TWI295613B - - Google Patents

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Publication number
TWI295613B
TWI295613B TW95132240A TW95132240A TWI295613B TW I295613 B TWI295613 B TW I295613B TW 95132240 A TW95132240 A TW 95132240A TW 95132240 A TW95132240 A TW 95132240A TW I295613 B TWI295613 B TW I295613B
Authority
TW
Taiwan
Prior art keywords
mold
pattern
rubber
film
layer
Prior art date
Application number
TW95132240A
Other languages
English (en)
Chinese (zh)
Other versions
TW200810896A (en
Inventor
Wen-Fu Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW95132240A priority Critical patent/TW200810896A/zh
Publication of TW200810896A publication Critical patent/TW200810896A/zh
Application granted granted Critical
Publication of TWI295613B publication Critical patent/TWI295613B/zh

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Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW95132240A 2006-08-31 2006-08-31 Method for manufacturing silicon rubber products having back adhesive TW200810896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95132240A TW200810896A (en) 2006-08-31 2006-08-31 Method for manufacturing silicon rubber products having back adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95132240A TW200810896A (en) 2006-08-31 2006-08-31 Method for manufacturing silicon rubber products having back adhesive

Publications (2)

Publication Number Publication Date
TW200810896A TW200810896A (en) 2008-03-01
TWI295613B true TWI295613B (enExample) 2008-04-11

Family

ID=44767527

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95132240A TW200810896A (en) 2006-08-31 2006-08-31 Method for manufacturing silicon rubber products having back adhesive

Country Status (1)

Country Link
TW (1) TW200810896A (enExample)

Also Published As

Publication number Publication date
TW200810896A (en) 2008-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees