TWI292731B - Polishing apparatus and method - Google Patents

Polishing apparatus and method Download PDF

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Publication number
TWI292731B
TWI292731B TW094107050A TW94107050A TWI292731B TW I292731 B TWI292731 B TW I292731B TW 094107050 A TW094107050 A TW 094107050A TW 94107050 A TW94107050 A TW 94107050A TW I292731 B TWI292731 B TW I292731B
Authority
TW
Taiwan
Prior art keywords
polishing
workpiece
head
layer
polishing head
Prior art date
Application number
TW094107050A
Other languages
Chinese (zh)
Other versions
TW200631732A (en
Inventor
Kuo Cheng Huang
Zong Ru Yu
Ching Hsiang Kuo
Original Assignee
Nat Applied Res Laboratories
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Publication date
Application filed by Nat Applied Res Laboratories filed Critical Nat Applied Res Laboratories
Priority to TW094107050A priority Critical patent/TWI292731B/en
Priority to US11/369,652 priority patent/US20060205327A1/en
Publication of TW200631732A publication Critical patent/TW200631732A/en
Application granted granted Critical
Publication of TWI292731B publication Critical patent/TWI292731B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/01Specific tools, e.g. bowl-like; Production, dressing or fastening of these tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Description

1292731 九、發明說明: 【發明所屬之技術領域】 本發明是關於-麵光裝置與方法,且本發明更特別地係關 "種適用於非球面鏡片的負形抛光裝置與方法。 【先前技術】 當光學玻璃鏡片的製程可分為成形、研磨、拋光等流程, ς見的1程有傳統球面鏡加卫、單點鑽石切削以及玻璃模造等技 罝針面光學玻璃鏡片的製作方式是以曲率相同的拋光模 ;旦==;拋^得到很均句、精度高的鏡面, 作光學鏡片,並製作^時磨(Dla_d —_)製 /、衣作耗日寸且刀具易磨耗’進而影響表面形狀精度。 法以ΐϊϊίί學玻璃鏡片來說,由於鏡片表面的曲率不同,無 磨、拋光制其形狀精度與改善表面粗糙度,故目前在研 磨、拋光 小面積接觸或以類似單點切削的方式作研 差,致使非g 4衣耘無法以大面積研磨、拋光及矯正形狀誤 光壓力分佈獨?ί製作_遠較同尺寸球面鏡長,且易因拋 品質不理想。目表面留下巧細的環、紋’造成拋光後的表面 模具精度^长古月’m用玻璃模造技術製作非球面鏡,但是其 符合&因r玻社昂貴,故常麟大量生產才能 鏡。 破离杈以技術仍不適用於製作較大口徑之非球面 習知技藝的=朝f於非球面鏡片的需求,以及為了克服上述 不捨之精神,、炊it明人乃經悉心試驗與研究,並一本鍥而 、、,;於創作出本騎述之「負形拋光裝置與方 1292731 ^供具有特殊抛光層且可容許微小變形的拋光頭,即可以類似於 傳統球面賴光綠,直接騎_面制光, 好的拋糸钕罢。 【發明内容】 ▲本發明之一構想是提供一種負形拋光裝置,其具有一容許微 小變形的拋光頭,適用於直接對非球面鏡進行拋光。 、根據上述構想,本發明的負形拋光裝置包含一基座,用以承 載一工件;以及一抛光頭,其係位於該基座之上方,且該拋光頭 具有一拋光層,其係由一樹酯、一磨粒以及一石墨所製成,用以 對該工件進行拋光;—緩衝層,其係連接於該抛光層 ,用以使該 巧光頭具有傾斜與侧移的自由度;以及—金屬軸,其係連接於該 緩衝層。 根據上述構想’該磨粒係為鑽石粒、碳化矽(SiC)與立方晶 氮化硼(CBN)其中之一。 根據上述構想,該磨粒的粒度範圍係#800至#4000。 根據上述構想,該拋光層中該石墨的含量係為25%至35%。 根據上述構想,該拋光層更包含一導流槽。 根據上述構想,該導流槽中具有一抛光液。 根據上述構想,該導流槽具有至少一孔洞,以供該拋光液流 出。 根據上述構想,該緩衝層的材質係選自於泡綿、彈性膠以及 彈簧其中之一' 根據上述構想,該工件係一非球面鏡片。 