TW200744432A - Air guiding structure of heat sink - Google Patents

Air guiding structure of heat sink

Info

Publication number
TW200744432A
TW200744432A TW095117624A TW95117624A TW200744432A TW 200744432 A TW200744432 A TW 200744432A TW 095117624 A TW095117624 A TW 095117624A TW 95117624 A TW95117624 A TW 95117624A TW 200744432 A TW200744432 A TW 200744432A
Authority
TW
Taiwan
Prior art keywords
heat sink
heat
air guiding
main case
tapped holes
Prior art date
Application number
TW095117624A
Other languages
Chinese (zh)
Other versions
TWI303970B (en
Inventor
Min-Jui Wu
Original Assignee
Mitac Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Prec Technology Corp filed Critical Mitac Prec Technology Corp
Priority to TW095117624A priority Critical patent/TW200744432A/en
Publication of TW200744432A publication Critical patent/TW200744432A/en
Application granted granted Critical
Publication of TWI303970B publication Critical patent/TWI303970B/zh

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

This invention relates to an air guiding structure of a heat sink. The heat sink has an air guiding mask comprising a main case and a cover connected to one end of the main case. The other end of the cover and the main case have a pair of locking part and fastening part, respectively, and the main case is a hollow structure which is disposed with heat-dissipating fins therein. The outer surface of the air guiding mask has a heat-dissipating fan, and tapped holes are formed at the four corners of the bottom of the main case opposite to the heating device, in which the the tapped holes are corresponded to the tapped holes on the main board. The heat-dissipating fins and the tapped holes together form recesses so that the heat sink may be mounted on the main board or dismounted therefrom. The flappable cover may be opened, and users may lock or unlock the heat sink from the recesses, overcoming the inconvenient assembly/disassembly caused by the height of the heat-dissipating fins. As such, users may easily align the screwdriver and the bolts fixing the heat sink and mount the heat sink on the main board or dismount the heat sink therefrom.
TW095117624A 2006-05-18 2006-05-18 Air guiding structure of heat sink TW200744432A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095117624A TW200744432A (en) 2006-05-18 2006-05-18 Air guiding structure of heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095117624A TW200744432A (en) 2006-05-18 2006-05-18 Air guiding structure of heat sink

Publications (2)

Publication Number Publication Date
TW200744432A true TW200744432A (en) 2007-12-01
TWI303970B TWI303970B (en) 2008-12-01

Family

ID=45070845

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117624A TW200744432A (en) 2006-05-18 2006-05-18 Air guiding structure of heat sink

Country Status (1)

Country Link
TW (1) TW200744432A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486749B (en) * 2013-01-30 2015-06-01 Wistron Corp Heat dissipating assembly

Also Published As

Publication number Publication date
TWI303970B (en) 2008-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees