1301736 九、發明說明： 【發明所屬之技術領域】 一種電路板電性連接墊之導電結構及其製法，尤指一 種在電路板表面之各電性連接墊形成有列導電結構^ 法’以連接不同的電子元件。 衣 【先前技術】 隨著電子產業的蓬勃發展，電子產品之外型趨向輕薄 2=在功能上則逐漸邁人高性能、高功能、高速度化的 "向。而覆晶式（Flip chiP)半導體封裝技術為一種先進 =咖褒技術，在現行覆晶技術中，係於半導體積體 =路（Integrated Circuit ; IC)晶片的表面上配置有電極焊 ::於該電極焊墊上形成有焊錫凸塊，且在—有機電路 封衣基板上形成有相對應之電性連接墊與焊錫凸塊 供該晶片以電性接觸面朝下的方式設置於該封裝基板上。 心由於越來越多的產品設計趨向於小型化、高逮度、夕 功能，因此，覆晶技術的應用範圍將不斷擴大，成^ : f準的晶片封裝技術。同時為提升該些電子裝置之電性品 二：:I其中叹置有例如電阻、電容或電感等被動元件， 路：件同樣採用表面黏著技術(SMT)以接置於電 ，俾使預桿錫凸塊與表面黏著型金屬連接元件並存 同电/上’且兩者所形成之焊錫材料高度及尺寸並不相 與❹有不同類型之半導體元件之相配合電性導接。 而目可業界普遍使用化學沈積及模板印刷技街 (StenCiminting T—y)來形成基板上之谭錫材料。 19298 5 1301-736- 如第1A圖至f 1E圖所*，主要係於一具有複數電性 ‘連接墊2〇1(pad)的電路板20上形成一有機絕緣保護層 ，2】（solder mask)，該絕緣保護層2〗經圖案化製程而形θ成複 數個開孔211以顯露出該電性連接墊2〇1(如第圖所 示）；藉由濺鍍、蒸鍍、無電電鍍及化學沈積之一者形成一 金屬黏著層22(如第1Β圖所示）；再以一具有網格之 模板23於該電路板20之部份電性連接墊2〇1表面之黏著 層22以模板印刷方式形成一焊錫材料24(如第ι〇圖所 示）；最後再經由回焊如彳1〇^製程以形成 …圖所示)，俾以在電性連接塾201上形：同4二 之金屬黏著層或焊錫材料。 、 . ^以模板印刷的方式形成凸塊或焊接錫球，形成的厚 • f越高’於後段的製程中所形成的高度不易控制，導致迴 知後之凸塊或焊接錫球的高度不平均，而影響其電性連接 f片或印刷電路板。以及於該電路板之電性連接鲁上印刷 鲁焊錫材料以形成凸塊或焊接錫球容易導致迴焊製程中過多 焊錫材料溶融造成橋接現象及短路問題，而無法提供細間 距（Fine Pitch)之電性連接墊。同時大量使用焊錫材料亦面 臨環保問題。 上述之問題，實已成目前電路板製造業者亟欲1301736 IX. Description of the invention: [Technical field of the invention] A conductive structure of a circuit board electrical connection pad and a method of manufacturing the same, in particular, an electrical connection pad on a surface of a circuit board is formed with a column conductive structure to connect Different electronic components. Clothing [Prior Art] With the booming development of the electronics industry, the appearance of electronic products tends to be thin and light. 2 = The function is gradually becoming high-performance, high-performance, and high-speed. The flip-chip (Flip chiP) semiconductor packaging technology is an advanced = curry technology. In the current flip chip technology, electrode bonding is arranged on the surface of a semiconductor integrated circuit (IC) wafer: Solder bumps are formed on the electrode pads, and corresponding electrical connection pads and solder bumps are formed on the organic circuit sealing substrate, and the wafers are disposed on the package substrate with the electrical contact surface facing downward. . As more and more product designs tend to be miniaturized, high-capacity, and eve functions, the application range of flip chip technology will continue to expand, becoming a wafer packaging technology. At the same time, in order to improve the electrical properties of the electronic devices: 1:I sighs passive components such as resistors, capacitors or inductors, the road: the same surface adhesion technology (SMT) is used to connect to the electricity, so that the pre-bar The tin bumps and the surface-adhesive metal connecting elements coexist and/or the solder materials formed by the two are not in the same height and size as the mating electrical contacts of the different types of semiconductor components. It is common to use the chemical deposition and stencil printing technology street (StenCiminting T-y) to form the tan tin material on the substrate. 19298 5 1301-736- As shown in Fig. 1A to Fig. 1E, mainly to form an organic insulating protective layer on a circuit board 20 having a plurality of electrical 'connecting pads 2 〇 1 (pad), 2] (solder Mask), the insulating protective layer 2 is formed into a plurality of openings 211 by a patterning process to expose the electrical connection pads 2〇1 (as shown in the figure); by sputtering, evaporation, no electricity One of electroplating and chemical deposition forms a metal adhesion layer 22 (as shown in FIG. 1); and an adhesive layer having a grid template 23 on the surface of the circuit board 20 is electrically connected to the surface of the pad 2〇1. 22 forming a solder material 24 by stencil printing (as shown in FIG. 1); finally, by reflow soldering, for example, to form a pattern as shown in the figure), and forming a shape on the electrical connection 201: Same as the metal adhesion layer or solder material of 4-2. ^. Forming a bump or solder ball by stencil printing, the thickness of the formed f is higher. The height formed in the process of the latter stage is not easy to control, resulting in the height of the bump or solder ball after the return. On average, it affects its electrical connection to f-chip or printed circuit boards. And printing the solder material on the electrical connection of the circuit board to form bumps or solder balls is likely to cause bridging and short circuit problems caused by excessive solder material melting in the reflow process, and cannot provide fine pitch (Fine Pitch). Electrical connection pad. At the same time, the extensive use of solder materials is also facing environmental issues. The above problems have become the current circuit board manufacturers' desire
課題。 J 【發明内容】 I於上述習知技術之種種缺點，本發明之主要目的在 方；棱供一種電路板電性連接墊之導電結構及其製法，得提 19298 6 1301736* 供不同的導電結構，以供不同電性連接墊之電性連接使用。 本發明之又一目的在於提供一種電路板電性連接墊 之導電結構及其製法’並可形成細線路間距（Fine pitch)之 電性連接結構。 為達上述及其他目的’本發明之電路板電性連接墊之 導電結構之製法的較佳實施，係包括：提供一具有第一及 第二表面之電路板，該第一表面具有複數第一及第二電性 連接f❿a第—表面具有複數第三電性連接塾，且該第 -及第二表面分別形成有—第—及第二絕緣保護層，並形 成有複數個開孔以顯露該第一、第二及第三電性連接墊； 於，第-絕緣層及其開孔處表面形成—第—導電層，且於 :弟：絕緣層及其開孔處表面形成一第二導電層；於該第 -及弟二導電層表面分別形成—第—及第二阻層，且令該 第一ί第二阻層中形成複數開孔以露出該第一表面之第 :性：：：:連接墊表面之第一導電層及第二表面之第三 第二導電層；於顯露出該第-及第二阻 於二工二弟二及第三電性連接墊表面形成金屬 二連接層;於該第-及第二阻 阻層表面分别形二第=一連接層;於該第-及第二 三電性連接墊，且令Μ二=阻層，以覆蓋該第一及第 性連接墊上金屬衫面#r日形成開孔以露出該第二電 連接塾表面之it 連接層；以及於該第二電性 連接層表面形成第二連接層。 〜電路板之導電結構之製法復包括移除該第 19298 7 1301736* 二、弟四阻層及第―、第二阻層及該第— 蓋之第一、第二導電層，其中，該第一、第=層覆 ㈣四阻層係以物理及化學其中之-方式:：：第弟三 之第一、第二導電層係以微。二: 你人層所製成，該金屬黏著層係可選自钱 銀、金、錫/銀、雜/你厂k自錫、 场/銀錫/銀/銅、錄/金所組成群组之其中 μ弟一連接層係以電 選自錫、銀、全、Π: 成，該烊錫材料係可 此外，本發明之製法的另一實施，係於形：者、車技 層之前，先移除覆蓋於該金屬層表面之第接 可使後續形成於該金屬層上的第二連 ^層:因而 一連接層之存在 乂生連接墊上的導電結構由於第 什隹而產生金屬界面問題， 的導電結構之信賴性。 〜胃到所形成 桩@本發”在第—電性連接墊上形成金屬層及第、車 第-連接墊上形成金屬層、第-連接#及 弟一連接層，而在兮筮、土， 安曰及 連接厣 Μ二電性連接墊上形成金屬層及第一 連接層。此外，前述製 乐 構，而益需开4m 而要直接電鍍形成導電結 用需求。P了知供不同電性連接的使 人务皂性連接墊表面係以電获的太々1、 黏著層作為第一連接 x > 成金屬 性逢控」 連接表面黏著型元件，該第一- 性連接墊表面係以 必弟一， 、方式形成焊錫材料作為第一連接 8 19298 1301736· 層與第二連接層，以連接半導體晶片，而第三電性連接塾 表面係以電鍍的方式形成金屬黏著層作為第一連接層，以 作為該電路板之球塾(ballpad)。因電鑛製程係以曝二、顯 影形成阻層開孔’而能克服習知模版印刷法在細凸塊間距 時’即產生之製程瓶頸，且電鑛製程可精確控制痒錫材料 :積數量，避免迴焊製程中過多焊錫材料溶融造成橋接現 ，而可形成細線路間距（Fine pitch)之電性連接結構。 【實施方式】 、以下係藉由特定的具體實施例說明本發明之實施方 式，熟悉此技藝之人士可由本說明書所揭示之内容輕易地 瞭解本發明之其他優點與功效。 [第一實施例] 明芩閱第2 A圖至第21圖，係為本發明所揭露一種電 路板電性連接墊之導電結構之製法的剖視示意圖。。而該等 圖式均為簡易之示意圖’僅以示意說明本發明之 製程。 卜請參閱第2A圖，提供一電路板30,該電路板3〇具有 第一表面30a及第二表面3〇b，於該第一表面3〇a具有複 數個尺寸不同之第一電性連接墊3〇1及第二電性連接墊 302 ’而在該第二表面3〇b具有複數第三電性連接墊， 且該第一及第二表面30a，30b分別形成有一第一及第二絕 緣保護層304a，3〇4b ’其係可為綠漆之防焊層材料⑽仏 mask)’亚形成有複數個開孔3〇5a,3〇5b以顯露該第一、第 二及第三電性連接墊301,3〇2,3〇3。而該電路板3〇最外層 19298 1301736 之第一及第二絕緣保護層304a，304b形成之開孔3〇5a，3〇5b •係經曝光、顯影等圖案化製程所形成。 . 如第2B圖所示，接著於該第一絕緣保護層3〇4a及其 開孔305a中之表面形成一第一導電層31a，且於該第二絕 緣保護層304b及其開孔305b中之表面形成第二導電層 31b，其中，該第一及第二導電層31a，31b主要係作爲後續 電鍍金屬材料所需之電流傳導路徑，其可由金屬、合金或 沉積數層金屬層所構成，如選自銅、錫、鎳、鉻、鈦、銅_ 瞻鉻合金或錫·鉛合金等所構成之群組之其中一者所組成，係 以濺鍍、蒸鍍、無電電鍍及化學沈積之一者形成；或可使 用例如聚乙炔、聚苯胺或有機硫聚合物等導電高分子材 ，料，而以旋轉塗佈（spin coating)、噴墨印刷（ ink-jet printing)、網印（screen printing)或壓印（imprinting) 等方式形成該第一及第二導電層31a，31b。 如第2C圖所示，於該第一及第二導電層31a，31b上分 φ別形成弟一及第二阻層32a，32b，且於該第一及第二阻層 32a，32b中分別形成複數開孔320a，320b以露出該第一、第 二及第三電性連接墊301，302,303表面之第一導電層31a 及第二導電層31b。該第一及第二阻層32a，32b可為一例如 乾膜或液態光阻等光阻層（Photoresist)，其係利用印刷、旋 塗或貼合等方式分別形成於該第一及第二導電層3 1 a，Bb 表面’再藉由曝光、顯影等方式加以圖案化，以使該第一 及第二阻層32a，32b中分別形成複數開孔320a，320b，且該 等開孔320a，320b係對應該電路板表面之第一、第二及第 10 19298 1301736 二電性連接墊3〇1，3〇2,3〇3位置處。 