TWI301779B - - Google Patents

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TWI301779B
TWI301779B TW93126587A TW93126587A TWI301779B TW I301779 B TWI301779 B TW I301779B TW 93126587 A TW93126587 A TW 93126587A TW 93126587 A TW93126587 A TW 93126587A TW I301779 B TWI301779 B TW I301779B
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Taiwan
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wire electrode
pair
particle
discharge machining
electric discharge
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TW93126587A
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Chinese (zh)
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TW200609069A (en
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C L Kuo
Zi-Xiang Xia
Jun-De Huang
jun-qin Wang
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C L Kuo
Wang Jiun Chin
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Priority to TW093126587A priority Critical patent/TW200609069A/en
Publication of TW200609069A publication Critical patent/TW200609069A/en
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Publication of TWI301779B publication Critical patent/TWI301779B/zh

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  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Description

1301779 五、發明說明(1) 【發明所屬之技術領域】 本發明係有關—種放電加工技術之裝置、所用之線電 極及其製法,特別是指一種線切割放電加工裝置與放電加 工之線電極及其製法,其兼具待加工物之表面粗糙度大鴨 改善 '放電加工時之排屑效果佳及可進行切割寬度更小之 窄縫加工之優點及功效。 【先前技術】 請參閱第一圖,此為傳統式線切割放電加工裝置, 包括: ^1301779 V. Technical Description of the Invention (1) The present invention relates to a device for electrical discharge machining technology, a wire electrode used therefor, and a method for manufacturing the same, and more particularly to a wire-cut electrical discharge machining device and a wire electrode for electrical discharge machining And its preparation method, which has the surface roughness of the object to be processed, the duck has improved the advantages of the chip removal effect during the electric discharge machining and the narrow slit processing which can perform the cutting width smaller. [Prior Art] Please refer to the first figure, which is a conventional wire-cut EDM, including: ^

一基座9 1 0,具有一供線部9 11、一收線部9 1:2及一介 於其間之工作空間9丨3 ; 一線電極920 ’由該供線部911供出而進入該工作空間 913中再進入該收線部912中。 曰 藉由上述元件之組合,將一待加工物9 3 0以習知放電 加工技術切開或切出一細縫。a pedestal 910 has a supply portion 9 11 , a take-up portion 9 1:2 and a working space 9 丨 3 interposed therebetween; a line electrode 920 ′ is supplied from the supply portion 911 to enter the working space The retracting unit 912 is re-entered in 913.藉 By the combination of the above components, a workpiece 903 is cut or cut into a slit by a conventional electric discharge machining technique.

〇然而’傳統式之線切割放電加工裝置之線電極9 2 0為 圓柱狀i其切面為圓形。請參閱第二圖,假設其直徑d 為50微米,加上兩側之放電間隙6各5微米,則理論上切 後之切割見度X為60微米。若線·電極92〇選用銅製品,價格 幸乂便且’但強度較差,現有商業用之最小直徑約「〕〇微米。 若線電極9 2 0改用鎢製&,價格較貴,但強度較佳,現有 商業用之最小直徑約3 〇微米。 因此,業界一直希望開發出直徑低於3 0微米的線電極 920,而且,若能以較廉價之材質來達成則更好。 一However, the wire electrode 9 2 0 of the conventional wire-cut electric discharge machining apparatus has a cylindrical shape and its sectional surface is circular. Referring to the second figure, assuming a diameter d of 50 μm and a discharge gap of 6 μm on both sides, the theoretical cut visibility X is 60 μm. If the wire/electrode 92 is made of copper, the price is fortunate and 'but the strength is poor. The minimum diameter of the commercial commercial is about 〕 〇 micron. If the wire electrode 9 2 0 is changed to tungsten &, the price is more expensive, but The strength is better, and the minimum diameter for commercial use is about 3 〇. Therefore, the industry has been hoping to develop a wire electrode 920 having a diameter of less than 30 μm, and it is better if it can be achieved with a cheaper material.

第5頁 1301779 五、發明說明(2) 之加:ί面9:再/閱第二圖’放電加工時之待加工物93〇 些微小金屬有::不放電加工時會產生-因 寸d有排屑不順的情形。 【發明内容】必要研發新產品,以解決上述缺點。 在於提供-種放電加工裝置與放 表面時有研磨由於複數微小顆粒在接觸加工 心ΠίίΓΐ;能,戶斤以’可以將表面研磨的更細 八Τ田改善表面粗糙度。 \ 本發明之次一目的,在於提供一種放電加工 電加工之線電極及其製法,在放電加工時,微顆2 可順勢帶走金屬屑,故,排屑效果佳。複數撻小顆粒 本發明之又一目的,放電加工裝置與放電加工之線電 極及其製法,可進行切割寬度更小之窄縫加工。 本發明係提供一種放電加工裝置與放電加工之線電極 及其製法,關於放電加工裝置部份,其包括: 一基座,係具有一供線部、一收線部及_介於其間之 工作空間; 、/' Β 一線電極,由該供線部供出而進入該工作空間中再進 入該收線部中; 一對擠壓滾輪’用以將該線電極由圓桿狀擠壓變形成 為扁平狀,而形成一第一表面及一第二表面,且該第一表 面與該第二表面大體平行;該對擠壓滾輪係由至少一撥2 滚輪驅動裝置所驅動, 1301779 五、發明說明(3) 一對顆粒供給裝置 喷出複數微小顆粒,而 面上;又,該複數微小 關於該放電加工之 及一苐一表面,其上係 之橫截面概呈矩形並具 關於該放電加工之 步驟、滾壓步驟、上顆 本發明之上述目的 之詳細說明與附圖中, 兹以下列實施例並 【實施方式】 請參閱第三至五圖 之第一實施例,其包括 滾輪3 0及一對顆粒供給 該基座10,具有一 間之工作空間1 3 ; ’用以朝該第一平面及該第二平面 使其附著於該第一表面及該第二表 顆粒係不導電。 線電極,該線電極星右一笼一矣 固定複數個微小顆粒,且該線電極 有一線寬及一線厚。 線電極之製法,其主要包括··準備 粒步驟、完成步驟。 與優點,不難從下述所選用實施例 獲得深入瞭解。 配合圖式詳細說明本發明於後: ’本發明係有關一種放電加工裝置 一基座1 0、一線電極20、一對擠壓 裝置40。 供線部11、一收線部1 2及一介於其 ^ 線電極2 0,係由該供線部1 1供出而進入該工作空間 13後再進入該收線部12中;· μ , 一對擠壓滾輪3 0,係用以將該線電極2 0由圓桿狀擠壓 成扁平狀,並形成一第一表面21及一第二表面22,該 由表面21與該第二表面22大體平行;該對擠壓滾輪30係 至少一擠壓滾輪驅動裝置3丨所驅動; ~對顆粒供給裝置40,係用以朝該第一平面21及該第 1301779 五、發明說明(4) ---- 二平面22喷出複數微小顆粒41,並使其附著於該第_表面 21及該第二表面22上;又,該複數微小顆粒41不導電。 在本實施例中,又包括一對顆粒附著滾輪5 〇,位於該 對顆粒供給裝置40之喷出方向附近,用以將該複數微小顆 粒41擠壓並附著在線電極2〇之第一表面21及第二表面22 ; 又,該對顆粒附著滾輪5 0係由至少一顆粒附著滾輪驅動元 件5 1所驅動。當然,該顆粒附著滾輪5 〇也可省略,而由該 對擠壓滾輪3 0來取代,亦即,該擠壓滾輪3 〇同時具有將線 電極20擠壓成扁平狀,以及將複數微小顆粒41直接擠入線 電極20而附著(或嵌卡)於其上之功能。 關於該微小顆粒4 1,必須不導電,最好具有研磨表面 的功能,故可選自工業用鑽石、金剛砂、碳化硼、二氧化 矽、類似功能之材料。 其次,請參閱第六及七圖,此為本發明之第二實施例 ,其基本結構與前述之第一實施例相同,在此不贅述。當 然,為增加附著效果,又包括: 一對膠液供應元件60,係用以對該線電極20之第一表 面21及第二表面22塗佈一^膠液(圖面未予顯示,合先陳明 。),藉此使該複數微小顆粒U穩固的附著於該第一表面 21及第二表面22上。 其中,此膠液係選自工業用黏膠、紫外線膠(俗稱UV 膠)、熱硬化膠、類似功能之膠液。 若採用紫外線膠,則需搭配一紫外線光源(圖中未示) ,程序上係先將線電極2 0壓扁,之後喷塗紫外線膠於第一 1301779 五、發明說明(5) 表面21及第二表面22,再喷出複數微小顆粒41,經顆粒附 著滾輪5 0之擠壓,再經過紫外線光源之照射而硬化,穩固 的將複數微小顆粒41附著於該線電極20上。 當然’如苐六圖所示,不管是前述那一實施例,都可 以再對線電極2 0與待加工物9 3 0的加工縫隙處,施予一冷 卻液或是潤滑液,有助提昇線電極20對待加工物930的加 工速度及品質。 關於本發明之放電加工方法,請參閱第五圖,此為第 一實施例之加工方法之步驟,其依序包括:準備步驟7 1、 滾壓步驟72、上顆粒步驟74、完成步驟75,其中: 關於準備步驟71,係準備一線電極2〇,其橫截面概呈 圓形’且具有一直徑D(配合參閱第四圖); 該滾壓步驟72,係利用一對擠壓滾輪3〇,將該線電極 20擠壓形成一第一表面21及一第二表面22,該第一、二表 面21與22大體平行;Page 5 1301779 V. Invention Description (2) Addition: 面面9: Re-reading the second picture 'The workpiece to be processed during the electrical discharge machining 93 〇 some tiny metals are:: will be produced when not discharging - There are cases where the chip removal is not smooth. SUMMARY OF THE INVENTION It is necessary to develop new products to solve the above disadvantages. In the case of providing an electric discharge machining apparatus and a surface, there is grinding due to the fact that a plurality of fine particles are in contact with each other, and the surface roughness can be improved by the finer octagonal field which can grind the surface. The second object of the present invention is to provide a wire electrode for electrical discharge machining and a method for manufacturing the same, and in the electrical discharge machining, the micro-particles 2 can take away the metal chips, so that the chip removal effect is good. In addition, the wire electrode of the electric discharge machining apparatus and the electric discharge machining method and the manufacturing method thereof can perform the slit machining with a smaller cutting width. The present invention provides a wire electrode for an electric discharge machining device and an electric discharge machining, and a method for manufacturing the same, relating to an electric discharge machining device, comprising: a base having a wire supply portion, a wire take-up portion, and a work therebetween Space; / / Β a wire electrode, which is supplied from the wire feeding portion into the working space and then enters the wire take-up portion; a pair of pressing rollers 'for deforming the wire electrode from a round rod shape into a flat shape Forming a first surface and a second surface, and the first surface is substantially parallel to the second surface; the pair of pressing rollers are driven by at least one of the 2 roller driving devices, 1301779 3) a pair of particle supply devices eject a plurality of micro-particles on the surface; and the plurality of micro-dissections on the surface of the e-discharge process, the cross-section of the upper system is rectangular and has steps related to the electrical discharge machining The detailed description of the above-mentioned object of the present invention and the accompanying drawings are as follows. [Embodiment] Please refer to the first embodiment of the third to fifth figures, which includes a wheel 30 and a The susceptor is supplied with the susceptor 10 having a working space 1 3; </ RTI> for attaching to the first surface and the second plane to the first surface and the second surface granules are non-conductive. A wire electrode, which is fixed in a plurality of tiny particles, and has a line width and a line thickness. The method for preparing a wire electrode mainly comprises: preparing a particle step and completing a step. With advantages, it is not difficult to gain insights from the selected embodiments described below. DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in detail with reference to the drawings: The present invention relates to an electric discharge machining apparatus, a base 10, a line electrode 20, and a pair of pressing means 40. The wire supply portion 11, the wire receiving portion 1 2 and the wire electrode 20 are supplied from the wire portion 1 1 and enter the working space 13 and then enter the wire receiving portion 12; The pressing roller 30 is configured to press the wire electrode 20 into a flat shape by a round rod shape, and form a first surface 21 and a second surface 22, and the surface 21 and the second surface 22 are formed. The pair of squeezing rollers 30 are driven by at least one squeezing roller driving device 3; the pair of granule supply device 40 is for facing the first plane 21 and the 1301779. 5, invention description (4) - --- The two planes 22 eject a plurality of fine particles 41 and attach them to the first surface 21 and the second surface 22; in addition, the plurality of fine particles 41 are not electrically conductive. In this embodiment, a pair of particle attachment rollers 5 又 are further disposed, which are located near the discharge direction of the pair of particle supply devices 40 for pressing and adhering the plurality of fine particles 41 to the first surface 21 of the wire electrode 2〇. And the second surface 22; further, the pair of particle attachment rollers 50 are driven by at least one particle attachment roller drive element 51. Of course, the particle-adhering roller 5 〇 can also be omitted, and is replaced by the pair of squeezing rollers 30, that is, the squeezing roller 3 〇 simultaneously has the wire electrode 20 extruded into a flat shape, and the plurality of fine particles 41 The function of directly squeezing into the wire electrode 20 to attach (or snap-in) thereto. The fine particles 41 must be non-conductive and preferably have a function of abrading the surface, so that they can be selected from industrial diamonds, silicon carbide, boron carbide, cerium oxide, and the like. Next, please refer to the sixth and seventh figures, which are the second embodiment of the present invention, and the basic structure thereof is the same as the first embodiment described above, and details are not described herein. Of course, in order to increase the adhesion effect, the method further includes: a pair of glue supply elements 60 for applying a glue to the first surface 21 and the second surface 22 of the wire electrode 20 (the surface is not shown, First, the plurality of fine particles U are firmly adhered to the first surface 21 and the second surface 22. Among them, the glue is selected from industrial glue, ultraviolet glue (commonly known as UV glue), heat hardening glue, glue of similar function. If UV glue is used, it needs to be equipped with an ultraviolet light source (not shown). The procedure is to first flatten the wire electrode 20, then spray the UV glue on the first 1301779. 5. Invention description (5) Surface 21 and The second surface 22 is further sprayed with a plurality of fine particles 41, which are pressed by the particle-attaching roller 50, and then hardened by irradiation with an ultraviolet light source to firmly adhere the plurality of fine particles 41 to the wire electrode 20. Of course, as shown in the sixth figure, in the above-mentioned embodiment, it is possible to apply a coolant or a lubricating liquid to the processing gap between the wire electrode 20 and the workpiece 9390, which can help to improve. The processing speed and quality of the wire electrode 20 to be processed 930. For the electric discharge machining method of the present invention, please refer to the fifth figure, which is a step of the processing method of the first embodiment, which includes, in order, a preparation step 71, a rolling step 72, an upper particle step 74, and a completion step 75. Wherein: in the preparation step 71, a line electrode 2 is prepared, which has a circular cross section and has a diameter D (refer to the fourth figure); the rolling step 72 utilizes a pair of squeeze rollers 3 Extruding the wire electrode 20 to form a first surface 21 and a second surface 22, the first and second surfaces 21 and 22 being substantially parallel;

該上顆粒步驟74,係利用一顆粒供給裝置4〇朝該第一 表面21及該第二表面22喷出複數微小顆粒41,並透過一對 顆粒附著滾輪5 0將該複數微小顆粒41擠壓並附著在線電極 20之第一表面21及第二表面22 J 至於該完成步驟75,係在該線電極20之第一表面21與 第二表面22上固定複數個微小顆粒41,且該線電極2〇之橫 截面概呈矩形並具有一線寬W及一線厚τ (配合參閱第四及 第六圖);又,該線寬W係大於該直徑d,但該線厚τ係小於 該直徑D。 1301779 、發明說明(6) 或是,在上顆粒步驟74前可增加一上膠步驟 七圖所示,而成為第二實施例之加工方法之步驟 。 而此上膠步驟73,係用一對膠液供應元件6〇 電極20之第一表面21及第二表面22上膠。 對該綠 關於本發明之實際運作方式,首先,#第八及第九圖 ,不:當進行放電加工時,線電極2〇由上至下不斷的供應 而待加工物9 3 0則逐漸移動以透過放電加工的方式切割 一具有切割寬度X之凹槽,該凹槽係為線厚τ加上兩側之The upper particle step 74 is performed by spraying a plurality of fine particles 41 toward the first surface 21 and the second surface 22 by a particle supply device 4, and extruding the plurality of fine particles 41 through a pair of particle attachment rollers 50. And attaching the first surface 21 and the second surface 22 J of the wire electrode 20 to the finishing step 75, fixing a plurality of fine particles 41 on the first surface 21 and the second surface 22 of the wire electrode 20, and the wire electrode The cross section of the 〇 is generally rectangular and has a line width W and a line thickness τ (refer to the fourth and sixth figures); in addition, the line width W is larger than the diameter d, but the line thickness τ is smaller than the diameter D . 1301779, invention description (6) Alternatively, a step of sizing may be added before the upper particle step 74, and the steps of the processing method of the second embodiment are obtained. The sizing step 73 is performed by sizing the first surface 21 and the second surface 22 of the pair of glue supply members 6 电极 the electrode 20. Regarding the actual operation mode of the present invention, first, #8th and ninth diagrams, no: when the electric discharge machining is performed, the wire electrode 2〇 is continuously supplied from top to bottom while the workpiece 9 3 0 is gradually moved. Cutting a groove having a cutting width X by means of electrical discharge machining, the groove being a line thickness τ plus both sides

放電間隙G(如第十圖所示);當線厚τ越小,所加工得到之 切割寬度X也越小。 特別是請參閱第十至第十二圖,由於待加工物93〇之 力:工表面931上具有許多突出部933 (如第十一圖所示),使 得整體之表面粗糙度不佳,但是,因為本發明設有複數微 小顆粒41,故產生兩大功效: (1 )可將突出部9 3 3刮除或磨平一些,使得待加工物 9 3 0之加工表面9 3 1較平坦,而大幅改善加工表面9 3 1之表 面粗度。 (2)可將放電加工時所產生之金屬屑932順勢帶走,排 屬更順暢,避免金屬屑9 3 2累積·之問題。 故’在第十二圖中,經複數微小顆粒41刮除後之加工 表面9 3 1已變得較為平坦,而縱使部分微小顆粒4 1在線電 極20進行放電加工的過程中,因與待加工物93〇摩擦而脫 落’仍不失其摩擦突出部9 3 3 (如第十一圖所示)的功效。 此外’由於本發明之線電極2 〇之表面上附有複數微小The discharge gap G (as shown in the tenth figure); the smaller the line thickness τ, the smaller the cut width X obtained by the processing. In particular, please refer to the tenth to twelfth drawings, due to the force of the workpiece 93: the workpiece surface 931 has a plurality of protrusions 933 (as shown in FIG. 11), so that the overall surface roughness is not good, but Because the present invention is provided with a plurality of micro-particles 41, two major effects are produced: (1) the protrusions 9 3 3 can be scraped or smoothed, so that the processed surface 913 of the workpiece 930 is flat. The surface roughness of the machined surface 913 is greatly improved. (2) The metal shavings 932 generated during the electric discharge machining can be taken away, and the discharge is smoother, and the problem of accumulation of metal shavings is avoided. Therefore, in the twelfth figure, the machined surface 913 after being scraped off by the plurality of fine particles 41 has become relatively flat, and even though some of the minute particles 4 1 are subjected to electric discharge machining in the wire electrode 20, The object 93 rubs and falls off' without losing the effect of its friction protrusion 9 3 3 (as shown in Fig. 11). Further, due to the fact that the surface of the wire electrode 2 of the present invention is provided with a plurality of tiny

l3〇1779 ___________ 友、發明說明(7) 羯粒41,亦可當作「線据」來使用。 再者,由於本發明之線電極20已被擠扁,所以線厚T 匕原先之直徑D小,因此,可以利用較廉價且尺寸較大之 線電極,經擠壓後,變成可進行切割寬度X更小之窄缝加 施例二由較佳實施例詳細說明本發明,對於該實 與範圍。任何簡單修改與變化,皆不脫離本發明之精神 確可GiJtr月丄可使熟知本項技藝者明瞭本發明的 專利申請。、,貫已符合專利法之規定,爰提出發明L3〇1779 ___________ Friends, invention instructions (7) 羯 41 41, can also be used as a "line". Furthermore, since the wire electrode 20 of the present invention has been squashed, the wire thickness T 匕 is originally small in diameter D. Therefore, it is possible to use a wire electrode which is relatively inexpensive and has a large size, and after being extruded, becomes a cutting width. The smaller slit of X and the second embodiment are described in detail by the preferred embodiment, for the scope of the invention. Any simple modifications and variations are possible without departing from the spirit of the invention. It is true that GiJtr can make the patent application of the present invention well known to those skilled in the art. , and have complied with the provisions of the Patent Law

1301779 圖式簡單說明 【圖式簡單說明】1301779 Simple description of the drawing [Simple description of the drawing]

$ 一圖係傳統式線切割放電加工裝置之立體圖 第二圖係傳統式線切割放電加工時之局部剖視示意圖 第二圖係本發明之第一實施例之立體圖 ,四圖係本發明之第一實施例之局部放大立體圖 第五圖係本發明之第一實施例之加工方法之流程圖 第六圖係本發明之第二實施例之局部放大立體圖 ^七圖係本發明之第二實施例之加工方法之流程圖 第八圖係本發明線切割過程一之示意圖 第九圖係本發明線切割過程二之示意圖 第十圖係本發明線切割過程之局部放大示意圖 第十一圖係第十圖圈示處研磨前之放大示意圖 第十一圖係第十圖圈示處研磨後之放大示音圖 【圖式元件符號說明】 心 11、9 11供線部 1 3、9 1 3工作空間 21第一表面 3 0擠壓滾輪 -4 0顆粒供給裝置 50顆粒附著滾輪 6 0膠液供應元件 7 2滾壓步驟 7 4上顆粒步驟 9 3 0待加工物Fig. 1 is a perspective view showing a conventional wire-cut electrical discharge machining device. Fig. 2 is a partial cross-sectional view showing a conventional wire-cut electrical discharge machining. The second drawing is a perspective view of a first embodiment of the present invention, and the fourth drawing is the first embodiment of the present invention. 5 is a partially enlarged perspective view of a processing method of a first embodiment of the present invention. A sixth enlarged view of a second embodiment of the present invention is a second embodiment of the present invention. The eighth embodiment is a schematic diagram of the wire cutting process of the present invention. The ninth drawing is a schematic view of the wire cutting process of the present invention. The tenth drawing is a partial enlarged schematic view of the wire cutting process of the present invention. The figure shows the enlarged view before grinding. The eleventh picture shows the enlarged sound picture after the grinding at the circle of the tenth figure. [Illustration of the symbol of the figure] Heart 11, 9 11 supply part 1 3, 9 1 3 working space 21 first surface 3 0 squeeze roller - 4 0 particle supply device 50 particle attachment roller 6 0 glue supply element 7 2 rolling step 7 4 upper particle step 9 3 0 to be processed

10、910基座 1 2、91 2收線部 20、920線電極 22第二表面 31擠壓滾輪驅動裝置 41微小顆粒 5 1顆粒附著滾輪驅動元件 71準備步驟 7 3上膠步驟 7 5完成步驟10, 910 base 1 2, 91 2 take-up part 20, 920 line electrode 22 second surface 31 squeeze roller drive device 41 tiny particles 5 1 particle attachment roller drive component 71 preparation steps 7 3 gluing step 7 5 completion steps

1301779 圖式簡單說明 9 3 1加工表面 933突出部 D直徑 W線寬 932金屬屑 X切割寬度 G放電間隙 T線厚1301779 Simple description of the drawing 9 3 1 Machining surface 933 protrusion D diameter W line width 932 metal shavings X cutting width G discharge gap T line thickness

Claims (1)

