TWI297904B - - Google Patents

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Publication number
TWI297904B
TWI297904B TW092105530A TW92105530A TWI297904B TW I297904 B TWI297904 B TW I297904B TW 092105530 A TW092105530 A TW 092105530A TW 92105530 A TW92105530 A TW 92105530A TW I297904 B TWI297904 B TW I297904B
Authority
TW
Taiwan
Prior art keywords
processing container
measurement data
processing
supplied
aging
Prior art date
Application number
TW092105530A
Other languages
English (en)
Chinese (zh)
Other versions
TW200421411A (en
Inventor
Satoshi Harada
Hin Oh
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200421411A publication Critical patent/TW200421411A/zh
Application granted granted Critical
Publication of TWI297904B publication Critical patent/TWI297904B/zh

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Classifications

    • H10P72/0612—
    • H10P72/0604—

Landscapes

  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW092105530A 2002-03-12 2003-03-12 Plasma processing method, seasoning end detection method, and plasma processing device TW200421411A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002066369A JP4173311B2 (ja) 2002-03-12 2002-03-12 シーズニング終了検知方法及びプラズマ処理方法並びにプラズマ処理装置

Publications (2)

Publication Number Publication Date
TW200421411A TW200421411A (en) 2004-10-16
TWI297904B true TWI297904B (OSRAM) 2008-06-11

Family

ID=27800250

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092105530A TW200421411A (en) 2002-03-12 2003-03-12 Plasma processing method, seasoning end detection method, and plasma processing device

Country Status (5)

Country Link
JP (1) JP4173311B2 (OSRAM)
CN (1) CN100355040C (OSRAM)
AU (1) AU2003221362A1 (OSRAM)
TW (1) TW200421411A (OSRAM)
WO (1) WO2003077303A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7313451B2 (en) 2002-03-12 2007-12-25 Tokyo Electron Limited Plasma processing method, detecting method of completion of seasoning, plasma processing apparatus and storage medium
KR100557673B1 (ko) * 2003-12-22 2006-03-06 어댑티브프라즈마테크놀로지 주식회사 플라즈마 장비를 시즌닝하는 방법
US7393459B2 (en) * 2004-08-06 2008-07-01 Applied Materials, Inc. Method for automatic determination of substrates states in plasma processing chambers
JP4640828B2 (ja) * 2006-03-17 2011-03-02 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
CN102315112B (zh) * 2011-09-28 2016-03-09 上海华虹宏力半导体制造有限公司 堆栈金属栅极的刻蚀方法
US10896833B2 (en) * 2018-05-09 2021-01-19 Applied Materials, Inc. Methods and apparatus for detecting an endpoint of a seasoning process
US12032355B2 (en) * 2022-03-31 2024-07-09 Tokyo Electron Limited Virtual metrology model based seasoning optimization

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1131599A (ja) * 1997-07-08 1999-02-02 Sumitomo Metal Ind Ltd プラズマ処理装置における予熱方法及びプラズマ処理装置
US6368975B1 (en) * 1999-07-07 2002-04-09 Applied Materials, Inc. Method and apparatus for monitoring a process by employing principal component analysis
JP4570736B2 (ja) * 2000-07-04 2010-10-27 東京エレクトロン株式会社 運転状態の監視方法

Also Published As

Publication number Publication date
CN100355040C (zh) 2007-12-12
JP2003264179A (ja) 2003-09-19
CN1643664A (zh) 2005-07-20
JP4173311B2 (ja) 2008-10-29
AU2003221362A1 (en) 2003-09-22
WO2003077303A1 (fr) 2003-09-18
TW200421411A (en) 2004-10-16

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MM4A Annulment or lapse of patent due to non-payment of fees