如：2D圖:斤示，進行電鍍（Ει__—)製程， • It由該第一及第二導雷爲 一 、電層31a，31b作爲電鍍時的電流傳導 路徑，以在該第一、筮— 弟一及弟二電性連接墊301,302,303 表面之第一及第二導電声 电曰31a，31b上形成金屬層33。苴 ’該金屬層33之材料可為諸如鉛、錫、銀、銅、金、鉍、 銻、鋅:鎳、錯、鎂、銦、碲以及鎵等金屬之其中一者。 ^ :依貫際刼作之經驗，由於銅為成熟之電鍍材 ’較低，因此，該金屬屉+ Μ λ 鸯θ 33以由电鍍銅所構成者為 非以此為限。 η平乂 k 1一 如弟2E圖所示，斜續雷放^ _ 卞°哀電路板30持績進行電鍍製程， 猎由該金屬層3 3具導電特性廿 ― . 、♦电4寸丨生，並以該第一及第二導電層 :a，'b作為進行電鍍時之電流傳導路徑，以在該等金屬層 33上電鑛形成有第一連接声34，r # 入“。 亥第一連接層34係以 讀金屬黏者層所製成，該金屬黏著層係可選自錫、銀、 _金、錫/銀、錫/銀7鋼、鎳/金所組成群組之其中一者。 此外’亦可視製程需要，無需形成該金屬層Μ即可 Γ f 一及第Ϊ阻層32Μ21)開孔咖，3鳥中形成電鍍金 屬黏者層作為弟一連接層34。 如第f圖所示，接著於該第-及第二阻層32a，32b上 分別形成弟二及第四阻層35a，35b，以覆蓋該第一及第三電 性連接塾30U03表面之金屬層％表面的第一連接層外 且令該第三阻層35a中對應該第二電性連接墊3〇2位置形 成複數開孔350a以露出覆蓋該第二電性連接塾術表面之 19298 11 1301*736. 33上的第一連接層34。該第三、第四阻層35a,35b =、、一例如乾膜或液態光阻等光阻層（ph〇t〇resist)，其係利 P刷、旋塗或貼合等方式分別形成於該第—及第二阻層 =32b表面，再藉由曝光、顯影等方式加以圖案化，以使 5亥弟二阻層35a中形成複數開孔35〇a。 报# ^第2G圖所不’於露出該第一連接層34表面復電鍍 ,連接層36，且该第二連接層36係以電鍍焊錫材 广所製成’該焊錫材料係可選自錫、銀 所組成群組之其中一者。 及辞 外如^ 2H圖所示，移除該第三、第四阻層35a，35b及 ==第^且層32a，32b，以及該第一、第二阻層^，奶 二盍：第一、第二導電層3u，31b。其中，該第一、第二、 弟-及第四阻層32a，32b，35a，35b係以物理或化學方式移 除’該第-、第二阻層32a，32b所覆蓋之第一、第二導電 層3la，3lb係以微蝕方式移除。 包 制如第21圖所示，之後，復可進行迴焊（ref1〇W-solder) 衣程，以使該第二電性連接墊搬上之第一、第二連接層 34,36經迴焊而形成—包覆該金屬層33之預焊錫凸塊3/ (solder bump ) 〇 本實施例中，由於該第一連接層34係以電鑛錫方式 形成在第一、第三電性連接墊30U03上之金屬層33上， 而在該第二電性連接塾逝上之金屬㈣表面再以電 錫材料形成第二連接層36，俾可分別在該第―、第 三電性連接墊3〇1，3〇2,3〇3上以電鍵方式形成不同材—質之 12 19298 1301736 導電結構。其中該第一連接層34係以電 成，該金屬黏著層係可選自錫、銀、人 屬钻者層所衣 鎳/金所組成群組之其中—者，可^錫/銀、鍚/銀/銅、 或作為球墊(ban pad)使用；而該第^^面崎型元件’ 焊錫材料所製成，該焊錫材料係可選層36係以電鍍 錯及鋅所組成群組之其中-者，以連接半導：晶此 即以電鍍方式形成不同材質的導t 曰曰 電性連接使用。 ^電結構’以供不同需要的 [弟一貫施例] 如第3A圖至扣圖所示者係為本發明之另—實施製造 2 ’與前-實施不同處在於先移除㈣二電性連接塾上 :屬層表面的第-連接層、然後再電鑛形成第二連接層， 评細製程如下所述。 如第3A圖所示，係接續前實施例之第2F圖，利用例 （Etching)或電解（Electrolyzing)等方式移除位 =遠第三阻層35a之開孔35〇a中之該金屬層33表面上的 第一連接層34。 如第3B圖所示，於該第三阻層35a之開孔35〇a中之 金屬層33上電鍍形成第二連接層36。 如第3C圖所示’接著移除該第三、第四阻層35a，35b 及第、第二阻層32a，32b，以及該第一、第二阻層32a，32b 所覆蓋之第一、第二導電層31a，31b。 如第3D圖所示，之後，復進行迴焊製程，使該第二 屯性連接墊302上之第二連接層36經迴焊而形成一包覆該 13 19298 1301736 金屬層33之預焊錫凸塊38。 • 復請參閱第3C圖，本發明復提供電路板電性連接墊 -之導電結構’係包括:一具有第一及第二表面3〇a,3〇b之電 路板30,該電路板30之第一表面3〇a具有複數個第一、 第二電性連接墊301，302; 一金屬層33及一第一連接層 34係^成於該第一電性連接塾3〇1上；以及一金屬層^ 1一第二連接層36係形成於該第二電性連接墊302上。此 板心第二表面鳥復具有複數個第三電性連 ”，二一金屬層33及一第—連接層34係形成於 4弟二電性連接墊3〇3上。 之^如第2H圖所示’該電路板第二電性連接墊302上 之電結構，復可句括—繁 .33及笛、二 連接層34形成於該金屬層 .及第二連接層36之間。 如第21圖或第3D圖所示，兮筮-兩α 土 之第-β。 忒弟一黾性連接墊302上 弟一連接層36復可經迴焊而形 _之預谭錫凸塊37,38。 $成有包^金屬層33 及第：二發明可在第—電性連接墊上形成金屬層 連該第二電性連接墊上形成金屬層、第- 連接層及第二連接荀9弟 層及第-連接層^外二電性連接塾上形成金屬 成導電社構，而益程亦可視需要直接電鍍形 ^电、，·口構’而無需形成金屬層， 連接的使用需求。 』杈仏不问電性 且該第一電性連接墊 黏著層作為第1㈣，㈣的方式形成金屬 要曰連接表面黏著型元件，該第二電 19298 1301736 性連接墊表面係以電鍍的方式 .層及第二連接層，以連接半導體晶Γ，而第^第一連接 .的方式形成金屬黏著層作為第= 作為该電路板之球塾（ballpad)。 ^層以 •卜。構，而可克服習知模版印刷法之製程瓶 成 成細線路間距（Fine pitch)之電性連接結構。、並可形 a :外’本發明之方法中，並可於形成第二連接声之 則，先移除覆蓋於第二電性連接墊上 关印之 ⑩拯爲^ ^ ^ , 上孟屬層表面的第一連 ，層，使後_成於該金屬層上的第二連接層之 連 二同時：避免最終形成於第二電性連接墊上的導電： 由於弟一連接層之存在而產生金屬界面問題。 冓 上述實施例僅為例示性說明本發明之原理及其功 效，而非用於限制本發明。任何熟習此項技藝之人士均口 f不違背本發明之精神及範4下，對上述實施例進行終: ㈣化。因此，本發明之權利保護範圍，應申 鲁專利範圍所列。 K甲h 【圖式簡單說明】 第1A圖至第ιέ圖係為習知電路板上形成焊錫材 剖視示意圖； “第2 A圖至第21圖係本發明之電路板電性連接墊之導 電結構及其製法的第一實施例剖視示意圖；以及 、 第3A圖至第3D圖係本發明之電路板電性連接墊之導 電結構及其製法的第二實施例剖視示意圖。 【主要元件符號說明】 19298 15 1301736, 20、30 電路板 201 電性連接墊 21 絕緣保護層 211 開孔 22 23 23a 24 • 24,、37、38 30a 30b 301 ’ 302 ’ 303 304a φ 304b 305a、305b 黏著層 模板 網格 焊錫材料 預焊錫凸塊 第一表面 第二表面 第一電性連接墊 第二電性連接墊 第三電性連接墊 第一絕緣保護層 第二絕緣保護層 開孔 31a 第一導電層 31b 第二導電層 32a 第一阻層 32b 第二阻層 320a、320b 開孔 3 3 金屬層 第一連接層 16 19298 34 1301736 35a 第三阻層 350a 開孔 35b 第四阻層 36 第二連接層Question. J [Summary] I have the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a conductive structure for a circuit board electrical connection pad and a method for manufacturing the same, and to provide different conductive structures for 19298 6 1301736* For electrical connection of different electrical connection pads. Another object of the present invention is to provide a conductive