TWI300736B - - Google Patents

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Publication number
TWI300736B
TWI300736B TW95145342A TW95145342A TWI300736B TW I300736 B TWI300736 B TW I300736B TW 95145342 A TW95145342 A TW 95145342A TW 95145342 A TW95145342 A TW 95145342A TW I300736 B TWI300736 B TW I300736B
Authority
TW
Taiwan
Prior art keywords
layer
polishing pad
insulating layer
cusp
insulating
Prior art date
Application number
TW95145342A
Other languages
English (en)
Chinese (zh)
Other versions
TW200824840A (en
Inventor
Choung Lii Chao
Ying Yung Chen
Chien Min Sung
Original Assignee
Choung Lii Chao
Ying Yung Chen
Chien Min Sung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Choung Lii Chao, Ying Yung Chen, Chien Min Sung filed Critical Choung Lii Chao
Priority to TW95145342A priority Critical patent/TW200824840A/zh
Publication of TW200824840A publication Critical patent/TW200824840A/zh
Application granted granted Critical
Publication of TWI300736B publication Critical patent/TWI300736B/zh

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Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW95145342A 2006-12-06 2006-12-06 Surface structure of polishing pad conditioner TW200824840A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95145342A TW200824840A (en) 2006-12-06 2006-12-06 Surface structure of polishing pad conditioner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95145342A TW200824840A (en) 2006-12-06 2006-12-06 Surface structure of polishing pad conditioner

Publications (2)

Publication Number Publication Date
TW200824840A TW200824840A (en) 2008-06-16
TWI300736B true TWI300736B (ja) 2008-09-11

Family

ID=44771654

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95145342A TW200824840A (en) 2006-12-06 2006-12-06 Surface structure of polishing pad conditioner

Country Status (1)

Country Link
TW (1) TW200824840A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102829707B (zh) * 2011-06-14 2015-04-08 虎尾科技大学 调节器检测装置及其用以检测调节器的方法

Also Published As

Publication number Publication date
TW200824840A (en) 2008-06-16

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