看到螺絲起子一端與螺絲結合的狀態，從而很 容易於將螺絲起子與螺絲對準，而方便地將該螺絲鎖合 或解鎖，並且不會碰撞該散熱鰭片。 爲使對本發明的目的、構造特徵及其功能有進一步 的暸解，茲配合圖示詳細說明如下： • 【實施方式】 請參閱第二圖所示，為實施本發明散熱器之導風結 構的散熱器的立體組合圖，該散熱器2組設於電子裝置 * - 的主機板（未圖示）上，用以與主機板上之發熱器件（如 中央處理器等）配合，而將該發熱器件工作時產生的熱 量帶走，而將該發熱器件的溫度維持在正常的工作溫度 $ 範圍内，該散熱器2通常包括一導風罩20，且該導風罩 20内部容設有複數疊加之散熱鰭片23,以增加與空氣接 觸之面積，從而加快熱量之散發，且該於導風罩20 —侧 組設有一散熱風扇24，該導風罩20之底面與該發熱器 件表面貼合，並且該導風罩20之底面凸出該發熱器件之 部分設有螺孔218 (參第三圖所示），該散熱器2藉由一 螺絲219鎖合於該螺孔218與主機板對應的螺孔（未圖 11 1303970 示）鎖固，而將該散熱器2組設於主機板上。 另，由於該散熱鰭片23高度之影響，使用者在將該 散熱器2組裝於主機板上，或從主機板上拆卸下來時， 無法看清螺絲起子3之末端是否與螺絲219是否結合， 由而非常不便於操作，同時還有可能碰撞損壞該散熱鰭 片23 ’本發明正是對該散熱器2之導風罩20的結構進 行改進，至於其他結構，習知技術多有描述，此處不再 贅述。 請參閱第三圖，為實施本發明的散熱器的立體分解 圖，該散熱器2之導風罩20呈縱長框形，包括一主殼體 21，該主殼體21包括二相對之第一與第二侧板211、 212，及連接第一與第二侧板211、212，並與之垂直設 置的第三侧板213及底板214，該等第一與第二侧板 211、212 ,第三侧板213及底板214共同圍設成收容散 熱鰭片23之收容空間210。該散熱風扇24組設於第三 侧板213外侧面，且該第三侧板213中部設有一開口 216,與收容空間210連通，如此該散熱風扇24轉動時’ 空氣可藉由該開口 216而流過散熱鰭片23進行熱量交 換0 12 1303970 另，该主殼體21遠離底板214的一側，並遠離第三 侧板213的一端樞接有一蓋體22，該蓋體22呈板狀， 其运離散熱風扇24的一侧兩邊對稱設有樞軸221，而主 殼體21之第一與第二側板211、212則對應設有樞孔 217，如此蓋體22可相對主殼體21樞轉，而該蓋體22 的另一侧兩邊對稱設有卡扣部220,相應的主殼體21之 Φ 第一與第二侧板211、212則對應設有扣合部215，藉由 卡扣部220與扣合部215扣合，而將蓋體22組合於主殼 體21上。在本實施例中，該卡扣部220包括從該蓋體 • 22鄰近散熱風扇24之一侧兩邊各凸出設有一翼片222, 且該翼片222與該主殼體21相對的表面垂直凸出一抵持 片224,而該二相對之抵持片224表面相對凸出設有卡 柱225，而相應的扣合部215為設於主殼體21的第一與 參 第二侧板211、212背離收容空間210的表面’並向收容 空間210内部凹陷的凹孔’如此籍由該卡柱225與凹孔 卡合，而令該蓋體22與主殼體21卡合。另，為便於使 用者施力於該卡扣部220，而令該卡柱225與凹孔卡合 或解扣，該翼片222背離收容空間210的表面凸出設有 複數條凸肋223 (參第二圖所示）。 13 1303970 另，為將該散熱器2與主機板發熱器件之表面緊密 貼合，該主殼體21的底板四角處設有螺孔218,與主機 板的螺孔（未圖示）相對應，如此藉由螺絲219鎖合於 螺孔218及主機板的螺孔中，而將該散熱器2組設於主 機板上，同時為便於螺絲起子3進入收容空間210，以 鎖合或鬆開螺絲219,該散熱鰭片23對應該底板214的 螺孔218在其四角處内縮形成缺口 230，如此當該散熱 鰭片23組設於收容空間210中後，操作者可使用螺絲起 子3穿過該缺口 230而鎖合或解鎖螺絲219。 請一同參閱第二圖與第四圖所示，組裝時，可先將 散熱風扇24組合於主殼體21的第三側板213上，並將 蓋體22樞接於主殼體21 —側，並呈打開狀態，其後將 散熱鰭片23容置於主殼體21的收容空間210内，然後 藉由螺絲起子3伸入散熱鰭片23的缺口 230内，並將螺 絲219鎖固於主殼體21底板214的螺孔218與主機板對 應的螺孔中，而將該散熱器2組設於主機板上，最後將 旋轉蓋體22,並施力於蓋體22卡扣部220的翼片222, 令卡扣部220的卡柱225卡合於主殼體21第一與第二侧 板211、212的扣合部215中，如此封密收容空間210 14 1303970 遠離主機板的開口，以防止氣流流出。 • 虽將該散熱器2從主機板上拆卸下時，先施力於蓋 體22卡扣部220的翼片222，令卡扣部220的卡柱225 從主殼體21第一與第二侧板21卜212的扣合部215脫 離，然後旋轉蓋體22’令散熱鰭片23的缺口 230露出， 其後操作者利用一螺絲起子3伸入此缺口 23〇，以將螺 • 絲219解鎖，從而可將該散熱器2從主機板上拆卸下來。 相車父於習知技術’本發明利用將導風罩2〇設計為一 主殼體21與該主殼體21樞接之蓋體22結構，並利用設 - 於主殼體21與蓋體22另一侧之卡扣部220與扣合部215 扣合或解扣，而將該蓋體22相對該主殼體21閉合或打 開’如此在將該散熱器2組襞於主機板上，或從主機板 麟 上拆卸下來時’打開該蓋體22，如此將該散熱鰭片23 對應该螺孔218的缺口 230露出，如此使用者在使用螺 絲起子3自該缺口 230而將鎖固該散熱器2的螺絲219 鎖合或解鎖時，可以避免該散熱鰭片23高度之影響，可 以令操作者很清楚地看到螺絲起子3 —端與螺絲219結 合的狀態，從而很容易於將螺絲起子3與螺絲219對準， 而方便地將該螺絲219鎖合或解鎖，並且不會碰撞該散 15 1303970 熱鰭片23。 以上所述者，僅爲本發明其中的較佳實施例而已， 並非用來限定本發明的實施範圍；即凡依本發明申請專 利範圍所作的均等變化與修飾，皆爲本發明專利範圍所 涵蓋。 【圖式簡單說明】 第一圖為習知之散熱器組設於電腦裝置上的立體組合 圖。 第二圖為實施本發明散熱器之導風結構的散熱器的立體 組合圖。 第三圖為實施本發明散熱器之導風結構的散熱器的立體 分解圖。 第四圖為將實施本發明散熱器之導風結構的散熱器拆卸 的示意圖。 【主要元件符號說明】 散熱器 2 導風罩 20 主殼體 21 收容空間 210 第一侧板 211 第二侧板 212 16 1303970 第三侧板 213 底板 214 扣合部 215 開口 216 柩孔 217 螺孔 218 螺絲 219 蓋體 22 卡扣部 220 樞轴 221 翼片 222 凸肋 223 224 225 23 24 抵持片 卡柱 散熱鰭片 散熱風扇 171303970 IX. Description of the Invention: [Technical Field] The present invention relates to an air guiding structure of a heat sink, and more particularly to a rotatably fitting of a main body of a windshield by using a cover body to facilitate Remove the heat sink from the motherboard or assemble the heat sink to the motherboard. [Prior Art] Today, our life is entering an era of information booming in the electronics industry. 'A variety of high-tech products and electronic devices derived from computers ▲ The rapid development of people' has brought great convenience to people's daily lives. Sexuality 'However' With the continuous development and improvement of various electronic technologies, • The research and development concept of related electronic products is based on a high-frequency, high-speed data processing mode, and is characterized by light, thin, short and small appearance. When the housing of the electronic product is shrunk, the size of the internal chip will gradually become micro-shaped, and the design concept will cause the heat density of the electronic component to become higher and higher. Moreover, the circuit design in the early days of the computer is extremely simple, and the application program is less, and the speed of the u is slower. Therefore, the computer system is less likely to be out of control or crash due to high