1293334 ’ 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種銅鋁合金材料的結合方法，特別係一種能夠克 服其介面阻抗，降低介面熱阻的銅鋁合金材料的結合方法。 【先前技術】 銅銘材料在工業生産中有較廣泛的用途，銅和I呂的連接在異種金 屬的連接中具有相當重要的地位，目前市場上有許多銅銘合金^合技 術。對於銅鋁合金結合技術的最為典型的例子是用於冷卻電子元件的 散熱器製程技術。 中央處理器（CPU)是一個高密度的發熱源，先要把熱量分散到一 個車父大的面積，再借助風扇的強制對流作用將其散發到空氣中，達到 散熱目的。熱量從CPU核心散發到散熱片表面，是一個熱傳導過程。 散熱片選用較高導熱係數的材料對提高熱傳導效率很有幫助，如銘的 導熱係數為735KJ/(M.H.K)，鋼的導熱係數為1386KJ/(MHK)，在所有 其他條件均相__，銅在單位_内傳導的熱量是叙的近兩倍。 可見將鋁合金散熱片改用銅來製造，對熱的傳導速率將會有一個很可 ，的提升，這樣當然麟CPU高度集巾的熱量具有鶴有利效果。但 是，還需要考慮銅的比重比銘大，將不符合散熱片重量限制的要求，·銅 的硬^不純合金，某些機械加工性能不如，如剖溝等；銅的溶點 比銘南很多’不利於擠壓成形等等問題。 、所以業界將銅、減合細，利關的高導熱係數特點，把熱量 傳導，蹄質的鰭片，再通過風扇的雌作用散發至空氣中。既<呆證 其重量不超標，又可量産，也取得了—定的效能提升。 … 目前業界不管是綱於散熱H的製造，還是其它用處，其 用的銅銘合金結合方式有焊接、螺絲鎖合、機械式壓合等等。 烊接方法係採用熔點比母材熔點低的金屬材料作為焊料， 母材熔點而高於__的溫度下，液態焊料顧母材，填充接 頭間隙，然後冷凝形成牢固接合介面的焊接方法。主要工序有·材 前處理、組裝、加熱焊接、冷卻、後處理等工序。常用的焊 錫焊，絲面在空氣中會形成一層非常穩定的氧化層他⑻，使^鋁 1293334 焊接難度較高，這是阻礙焊接的最大因素 tm 嚴 學方法將其絲舰紐-顧或其絲轉接的麵去=== =順利焊接在-起。但是，目前市場上的採脑轉 品最 重的就是谭著率低或品質不穩定，從而其介面熱阻較高。取為 螺絲鎖合方法係在銘材與銅材之間使用高性 壓I後用螺絲將其鎖緊，其介面熱阻與焊二效;； =I方法ί導熱介f、結合面的平整度及螺絲的扭力制素，從而 其同樣存在嚴重的介面熱阻較高問題。 〃 機械式壓合方式係將鋁材與銅材通過機械的方式遷合 為紹有延展性，所以銅可以在常溫下與銘質結合，例如， 2 ，有「圓筒孔，-銅質材料為圓柱形，其直徑略大於該圓孔二 徑，通過賊枝將細柱賴域|gf制，這種枝的女 阻高的問題。減糊傷嚴重衫響熱傳導率，還是存在介面熱 义f為雜壓技術的增強型工藝，她結合技術雖然有效 剛面提到的問題’侧為_結合技術的最 1 ^ git，如紅藝上不能解決此問題，那麼成品效 【發明内容】 之銅係提供—種藉㈣處理方式大幅降低介面熱阻 入方ίΐ3ΐ目的丄本發明採用町技術方案：本發明_合金結 使銅銘合金材料接合介面處產生—種擴散合金 合介面緊密；⑷冷卻，將=趣。金材料接 部：⑸出料，將已mts；熱出裝冷 如有廢品將其扣上料⑵辣進行重I。其中該灯内的氣^環 1293334 境為防止氧化之保護性氣氛環境。 本發明相比先前技術具有如下優點：由於本發明銅鋁合金結合方 法主要係對_合金材料進行熱處理，在結構及功能方爾產品本身 ==構‘丨不會有影響，在製程及成本方面不用對原本的產線做太大 只Μ微調整即可’不需要過高的設備成本，同時可應用在廢 :工方面，大幅減少製造成本；銅鋁合金材料的介面處產生一種擴 政合金，是唯一充分達到銅鋁物理結合的製程，由介面形成合金相的 方式來降低熱阻，大幅提高熱傳導性。 【實施方式】 …本發明銅鋁合金結合方法主要係通過熱處理方式克服銅鋁合金材 料結合時的介面阻抗醜，從而大幅降低介面熱阻，提昇傳熱性能。 該銅銘合金結合方法-般使麟備為可快速加熱的加熱裝置，例 如加熱爐，該加熱爐通過電阻絲從外圍加熱，最高溫度可達12〇〇。。， 加熱爐的内部材料為陶瓷。本發明的銅鋁合金材料包括銅（Cu)材料 (純鋼或銅合金）及鋁合金（A1)材料（純鋁或鋁合金）。 ^第一圖係本發明銅鋁合金結合方法的主要步驟的流程圖，第二圖 係本發明銅鋁合金結合方法的銅銘合金材料結合示意圖。該銅紹合金 結合方法主要包括以下步驟： (1)材料表面處理，將銅鋁合金材料的欲結合的表面進行平整〈匕 處理，使其表面粗糙度越小越好，例如將銅鋁合金材料表面電解加工 或化學研磨，再分別由乙醇、丙酮等清洗銅鋁合金材料表面的油污， 然後通過超聲波震動法去除其氧化層； (2) 進料，將已經過表面處理的銅鋁合金材料放置於加熱爐内， 使其欲結合的表面相對貼靠，並從相對外側予以一定應力； (3) 加熱恆溫處理，將已組裝好銅鋁合金材料的加熱爐開始迅速 加熱至330—420 C左右，並恒溫處理1 —·4小時，此時由於銅銘合金材 料在受壓力及溫度的影響下，其介面處產生一種擴散合金，例如·· 八1尤112，使得銅鋁合金材料的接合介面更緊密，熱阻亦能得到大幅降低 (如第二圖所示）； (4)冷卻，將已結合的成品在爐内進行自然冷卻； 1293334 (5)出料’將已冷卻的成品從爐内拿出，得到最後產品，如有廢 品將其打回上述第（2)步驟進行重工。 其中，各步驟所需條件如下： 一、表面粗糙度（Roughness，Ra)及加工條件：在銅鋁合金材料 熱處理之前，銅鋁合金材料的表面粗糙度是非常重要的，表面越平整， 接觸（緊密度）越良好，導熱性能更好，故將其平整化處理，使其表 面粗糙度控制在一定範圍内，從而使得銅鋁合金材料在熱處理前的緊 密度達到良好的程度。 μ 一、應力（Stress，σ )··在熱處理過程中，利用銅及|呂兩者不同的 熱脹冷縮係數產生的應力，使其介面緊密結合，由於一方面防止擴散 空洞（frkendall效應）的產生，另一方面可以盡量避免其界面接觸不 良的考量，初步實驗估計其應力為約3〇Mpa，為了精準控制其應力大 小，因此溫度的控制是非常重要的。 三、處理溫度（Temperature，T):根據銅-銘相圖以及考慮到鋁的熔 點問題（溫度過高易使鋁擠材料變形），溫度範圍取決於33(M2〇t^ 右，此溫气範圍内銅鋁介面生成某種擴散合金（例如：“3〇12)，尤其 在350-370C左右，即將此溫度控制在36〇°C左右時，其形成的擴散合 金更為理想。此生成之雛合金會有效崎低因介面阻抗所造成的熱 阻過大問題，但是此擴散合金的量不可過多，同時此合金層必須盡^ 能的薄，所以處理的時間控制是很重要的參數。 、 四 、持溫時間（time，t):初步實驗中，針對上述溫度恆溫分別i、 2、3和4 λΜ夺，其熱處理前後的熱阻係數變化對比結果如第三圖（心 至（^)所不’可發現持溫3小時後的試片之熱阻係數日聰低於未處理 ^的试片，熱阻係數’但疋局溫時持溫時間越久，試片氧化程度越嚴 層會嚴重影響導熱性能，為了避免在處理過程中氧化層 的衫響，處理時的環境就非常重要。 ，、j理氣氛··為了避免在處理過程中發生嚴重的氧化，在保護 坑下處理是必_。例如，加熱爐内部的氣氛滿足N2+H2的保護 從以上特徵可知，本發_齡金結合的熱處理方法有以下優點·· (1)、、、n構及功旎方面：對產品本身的結構設計不會有影響，並會 1293334 進一步提昇產品的熱傳導性。 (2)製程及成本方面：不用對原本的產線做太大 調整即可，不需高的設備成本，_可翩在廢品重工方 低製造成本。 * ⑴充分__物理結合的製程，由介面形成合金相的方 熱料性，讎恆溫纽3小時後的成品可增加熱傳 下面結合雛材料（試片）的熱處理實驗，進一步説明本發明： (33^2= ^、D分別是經過卜2、3和4小時的熱處理 (，〜420C)，母30为鐘對爐内溫度做一次紀錄，如表一所示 現縱使試>j環境不是真空，但其溫度的變化差異並不會 ^ 爐内，其加熱是均勻的。 