TWI292852B - - Google Patents
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- Publication number
- TWI292852B TWI292852B TW091120921A TW91120921A TWI292852B TW I292852 B TWI292852 B TW I292852B TW 091120921 A TW091120921 A TW 091120921A TW 91120921 A TW91120921 A TW 91120921A TW I292852 B TWI292852 B TW I292852B
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- acid
- carbon atoms
- bis
- hydrogen atom
- Prior art date
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1812—C12-(meth)acrylate, e.g. lauryl (meth)acrylate
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001277156A JP4420169B2 (ja) | 2001-09-12 | 2001-09-12 | 高分子化合物、レジスト材料、及びパターン形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWI292852B true TWI292852B (US20040234885A1-20041125-C00002.png) | 2008-01-21 |
Family
ID=19101730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091120921A TWI292852B (US20040234885A1-20041125-C00002.png) | 2001-09-12 | 2002-09-11 |
Country Status (4)
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4083053B2 (ja) * | 2003-03-31 | 2008-04-30 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
WO2005012374A1 (ja) * | 2003-08-05 | 2005-02-10 | Jsr Corporation | アクリル系重合体および感放射線性樹脂組成物 |
JP4092572B2 (ja) * | 2003-08-07 | 2008-05-28 | 信越化学工業株式会社 | レジスト用重合体、レジスト材料及びパターン形成方法 |
JP4539847B2 (ja) * | 2004-04-09 | 2010-09-08 | 信越化学工業株式会社 | ポジ型レジスト材料並びにこれを用いたパターン形成方法 |
US7910283B2 (en) | 2005-11-21 | 2011-03-22 | Shin-Etsu Chemical Co., Ltd. | Silicon-containing antireflective coating forming composition, silicon-containing antireflective coating, substrate processing intermediate, and substrate processing method |
US7678529B2 (en) | 2005-11-21 | 2010-03-16 | Shin-Etsu Chemical Co., Ltd. | Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method |
EP1845132B8 (en) | 2006-04-11 | 2009-04-01 | Shin-Etsu Chemical Co., Ltd. | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method |
US7855043B2 (en) | 2006-06-16 | 2010-12-21 | Shin-Etsu Chemical Co., Ltd. | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method |
US8652750B2 (en) | 2007-07-04 | 2014-02-18 | Shin-Etsu Chemical Co., Ltd. | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method |
US7875417B2 (en) | 2007-07-04 | 2011-01-25 | Shin-Etsu Chemical Co., Ltd. | Silicone-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method |
JP4793592B2 (ja) | 2007-11-22 | 2011-10-12 | 信越化学工業株式会社 | 金属酸化物含有膜形成用組成物、金属酸化物含有膜、金属酸化物含有膜形成基板及びこれを用いたパターン形成方法 |
JP5015891B2 (ja) | 2008-10-02 | 2012-08-29 | 信越化学工業株式会社 | 金属酸化物含有膜形成用組成物、金属酸化物含有膜形成基板及びパターン形成方法 |
JP5015892B2 (ja) | 2008-10-02 | 2012-08-29 | 信越化学工業株式会社 | ケイ素含有膜形成用組成物、ケイ素含有膜形成基板及びパターン形成方法 |
JP5038354B2 (ja) | 2009-05-11 | 2012-10-03 | 信越化学工業株式会社 | ケイ素含有反射防止膜形成用組成物、ケイ素含有反射防止膜形成基板及びパターン形成方法 |
JP5399347B2 (ja) | 2010-09-01 | 2014-01-29 | 信越化学工業株式会社 | ケイ素含有膜形成用組成物、ケイ素含有膜形成基板及びこれを用いたパターン形成方法 |
JP5900340B2 (ja) | 2010-09-17 | 2016-04-06 | Jsr株式会社 | 感放射線性樹脂組成物及びレジストパターン形成方法 |
JP5642731B2 (ja) | 2012-04-27 | 2014-12-17 | 信越化学工業株式会社 | パターン形成方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3751065B2 (ja) | 1995-06-28 | 2006-03-01 | 富士通株式会社 | レジスト材料及びレジストパターンの形成方法 |
JP3297272B2 (ja) | 1995-07-14 | 2002-07-02 | 富士通株式会社 | レジスト組成物及びレジストパターンの形成方法 |
JP4131062B2 (ja) | 1998-09-25 | 2008-08-13 | 信越化学工業株式会社 | 新規なラクトン含有化合物、高分子化合物、レジスト材料及びパターン形成方法 |
JP2000336121A (ja) | 1998-11-02 | 2000-12-05 | Shin Etsu Chem Co Ltd | 新規なエステル化合物、高分子化合物、レジスト材料、及びパターン形成方法 |
-
2001
- 2001-09-12 JP JP2001277156A patent/JP4420169B2/ja not_active Expired - Lifetime
-
2002
- 2002-09-11 TW TW091120921A patent/TWI292852B/zh not_active IP Right Cessation
- 2002-09-11 KR KR1020020054834A patent/KR100571454B1/ko active IP Right Grant
- 2002-09-12 US US10/241,530 patent/US6703183B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20030091929A1 (en) | 2003-05-15 |
KR100571454B1 (ko) | 2006-04-17 |
JP2003084438A (ja) | 2003-03-19 |
US6703183B2 (en) | 2004-03-09 |
KR20030051181A (ko) | 2003-06-25 |
JP4420169B2 (ja) | 2010-02-24 |
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MK4A | Expiration of patent term of an invention patent |