structure of a circuit board electrical connection pad and a method of manufacturing the same, and to form a fine pitch electrical connection structure. A preferred embodiment of the method for fabricating the conductive structure of the circuit board electrical connection pad of the present invention for the above and other purposes comprises: providing a circuit board having first and second surfaces, the first surface having a plurality of first And the second electrical connection f❿a has a plurality of third electrical connections, and the first and second surfaces are respectively formed with a first and second insulating protective layer, and a plurality of openings are formed to expose the The first, second and third electrical connection pads; the first insulating layer and the opening surface thereof form a first conductive layer, and a second conductive layer is formed on the surface of the insulating layer and the opening thereof Forming a first-and second-resistive layer on the surface of the first and second conductive layers, and forming a plurality of openings in the first resistive layer to expose the first surface: Selecting a first conductive layer on the surface of the pad and a third conductive layer on the second surface; forming a metal two connection on the surface of the second and third electrical connection pads a layer; a second connecting layer on the surface of the first and second resistive layers; a first-and a second-third electrical connection pad, and a second-resistance layer, to cover the first and the first connection pads, the metal shirt surface #r-day forming an opening to expose the second electrical connection surface of the connection a layer; and forming a second connection layer on a surface of the second electrical connection layer. The method for manufacturing the conductive structure of the circuit board comprises removing the first and second conductive layers of the 19298 7 1301736* 2, the fourth resistive layer and the first and second resistive layers and the first cover, wherein the first First, the first layer of the (four) four-resistance layer is based on physics and chemistry - the way::: the first of the third brother, the second conductive layer is micro. Two: Made by your layer, the metal adhesion layer can be selected from the group consisting of money silver, gold, tin/silver, miscellaneous/your factory k from tin, field/silver tin/silver/copper, record/gold. Wherein, the connection layer is electrically selected from the group consisting of tin, silver, and yttrium, and the bismuth tin material may be further. Another embodiment of the method of the present invention is before the shape: the vehicle technology layer. First removing the second layer covering the surface of the metal layer to form a second layer subsequently formed on the metal layer: thus the presence of a connecting layer on the conductive pad on the bonding pad causes a metal interface problem due to the third layer , the reliability of the conductive structure. ~ Stomach to the formed pile @本发" on the first electrical connection pad to form a metal layer and the first, the first connection pad to form a metal layer, the first connection # and the younger one connection layer, and in the earth, soil, security The metal layer and the first connecting layer are formed on the second electrical connection pad. In addition, the above-mentioned system is required to be directly electroplated to form a conductive junction for the purpose of opening 4 m. P is known for different electrical connections. The surface of the soap-based connection pad is made of electrically obtained