衣不在 予同哼間的加墊爐的溫度紀錄BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for bonding a copper-aluminum alloy material, and more particularly to a method for bonding a copper-aluminum alloy material capable of absorbing the interface impedance and reducing the thermal resistance of the interface. [Prior Art] Tongming materials have a wide range of applications in industrial production. The connection between copper and Ilu has a very important position in the connection of heterogeneous metals. There are many copper alloys on the market. The most typical example of a copper-aluminum alloy bonding technique is a heat sink process technology for cooling electronic components. The central processing unit (CPU) is a high-density heat source. It first disperses the heat to the area of a car's father, and then uses the forced convection of the fan to dissipate it into the air for heat dissipation. Heat is dissipated from the CPU core to the heat sink surface and is a heat transfer process. The use of a material with a higher thermal conductivity for the heat sink is helpful for improving the heat transfer efficiency. For example, the thermal conductivity of the heat is 735KJ/(MHK), and the thermal conductivity of the steel is 1386KJ/(MHK). In all other conditions, the phase is __, copper. The amount of heat conducted in the unit _ is nearly twice that of the legend. It can be seen that the aluminum alloy heat sink is made of copper, and the heat conduction rate will have a very good upgrade, so that the heat of the high CPU of the lining CPU has the beneficial effect of the crane. However, it is also necessary to consider that the specific gravity of copper is larger than that of Ming, and it will not meet the requirements of the weight limit of the heat sink. · The hard alloy of copper is not pure alloy, and some mechanical processing properties are not as good as those such as cutting trenches; the melting point of copper is much higher than that of Mingnan. 'Not conducive to extrusion and so on. Therefore, the industry will be copper, reduce the fineness, and the high thermal conductivity of Liguan, the heat conduction, the fins of the hoof, and then the female effect of the fan will be released into the air. Both the price and the weight of the drug are not exceeded, but also mass production, and also achieved a certain performance improvement. ... At present, the industry is not only the manufacture of heat dissipation H, but also other uses. The combination of copper alloys used in welding is screwing, screwing, mechanical pressing and so on. The splicing method is a welding method in which a metal material having a melting point lower than the melting point of the base material is used as a solder, a melting point of the base material is higher than __, a liquid solder is placed on the base material, a joint gap is filled, and then condensed to form a firm joint interface. The main processes include pre-treatment, assembly, heating and welding, cooling, and post-treatment. Commonly used soldering, the surface of the wire will form a very stable oxide layer in the air (8), making the aluminum 1293334 difficult to weld, which is the biggest factor hindering the welding of the tm rigorous method to its wire ship New-Gu or its The surface of the wire transfer goes === = smooth welding at -. However, the most important brain-switching products on the market today are low Tan or low-quality, and thus high thermal resistance of the interface. The screw locking method is to use a high pressure I between the name material and the copper material, and then tighten it with a screw, and the interface thermal resistance and the welding effect;; =I method ί heat conduction f, the flat surface of the joint surface The degree of torque and the torque of the screw, so that it also has a serious problem of high interface thermal resistance. 〃 Mechanical pressing method is to mechanically transfer aluminum and copper into a ductile manner, so copper can be combined with the inscription at room temperature, for example, 2, there are "cylinder holes, - copper materials It is cylindrical, its diameter is slightly larger than the diameter of the circular hole, and the stalks are made by the squid branch. The female resistance of the branch is high. The thermal conductivity of the smear is severe, and the interface is still hot. f is an enhanced process of the hybrid technology, she combines the technology, although the problem mentioned in the effective face is 'the side of the _ combined technology of the most 1 git, such as the red art can not solve this problem, then the effect of the product [invention] The copper system provides a method of reducing the thermal resistance of the interface by the method of (4). The invention adopts the technical solution of the invention: the invention _ alloy junction enables the bonding interface of the copper alloy material to be densely formed; (4) cooling , will be = interesting. Gold material joint: (5) discharge, will have mts; hot out of the cold if there is a waste to buckle it (2) spicy to carry a weight I. The gas inside the lamp ring 1293334 to prevent oxidation Protective atmosphere environment. The prior art has the following advantages: since the copper-aluminum alloy bonding method of the present invention mainly performs heat treatment on the alloy material, the structure and function of the product itself are not affected, and the original process is not required in terms of process and cost. The production line is too large to be adjusted slightly to 'do not need too high equipment costs, and can be applied in waste: work, greatly reducing manufacturing costs; copper-aluminum alloy material interface produces a kind of expansion alloy, is the only full The process of physical combination of copper and aluminum is achieved, and the thermal resistance is reduced by the formation of an alloy phase by the interface, and the thermal conductivity is greatly improved. [Embodiment] The copper-aluminum alloy bonding method of the invention mainly overcomes the combination of copper and aluminum alloy materials by heat treatment. The interface impedance is ugly, which greatly reduces the interface thermal resistance and improves the heat transfer performance. The copper alloy combination method is generally a heating device capable of rapid heating, such as a heating furnace, which is heated from the periphery by a resistance wire, the highest The temperature can reach 12 〇〇... The inner material of the heating furnace is ceramic. The copper-aluminum alloy material of the present invention includes copper (Cu Materials (pure steel or copper alloy) and aluminum alloy (A1) materials (pure aluminum or aluminum alloy). The first figure is a flow