1301779 --^^J^26587 /、申凊專利範圍 1 -種放電加工裝置,其包括 且 !WTr …一 〆、w q口· ----— 工作空間/、有一供線部、-收線部及-介於其間之 進入該:Ξ部ΐ該供線部供“進入該工作空間後再 成:=滾m該線電極由圓桿狀擠壓變形 第:::丨形成一第一表面及-第二表面,G 至小ί:該第二表面大體平行;該對擠壓滾輪係! 夕擠壓滚輪驅動裝置所驅動; ’、 一對顆粒供給裝置,用以朝該第一平面及該第二 面噴出複數微小顆粒,而使其附著於該第一表面^: 第二表面上;又,該複數微小顆粒係不導電。 μ 如申請專利範圍第i項所述之放電加工裝置,复 括: ,、又包 一對顆粒附著滾輪,位於該對顆粒供給裝置之嘴出 方向附近,用以將該複數微小顆粒擠壓並附著在線電 極之第一表面及第二表面;又,該對顆粒附著滾輪係 3 由至少一顆粒附著滾輪驅動元件所驅動。 “ 如申請專利範圍第1項所述之放電加工裝置,其又勺 括: ’、匕 一對膠液供應元件,係用以對該線電極之第一表面 及第二表面塗佈一膠液,藉此使該複數微小顆粒穩固 的附者於該苐一表面及第二表面上。 ' 4 爾( 如申請專利範圍第1項所述之放電加工裝置,其中,1301779 --^^J^26587 /, 申凊 patent scope 1 - an electric discharge machining device, including: WRT ... a 〆, wq mouth · ----- work space /, a supply line, - take off The part and the intervening entry: the ΐ part ΐ the supply part for "entering the working space and then re-forming: = rolling m the line electrode is deformed by a round rod shape::: 丨 forming a first surface And a second surface, G to small ί: the second surface is substantially parallel; the pair of squeeze rollers are driven by the squeezing roller drive; ', a pair of particle supply means for facing the first plane and The second surface ejects a plurality of micro-particles to adhere to the first surface: the second surface; and the plurality of micro-particles are non-conductive. μ. The electric discharge processing apparatus according to claim i, a plurality of particles, and a pair of particle-attaching rollers are disposed adjacent to the nozzle-out direction of the pair of particle supply devices for pressing and adhering the plurality of micro-particles to the first surface and the second surface of the wire electrode; The particle attachment roller system 3 is driven by at least one particle attachment roller The electric discharge machining device according to the first aspect of the patent application, which further includes: ', a pair of glue supply elements for coating the first surface and the second surface of the wire electrode A glue is applied whereby the plurality of fine particles are firmly attached to the first surface and the second surface. ' 4 (as in the electric discharge machining apparatus described in claim 1 of the patent application, wherein 1H 第14頁 1301779 修正 曰 案號 93126587 六、申請專利範圍 該複數微小顆粒係選自工業用鑽石、金剛砂、石户 、二氧化矽之其中一項或數項。 吸化糊 5 · —種放電加工線電極之製法,其包括下列步驟·· 準備步驟:係準備一線電極,其橫截面概 且具有一直徑,· 圓形’ 滾壓步驟··係利用一對擠壓滾輪,將該線電極 形成一第一表面及一第二表面,兩者大體平行;&amp; 上顆粒步驟··利用一顆粒供給裝置朝該第一表面及 該第二表面喷出複數微小顆粒,並透過一對顆粒附著 滾輪將該複數微小顆粒擠壓並附著在線電極之第一表 面及第二表面上; 完成步驟··該線電極之第一表面與第二表面上係固 定複數個微小顆粒,且該線電極之橫截面概呈矩形並 具有一線寬及一線厚;又,該線寬係大於該直徑,但 該線厚係小於該直徑。 6 如申請專利範圍第5頊所述之放電加工之線電極之製 法,其中,在上顆粒夕驟前可增加一上膠步驟,該上 膠步驟係利用一對膠浪供應元件,對該線電極之第一 表面及第二表面上膠。1H Page 14 1301779 Amendment 曰 Case No. 93126587 VI. Scope of Application The plurality of fine particles are selected from one or more of industrial diamonds, silicon carbide, stone houses and cerium oxide. A method for preparing an electric discharge machining wire electrode, comprising the following steps: Preparation step: preparing a wire electrode having a diameter in a cross section, and a circular 'rolling step··using a pair Squeezing the roller, forming the wire electrode to form a first surface and a second surface, the two are substantially parallel; &amp; granules step · using a particle supply device to spray a plurality of tiny particles toward the first surface and the second surface And squeezing the plurality of fine particles by a pair of particle attachment rollers and adhering to the first surface and the second surface of the wire electrode; completing the step of fixing the plurality of the first surface and the second surface of the wire electrode a fine particle, and the wire electrode has a rectangular cross section and has a line width and a line thickness; further, the line width is larger than the diameter, but the line thickness is smaller than the diameter. [6] The method for manufacturing a wire electrode for electric discharge machining according to the fifth aspect of the patent application, wherein a step of applying a glue may be added before the step of the upper particle, wherein the step of applying the glue is to use a pair of glue wave supply elements, the line is The first surface and the second surface of the electrode are glued.
TW093126587A 2004-09-02 2004-09-02 Electrical discharge machining device and electrical discharge machining wire electrode and manufacturing method thereof TW200609069A (en)

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