TWI300736B - - Google Patents

Description

1300736 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a dresser for a polishing pad, and more particularly to a surface structure of a chemical mechanical polishing pad conditioner. [Prior Art] Chemical Mechanical Polishing (CMP) is a precision polishing process for wafer fabrication. The purpose is to make the surface of the wafer completely flat. The fine circuit pattern of the sigh can be completely integrated through the exposure and development process. On the wafer. The basic principle of the CMP technology is to rotate the workpiece to be polished in a presence of a certain downforce and a polishing liquid (a mixture of ultrafine particles, a chemical oxidant and a liquid medium) with respect to a polishing pad (Pad). The mechanical removal of the abrasive particles and the corrosion of the chemical oxidant are used to remove the material from the surface of the workpiece and obtain a smooth surface. In the CMP process, the polishing pad is often a polyurethane-containing polyester fiber 蚝 which has a plurality of small holes thereon which facilitate the conveyance of the material and polishing. After polishing a plurality of wafers, the polishing pad is smoothed while the pores are filled with slurry particles as shown in FIG. In addition to wear due to grinding, the surface of the polishing pad may also be filled with the accumulation of grinding by-products, causing the polishing pad to lose some of its ability to maintain the slurry. If the polishing pad is not trimmed, the number of crystals is ground. After the circle, a large amount of impurities are deposited on the surface of the polishing pad, so that the removal rate of the subsequent wafer is significantly reduced, and the surface of the crucible is also scratched. In order to meet the needs of the wafer plus 1300,736 workmanship and maintain the stability of the quality, the polishing pad must be trimmed with a Diamond trimer for a period of time.

The product, in order to restore the rough surface of the polished enamel, as shown in Figure 2, the grinding field J ding improves its ability to contain the purple material, restores the pores on the surface of the polishing pad and its ability to hold, '', transport the slurry, so It can be called the cost and the demand for stable wafer quality. The trimmer determines the contact area and succession between the wafer and the scratch, also

The efficiency and flatness of wafer polishing are determined, and it is practical, commercial, and forward-looking in the electronics and optoelectronic industries. ^ 〃 The drills currently used in the industry; 5 trimming H '-- all kinds of diamonds are glued on the metal plate, and the fine diamonds are cut into the polishing pad to remove them, so the surface, density, and density of diamonds __ The setting method has become an important factor affecting the quality of the polishing 塾. Diamonds on diamond dressers are usually made of natural diamonds or artificial single crystal diamonds made of high pressure. Natural diamonds have irregular shapes and sharp corners, so they can have a higher polishing pad removal rate when trimming the polishing pad, but they also make the polishing pad consume faster and have a shorter life; Because of the irregular shape of the diamond, it is prone to cracking and scratching the wafer when subjected to impact. As for the high-pressure artificial single crystal diamond, the crystal form of the diamond is usually relatively complete and has few internal defects, so the high cracking strength can greatly reduce the occurrence of scratches on the wafer due to broken diamonds. 1300736 The diamond dresser in the industry today is generally trying to fix the stone on the metal circular plate, and the method of fixing the diamond is roughly (1) Electroplating ^(2)^ (Brazing) CVDCChemical

Vapor Deposits' chemical vapor deposition. The electro-mine method is to randomly sprinkle the diamond on the metal circular plate and then put it into the containing