enamel 1, the adhesive layer is used as the first connection x > the metallization is controlled, and the surface-adhesive element is connected, and the surface of the first-type connection pad is Forming a solder material as a first connection 8 19298 1301736·layer and a second connection layer to connect the semiconductor wafer, and a third electrical connection surface is formed by electroplating to form a metal adhesion layer as the first connection layer, As the ballpad of the board. Because the electric ore processing system can form the resistive opening by the exposure and development, it can overcome the process bottleneck caused by the conventional stencil printing method at the fine bump pitch, and the electric ore process can precisely control the itch tin material: the number of products In order to avoid the bridging of too much solder material in the reflow process, an electrical connection structure with a fine pitch can be formed. The embodiments of the present invention are described by way of specific embodiments, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention. [First Embodiment] FIG. 2A to FIG. 21 are schematic cross-sectional views showing a method of manufacturing a conductive structure of a circuit board electrical connection pad according to the present invention. . The drawings are merely schematic illustrations to illustrate the process of the invention. Referring to FIG. 2A, a circuit board 30 is provided. The circuit board 3 has a first surface 30a and a second surface 3B. The first surface 3A has a plurality of first electrical connections of different sizes. The pad 3〇1 and the second electrical connection pad 302′ have a plurality of third electrical connection pads on the second surface 3〇b, and the first and second surfaces 30a, 30b are respectively formed with a first and a second The insulating protective layer 304a, 3〇4b 'which may be a green paint solder resist material (10)仏mask)' is formed with a plurality of openings 3〇5a, 3〇5b to reveal the first, second and third Electrical connection pads 301, 3〇2, 3〇3. The openings 3〇5a, 3〇5b formed by the first and second insulating protective layers 304a, 304b of the outermost layer 19298 1301736 of the circuit board 3 are formed by a patterning process such as exposure and development. As shown in FIG. 2B, a first conductive layer 31a is formed on the surface of the first insulating protective layer 3A4a and its opening 305a, and is disposed in the second insulating protective layer 304b and the opening 305b thereof. The surface is formed with a second conductive layer 31b, wherein the first and second conductive layers 31a, 31b are mainly used as a current conducting path required for subsequent plating of a metal material, which may be composed of a metal, an alloy or a plurality of deposited metal layers. Such as selected from the group consisting of copper, tin, nickel, chromium, titanium, copper chrome or tin-lead alloy, by sputtering, evaporation, electroless plating and chemical deposition One may be formed; or a conductive polymer material such as polyacetylene, polyaniline or organic sulfur polymer may be used, and spin coating, ink-jet printing, screen printing (screen) The first and second conductive layers 31a, 31b are formed by printing or imprinting. As shown in FIG. 2C, the first and second conductive layers 31a, 31b are formed on the first and second conductive layers 31a, 31b, respectively, and the first and second resist layers 32a, 32b are formed in the first and second resistive layers 32a, 32b, respectively. A plurality of openings 320a, 320b are formed to expose the first conductive layer 31a and