chart of the main steps of the copper-aluminum alloy bonding method of the present invention, and the second figure is the copper of the present invention. A schematic diagram of the combination of the copper alloy material of the aluminum alloy bonding method. The copper-sand alloy bonding method mainly comprises the following steps: (1) The surface treatment of the material, the surface of the copper-aluminum alloy material to be combined is flattened and the surface is roughened. The smaller the degree, the better, for example, electrolytically or chemically grind the surface of the copper-aluminum alloy material, and then clean the surface of the copper-aluminum alloy material by ethanol, acetone, etc., and then remove the oxide layer by ultrasonic vibration; (2) feeding The surface treated copper-aluminum alloy material is placed in a heating furnace so that the surface to be bonded is relatively abutted, and a certain stress is applied from the opposite side; (3) heating and thermostatic treatment, the copper-aluminum alloy material is assembled The heating furnace starts to heat rapidly to about 330-420 C and is heated for 1 to 4 hours. At this time, the interface of the copper alloy is affected by pressure and temperature. A diffusion alloy is produced, for example, 八一尤112, which makes the joint interface of the copper-aluminum alloy material tighter and the thermal resistance can be greatly reduced (as shown in the second figure); (4) cooling, the combined Finished product is naturally cooled in the furnace; 1293334 (5) Discharge 'take the cooled finished product out of the furnace to get the final product. If there is any waste, return it to the above step (2) for heavy work. Among them, the requirements for each step are as follows: 1. Surface roughness (Roughness, Ra) and processing conditions: Before the heat treatment of copper-aluminum alloy materials, the surface roughness of the copper-aluminum alloy material is very important, the flatter the surface, the contact ( The better the tightness, the better the thermal conductivity, so it is flattened to control the surface roughness within a certain range, so that the tightness of the copper-aluminum alloy material before heat treatment reaches a good level. μ I. Stress (Stress, σ )·· During the heat treatment process, the stress generated by the different thermal expansion and contraction coefficients of copper and |Lu is used to make the interface tightly combined, because on the one hand, the diffusion cavity is prevented (frkendall effect) On the other hand, it can try to avoid the consideration of poor interface contact. The initial experiment estimates that the stress is about 3〇Mpa. In order to accurately control the stress, the temperature control is very important. Third, the processing temperature (Temperature, T): According to the copper-characteristic map and considering the melting point of aluminum (the temperature is too high, the aluminum extruded material is easily deformed), the temperature range depends on 33 (M2〇t^ right, this warm air A certain diffusion alloy is formed in the copper-aluminum interface (for example, "3〇12"), especially around 350-370C, that is, when the temperature is controlled at about 36 °C, the diffusion alloy formed is more ideal. The alloy will effectively reduce the thermal resistance caused by the interface