temperature heat, or even internal components. Burned, usually only add a cooling fan on the central processing unit, 6 1303970. Nowadays, the computer needs more and more capacity for the memory of the function, and the speed of the real operation is getting faster and faster. The working temperature is also relatively improved. In addition, in line with the trend and convenience of the above products, the outer design of the casing is getting smaller and smaller, so that the heat inside the casing is often unable to be discharged smoothly, so the "high temperature" has become a computer. Machine, even the main factor of damage. Therefore, the cooling method related to electronic products can be said to be one of the important factors that determine the stability and market competitiveness of electronic products related companies. In other words, the heat dissipation function and effect of electronic products is the current information. The main issues discussed in the industry are also important factors in determining the stability of its products. For example, in the entire computer system, its central processing unit (CPU) is not only a core component, but also the most busy. The component is also the most power-consuming component of the computer system. Therefore, if the temperature of the computer is too high, it will reduce its execution efficiency. In severe cases, it may cause a crash, so if the central processing unit is kept at a low temperature. In the environment, the computer execution efficiency will be better. The chance of crashing will be much reduced. However, the central processing is good for the heat dissipation. It depends on the quality of the heat sink (Cpu Cooler) and the CPU. The medium between the heat sink and the central processor 7 1303970 and whether the surrounding air can convect. In order to increase the convection of the air, to improve the heat dissipation effect, the heat sink is provided with a cooling fan. Usually, the cooling fan is mostly installed vertically above the central processing unit, but there is also a reduction in the height of the heat sink. The heat dissipating fan is disposed on one side of the heat sink and disposed at a vertical angle with the central processing unit. For details, as shown in the first figure, the heat sink 1 includes an air guiding cover 10, and the air guiding cover 10 is hollow. The heat sink fins 11 are disposed on the side of the air deflector 10, and the heat sink 1 is disposed on the motherboard (not shown) and is disposed at the center of the motherboard. The processing unit - (not shown) is attached to absorb the heat generated by the central processing unit, and the heat generated by the central processing unit is quickly taken away by the blowing of the cooling fan 12, thereby The operation of the central processing unit and the temperature are within the normal temperature range. At the same time, in order to ensure that the bottom surface of the heat sink 1 is in close contact with the central processing unit to ensure good heat absorption, the heat sink 1 is usually locked by a screw (not shown) and a corresponding screw hole (not shown) on the motherboard. The heat sink 1 is fixed to the motherboard, and in a specific implementation, a surface of the air hood 10 opposite to the central processing unit is generally provided with a screw hole (not shown), and the air hood 10 is away from the air hood 10 The surface of the central processing unit is provided with a through hole 100, and the heat dissipating fin u forms a notch (not shown) on the side of the air guiding cover 10, so that the screw is passed through the through hole and the notch by a screwdriver. The screw hole is locked in the screw hole of the air guiding cover 10 and the screw hole of the motherboard, so that the heat sink i is in close contact with the central processing unit. However, the above structure has the following disadvantages: When the heat dissipation H1 is set on the main board or removed from the main board, the height of the heat sink fin U is the same, and the operator's line of sight is blocked. Therefore, it is difficult to align the screwdriver with the screw, the 糸 糸 & 响 rang the efficiency of assembly and disassembly; at the same time, because the heat dissipation - the cymbal 11 blocks the line of sight of the # author, the end of the screwdriver may collide with the heat dissipation fin 11 The edge will deform it and affect the heat dissipation effect. It is necessary to provide a kind of wind guide structure for the radiator, which is enough to overcome the influence of the height of the fins, and allows the operator to easily disassemble the screwdriver. The political heat 2 is assembled on the domain board or removed from the motherboard. SUMMARY OF THE INVENTION Therefore, the object of the present invention is to provide a wind guide structure for a radiator, which (4) overcomes the influence of the height of the sheet, and allows the operator to conveniently screw the screwdriver and the screw of the radiator. Alignment to facilitate the removal or removal of the heat sink assembly I from the motherboard. 1303970 In order to achieve the above object, the present invention provides an air guiding structure of a heat sink, which is disposed on a surface of a heating and correcting surface of an electronic device for dissipating heat generated when the heat generating device operates, and the heat sink includes an air guiding body. a cover, the air hood includes a main body and a cover body pivotally connected to the domain body side, and the cover body and the other side of the main body are respectively engaged with a fastening portion and a fastening portion. And the main casing is hollow, and the heat dissipation fins are accommodated in the interior thereof, and the windshield-side outer surface group is provided with a heat dissipation wind feather, and the main body is opposite to the bottom wall of the heat-generating component The screw hole is opened and corresponds to the screw hole of the motherboard, and the heat dissipation fin forms a gap corresponding to the screw hole, so that when the heat sink is assembled on the motherboard or removed from the motherboard, the opening can be opened The cover body uses a screwdriver to lock or unlock the screw that locks the heat sink from the notch. Compared with the prior art, the present invention completely uses the windshield cover as a cover structure in which the main body is pivotally connected to the main casing, and utilizes the buckle portion of the main casing and the other side of the cover body. The buckle portion is fastened or unfastened, and the cover body is turned over or opened relative to the main body, so that when the fresh-skin is assembled on the main board or removed from the main board, the cover body is opened, so The heat dissipation fins are exposed to the notches of the screw holes, so that the user can avoid the influence of the height of the heat dissipation fins when the user uses the screwdriver to lock the heat dissipation (four) screw or the 1303970 lock. It allows the operator to clearly see the state in which the screw driver is coupled to the screw, so that it is easy to align the screwdriver with the screw, and the screw can be easily locked or unlocked without colliding with the heat sink fin. In order to further understand the object, structural features and functions of the present invention, the following detailed description will be given with reference to the accompanying drawings: • [Embodiment] Referring to the second figure, the heat dissipation of the air guiding structure of the heat sink of the present invention is implemented. The three-dimensional combination diagram of the heat sink 2 is disposed on a motherboard (not shown) of the electronic device* for cooperating with a heat generating device (such as a central processing unit) on the motherboard, and the heat generating device is assembled The heat generated during operation is carried away, and the temperature of the heat generating device is maintained within a normal operating temperature range. The heat sink 2 generally includes an air hood 20, and the air hood 20 is internally provided with a plurality of superimposed layers. The heat dissipating fins 23 are arranged to increase the area of contact with the air, thereby accelerating the heat dissipation, and the side of the air guiding cover 20 is provided with a heat dissipating fan 24, and the bottom surface of the air guiding cover 20 is adhered to the surface of the heat generating device. And a portion of the bottom surface of the air hood 20 protruding from the heat generating device is provided with a screw hole 218 (shown in FIG. 3). The heat sink 2 is locked to the screw hole 218 by a screw 219 corresponding to the motherboard. Screw hole (not shown in Figure 11 130 3970 shows) locking, and the heat sink 2 is set on the motherboard. In addition, due to the influence of the height of the heat dissipation fins 23, when the user assembles the heat sink 2 on the motherboard or removes from the motherboard, it is impossible to see whether the end of the screwdriver 3 is combined with the screw 219. Therefore, it is very inconvenient to operate, and at the same time, it is possible to collide and damage the heat dissipating fins 23'. The present invention is to improve the structure of the air guiding hood 20 of the heat sink 2. As for other structures, the prior art has many descriptions. I won't go into details here. Referring to the third drawing, for an exploded perspective view of the heat sink embodying the present invention, the air hood 20 of the heat sink 2 has a vertically long frame shape, and includes a main casing 21 including two opposite bodies. a first side plate 211, 212, and a third side plate 213 and a bottom plate 214 connected to the first and second side plates 211, 212 and perpendicular thereto, the first and second side plates 211, 212 The third side plate 213 and the bottom plate 214 are collectively arranged to receive the receiving space 210 of the heat dissipation fins 23 . The cooling fan 24 is disposed on the outer side of the third side plate 213, and an opening 216 is defined in the middle of the third side plate 213 to communicate with the receiving space 210. When the cooling fan 24 rotates, the air can pass through the opening 216. The heat dissipation is performed on the heat dissipation fins. The cover 22 is pivotally connected to the side of the bottom plate 214, and the cover 22 is pivotally connected to the end of the third side plate 213. A pivot 221 is symmetrically disposed on one side of the discrete heat fan 24, and the first and second side plates 211 and 212 of the main casing 21 are correspondingly provided with a pivot hole 217, so that the cover 22 can be opposite to the main casing 21. Pivot, and the other side of the cover 22 is symmetrically provided with a buckle portion 220, and the first and second side plates 211 and 212 of the corresponding main housing 21 are correspondingly provided with a fastening portion 215. The buckle portion 220 is engaged with the fastening portion 215, and the cover 22 is combined with the main casing 21. In this embodiment, the latching portion 220 includes a flap 222 protruding from one side of the cover body 22 adjacent to one side of the heat dissipating fan 24, and the surface of the flap 222 opposite to the main housing 21 is perpendicular. A resisting piece 224 is protruded, and the surface of the two opposing resisting pieces 224 is oppositely protruded from the post 225, and the corresponding engaging portion 215 is the first and second side plates provided on the main casing 21. The recesses 211, 212 facing away from the surface 'of the accommodating space 210 and recessed toward the inside of the accommodating space 210' are engaged with the recessed holes by the post 225, and the cover 22 is engaged with the main casing 21. In addition, in order to facilitate the user to apply the force to the buckle portion 220, the post 225 is engaged or disengaged from the recessed hole, and the flap 222 is protruded away from the surface of the receiving space 210 to provide a plurality of ribs 223 ( See the second picture). 13 1303970 In addition, in order to closely bond the heat sink 2 to the surface of the heat generating device of the motherboard, the main housing 21 has screw holes 218 at the four corners of the bottom plate, corresponding to the screw holes (not shown) of the motherboard. Thus, the screw 219 is locked in the screw hole 218 and the screw hole of the motherboard, and the heat sink 2 is assembled on the motherboard, and the screw driver 3 is inserted into the accommodating space 210 to lock or loosen the screw. 