the second conductive layer 31b on the surfaces of the first, second and third electrical connection pads 301, 302, 303. The first and second resist layers 32a, 32b may be a photoresist layer such as a dry film or a liquid photoresist, which is formed on the first and second portions by printing, spin coating or lamination, respectively. The surface of the conductive layer 3 1 a, Bb is patterned by exposure, development, etc., so that a plurality of openings 320a, 320b are formed in the first and second resist layers 32a, 32b, respectively, and the openings 320a are formed. , 320b corresponds to the first, second and 10 19298 1301736 two electrical connection pads on the surface of the board at positions 3〇1, 3〇2, 3〇3. Such as: 2D map: kg shows, electroplating (Ει__-) process, • It consists of the first and second guide lightning, the electric layer 31a, 31b as the current conduction path during electroplating, in the first, — The metal layer 33 is formed on the first and second conductive acoustic oximes 31a, 31b on the surface of the first and second electrical connection pads 301, 302, 303. The material of the metal layer 33 may be one of metals such as lead, tin, silver, copper, gold, bismuth, antimony, zinc: nickel, germanium, magnesium, indium, antimony, and gallium. ^ : According to the experience of continuous production, since the copper is a mature electroplated material 'lower, the metal drawer + Μ λ 鸯 θ 33 is not limited to the one made of electroplated copper. η平乂k 1一如弟二E diagram, obliquely swaying and dropping _ 卞 哀° mourning board 30 performance to carry out the electroplating process, hunting by the metal layer 3 3 with conductive characteristics . ― ♦ 电 4 inch 丨Raw, and the first and second conductive layers: a, 'b as a current conduction path during electroplating, to form a first connection sound 34, r # into "" on the metal layer 33. The first connecting layer 34 is made of a read metal adhesive layer, which may be selected from the group consisting of tin, silver, gold, tin/silver, tin/silver 7 steel, and nickel/gold. In addition, 'it is also necessary to process the process, no need to form the metal layer Μ 一 f and the first resist layer 32 Μ 21) open hole coffee, 3 birds form an electroplated metal adhesive layer as a connection layer 34. As shown in FIG. 12, second and fourth resistive layers 35a, 35b are formed on the first and second resistive layers 32a, 32b, respectively, to cover the metal layer of the first and third electrical connections 30U03. a plurality of openings 350a are formed outside the first connection layer of the surface and corresponding to the second electrical connection pads 3〇2 in the third resistance layer 35a to expose the second electrical connection The first connection layer 34 on the surface of 19298 11 1301*736. 33. The third and fourth resistance layers 35a, 35b =, a photoresist layer such as a dry film or a liquid photoresist (ph〇t〇 Resist), which is formed on the surface of the first and second resistive layer=32b by means of brushing, spin coating or lamination, and then patterned by exposure, development, etc., so as to make 5 A plurality of openings 35A are formed in the layer 35a. The surface of the first connection layer 34 is double-plated to expose the connection layer 36, and the second connection layer 36 is made of a plated solder material. The solder material can be selected from one of the group consisting of tin and silver. The outer and outer layers 35a, 35b and == ^ are removed as shown in the figure 2H. And the layers 32a, 32b, and the first and second resistive layers, the first and second conductive layers 3u, 31b, wherein the