本發明之另一構想是提供一種容許微小變形的拋光頭,用於 直接對非球面鏡進行拋光。 1292731 酷乂光f:其係由:樹 光層,用以使職光頭具有傾斜與側移的 由度、。係連接於5亥拋 氣化粒係為鑽石粒、碳化邦ic)與立方晶 根據上述構想,該磨粒的粒度範圍係#800至#4000。 根據上述構想,馳光層巾該^墨的含量係為25%至35%。 根據上述構想,該拋光層更包含一導流槽。 根據上述構想,該導流槽中具有一抛光液。 根據上述構想’該導流槽具有至少—孔洞,以供該拋光液流 根據上述構想,该緩衝層的材質係選自於泡綿、彈性膠以及 彈簧其中之一。 根據上述構想,該工件係一非球面鏡片。 本發明之另一構想是提供一種負形拋光方法,該方法包含的 步驟為⑻提供一拋光裝置,該拋光裝置包含一基座,用以承載 一工件;以及一拋光頭,其係位於該基座之上方,該拋光頭具有 一拋光層,其係由一樹酯、一磨粒以及一石墨所製成,用以對該 工件進行拋光;一緩衝層,其係連接於該拋光層,用以使該拋光 頭具有傾斜與側移的自由度;以及一金屬軸,其係連接於該緩衝 層,,中該工件係一凹面工件,且其中心曲率半徑係為R且具 有一第一圓錐係數(conic constant)為κ ;以及(b)調整該拋光頭的 中心曲率半徑為且其第二圓錐係數(conic constant)為(K士 △κ),以對該凹面工件進行拋光,其中0001R $ 0.1R且 0.001Κ<ΔΚ<0.1Κ ° 本發明之另一構想是提供一種負形拋光方法,該方法包含的 1292731 步驟為⑻提供一凹面工件,其中心曲率半徑係為R且具有一第 一圓錐係數(conic constant)為K ; (b)提供一拋光頭,其中心曲率 半徑為(R±AR)且其弟二圓錐係數(c〇nic constant)為(K土ΔΚ),且 0.001R AR $ 0.1R 且 〇·〇〇1Κ $ 0.1K ;以及(c)藉由該拋光 頭,對該凹面工件進行拋光。 本發明之另一構想是提供一種負形拋光方法,該方法包含的 步驟為⑻提供一拋光裝置,該拋光裝置包含一基座,用以承載 一工件;以及一拋光頭,其係位於該基座之上方,該拋光頭具有 一拋光層,其係由一樹酯、一磨粒以及一石墨所製成,用以對該 工件進行拋光;一緩衝層,其係連接於該拋光層,用以使該拋光 頭具有傾斜與侧移的自由度;以及一金屬軸,其係連接於該緩衝 層,其中該工件係一凸面工件,且其中心曲率半徑係為R、c〇nie constant為K;以及(b)調整該拋光頭,使其中心曲率半徑為(R+AR) 且圓錐係數(conic constant)為(K土ΔΚ),以對該凸面工件進行拋 光’其中 0.001R $ 0.1R、〇 001K £ 0.1K。 本發明之另一構想是提供一種負形拋光方法,該方法包含的 步驟為⑻提供一凸面工件,其中心曲率半徑係為R且圓錐係數 (come constant)為Κ; (b)提供一拋光頭,其中心曲率半徑為(r+aR) 且圓錐係數(conic constant)為(K士ΔΚ),且 0.001R £ 0.1R、 001K $ 〇·1Κ ,以及(c)猎由該抛光頭,對該凸面工件進行 抛光。 【實施方式】 〜本案所提供負形拋光裝置與方法,將可由以下的實施例說明 而得到^分瞭解,並使得熟習本技藝之人士可以據以完成之,然 本案之實施型態並不限制於下列實施例中。 _請參閱第一圖,其係本發明第一較佳實施例的示意圖,用以 說明本發明所提供的拋光頭。本發明所提供的拋光頭1包含一拋 1292731 31二:,=Λ2厂金屬層13以及—金屬軸14。該撤光 酉旨基鑽石材中加人石墨而製成物基材’並在雜 Ι(5 11^ώβηη 表成鑌拋先層11,其中該磨粒的粒度 =纖)0至#4_,且該磨粒係為鑽石粒 μ光θ 1中添加石墨可添加拋光時的潤滑性。 的’其係本發明第—較佳實施例中該拋光層11 光層11更包含—導流槽111與孔洞112,且該 導^tyi中具有-拋光液,其可自該孔洞112流出。請參閱第 =分ΐ係本發明第—較佳實施例中該緩衝層12的功能示意 ϋ/:緩衝層12的材質係為泡綿、彈性膠或彈簧,因此由於該 =層12係為可微變形的軟,故可用贿該拋光頭i具 ,賴角與側移的自由度。第三圖的上半部是說明該抛光頭工 '則私的情形,第三圖的下半部是說明該抛光頭1可傾角的情 形0 、 、,參閱第四圖,其係根據本發明第二較佳實施例的示意圖, 用以說明本發明所提供的一拋光裝置。本發明所提供的拋光裝置 4係包含一基座41與一拋光頭43,其中該拋光頭43包含一拋光 m 緩衝層432以及一金屬轴433。該基座41係用以承載 ^工件42 ;該拋光頭43係位於該基座41之上方;該緩衝層432 係連接於該拋光層431 ;以及該金屬軸433係連接於該緩衝層 432 〇 該抛光層431的形成係由樹酯與磨粒燒結而成樹酯基鑽石 材’並在该樹酯基鑽石材中加入石墨而製成該撤光層431,其中 該磨粒的粒度範圍係#800至#4000,且該磨粒係為鑽石粒、碳化 夕(SiC)或立方晶氮化蝴(CBN) ’以及該抛光層431中該石墨的含 置係為25%至35%。該拋光層431中添加石墨可添加拋光時的 潤滑性。 1292731 該緩衝層432的材質係為泡綿、彈性膠或彈簧,故可知由於 該緩衝層432係為可微變形的軟質材質,因而可用以使該拋光頭 43具有些許傾角與側移的自由度。 該拋光層431更包含一導流槽4311與孔洞4312,且該導流 槽4311中具有一拋光液,其可自該孔洞4312流出,作為拋光工 件時的潤滑液。 本發明不僅適用於一般球面鏡片的拋光,更特別的是本發明 更可適用於非球面鏡片的撤光。請參閱第四圖,使用本發明的据 光裝置4進行一工件42(例如:非球面鏡片)的拋光時,由於該拋 光頭43的該金屬軸433中設計有導流路徑(未顯示)可提供拋光 液流入至該拋光層431,而後拋光液經該導流槽4311由該孔洞 4312流出至工件42的表面;再者,由於該緩衝層432為可微變 形的軟質材質,故使該拋光頭43具有些許傾角與侧移的自由 度,因而使得該拋光層431與該工件42可達到良好的密合度, 接著以拋光層431中微粒鑽石磨拋削工件42,以去除工件表面 的刺孔與刮痕,達到撖光的效果;除此之外,在本發明的拋光裝 置中,由於該拋光液係均勻地填充在該拋光層431與該工件42 的表面間,因而更增加拋光的效率及穩定性。 、再者’經本案發明人悉心试驗後得知:當所欲進行拋光的工 件為具有中心曲率半徑R的凹面工件時,將該拋光頭的中心曲 率半徑調整為R±AR,可得到最佳的拋光效果,其中, 0·〇〇1汉^0.1,C值的大小依該工件實際大小而^ ;然而,當所 欲進行拋光的工件為具有中心曲率半徑R的凸面工件時,^該 抛光頭的中心曲率半徑調整為R±AR,可得到最佳的拋光效果二 ,中ARCR,0.001孓<0.1,C值的大小依該工件實際大小而 定0 另拋光頭的圓錐係數(conic constant) K亦可調整為κ+Ακ, 其中AK-DK,0.001SDS0.1,D值的大小依該工件實際大小而 1292731 定 可精確地完成修正抛光形狀:置其均勻抛光’更 的大細痕及刺孔 拋ίΓ:,與側移:機制二= =鏡片㈣因此,本發明特別_於處理非球面的光學鏡片 作為ίίίϊϊίϊ拋,’進—步量測件表面形狀精度,以 t] π ^ 係分別°代表1=~狀Γ差時,請參閱第六圖⑻與第六圖⑻,其 所示,^ 凹面鏡片的修正拋光示意圖。如第六圖⑻ M,域需修正形狀誤差時,控制拋光頭接近第I =接誤差側移δ1並轉動6角度,使與凸面 域,並批剖报4·:域並使拋光頭左右晃動,以均勻接觸第1區 幻ίΐί光時間以執行第1區域修正拋光工作。其中~與0 1 第II區域ΐϊ觸鏡片第1區域中所需移除誤差而調整。當鏡片 儀八別正形狀誤差時,請參閱第七圖⑻與第七剛,其 盘斤面鏡i與凹面鏡片的修正拋光示意圖。如第七圖⑻ 域’再使拋光齡減制縣逐_移心並 使拋光頭與鏡片接觸面積集中在第11區域,由於 古衝層係為可微變形的軟質材質’故使得該抛光頭具 側移的自由度,再使抛光頭左右晃動,藉以達到密 二ίίί果,進行第11區域修正拋光工作。當鏡片第111區域需 I正形狀决差時,請參閱第八圖⑻與第八圖⑻,其係分別代表 11 1292731 凸面鏡片與凹面鏡片的修正撤絲意圖。如第八圖⑻所示 凹面鏡片的第III區域需修正形狀誤差時,控繼光頭接近第瓜 區域’再使拋光頭主軸依鏡片誤差逐漸側移^並轉動必3角度, -使拋光頭與凹面鏡片接觸面積射至第ΠΙ區域,同理抛光頭 由緩衝層而逐漸變形並使拋光頭左右晃動達到密合拋光效果,^ 凹面鏡片修正抛紅作集中在第m區域。由上可知,由於本發 明的拋光裝置具有可微變形的抛光頭,故可因應工件表面的不^ 狀況而進行傾角與側移,達到良好的拋光修正效果。 本發明所提供馳辆,其拋光層為樹酯基鑽石材,可完成 精緻的拋光效果,再加上具有可為變形的緩衝層,使本發明的拋 光頭具有可微位移與傾角的機制,得以與欲被拋光之工件達到密 合的拋光效果。綜上所述,可想而知的是本發明不僅對於球面鏡 片具有當然的良好拋光效果,更特別的是本發明提供適用於非球 3鏡片的拋光裝置與拋光方法,用以矯正非球面鏡片的形狀精度 ^改善非球面制的表面粗糙度。據此,本發明不僅具有新颖 性、進步性,且更當然具有產業上的利用性。 、 、本案得由熟悉本技藝之人士任施匠思而為諸般修飾,然皆 脫如附申請專利範圍所欲保護者。 Μ 【圖式簡單說明】 第一圖係本發明第一較佳實施例的示意圖,用以說 的拋光頭。 ^ ^ 第二圖係本發明第一較佳實施例中該拋光層的示意圖。 第三圖係本發明第一較佳實施例中該緩衝層的功能示意圖。 第四圖係本發明第二較佳實施例的示意圖,用以說明 的負形拋光裝置。 月 第五圖⑻係凸面鏡片的拋光示意圖。 12 1292731 第五圖(b)係凹面鏡片的拋光示意圖。 第六圖(a)係凸面鏡片的修正拋光示意圖。 第六圖(b)係凹面鏡片的修正拋光示意圖。 第七圖⑻係凸面鏡片的修正拋光示意圖。 第七圖(b)係凹面鏡片的修正拋光示意圖。 第八圖⑻係凸面鏡片的修正拋光示意圖。 第八圖(b)係凹面鏡片的修正拋光示意圖。 【主要元件符號說明】 1拋光頭 11拋光層 12缓衝層 13金屬層 14金屬軸 111導流槽 112孔洞 4拋光裝置 41基座 42工件 43拋光頭 431拋光層 432緩衝層 4311導流槽 4312孔洞 131292731 IX. Description of the Invention: [Technical Field] The present invention relates to a surface light device and method, and the present invention more particularly relates to a negative polishing device and method suitable for an aspherical lens. [Prior Art] When the process of optical glass lens can be divided into forming, grinding, polishing and other processes, the first step of the process is the production of traditional spherical mirrors, single-point diamond cutting and glass molding. It is a polishing die with the same curvature; Dan ==; throwing a mirror with a high uniformity and high precision, making it as an optical lens, and making a time-shaving (Dla_d__) system, and the clothes are easy to wear and the tool is easy to wear. 