1301948 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電子標籤之製造方法，特別是指 種應用於無線射頻辯識系統（Radio Frequency Identification System )之電子標籤的製造方法。 【先前技術】 無線射頻辯識系統（簡稱為RFID )目前逐漸普遍應用 於取代識別條碼，其主要是結合了晶片、天線、接收器與 後端系統的中介軟體，其中天線是以一銅材或铭材之金屬 泊成型而成，再與晶片設置於一基板上，最後封裝形成一 電子標籤，以下就電子標籤構造進一步說明。 請參閱圖1及圖2，電子標籤1包含有一第一基板U，1301948 IX. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing an electronic tag, and more particularly to a method of manufacturing an electronic tag applied to a Radio Frequency Identification System. [Prior Art] Radio Frequency Identification System (RFID) is now widely used to replace identification barcodes. It mainly combines the intermediary software of the chip, antenna, receiver and back-end system. The antenna is a copper or The metal mooring of the material is molded, and then the wafer is placed on a substrate, and finally the package is formed into an electronic label. The electronic label structure is further described below. Referring to FIG. 1 and FIG. 2, the electronic tag 1 includes a first substrate U.
.又置於4第-基板u上之天線12…連結於該天線U 上，，片13，以及一封蓋於天線12上之第二基板14，其 中忒晶片13之二接腳131連結於天線12上且顯露於第二 基板14外，而第一基板u必須為耐腐餘之材 為玻璃纖維材質，該第二基板14為塑膠材質^ : 塑膠材質。 仕此馮逯明 而電子標籤1目前的製造方式，請參閲圖3,主要勺人 有一貼合步驟2 1、—本私止 晋匕3 一塗敷步驟22、一光照步驟23、一蝕 步驟24、一植#牛驟,a 是在第-μ曰 裝步驟26。該貼合步驟21 一 土 1上塗敷上一層黏膠，再將金屬箔貼於兮 ㈣佈於該金屬以 驟23乃將所要的形狀對金屬箱進行照光，以 1301948 使金屬箔上之感光劑的部分 、々刀琢先。该餘刻步驟24乃以化學 :=全屬二感光劑感光的部分進_，最後產: 金屬μ’到此完成天線12的成型。該植晶步驟25 乃將日日片13固設於第一其此，、 弟幻反11上並將晶片13之二接腳 連結於天線12上。至於兮私壯止 接腳 於5亥封虞步驟26乃將第二基板 14封蓋於第一基板u上， 极 I肘大綠12夾置於其中。 然而習知此種製造方式太 “ 万式在天線12的製造過程較為繁複The antenna 12, which is further disposed on the 4th substrate u, is coupled to the antenna U, the chip 13, and a second substrate 14 covering the antenna 12, wherein the two pins 131 of the silicon wafer 13 are connected to The antenna 12 is exposed on the outside of the second substrate 14. The first substrate u must be made of glass fiber, and the second substrate 14 is made of plastic material: plastic material. Shi Fengming and the current manufacturing method of the electronic label 1, please refer to Figure 3, the main spoon person has a fitting step 2 1, - this private stop Jin 3 a coating step 22, a light step 23, an eclipse Step 24, a plant #牛, a is in the -μ曰 step 26. The bonding step 21 applies a layer of adhesive to a soil 1 , and then attaches the metal foil to the metal (4) to the metal, and then illuminates the metal box with the desired shape to make the photosensitive agent on the metal foil at 1301948. The part, the sickle first. The remaining step 24 is carried out by chemically: = partially sensitized by the sensitizer, and finally produced: metal μ' to complete the shaping of the antenna 12. The seeding step 25 is to fix the day sheet 13 to the first one, and to connect the two pins of the wafer 13 to the antenna 12. As for the self-locking pin, the second substrate 14 is capped on the first substrate u, and the pole elbow green 12 is placed therein. However, it is known that this type of manufacturing is too complicated.
’影響電子標藏1的生產效率，同時天線12的成品不良率 也較南，此等均會提高製造成本，再者㈣的化學溶劑也 會造成環㈣題’ & f知電子標籤的製造方法並非為-理 想之製造方式。 【發明内容】 因此，本發明之目的即在提供一種可提升生產效率及 降低製造成本的電子標籤之製造方法。 於是，本發明電子標籤之製造方法，其包含有下列步 驟：一烫金步驟、一植晶步驟及一封裝步驟。 該烫金步驟乃將金屬箔依所需形狀燙貼於一第一基板 上，以在該第一基板上形成一金屬層之天線。 該植晶步驟乃在第一基板上設置一與該天線連結之晶 片。 曰 該封裝步驟乃將一第二基板封蓋於第一基板上，以將 該天線夾置於第一、第二基板之間。 藉由燙金步驟中可快速將金屬箔烫印於第一基材上， 以在第一基材上產生預定形狀之天線，接著進行植晶及封 裝等步驟，可有效提升電子標籤的生產效率，及減少金屬 材料成本，進而大幅降低電子標籤的製造成本。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖1、圖2與圖4，本發明電子標籤之製造方法之 一較佳實施例，是適用於無線射頻辯識系統用的電子標籤i 之製造，其依序包含有： 一燙金步驟3 ··乃利用一預先準備之模板將金屬箔壓燙 於第基板11上，此時在該第一基板11上即會形成一特 定幵少狀的金屬層之天線12，而該第—基板^可為紙材或塑 膠材質。 一植晶步驟4 ··乃將一晶片13設置在第一基板丨丨上 並使晶片13之接腳13ι與天線12連結。 14封蓋黏合於第一基 、弟一基板11、14之 一封裝步驟5:乃將一第二基板 板11上’以將該天線12夾置於第一 間。 本發明乃利用燙金的方式直接將金屬箔燙貼於第一基 板，且錢金步驟3完成後，天線12的形狀也同時二 併形成，因此，本發明之製造方法與習知的方式必需先將 金屬 >白膠合於第_基板u上，再㈣成型出所需形狀的天 1301948 =2相較’本發明確實可縮減天線i2成型的製程 ==且無環保問題’同時利用本發明的製:方 法產生的天線厚度，可明顯較習知的金屬薄板或金: 薄，具有降低材料成本之功效。 還 ::㈣圖5及圖6，是本發明電子標籤之製造方法之 另-較佳貫_，為了加強天線12與晶片 果，本實施例除了與前一實施例同樣包含有一烫金步= -植晶步驟4及—封裝步驟5外，更包含有—導電處理牛 驟6，該導電處理步驟6主要是在烫金步驟3前先對金屬； 施以導電處理，以增加晶片13與天線12間的導電效果。/ 該金屬^具有一離型膜層71、一真空鍍金層72及—膠 層乃，該導電處理步驟6乃是在該離型臈層η與 仝'Influence of the production efficiency of the electronic standard 1, while the defective rate of the finished product of the antenna 12 is also relatively south, which will increase the manufacturing cost, and the chemical solvent of (4) will also cause the ring (four) title '& f know the manufacture of electronic tags The method is not the ideal way of manufacturing. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of manufacturing an electronic tag that can improve production efficiency and reduce manufacturing costs. Thus, the method of manufacturing an electronic tag of the present invention comprises the following steps: a bronzing step, a seeding step, and a encapsulating step. The bronzing step is to apply a metal foil to a first substrate in a desired shape to form a metal layer antenna on the first substrate. The crystallization step is to provide a wafer connected to the antenna on the first substrate.曰 The encapsulating step is to cover a second substrate on the first substrate to sandwich the antenna between the first and second substrates. By hot stamping the metal foil on the first substrate by the bronzing step, an antenna of a predetermined shape is generated on the first substrate, followed by steps of crystallization and encapsulation, thereby effectively improving the production efficiency of the electronic tag. And reduce the cost of metal materials, thereby significantly reducing the manufacturing cost of electronic tags. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 1 , FIG. 2 and FIG. 4 , a preferred embodiment of the method for manufacturing an electronic tag of the present invention is an electronic tag i suitable for use in a radio frequency identification system, which includes: a bronzing step 3 The metal foil is pressed onto the first substrate 11 by using a pre-prepared template. At this time, an antenna 12 of a specific metal-like layer is formed on the first substrate 11, and the first substrate is Can be made of paper or plastic. A seeding step 4 is to place a wafer 13 on the first substrate and connect the pins 13 of the wafer 13 to the antenna 12. The cover 14 is adhered to the first base, the first substrate 11, 14 of the package step 5: a second substrate 11 is placed on the second substrate 11 to sandwich the antenna 12 therebetween. In the present invention, the metal foil is directly adhered to the first substrate by means of bronzing, and after the completion of the step 3 of the gold, the shape of the antenna 12 is simultaneously formed. Therefore, the manufacturing method and the conventional method of the present invention must be first. The metal > white glue is bonded to the first substrate u, and (4) the desired shape of the day 1301948 = 2 is compared with the 'the invention can indeed reduce the process of forming the antenna i2 == and there is no environmental problem' while using the invention System: The thickness of the antenna produced by the method can be significantly thinner