219, the heat dissipation fins 23 are correspondingly formed at the four corners of the bottom holes 214 to form a notch 230. When the heat dissipation fins 23 are assembled in the receiving space 210, the operator can use the screwdriver 3 to pass through. The notch 230 locks or unlocks the screw 219. Referring to the second and fourth figures, the heat dissipating fan 24 can be assembled on the third side plate 213 of the main casing 21 and the cover 22 is pivotally connected to the main casing 21 side. After being opened, the heat dissipation fins 23 are received in the receiving space 210 of the main casing 21, and then protruded into the notch 230 of the heat dissipation fin 23 by the screwdriver 3, and the screw 219 is locked to the main The screw hole 218 of the bottom plate 214 of the casing 21 is in the screw hole corresponding to the main board, and the heat sink 2 is assembled on the main board, and finally the cover body 22 is rotated and applied to the buckle portion 220 of the cover body 22. The tab 222 is configured to engage the latch 225 of the latching portion 220 in the engaging portion 215 of the first and second side plates 211 and 212 of the main housing 21, so as to close the opening of the receiving space 210 14 1303970 away from the motherboard To prevent airflow. • When the heat sink 2 is detached from the motherboard, the blade 222 of the latching portion 220 of the cover 22 is first applied, so that the post 225 of the latching portion 220 is first and second from the main housing 21. The engaging portion 215 of the side plate 21 212 is disengaged, and then the cover 22' is rotated to expose the notch 230 of the heat dissipating fin 23, and then the operator uses a screwdriver 3 to extend into the notch 23〇 to screw the wire 219 Unlocked so that the heat sink 2 can be removed from the motherboard. The present invention utilizes a structure in which the air hood 2 is designed to be a main body 21 pivotally connected to the main casing 21, and is designed to be used in the main casing 21 and the cover. The buckle portion 220 on the other side is fastened or unfastened with the fastening portion 215, and the cover 22 is closed or opened relative to the main housing 21, so that the heat sink 2 is placed on the motherboard. When the detachment from the motherboard is removed, the cover 22 is opened, so that the heat sink fin 23 is exposed to the notch 230 corresponding to the screw hole 218, so that the user locks the screw 230 from the notch 230. When the screw 219 of the heat sink 2 is locked or unlocked, the influence of the height of the heat radiating fin 23 can be avoided, and the operator can clearly see the state in which the screw driver 3 end is combined with the screw 219, so that the screw can be easily The driver 3 is aligned with the screw 219, and the screw 219 is conveniently locked or unlocked and does not collide with the heat 15 1303970 hot fin 23. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; that is, the equivalent variations and modifications made by the scope of the present invention are covered by the scope of the present invention. . [Simple description of the diagram] The first figure is a three-dimensional combination diagram of a conventional radiator set on a computer device. The second figure is a perspective assembled view of a heat sink embodying the air guiding structure of the heat sink of the present invention. The third figure is a perspective exploded view of a heat sink embodying the air guiding structure of the heat sink of the present invention. The fourth figure is a schematic view of the heat sink from which the air guiding structure of the heat sink of the present invention is implemented. [Main component symbol description] Heat sink 2 Air hood 20 Main housing 21 accommodating space 210 First side plate 211 Second side plate 212 16 1303970 Third side plate 213 Base plate 214 Fastening portion 215 Opening 216 Boring hole 217 Screw hole 218 Screw 219 Cover 22 Buckle 220 Pivot 221 Tab 222 Rib 223 224 225 23 24 Resisting clip post heat sink fin cooling fan 17