'In turn affect the surface shape accuracy. In the case of 玻璃ίί glass lenses, the curvature of the surface of the lens is different, the shape accuracy is improved without grinding and polishing, and the surface roughness is improved. Therefore, it is currently grinding or polishing a small area or making a similar single point cutting method. As a result, non-g 4 clothes can not be polished, polished and corrected in a large area. The shape of the light is not unique. The production is far longer than the spherical mirror of the same size, and the quality of the throw is not ideal. The surface of the mesh leaves a delicate ring and pattern, which results in a polished surface. The accuracy of the mold is long. The long-formed moon is made by glass molding technology, but it is in accordance with the high frequency of the R-glass, so Changlin can produce a large number of mirrors. The need to break the 杈 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 = = = = = = = = = = = = = = = = = = = = = 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于And create a "negative polishing device and a square 1292731 ^ for a polishing head with a special polishing layer that can tolerate slight deformation, which can be similar to the traditional spherical glare green. Directly riding _ surface light, good throwing. [Summary] ▲ One idea of the present invention is to provide a negative polishing device having a polishing head that allows slight deformation, suitable for directly polishing the aspherical mirror According to the above concept, the negative polishing apparatus of the present invention comprises a base for carrying a workpiece; and a polishing head located above the base, and the polishing head has a polishing layer which is a resin, a abrasive grain, and a graphite for polishing the workpiece; a buffer layer coupled to the polishing layer for imparting freedom of tilt and side shift to the optical head; a metal shaft connected to the buffer layer. According to the above concept, the abrasive grain is one of diamond particles, tantalum carbide (SiC) and