impedance, but the amount of the diffusion alloy should not be excessive, and the alloy layer must be as thin as possible, so the time control of the treatment is an important parameter. Temperature holding time (time, t): In the preliminary experiment, for the above temperature constant temperature, i, 2, 3 and 4 λ, respectively, the thermal resistance coefficient change before and after heat treatment comparison results as shown in the third figure (heart to (^) It is not possible to find that the thermal resistance coefficient of the test piece after holding the temperature for 3 hours is lower than that of the untreated ^ test piece, and the thermal resistance coefficient is 'but the longer the temperature is maintained, the stricter the oxidation degree of the test piece will be. Affect thermal conductivity, in order to avoid the process In the middle layer of the oxide layer, the environment at the time of processing is very important. ·, J atmosphere · · In order to avoid serious oxidation during the treatment process, it is necessary to treat under the protection pit. For example, the atmosphere inside the furnace is satisfied. Protection of N2+H2 It is known from the above characteristics that the heat treatment method of the present invention has the following advantages: (1), , n structure and function: there is no influence on the structural design of the product itself, and 1293334 Further improve the thermal conductivity of the product. (2) Process and cost: no need to adjust the original production line too much, no high equipment cost, _ can be used in scrap heavy work and low manufacturing cost. * (1) Full __The physical combination process, the hot phase of the alloy phase formed by the interface, the finished product after 3 hours of constant temperature neon can increase the heat transfer experiment of the heat transfer under the combined material (test piece), further illustrating the invention: (33^ 2= ^, D is the heat treatment after 2, 3 and 4 hours (~420C), and the mother 30 is the clock for the temperature in the furnace. As shown in Table 1, the test is not vacuum. But the difference in temperature changes and Will ^ furnace, the heating is uniform. I do not dress with padded oven temperature record between hum
同時·件的熱熱阻係 一組條件取五個試片（試片號分別為卜2、3'4、5)，=2^母 乍熱阻係數的分析’如第三圖(a)至心圖= 號’縱坐標為熱阻係數。從第三圖⑷中可明顯看出，在怪 二二處理-一小時之後的熱阻係數明顯高於未經熱處理的試片。 66勒過2小雜溫熱處理的分析，從圖中可看出經触處理^ 的「阻係數有低於未經熱處理試片崎勢。接著在第 ^ 預 :溫熱，三小時後的熱阻係數，明顯低於未經熱處^中^阻 處理#的熱阻錬，如第三圖⑷所示，此結果的原因係材料介面 1293334 的擴散合金的量過多，而且擴散合金向不利于降低熱阻係數方向變 化。第四圖是總結第三圖（a)至（d)中的未經熱處理及分別經過卜 2、3、4小時熱處理的試片熱阻係數並取其平均值後的a、B、e、D 四組試片的熱處理前後的熱阻係數的比較圖。圖中，橫坐標為各組號， 縱坐標為熱阻係數。從第四圖中可見經過3小時後的試片熱阻係數的 降低率最大，假設A、B、C、D四組試片的緊密度皆良好並基本相同， 則經過3小時恆溫熱處理後的試片熱阻係數明顯下降，該種結果是因 為兩個原因： 1·由於鋁擠壓的溫度是在520〜540°C間進行，而試片在恆溫三小時 後’銘孔的表面可能由於發生類似退火效應，導致殘留硬力消除，而 使得銅鋁緊密度更好，因而降低熱阻係數。 ^ 2·在此條件下，其銅鋁接合界面有足夠時間產生交互擴散形成某種 穩疋相’因而降低熱阻係數。 綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟， =上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在 ，依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利 範圍内。 【圖式簡單說明】 第一圖係本發明銅鋁合金結合方法的主要步驟的流程圖。 第二圖係本發明銅鋁合金結合方法的銅鋁合金材料結合示意圖。 第二圖（a)至（d)係四組試片a、B、C、D的熱處理前及分別 各取五個試片經過1、2、3、4小時熱處理後的熱阻係數比較坐標圖。 第四圖係取第三圖（a)至（d)的平均值後的A、B、C、 D四組 試片的熱處轉後的熱阻係數比較坐標圖。 