than the conventional metal sheet or gold: it has the effect of reducing material cost. Further:: (d) FIG. 5 and FIG. 6 are another preferred method for manufacturing the electronic tag of the present invention. In order to reinforce the antenna 12 and the wafer, the embodiment includes a bronzing step as in the previous embodiment. In addition to the seeding step 4 and the packaging step 5, the conductive processing step 6 is further included. The conductive processing step 6 is mainly performed on the metal before the bronzing step 3; and the conductive treatment is applied to increase the between the wafer 13 and the antenna 12. The conductive effect. / the metal ^ has a release film layer 71, a vacuum gold plating layer 72 and a glue layer, the conductive treatment step 6 is in the release layer η and the same
層72間形成-具有導電性之護膜層74,參閱圖7，、；：屬 ^被烫貼於第—基板U上時，該真空鍍金層72藉由膠層 黏貼於弟-基板u，且該離型膜層71被撕離，該護膜層 74即用以保護真空鍍金層72避免脫落，亦即該晶片u : ，晶步驟4後’其接腳131是直接與該護膜層74接觸，故 藉由本實施例之導電處理㈣6以導電樹脂（conductive resm)形成該護膜層74,可有效提升天線12與晶片η間 的導電效果。 S 綜上所述，本發明電子標籤之製造方法在烫金步驟中 可快=將金屬熔液燙印於第一基材上，以在第一基材上產 ^預定形狀之天線，接著進行植晶及封裝等步驟，可有效 提升電子標籤的生產效率，及減少金屬材料成本，進而大Between the layers 72, a conductive film layer 74 is formed. Referring to FIG. 7, when the galvanic layer is applied to the first substrate U, the vacuum gold plating layer 72 is adhered to the slab-substrate u by a glue layer. And the release film layer 71 is torn off, the film protection layer 74 is used to protect the vacuum gold plating layer 72 from falling off, that is, the wafer u: after the crystal step 4, the pin 131 is directly connected to the film layer. Since the contact is formed by the conductive treatment (four) 6 of the present embodiment, the conductive layer between the antenna 12 and the wafer η can be effectively improved. In summary, the manufacturing method of the electronic tag of the present invention can be fast in the bronzing step = hot stamping the molten metal on the first substrate to produce an antenna of a predetermined shape on the first substrate, followed by implantation Crystal and packaging steps can effectively improve the production efficiency of electronic tags, and reduce the cost of metal materials, and thus
1301948 幅降低電子標籤的製造成本，再者可再對金屬箱進行導電 處理，以增加晶片與天線間的導電效果，故確實可=到本 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明中請二利 範圍及發明說明内容所作之簡單的等效變化與修飾。:皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明] 圖1是電子標籤之俯視圖； 圖2疋该電子標籤之側面剖視圖； 圖3是3電子標籤習知製造方法之步驟流程圖； 圖4.是本發明—較佳實施例電子標籤之製造方法的步 步驟流程圖； 圖6是广發明之金屬箱的放大部分剖視示意圖；及 =疋本發明之一側面剖視示意圖，說明該金屬 貼於第-基板上’且晶片的接腳接合於金屬箱的護膜層上 1301948 Λ 【主要元件符號說明】The 1301948 can reduce the manufacturing cost of the electronic tag, and the conductive process can be further performed on the metal case to increase the conductive effect between the chip and the antenna. Therefore, it can be said that the above is only the preferred embodiment of the present invention. For example, the scope of the invention is not limited thereto, that is, the equivalent equivalents and modifications of the scope of the invention and the description of the invention. : All are still within the scope of the patent of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of an electronic tag; FIG. 2 is a side cross-sectional view of the electronic tag; FIG. 3 is a flow chart showing the steps of a conventional electronic tag manufacturing method; FIG. 6 is a schematic cross-sectional view showing an enlarged portion of a metal case of the invention; and FIG. 6 is a side cross-sectional view showing the metal attached to the first substrate and the wafer The pin is attached to the protective layer of the metal case 1301948 Λ [Main component symbol description]
1 電子標籤 4 植晶步驟 11 第一基板 5 封裝步驟 12 天線 6 導電處理步驟 13 晶片 71 離型膜層 131 接腳 72 真空鍍金層 14 第二基板 73 膠層 3 燙金步驟 74 護膜層1 Electronic label 4 Crystallization step 11 First substrate 5 Packaging step 12 Antenna 6 Conductive processing steps 13 Wafer 71 Release film layer 131 Pin 72 Vacuum gold plating layer 14 Second substrate 73 Adhesive layer 3 Hot stamping step 74 Protective layer
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