CN111816571A - Semiconductor packaging method - Google Patents
Semiconductor packaging method Download PDFInfo
- Publication number
- CN111816571A CN111816571A CN202010782035.0A CN202010782035A CN111816571A CN 111816571 A CN111816571 A CN 111816571A CN 202010782035 A CN202010782035 A CN 202010782035A CN 111816571 A CN111816571 A CN 111816571A
- Authority
- CN
- China
- Prior art keywords
- film
- chip
- plastic package
- packaging method
- semiconductor packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 47
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims description 21
- 150000001875 compounds Chemical class 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 abstract description 8
- 239000011230 binding agent Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 36
- 239000000853 adhesive Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- IHCHOVVAJBADAH-UHFFFAOYSA-N n-[2-hydroxy-4-(1h-pyrazol-4-yl)phenyl]-6-methoxy-3,4-dihydro-2h-chromene-3-carboxamide Chemical compound C1C2=CC(OC)=CC=C2OCC1C(=O)NC(C(=C1)O)=CC=C1C=1C=NNC=1 IHCHOVVAJBADAH-UHFFFAOYSA-N 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- WABPQHHGFIMREM-OUBTZVSYSA-N lead-208 Chemical compound [208Pb] WABPQHHGFIMREM-OUBTZVSYSA-N 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010782035.0A CN111816571A (en) | 2020-08-06 | 2020-08-06 | Semiconductor packaging method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010782035.0A CN111816571A (en) | 2020-08-06 | 2020-08-06 | Semiconductor packaging method |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111816571A true CN111816571A (en) | 2020-10-23 |
Family
ID=72863670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010782035.0A Pending CN111816571A (en) | 2020-08-06 | 2020-08-06 | Semiconductor packaging method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111816571A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113270331A (en) * | 2021-05-12 | 2021-08-17 | 湖南越摩先进半导体有限公司 | Packaging method and packaging structure of semiconductor device |
-
2020
- 2020-08-06 CN CN202010782035.0A patent/CN111816571A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113270331A (en) * | 2021-05-12 | 2021-08-17 | 湖南越摩先进半导体有限公司 | Packaging method and packaging structure of semiconductor device |
CN113270331B (en) * | 2021-05-12 | 2023-12-01 | 湖南越摩先进半导体有限公司 | Packaging method and packaging structure of semiconductor device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201104 Address after: 310051 No. 6 Lianhui Street, Xixing Street, Binjiang District, Hangzhou City, Zhejiang Province Applicant after: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) Co.,Ltd. Address before: 230000 no.3699 Xiyou Road, hi tech Zone, Hefei City, Anhui Province Applicant before: Tan Xiaochun |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201228 Address after: 200233 room 1401, No.2, Lane 99, Jiang'an Road, Xuhui District, Shanghai Applicant after: Tan Xiaochun Address before: No.6, Lianhui street, Xixing street, Binjiang District, Hangzhou City, Zhejiang Province Applicant before: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) Co.,Ltd. |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20210114 Address after: 230088 room 190, building H2, phase II, innovation industrial park, 2800 innovation Avenue, high tech Zone, Hefei City, Anhui Province Applicant after: HEFEI ZUAN INVESTMENT PARTNERSHIP ENTERPRISE Address before: 200233 room 1401, No.2, Lane 99, Jiang'an Road, Xuhui District, Shanghai Applicant before: Tan Xiaochun |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210219 Address after: No.33 lujiazhai, yangjiaxiang village, Huacao Town, Minhang District, Shanghai 201100 Applicant after: Lu Peiliang Address before: 230088 room 190, building H2, phase II, innovation industrial park, 2800 innovation Avenue, high tech Zone, Hefei City, Anhui Province Applicant before: HEFEI ZUAN INVESTMENT PARTNERSHIP ENTERPRISE |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210401 Address after: No.6, Lianhui street, Xixing street, Binjiang District, Hangzhou City, Zhejiang Province Applicant after: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) Co.,Ltd. Address before: No.33 lujiazhai, yangjiaxiang village, Huacao Town, Minhang District, Shanghai 201100 Applicant before: Lu Peiliang |
|
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20201023 |