【主要元件符號說明】 11At the same time, the thermal resistance of the piece is taken as a set of five test pieces (the test piece numbers are respectively Bu, 2, 3'4, 5), and the analysis of the thermal resistance coefficient of the female mold is as shown in the third figure (a). To the heart map = number 'the ordinate is the thermal resistance coefficient. It is apparent from the third figure (4) that the thermal resistance coefficient after the eccentric treatment - one hour is significantly higher than that of the unheated test piece. 66 Le over 2 small temperature heat treatment analysis, it can be seen from the figure that the "resistance coefficient of the touch treatment ^ is lower than the unheated test strip. Then in the first ^: warm, three hours later The thermal resistance coefficient is significantly lower than that of the unheated heat treatment, as shown in the third figure (4). The reason for this result is that the amount of diffusion alloy of the material interface 1293334 is too large, and the diffusion alloy is not It is beneficial to reduce the direction change of the thermal resistance coefficient. The fourth figure summarizes the thermal resistance coefficient of the test piece without heat treatment and heat treatment after 2, 3, 4 hours in the third figure (a) to (d) and takes the average value. A comparison chart of the thermal resistance coefficients of the four test pieces of a, B, e, and D after heat treatment. In the figure, the abscissa is the group number, and the ordinate is the thermal resistance coefficient. It can be seen from the fourth figure that after 3 hours. The reduction rate of the thermal resistance coefficient of the test piece is the largest. It is assumed that the tightness of the four test pieces A, B, C, and D are both good and basically the same, and the thermal resistance coefficient of the test piece after the constant heat treatment for 3 hours is significantly decreased. The results are for two reasons: 1. Since the temperature of the aluminum extrusion is between 520 and 540 ° C, After the test piece is heated for three hours, the surface of the hole may be caused by a similar annealing effect, resulting in the elimination of residual hard force, which makes the copper and aluminum tighter, thus reducing the thermal resistance coefficient. ^ 2 · Under this condition, the copper The aluminum joint interface has sufficient time to generate mutual diffusion to form a certain stable phase, thus reducing the thermal resistance coefficient. In summary, the invention complies with the invention patent requirements, and patents are filed according to law. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S) The equivalent modifications or variations made in the spirit of the present invention are intended to be included in the following claims. A flow chart of the main steps of the invention relates to a copper-aluminum alloy bonding method. The second figure is a schematic diagram of the copper-aluminum alloy material bonding method of the copper-aluminum alloy bonding method of the present invention. The second drawing (a) to (d) are four sets of test pieces a and B. , C, D before the heat treatment and each of the five test strips after 1, 2, 3, 4 hours heat treatment coefficient comparison chart. The fourth picture is taken in the third figure (a) to (d) A, B after the average Comparison chart of thermal resistance coefficient after heat transfer of C and D four groups. [Main component symbol description] 11