In the electrolytic cell of the hidden 4 (nickel sulphate) liquid, the recorded n deposited by electrolysis is attached to the surface of the metal circular plate 10 by the metal of the ||11 1_11'^^; However, in this fixed mode, (4) the metal is a low-grain joint with the convex surface stone 12, so it can only mechanically clamp the diamond 12, as shown in Fig. 3, so that the diamond 12 is trimmed and trimmed in the polishing pad. It is not strong and easy to fall off' causing wafer damage. Furthermore, the HU metal must cover the majority of the diamond 12 in order to catch it, so that the diamond 12 is exposed to a limited height and cannot be effectively cut into the polishing pad; and the concentration of the nickel 11 layer is too high, which hinders the chip removal, making the processing The efficiency is greatly reduced and even impossible to cut. In the brazing method, the diamond 12 is first randomly sprinkled on the metal disc 1 ,, and then the diamond paper is welded to the metal disc 1 炼 by the fused nickel 11 alloy. As shown in Figure 5. Although brazing is a chemical mode to fix the diamond 12, due to the uneven distribution of the diamond 12, the nickel 11 layer is thinner in some places, so when the diamond 12 dresser is subjected to a large impact, the diamond 12 together with the nickel still appears. 11 The phenomenon of metal falling off together, as shown in Figure 6. Electroplating or brazing, because the diamond is randomly sprinkled or arranged on the metal 1300736 disc, will cause uneven distribution of the diamond dresser, only the local higher diamond can contact the polishing pad, so that The number of working diamonds is small and the efficiency is not south. The CVD diamond coating method uses a CVD technique to form a diamond film 13 having a plurality of sharp points 131 on the metal circular plate 14. The advantage is that the sharp point 131 of the diamond is very neat and equal, as shown in FIG. pad. However, the diamond film 13 still has cracks and cracks, as shown in Fig. 8. When the sharp point 131 of the diamond film 13 is broken, the wafer is scratched and the processing efficiency is lowered. In order to increase the bonding strength between the diamond and the metal circular plate, and to extend the use of the CMp dresser, there are a number of patents disclosed in the related art, for example, the chemical mechanical polishing dresser disclosed in Taiwan Patent Publication No. 200626300, which is attached to a resin layer. The invention has an improved superabrasive adhesion; the polishing cloth dresser disclosed in Japanese Laid-Open Patent Publication No. 2,533,467, and the method of manufacturing the same, which maintains the polishing cloth to be trimmed to be stable, especially to eliminate threshing. Wafer scratches caused by the polishing cloth of the cause; the chemical surface polishing enamel disclosed in Taiwan Patent No. 2-42, and related manufacturing and application methods, are used to increase the workload of the central abrasive grain to extend the CMP conditioner The service life. Generally, the diamond film dresser of the array is fabricated by CVD diamond plating technology, and the breakage of the sharp point 131 of the diamond film 13 cannot be detected, and the information of when to change the trimming cannot be provided. When the number of breaks of the cusp 131 is too large and the trimmer is not replaced immediately, the crystal damage will be caused and the 1300736 can not be effectively repaired, and the I-efficiency of the light pad can be reduced. Moreover, the general diamond film 13 is a single material structure, and when the sharp point 131 is broken, the side of the trimming pad is lost, which is less durable. SUMMARY OF THE INVENTION The present invention has been made to improve the service life of a trimmer and to have a structure that can be detected. ► The primary object of the present invention is to provide a surface structure for a polishing pad conditioner that extends the life of the dresser. Another object of the present invention is to provide a surface structure for a polishing pad conditioner that can detect breakage of a plurality of protruding cusps of the dresser. The surface structure of a polishing pad conditioner of the present invention is used to improve the service life of a trimmer and has a structure capable of being gamma, J, including a plurality of conductive layers and insulating layers sequentially bonded from the inside to the outside; the plurality of insulation The layers respectively have a plurality of correspondingly convex cusps, and when the sharp point of the insulating layer of the outer layer breaks, the sharp point of the inner layer of the insulating layer protrudes from the fracture, and the polishing pad can continue to be trimmed; Further, the two sides of the power source are electrically connected to the polishing pad of the adsorbed liquid, the conductive layer of the innermost layer of the trimmer, and a power sensor is electrically connected to the polishing pad for adsorbing the liquid, and the trimmer is respectively The conductive layers of each layer are known by the magnitude of the current or voltage displayed by the power sensor, and the cusps of the insulating layers of the layers of the trimmer are known. 1300736 For other purposes and functions of the present invention, please refer to the drawings and the embodiments, which are described in detail below. [Embodiment] Please refer to Fig. 9 and Fig. 1 for details. The surface structure of the polishing pad conditioner of the present invention is used to improve the service life of the trimmer and has a structure that can be detected; the trimmer 20 of the first embodiment includes a first conductive electrode sequentially bonded from the inside to the outside. The layer 21, the first insulating layer 22, the second conductive layer 23 and the second insulating layer 24; the first insulating layer 22 and the second insulating layer 24 respectively have a plurality of corresponding first sharp points 221 and second sharp points 241, as shown in FIG. When the second sharp point 241 breaks, the first sharp point 221 protrudes from the break, and the polishing pad 4 can continue to be trimmed, thereby improving the service life of the dresser 20, as shown in FIG. The trimmer 20 of the present embodiment is further configured to electrically connect the two ends of the power source with different polarities to the polishing liquid 40 of the adsorbed liquid, the inner conductive layer 21 of the innermost layer of the trimmer 2; and enable a power sensing The first conductive layer 21 and the second conductive layer 23 of each layer of the adsorbent 20 are electrically connected to the liquid, and the current or voltage of the power is sensed by the power sensing. The breakage of the cusp 221 and the second cusp 241 to instantly monitor the damage of the first cusp 221 and the second cusp 24 of the dresser 2 。. Wherein, the power source has a potential difference between the polishing pad 40 and the first conductive layer 21; when the plurality of protruding first inflammatory points 221 and the first sharp point 24 are not broken, the power sensor displays a high voltage, The condition of low current; when the plurality of protruding second sharp points 241 and the first sharp point 221 are broken, the liquid 1300736 adsorbed by the polishing pad 4 will penetrate into the second insulating layer 24 to contact the second conductive layer 23 And electrically connected, or infiltrated into the first insulating layer 22 and electrically connected to the first conductive layer 21, the power sensor will display a voltage drop, the current rises; when the second sharp point 241 When the number of the first sharp points 221 is broken, the power sensor shows that the current value is higher. Please refer to Figures 11 and 12. A second embodiment of the surface structure of the polishing pad conditioner of the present invention, the trimmer 30 has a first conductive layer 31, a first insulating layer 32, a second conductive layer 33, and a second insulating layer 34 which are sequentially bonded from the inside to the outside. The third conductive layer 35 and the third insulating layer 36; the first insulating layer 32, the second insulating layer 34, and the third insulating layer 36 respectively have a first sharp point 321' corresponding to the second sharp point 341 and a third Point 361, as shown in FIG. When the third sharp point 361 breaks, the second sharp point 321 protrudes from the break, and the polishing pad 4〇 can continue to be trimmed as shown in FIG. 12; or when the third sharp point 361 and the second sharp point 341 When the fracture occurs, the first sharp point 321 protrudes from the break, and the polishing pad 4 can continue to be trimmed, thereby improving the service life of the dresser 30. When it is to be detected whether the third cusp 361, the second cusp 341 and the first cusp 321 of the trimmer 30 are broken, the two ends of the power source are respectively electrically connected to the polishing pad 40 which adsorbs the liquid and The first conductive layer 31 is electrically connected to the first conductive layer 31', the second conductive layer 33, the third conductive layer 35, and the polishing pad 40, respectively. As described in the first embodiment, the third sharp point 36, the second sharp point 341 and the first sharp point 321 can be known by the electric conductor 1 displayed by the power detector.

Damage to 11 1300736. The first conductive layer of each of the above embodiments may be a metal disk, and other spaced-apart conductive layers and insulating layers are formed by CVD techniques. The trimmer of the present invention is a CMP conditioner, and the electrically conductive layer and the insulating layer which are arranged at intervals may be extended to have four or more layers respectively; the materials of the insulating layer may be diamond, polymer tree, ceramic, cubic boron nitride, respectively. (CBN), and composite materials. The trimmer of each embodiment of the present invention etches the germanium wafer into a pyramid shape by using a semiconductor etching technique, and then uses an electroforming technique or a grouting mold technique to reproduce the convex cusp of the array, and the protruding tip can be used. The dots are arranged in a matrix to fix the distance between the convex cusp and the convex cusp. The opening size of the pyramid can be used to control the length of the protruding large point, and the design of the reticle can be used to control the density of the convex cusp and spacing. Therefore, the CVD is regularly arranged, the number of protruding cusps which can exert the cutting force is increased, and the mutual support is provided, and the dead angle can be removed, covering all the working faces, and the effect of dressing the polishing pad can be greatly improved. In general, the trimmer cannot detect the breakage in time after the break, and the damage (wear) of the diamond dresser can only be judged after empirical judgment or inspection of the product. The invention has the multi-layer surface structure trimming H, in addition to the fact that the convex cusp point can be monitored immediately, when the convex cusp of the outer layer breaks, the convex cusp of the lower layer can still improve the trimming ability. (4) System life. The above is merely an embodiment of the present invention. Anyone who is familiar with the art of the present invention is subject to the patent, and is not limited to the disclosure of the embodiment. .

13 !3〇〇736 [Simple description of the drawing] Fig. 1 is a schematic view of the known polishing pad after use. Figure 2 is a schematic view of a known polishing crucible after trimming. Fig. 3 is a schematic view of a dresser which is known to be produced by electroplating. Fig. 4 is a schematic view showing the use of a dresser made by electroplating to remove diamonds after use. Fig. 5 is a schematic view of a dresser which is known to be fabricated by a brazing method. Fig. 6 is a schematic view showing the shedding of the diamond after the use of the dresser made by the brazing method.

Figure 7 is a schematic illustration of a diamond film known to be made using CVD techniques. Figure 8 is a schematic illustration of a diamond film cusp fracture known to be made by CVD techniques. Figure 9 is a schematic view showing a first embodiment of the surface structure of the polishing pad conditioner of the present invention. Figure 10 is a schematic view showing the cusp fracture of the insulating layer of the first embodiment of the present invention. Figure 11 is a schematic view showing a second embodiment of the surface structure of the polishing pad conditioner of the present invention. Figure 12 is a schematic view showing the cusp fracture of the insulating layer of the second embodiment of the present invention. [Main component symbol description]

10, 14 metal circular plate 12 diamond 131 cusp 20, 30 trimmer 22, 32 first insulating layer 23, 33 second conductive layer 24 341 second sharp point 36 third insulating layer 40 polishing pad 11 nickel 13 diamond 臈21, 31 first conductive layer 221, 321 first cusp 24, 34 second insulating layer 35 third conductive layer 361 third cusp

Claims (1)

'1300736 X. Patent application scope: 1. The surface structure of the human polishing pad conditioner is used to enhance the service life of the dresser: and has a structure that can be side-mounted, including a small number of externally combined small electric The layer and the sill layer, the plurality of insulating layers respectively have a plurality of correspondingly protruding tips, and when the ridge of the outer layer of the hoisting layer is broken, the cusp of the inner layer _ insulating layer protrudes from the fracture, and can continue Performing a dressing operation on a polishing pad; further providing a power supply of different polarity at both ends of the power supply for electrically connecting the adsorption liquid, the innermost conductive layer of the trimmer, and electrically connecting a power sensor The polishing pad for adsorbing the liquid and the conductive layers of the layer of the conditioner can be used to determine the breakage of the sharp points of the insulating layers of the layers of the device by the magnitude of the current or voltage displayed by the power sensor. The surface structure of the polishing pad conditioner of the first aspect of the invention, wherein the trimmer has a first conductive layer sequentially bonded from the inside to the outside, and the first layer is first electrically a layer and a first insulating layer, the first insulating layer and the second insulating layer respectively have a first cusp and a second sharp point which are correspondingly convex, and when the sharp point of the outer layer breaks, the __ pointed Point out the bribery, and continue to repair the work. 3. The surface structure of the polishing pad conditioner according to claim 1, wherein the trimmer has a first conductive layer, a first layer & a second layer, and a second conductive layer, which are sequentially bonded from the inside to the outside. The second insulating layer, the third conductive layer and the third insulating layer, the first insulating layer, the first insulating layer and the third insulating layer respectively have a first apex, a second cusp and a third cusp which are correspondingly convex Point, when the cusp of the outer layer breaks, the sharp point of the inner layer protrudes from the fracture and continues to be trimmed. The detection device of the surface of the polishing pad conditioner as described in claim 1, 2 or 3, wherein the innermost layer of the conductive layer is a metal disk, and the other conductive layers are arranged at intervals. The layer is formed by a CVD technique. The surface structure of the polishing pad conditioner according to claim 4, wherein the material of the insulating layer is selected from the group consisting of diamonds, southern molecular tree fingers, and ceramics. Research, cubic 曰 15 1300736 nitriding shed, and one of the composite materials. 6. The surface structure of a polishing pad conditioner as described in claim 5, wherein the dresser is a CMP conditioner. 16