1294313 九、發明說明： 【發明所屬之技術領域】 本發明係一種以複合式潔淨基板之表面污染物之方法，尤 其是關於一種不需耗費大量資源及能源，且更不會造成環保問 題，並能有效清除各種有機污染物與微粒之複合式潔淨基板之 表面污染物之方法。 【先前技術】1294313 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a method for cleaning surface contaminants of a composite substrate, in particular, a method that does not require a large amount of resources and energy, and which does not cause environmental problems, and A method for effectively removing surface contaminants of a composite clean substrate of various organic pollutants and particles. [Prior Art]
目前無論是半導體產業、平面顯示器（FPD)產業、印刷 電路板（PCB)產業、軟性線路板（FPCB)產業等，其所生產 產品之清洗方式，主要係使用濕式製程，以去除油脂、指紋、 殘留溶劑等有機污染物，以及金屬或氧化物等微粒。 然而，習知濕式清洗製程技術係會有化學品排放法規限 制，以及純水與溶劑成本不斷增加之缺點，且因使用大量的 水、溶劑、化學品，衍生環保問題而且浪費資源與能源，此時 較環保的乾式清洗製程逐漸被開發出來。 目前習知技術為解決上述濕式清洗製程之問題，乃係結合 RF電漿與二氧化碳雪花噴洗之方法，並應用於晶圓之去光阻製 程，其雖能較習知濕式清洗製程加速污染物移除，但其也有以 下缺點··例如耗時較久而且能量大可能對基板之表面有損傷、 需要真空㈣以產生無線頻率（RF)電漿、真空設備成本高而 且不適。大尺寸平板工件之快速清洗。因此，目前在平面顯示 器如TFT-LCD面板之清济太 雈俨田斤彳k咮制和 面，為避免面板表面有損傷，故仍At present, whether it is the semiconductor industry, flat panel display (FPD) industry, printed circuit board (PCB) industry, flexible circuit board (FPCB) industry, etc., the cleaning method of the products it produces mainly uses wet process to remove grease and fingerprints. , organic solvents such as residual solvents, and particles such as metals or oxides. However, the conventional wet cleaning process technology has the disadvantages of chemical emission regulations, the increasing cost of pure water and solvent, and the use of a large amount of water, solvents, chemicals, environmental issues and waste of resources and energy. At this time, the environmentally friendly dry cleaning process was gradually developed. At present, the conventional technology solves the above problems of the wet cleaning process, and is combined with the method of RF plasma and carbon dioxide snowflake spraying, and is applied to the wafer photoresist process, which can be accelerated by the conventional wet cleaning process. Contaminant removal, but it also has the following disadvantages: For example, it takes a long time and the energy is high, which may damage the surface of the substrate, requires vacuum (4) to generate radio frequency (RF) plasma, and the vacuum equipment is costly and uncomfortable. Quick cleaning of large-sized flat workpieces. Therefore, at present, in the flat display, such as the TFT-LCD panel, the 济 太 太 彳 彳 , , , , , , , , , , , , , , , , , , , , , ,
售才木用〉絲式水洗衣程，尤甘B ^ ,门&、主、也 ”見今第五代廠以上之玻璃基板尺寸 更大，因而清洗設備也爭★ 尺加魔大，當然相對也相當耗水。而習 5 1294313 洗製程如=_3(紫外線/臭氧）、大氣電漿作有機污 等停點除，具有壤保、省水、設備佔地面積小、清洗速度快 幾但其只對有機污染物之去除有效果，對於微粒之去除 驟，暮目此仍諸配㈣子（De-iQnized)水洗與供乾步 ,蛉致目前商業化效益不大。 製程基板表面之污染物去除效果，濕式清洗 對有機、、兮、九/、貝源/、此源之劣勢，而乾式清洗製程卻只能針 果，所以士去除有效果，若運用於微粒之去除則幾乎無效 係能右料2可重新設計一種去除基板之表面污染物之方法，其 清洗製與微粒之去除效果，且避免習知濕式 【發明内容】 缺失’即為本發明之標的。 板之之問題，本發明係一種以複合式潔淨基 用大量轉決f知濕式清洗製程係有著使 同時2水及化學㈣之資源浪m肖耗與環保之缺失， 克服習知乾式清洗製程只能針對有機污染物之去除，而 ’有效去除微粒之缺點。 毕物本發明係—種以複合式潔淨基板之表面污 驟、提^ 提供—基板步驟、提供—㈣供應單元步 孝、進:^^化碳雪花供應單元步驟、進行電漿纽基板作 步驟氧化碳雪花噴洗基板作業，係先提供一基板 /驟，此基板表面具有污染物；再提供一電漿佴 其係位於此基板上方；提供—二氧化碳厂'早凡步驟， 虱化妷奋化供應單元步驟，其 d於基板上方且置於電漿供應單元—側，又，進行電裝喷洗 6 1294313 基板作業步驟，此基板係與此電漿供應單元相對移動以進行電 漿喷洗基板，以及進行電漿及二氧化碳雪花喷洗基板作業步 驟，基板係與該電漿供應單元以及二氧化碳雪花供應單元二者 相對移動以進行電漿及二氧化碳雪花喷洗基板。 • 本發明係一種以複合式潔淨基板之表面污染物之方法，係 具備下述數點優於習知作法，並具備如下所述之顯著功效增 進。 _ 1.本發明係一種以複合式潔淨基板之表面污染物之方 法，藉由本發明之一種複合式潔淨基板之表面污染物之方法實 施運用，由於其結合大氣電漿之有機污染物去除能力與二氧化 碳雪花之微粒去除能力，故能有效提升基板之表面污染物之潔 淨效果。 2. 本發明係一種以複合式潔淨基板之表面污染物之方 法，藉由本發明之一種複合式潔淨基板之表面污染物之方法實 施運用，由於其結合大氣電漿與二氧化碳雪花，二者均在常壓 _ 下即能實施，故能適用於大尺寸平板工件之連續式清洗，且二 氧化碳更可同時作為大氣電漿之解離氣體及二氧化碳雪花產 生來源。 3. 本發明係一種以複合式潔淨基板之表面污染物之方 法，藉由本發明之一種複合式潔淨基板之表面污染物之方法實 施運用，其係能在常壓下操作，故不需真空腔體，因而能降低 設備成本。 為使對本發明的目的、構造特徵及其功能有進一步的了 解，茲配合相關實施例及圖式詳細說明如下： 7 1294313 【實施方式】 請參閱第1圖’本發明係一種以複合式潔淨基板之表面污 =Θ之方法，此複合式潔淨基板之表面污染物之方法S1係包 ^供-基板（步驟S1G)、提供—電衆供應單元（步驟S20)、 二乳化碳雪花供應單元（步,驟聊）、進行電裝噴洗基板 驟850^驟S4〇)及進仃電漿及二氧化碳雪花噴洗基板作業（步 2再參閱第1圖及第2圖，本發明係_種以複合式潔淨基 、去物之方法’此複合式潔淨基板之表面污染物之方 ⑽，糸先進行提供—基板（步驟別），基板1G表面具有污 構（圖2基，1G係可移動’即是將基板1G $置於一運動機 一㈤ 不）上以達到基板進行移動；再提供一電漿供應單 元（步驟S20 )，此電喂批虛留—、心 +將报藤β 早70 20係設置於基板10上方，且 應早12〇係可移動’同理即是供應單元2〇設置於 石山Ρ^圖中未示）上以能進行運動；又，提供-二氧化 石厌签化供應早元（步驟ς q Λ、 L _ ^ 位於基板1〇上方，與置於電)二=化T花供應單元30係 电水么、應早疋2 0之-—侧，-豐 兔雪花供應單元30係可f |4 花供声單元吕，係將二氧化碳雪 :::30 5又置於-運動機構（圖中未示）上以能進行運 件置於電漿供應單元20及 ::二:,：應早70 3°之間，用以消除靜電荷，並隔離二 乳化奴接化°貧發對於電漿供痛罝 主“ *心衣置50，用以吸離上述基板10 表面㈣後所產生之廢氣與污染物；又再，進行電漿喷洗基板 8 1294313 作業（步驟湖，此基板1Q係與電裝供應單元2()相對移動以 進行電漿噴發以清洗基板1();錢，進行㈣及二氧化壤雪花 賀洗基板作業（步驟S50)，基板1〇係輿電漿 — 氧化碳《供鮮元30相對移_進行及二早^ 二 喷洗上述基板10表面之污染物。 水及一虱化厌寻化 本發明係-種以複合式潔淨基板 複合式潔淨基板之表面污染物之方 ^物之方法，此 一離早塞庄呢 v , v 丨，上述遮擋件40係為 源。又，本叙明係一種以複合 染物之方法’此複合式、、主 飞亦乎基板之表面π ㈣mrw: 表面污染物之方法S1，上述 …路土板0係14電襞供應單元 相對電漿供應單元2G作移办動，係為基板10 係相對基板10作移動。另外’上嫌’、係為電漿供應單元20 驟（步驟S40)及進行電漿及=^漿嘴洗基板作業步 (步驟_，—洗基板作業步驟 雖然本發明以較佳每 邓進仃。 發明，任何熟習此項技’藝上離非用以限定本 内，當可做些許之更動林明之精神和範圍 附之申請範圍所界定者為準1 口此本發明之保護範圍當視後 【圖式簡單說明】 第1圖係本發明以複人切、、心 意圖；以及Q土板之表面污染物之方法流程示 第2圖係本發明以複人切％ 洗基板示意圖 ▼基板之表面污染物之方法進行清 1294313 【主要元件符號說明】 si複合式潔淨基板之表面污染物之方法 步驟S10提供一基板 步驟S20提供一電漿供應單元 步驟S30提供一二氧化碳雪花供應單元 步驟S40進行電漿喷洗基板作業 步驟S50進行電漿及二氧化碳雪花喷洗基板作業 φ 10基板 20電漿供應單元 30二氧化碳雪花供應單元 40遮擋件 50吸氣裝置Selling wood with silk water laundry, Yougan B ^, door & main, also "see the fifth generation of the factory above the glass substrate size is larger, so the cleaning equipment is also vying ★ ruler plus magic, of course Relatively quite water-consuming. Xi 5 1294313 washing process such as =_3 (ultraviolet / ozone), atmospheric plasma for organic sewage and other stop points, with soil protection, water saving, equipment footprint, cleaning speed but It only has an effect on the removal of organic pollutants. For the removal of particles, the de-iQnized water washing and drying steps are still in use, resulting in little commercialization benefits. The effect of material removal, wet cleaning on the organic, 兮, 九 /, 贝源 /, the source of the disadvantage, while the dry cleaning process can only be acupuncture, so the removal of the effect is effective, if applied to the removal of particles is almost ineffective The right material 2 can be redesigned to remove the surface contaminants of the substrate, the cleaning system and the removal effect of the particles, and avoid the conventional wet type [the invention is missing] is the subject of the invention. The invention is a composite The net base uses a large number of conversions to know that the wet cleaning process system has the lack of resources and environmental protection of the 2 water and chemical (4) resources. Overcoming the conventional dry cleaning process can only deal with the removal of organic pollutants, and is effective. Disadvantages of removing particles. The invention is based on the surface of a composite clean substrate, providing a substrate, providing a substrate, providing a step-by-step, providing a step-by-step, step-by-step, step-by-step The slurry substrate is used as a step of oxidizing carbon snowflake to spray the substrate, and a substrate/crush is provided first, and the surface of the substrate has contaminants; and a plasma is provided on the substrate; the carbon dioxide plant is provided with an early step. The step of stimulating the supply unit is carried out on the substrate and placed on the side of the plasma supply unit, and further, the substrate is operated by the electric spray washing 6 1294313, and the substrate is moved relative to the plasma supply unit to perform The plasma sprays the substrate, and performs the plasma and carbon dioxide snow spray substrate processing steps, and the substrate system is moved relative to the plasma supply unit and the carbon dioxide snow supply unit. The substrate is sprayed with plasma and carbon dioxide snow. • The present invention is a method for compounding the surface contaminants of a substrate, and the following points are superior to the conventional methods, and have the remarkable effect enhancement as described below. _ 1. The present invention is a method for compounding the surface contaminants of a substrate, and the method for the surface contaminant of the composite clean substrate of the present invention is applied, because of its ability to remove organic pollutants combined with atmospheric plasma. The carbon dioxide snowflake particle removal ability can effectively improve the surface cleaning effect of the substrate. 2. The invention is a method for compounding the surface contaminant of the substrate, and the surface contamination of the composite clean substrate of the invention The method of implementation of the material is combined with atmospheric plasma and carbon dioxide snow, both of which can be implemented under normal pressure, so it can be applied to continuous cleaning of large-sized flat workpieces, and carbon dioxide can be simultaneously used as atmospheric plasma. The source of dissociated gas and carbon dioxide snowflake. 3. The present invention is a method for compounding the surface contaminants of a substrate, and the method for applying the surface cleanup of the composite clean substrate of the present invention can be operated under normal pressure, so that no vacuum chamber is required. Body, thus reducing equipment costs. In order to further understand the object, structural features and functions of the present invention, the related embodiments and drawings are described in detail as follows: 7 1294313 [Embodiment] Please refer to FIG. 1 'The present invention is a composite clean substrate The method of surface contamination=Θ, the method for cleaning the surface contaminants of the composite substrate, the S1 package, the substrate (step S1G), the supply unit (step S20), and the second emulsified carbon snow supply unit (step) , Talk about), perform electric spray cleaning of the substrate step 850 ^ S4 〇) and enter the 仃 plasma and carbon dioxide snow spray substrate operation (step 2 and then refer to Figure 1 and Figure 2, the present invention _ species to compound The method of cleaning the base and removing the material's surface of the composite clean substrate (10), first provide the substrate (step), and the surface of the substrate 1G is dirty (Fig. 2 base, 1G system is movable) The substrate 1G $ is placed on a moving machine (5) not to move the substrate; and a plasma supply unit is provided (step S20), the electric feeding batch is left blank, and the heart + will be reported to the vine as early as 70 20 The system is disposed above the substrate 10 and should be early 12 可 可 可 可 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' _ ^ Located on the top of the substrate 1〇, and placed in the electricity) 2 = T Thua supply unit 30 is the electric water, should be earlier than 20 - side, - Feng rabbit snowflake supply unit 30 can f | 4 flowers for The sound unit Lu, the carbon dioxide snow:::30 5 is placed on the -motion mechanism (not shown) to enable the transport to be placed in the plasma supply unit 20 and:: 2:,: should be 70 3 ° early Between the two, to eliminate the static charge, and to isolate the two emulsification slaves ° poor for the plasma for the pain of the main " * heart set 50, used to absorb the surface of the above substrate 10 (four) after the generation of exhaust gases and pollutants And again, the plasma spray substrate 8 1294313 operation (step lake, the substrate 1Q and the electrical supply unit 2 () relative movement for plasma ejection to clean the substrate 1 (); money, for (four) and dioxide Soil snowflake washing substrate operation (step S50), substrate 1 〇 舆 — — 氧化 氧化 氧化 氧化 氧化 供 供 供 供 供 供 供 及 及 及 及 及 及 及 及 及 及The contaminant of the surface. The method of the present invention is a method for compounding the surface contaminants of a composite clean substrate composite clean substrate, which is away from the early sage v, v 丨, The above-mentioned shielding member 40 is a source. In addition, the present invention is a method for composite dyeing, the composite type, the main flying surface of the substrate, π (four) mrw: surface contaminant method S1, the above-mentioned road plate 0 system The 14 electric power supply unit is moved relative to the plasma supply unit 2G, and the substrate 10 is moved relative to the substrate 10. In addition, the 'supreme' is the plasma supply unit 20 (step S40) and the plasma and =^The nozzle washes the substrate work step (step _, - wash the substrate operation step although the present invention is better every Deng Jin. Invention, any skill in the art is not intended to limit the scope of the invention, and the scope of application of the invention is defined as the scope of application of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing the method of re-cutting, and intention of the present invention; and the surface contaminant of the Q-soil board. FIG. 2 is a schematic view of the substrate of the present invention. Method for Polluting Clearing 1294313 [Description of Main Components] Method for simulating surface contaminants of a composite substrate Step S10 provides a substrate step S20 to provide a plasma supply unit. Step S30 provides a carbon dioxide snowflake supply unit to step S40 for plasma treatment. Spraying substrate operation step S50 performing plasma and carbon dioxide snowflake spray substrate operation φ 10 substrate 20 plasma supply unit 30 carbon dioxide snowflake supply unit 40 shutter 50 suction device
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