1292946 九、發明說明： 【發明所屬之技術領域】 本毛明疋有關於-種表面黏著模組之封裝結構及方 方^且特別是㈣於-種紅外線接收模組之之封裝結構及 方法。 【先前技術】 隨著電子產業的曰新月異，紅外線接收模組普遍地應 用在各式各樣的電子產品上，但由於電子產品的尺寸一再 =小型化（例如：MP3 Player、個人數位助料），安裝於 延些電子產品内的紅外線接收模組相冑地也需越作越小， 表面黏著^ (Surface M_ting Deviee，SMD)紅外線接收模 組即為-種小型化的方式。如第丨圖所示，其為先前技術 中一種表面黏著型紅外線接收模組之結構示意圖。此表面 黏著型紅外線接收模組100將光半導體晶片1〇6及訊號處 理兀件1〇8經固晶（DieBond)、打線（WireB〇nd)而安裝於 印刷電路板102上。接著進行壓模，用樹脂11〇封裝光半 導體晶片106及訊號處理元件1 〇8。最後加上金屬外蓋 112，來排除外在光源（來自上方或側面）及電磁波的干擾。 因此，依上述步驟進行的製程，模組之組成需為本體 與鐵设的結合方式’所需成本較高。因此，一種能節省成 本支出並簡化製程步驟的方法是亟欲需要的。 【發明内容】 因此本發明的目的就疋在提供一種表面黏著模組之封 1292946 裝結構，包含··一支架以及一膠質本體。此支架具有一功 能區塊、一第一折蓋區塊以及一第二折蓋區塊。在功能區 塊上具有複數個開孔以成為一電路圖樣，而在功能區塊及 第一折蓋區塊之間係以一第一折線作為分隔，且第一折蓋 區塊及第二折蓋區塊之間係以一第二折線作為分隔。當支 架依第一折線及第二折線折疊時，功能區塊、第一折蓋區 塊以及弟一折蓋區塊將組成一容設空間，用以安裝一積體 電路以及一光半導體晶片於電路圖樣上。膠質本體，填充 於此容設空間，並封裝積體電路以及光半導體晶片於其中。 本發明的另一目的是在提供一種紅外線接收模組，包 含一支架，一積體電路，一光半導體晶片以及一膠質本體。 其中’此支架具有一功能區塊、一第一折蓋區塊、以及一 第二折蓋區塊。在功能區塊上具有複數個開孔以成一電路 圖樣，而積體電路及光半導體晶片即安裝於電路圖樣上， 且功能區塊及第一折蓋區塊之間係以一第一折線作為分 隔，而第一折蓋區塊及第二折蓋區塊之間係以一第二折線 作為刀iw。當支架依第一折線及第二折線折疊，則功能區 塊、第一折蓋區塊、以及第二折蓋區塊將組成一容設空間。 依第一折線及第二折線彎折此支架，使得功能區塊、第一 折蓋區塊以及第二折蓋區塊包覆此膠質本體。 另外，積體電路及光半導體晶片皆安裝於位於此容設 空間中的電路圖樣上。而膠質本體填充於容設空間中，並 封裝積體電路以及光半導體晶片。 本發明的另一目的是在提供一種表面黏著模組之封裝 方法，其步驟包含：首先’於一支架上安裝一積體電路及 7 1292946 :光半導體晶片。在此支架上具有一功能區塊、一第一折 盍區塊、以及一第二折蓋區塊’而功能區塊具有複數個開 子以成-電路圖樣。另外，功能區塊及第一折蓋區塊之間 係以一第一折線作為分隔，而第一折蓋區塊及第二折蓋區 塊之間係以一第二折線作為分隔。 由於’本發明在支架上的功能區塊即具有電路圖樣，以 供安裝光半導體晶片及-些電子元件，因此並不需要印刷 電路板，所以可以減少成本支出。另外，由於在開模製作 電路圖樣時，即能將接腳一併設計於電路圖樣中，所以僅 需一次開模而達到簡化製程步驟的目的。 【實施方式】 印同時參照第2圖及第3圖，其分別繪示本發明一較佳 實施例的表面黏著模組之封裝結構透視圖及側視圖。 在表面黏者模組之封裝結構（亦可為一紅外線接收模 組）中，支架200具有功能區塊201(底層）、第一折蓋區塊 202(側面）以及第二折蓋區塊2〇3(頂層）。而在功能區塊2〇1 上具有複數個開孔205以成一電路圖樣208,而此電路圖樣 208上更具有接腳211。功能區塊201及第一折蓋區塊202 之間以一第一折線206作為分隔，，而第一折蓋區塊202及 第二折蓋區塊203之間以一第二折線207作為分隔。 支架200依第一折線206及第二折線207折疊，功能 區塊201、第一折蓋區塊202以及第二折蓋區塊203組成一 谷没空間300(如第2圖所示），以供安裝一積體電路（圖未 示）以及一光半導體晶片（圖未示）於電路圖樣208上。 1292946 在此容設空間300中並由膠曾埴右，# 、 T五田胗貝填充，以封裝積體電路以及 光半導體晶片成為一膠質本體3〇1。 此表面黏著模組之封裝方法步驟流程圖，如第4圖所 示。而整個流程將利用第5至7圖，來表示表面黏著模組 之封裝方法的每-ρ音段。第5至7圖其依序緣示本發明一 較佳貫施例不同階段的表面黏著模組之封裝結構示意圖。 如第5圖所示，其為多個支架中串接的其中一個支架 200,此支架200的上下兩側各以一連接部位2〇4與其它的 支架串接在一起。此支架200具有一功能區塊2〇1、一第一 折蓋區塊202以及一第二折蓋區塊2〇3。在功能區塊2〇1 上具有複數個開孔205以成一電路圖樣208。而在功能區塊 201及第一折蓋區塊202之間以一第一折線2〇6作為分隔， 第一折蓋區塊202及第二折蓋區塊203之間以一第二折線 207作為分隔。 當上下兩侧各以一連接部位204連接之支架已經準備 妥當’接著，請同時參看第5圖及第6圖。如第6圖所示， 在電路圖樣208上依固晶及打線之方法安裝一積體電路 210以及一光半導體晶片2〇9 (步驟401 )。然後，一膠質壓 模於功能區塊201上，以封裝光半導體晶片2〇9及積體電 路210成膠質本體301 (步驟403)。之後並將於第5圖中 之連接部位204進行切腳，以成第6圖中每一個單元的支 架200，而在功能區塊2〇1上的電路圖樣208將具有接腳 211。 再來，當支架200依第一折線206及第二折線207折 疊時，功能區塊201、第一折蓋區塊202以及第二折蓋區塊 1292946 203包覆膠質本體3〇1(步驟彻）。其封裝後的表面黏著模 組的上視圖如第7圖所示，而側示圖如第6圖所示。 另外，如果位於表面黏著模組底部的膠體厚度很薄時， 表面黏著模組之接腳與其他電子元件組設時，可以直接與 電子兀件貼合。如此一來，不僅可以簡化製程的過程，而 且可以增加表面黏著模組與其他電子元件組設的多樣性。 由上可知，由於以金屬支架的封裝方式，可取代原PCB 及外部金屬殼材料可行，可以大幅減少成本支出。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限f本發明’任何熟習此技藝者，在不脫離本發明之精 神^乾圍内’當可作各種之更動與潤飾，因此本發明之保 濩範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】1292946 IX. INSTRUCTIONS: [Technical Fields of the Invention] The present invention relates to a package structure and a method for a surface mount module, and in particular, a package structure and method for the infrared receiver module. [Prior Art] With the rapid development of the electronics industry, infrared receiver modules are commonly used in a wide variety of electronic products, but the size of electronic products has repeatedly been reduced to small (eg, MP3 Player, personal digital aid). (Materials), the infrared receiving module installed in the extended electronic products needs to be smaller and smaller, and the Surface M_ting Deviee (SMD) infrared receiving module is a miniaturized method. As shown in the figure, it is a schematic structural view of a surface-adhesive infrared receiving module in the prior art. The surface-adhesive infrared receiving module 100 mounts the optical semiconductor wafer 1〇6 and the signal processing unit 1〇8 on the printed circuit board 102 via die bonding and wire bonding. Next, a stamper is applied to encapsulate the photo semiconductor wafer 106 and the signal processing element 1 〇8 with a resin 11 。. Finally, a metal cover 112 is added to eliminate external light sources (from above or from the side) and electromagnetic waves. Therefore, according to the process of the above steps, the composition of the module needs to be a combination of the body and the iron arrangement. Therefore, a way to save on cost and simplify process steps is what you need. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a surface mount module 1292946 package structure comprising a bracket and a gel body. The bracket has a functional block, a first flap block and a second flap block. A plurality of openings are formed in the functional block to form a circuit pattern, and a first fold line is used as a partition between the functional block and the first folding block, and the first folding block and the second folding block The cover blocks are separated by a second fold line. When the bracket is folded according to the first folding line and the second folding line, the functional block, the first folding cover block and the first folding cover block form a receiving space for mounting an integrated circuit and an optical semiconductor chip. On the circuit pattern. The colloidal body fills the housing space and encapsulates the integrated circuit and the optical semiconductor wafer therein. Another object of the present invention is to provide an infrared receiving module comprising a holder, an integrated circuit, an optical semiconductor wafer and a colloidal body. Wherein the bracket has a functional block, a first flap block, and a second flap block. A plurality of openings are formed in the functional block to form a circuit pattern, and the integrated circuit and the optical semiconductor chip are mounted on the circuit pattern, and a first broken line is used between the functional block and the first folding block. Separating, and a second fold line is used as the knife iw between the first flap block and the second flap block. When the bracket is folded according to the first fold line and the second fold line, the function block, the first flap block, and the second flap block will form a receiving space. The bracket is bent according to the first fold line and the second fold line, so that the functional block, the first flap cover block and the second flap cover block cover the gel body. In addition, the integrated circuit and the optical semiconductor wafer are mounted on the circuit pattern located in the housing space. The gel body is filled in the housing space, and the integrated circuit and the optical semiconductor wafer are packaged. Another object of the present invention is to provide a method of packaging a surface mount module comprising the steps of: first mounting an integrated circuit on a support and 7 1292946: an optical semiconductor wafer. There is a functional block, a first folded block, and a second folded block' on the bracket, and the functional block has a plurality of openers in a circuit pattern. In addition, a first fold line is used as a partition between the functional block and the first flap block, and the first flap block and the second flap block are separated by a second fold line. Since the functional block on the support of the present invention has a circuit pattern for mounting an optical semiconductor wafer and some electronic components, a printed circuit board is not required, so that cost can be reduced. In addition, since the pins can be designed together in the circuit pattern when the circuit pattern is formed by opening the mold, it is only necessary to open the mold once to achieve the purpose of simplifying the process steps. [Embodiment] At the same time, reference is made to Figs. 2 and 3, which respectively show a perspective view and a side view of a package structure of a surface mount module according to a preferred embodiment of the present invention. In the package structure of the surface adhesive module (which may also be an infrared receiving module), the bracket 200 has a functional block 201 (bottom layer), a first flap block 202 (side), and a second flap block 2 〇 3 (top layer). On the functional block 2〇1, there are a plurality of openings 205 to form a circuit pattern 208, and the circuit pattern 208 further has a pin 211. The function block 201 and the first flap block 202 are separated by a first fold line 206, and the first flap block 202 and the second flap block 203 are separated by a second fold line 207. . The bracket 200 is folded according to the first fold line 206 and the second fold line 207, and the function block 201, the first flap block 202 and the second flap block 203 form a valley space 300 (as shown in FIG. 2), An integrated circuit (not shown) and an optical semiconductor wafer (not shown) are mounted on the circuit pattern 208. 1292946 is accommodated in the space 300 and filled by the glue Zeng Yi right, #, T 五田胗, to encapsulate the integrated circuit and the optical semiconductor wafer into a colloidal body 3〇1. A flow chart of the method of packaging the surface mount module, as shown in FIG. The entire process will use Figures 5 through 7 to represent the per-ρ segment of the surface mount module packaging method. 5 to 7 are schematic views showing the package structure of the surface adhesion module at different stages of a preferred embodiment of the present invention. As shown in Fig. 5, it is one of the brackets 200 connected in series in the plurality of brackets. The upper and lower sides of the bracket 200 are connected in series with the other brackets by a connecting portion 2〇4. The bracket 200 has a functional block 2〇1, a first flap block 202 and a second flap block 2〇3. A plurality of openings 205 are formed in the functional block 2〇1 to form a circuit pattern 208. A first fold line 2〇6 is separated between the function block 201 and the first flap block 202, and a second fold line 207 is between the first flap block 202 and the second flap block 203. As a separation. When the brackets connected by a joint portion 204 on the upper and lower sides are already prepared, then, please refer to Figs. 5 and 6. As shown in Fig. 6, an integrated circuit 210 and an optical semiconductor wafer 2 are mounted on the circuit pattern 208 by means of solid crystal and wire bonding (step 401). Then, a colloidal stamper is applied to the functional block 201 to encapsulate the optical semiconductor wafer 2〇9 and the integrated circuit 210 into a colloidal body 301 (step 403). Then, the joint portion 204 in Fig. 5 is cut to form the bracket 200 of each unit in Fig. 6, and the circuit pattern 208 on the function block 2〇1 will have the pin 211. Then, when the bracket 200 is folded according to the first fold line 206 and the second fold line 207, the functional block 201, the first flap block 202 and the second flap block 1292946 203 cover the colloidal body 3〇1 (step ). The top view of the packaged surface mount mold set is shown in Figure 7, and the side view is shown in Figure 6. In addition, if the thickness of the gel at the bottom of the surface mount module is very thin, the pins of the surface mount module can be directly attached to the electronic component when assembled with other electronic components. In this way, not only can the process of the process be simplified, but the diversity of the surface mount module and other electronic components can be increased. It can be seen from the above that the metal PCB can be used to replace the original PCB and the external metal shell material, which can greatly reduce the cost. While the present invention has been described above in terms of a preferred embodiment, it is not intended to be limited to the invention, and may be used in various ways, without departing from the spirit of the invention. Therefore, the scope of the present invention is defined by the scope of the appended claims. [Simple description of the map]
&為讓本發明之上述和其他目的、特徵、優點與實施例 月匕更明顯易f蓳，所附圖式之詳細說明如下： 第1圖騎示先前技術中—種表面黏著型紅外線接收 模組之結構示意圖。 苐2圖係纟會示本發明一 封裝結構透視圖。 較佳實施例的表面黏著模組之 固保增、不本發明 封裝結構側視圖 =4圖騎示本發明—較佳實施例的表面黏著模 、了裒方法步驟流程圖。 第5至6圖係依序繪示本發明一較佳實施例不同 !292946 的表面黏著模組之封裝結構示意圖。 第7圖係繪示本發明—較佳實施例的表面黏著模組之 封裝結構上視圖。 第8圖係繪示本發明一較佳實施例的表面黏著模組之 封裝結構側示圖。The above and other objects, features, advantages and embodiments of the present invention are more obvious and obvious. The detailed description of the drawings is as follows: Figure 1 shows a prior art - surface-adhesive infrared receiving Schematic diagram of the module. The Fig. 2 system shows a perspective view of a package structure of the present invention. The surface mount module of the preferred embodiment is secured, and the side view of the package structure is not shown. Fig. 4 is a flow chart showing the steps of the surface mount mold and the method of the preferred embodiment of the present invention. 5 to 6 are diagrams showing the package structure of the surface adhesion module of a different embodiment of the present invention. Figure 7 is a top plan view showing the package structure of the surface mount module of the preferred embodiment of the present invention. Figure 8 is a side elevational view showing the package structure of the surface mount module in accordance with a preferred embodiment of the present invention.
【主 要元件符號說明】 200 : 紅外線接收模組 207 :第二折線 102 : 印刷電路板 208 ·•電路圖樣 106 ： 光半導體晶片 209 :光半導體晶片 108 : 訊5虎處理元件 210 :積體電路 110 ： 樹脂 211 :接腳 112 ： 金屬外蓋 300 :容設空間 200 ： 支架 301 :膠質本體 201 ： 功能區塊 401 、 403 、 405 :步 202 ： 第一折蓋區塊 203 ： 第二折蓋區塊 204 ： 連接部位 205 ： 開孔 206 : 第一折線 11[Main component symbol description] 200 : Infrared receiving module 207 : Second folding line 102 : Printed circuit board 208 · Circuit pattern 106 : Optical semiconductor wafer 209 : Optical semiconductor wafer 108 : Signal 5 Tiger processing element 210 : Integrated circuit 110 : Resin 211 : Pin 112 : Metal cover 300 : accommodating space 200 : Bracket 301 : Colloid body 201 : Functional block 401 , 403 , 405 : Step 202 : First flap block 203 : Second flap area Block 204: connection location 205: opening 206: first fold line 11