first, second, and fourth and fourth resistive layers 32a, 32b, 35a, 35b physically or chemically remove the first and second conductive layers 31a, 3b covered by the first and second resist layers 32a, 32b, and are removed by microetching. Figure 21 shows Thereafter, a reflow process (ref1〇W-solder) is performed to form the first and second connection layers 34, 36 on which the second electrical connection pad is mounted, and the metal layer is formed by reflowing. In the present embodiment, since the first connection layer 34 is formed on the metal layer 33 on the first and third electrical connection pads 30U03 by electro-minening, On the surface of the metal (4) on the second electrical connection elapsed, the second connection layer 36 is formed by an electro-tin material, and the first and third electrical connection pads 3, 1, 3, 2, 3, respectively. On the 〇3, 12 19298 1301736 conductive structure is formed by electric key. Wherein the first connecting layer 34 is electrically formed, and the metal adhesive layer may be selected from the group consisting of tin, silver, and nickel/gold in the human diamond layer, and may be tin/silver or enamel. /silver/copper, or used as a ban pad; and the ^^ surface-type component is made of solder material, the solder material is an optional layer 36 which is formed by electroplating and zinc. Among them, the connection is semi-conductive: crystal is formed by electroplating to form different materials. ^Electrical structure' for different needs [other consistent example] As shown in Figure 3A to the figure shown in the figure is another embodiment of the invention - implementation of manufacturing 2 'different from the pre-implementation is to remove (four) two electrical The connection layer is connected to the first connection layer on the surface of the layer, and then the second connection layer is formed by electric ore. The evaluation process is as follows. As shown in FIG. 3A, the second layer FF of the previous embodiment is removed, and the metal layer in the opening 35 〇a of the third third resist layer 35a is removed by means of Etching or Electrolyzing. The first connection layer 34 on the surface of 33. As shown in Fig. 3B, a second connecting layer 36 is electroplated on the metal layer 33 in the opening 35a of the third resist layer 35a. As shown in FIG. 3C, 'the third and fourth resistive layers 35a, 35b and the second and second resistive layers 32a, 32b, and the first and second resistive layers 32a, 32b are covered first, Second conductive layers 31a, 31b. As shown in FIG. 3D, after the reflow process is repeated, the second connection layer 36 on the second inertial connection pad 302 is reflowed to form a pre-solder bump covering the 13 19298 1301736 metal layer 33. Block 38. • Referring to FIG. 3C, the present invention provides a circuit board electrical connection pad-conducting structure comprising: a circuit board 30 having first and second surfaces 3〇a, 3〇b, the circuit board 30 The first surface 3〇a has a plurality of first and second electrical connection pads 301, 302; a metal layer 33 and a first connection layer 34 are formed on the first electrical connection port 3〇1; And a metal layer 1-4 a second connection layer 36 is formed on the second electrical connection pad 302. The second surface of the core has a plurality of third electrical connections, and the two metal layers 33 and the first connecting layer 34 are formed on the second electrical connection pads 3〇3. The electrical structure on the second electrical connection pad 302 of the circuit board is shown in Fig. 33 and the flute and two connection layers 34 are formed between the metal layer and the second connection layer 36. As shown in Fig. 21 or Fig. 3D, the first-β of the α-two α soil. The connection layer of the 连接 黾 连接 connection 302 is re-welded by the shape of the connection layer _ , 38. $成有包^metal layer 33 and the second: the invention can form a metal layer on the first electrical connection pad to form a metal layer, a first connection layer and a second connection layer on the second electrical connection pad The layer and the first connection layer and the outer two electrical connections form a metal to form an electrically conductive structure, and the benefit process can also directly electroform the shape of the electric, and the port structure without the need to form a metal layer, and the connection needs to be used.杈仏 Regardless of the electrical property, the first electrical connection pad adhesive layer is formed as a first (four), (four) way to form a metal bead connection surface adhesive component, the second electrical 1 9298 1301736 The surface of the connection pad is electroplated. The layer and the second connection layer are connected to the semiconductor wafer, and the first connection is formed to form a metal adhesion layer as the ball pad of the circuit board. The layer can be used to overcome the electrical connection structure of the fine pitch of the process bottle of the conventional stencil printing method, and can be formed in the method of the present invention. And in the case of forming the second connection sound, first removing the first connection layer covering the surface of the upper Meng layer, which is covered on the second electrical connection pad, so that the The second connection layer on the metal layer is simultaneously: avoiding the electrical conduction finally formed on the second electrical connection pad: a metal interface problem occurs due to the presence of a connection layer. The above embodiments are merely illustrative of the present invention. The principles and the effects thereof are not intended to limit the invention. Any person skilled in the art will be able to carry out the above embodiments without departing from the spirit and scope of the present invention. The scope of protection of rights shall be patented by Shenlu Listed below. K A h [Simplified description of the drawings] Figures 1A to ιέ are schematic cross-sectional views showing the formation of solder on a conventional circuit board; "2A to 21 are the circuit boards of the present invention. A cross-sectional view of a first embodiment of a conductive structure of a connection pad and a method of fabricating the same; and FIGS. 3A to 3D are cross-sectional views showing a second embodiment of a conductive structure of a circuit board electrical connection pad of the present invention and a method of manufacturing the same schematic diagram. [Major component symbol description] 19298 15 1301736, 20, 30 Circuit board 201 Electrical connection pad 21 Insulation protection layer 211 Opening 22 23 23a 24 • 24, 37, 38 30a 30b 301 ' 302 ' 303 304a φ 304b 305a, 305b Adhesive layer template grid solder material pre-solder bump first surface second surface first electrical connection pad second electrical connection pad third electrical connection pad first insulation protection layer second insulation protection layer opening 31a a conductive layer 31b second conductive layer 32a first resistive layer 32b second resistive layer 320a, 320b opening 3 3 metal layer first connecting layer 16 19298 34 1301736 35a third resistive layer 350a opening 35b fourth resistive layer 36 Two connection layer
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