cubic boron nitride (CBN). According to the above concept, the particle size of the abrasive grain The range is #800 to #4000. According to the above concept, the content of the graphite in the polishing layer is 25% to 35%. According to the above concept, the polishing layer further comprises a flow guiding groove. According to the above concept, the guiding groove In the above concept, the flow guiding groove has at least one hole for the polishing liquid to flow out. According to the above concept, the material of the buffer layer is selected from one of foam, elastic rubber and spring. According to the above concept, the workpiece is an aspherical lens. Another idea of the present invention is to provide a polishing head that allows slight deformation for directly polishing an aspherical mirror. 1292731 Cool light f: Its system: tree light layer For the purpose of making the head of the head have a tilt and side shift, the system is connected to the 5 hai gasification granules as diamond granules, carbonized ic) and cubic crystals. According to the above concept, the grain size range of the abrasive grains is #800. To #4000. According to According to the above concept, the polishing layer further comprises a flow guiding groove. According to the above concept, the flow guiding groove has a polishing liquid. It is contemplated that the flow guiding groove has at least a hole for the polishing liquid flow. According to the above concept, the material of the buffer layer is selected from one of a foam, an elastic rubber and a spring. According to the above concept, the workpiece is a non- Spherical Lens. Another idea of the present invention is to provide a negative polishing method, the method comprising the steps of (8) providing a polishing apparatus comprising a susceptor for carrying a workpiece; and a polishing head Located above the susceptor, the polishing head has a polishing layer made of a resin, an abrasive grain and a graphite for polishing the workpiece, and a buffer layer connected to the polishing layer. a degree of freedom for tilting and laterally moving the polishing head; and a metal shaft coupled to the buffer layer, wherein the workpiece is a concave workpiece having a central radius of curvature R and having a a conic constant is κ; and (b) adjusting a central radius of curvature of the polishing head and a second conic constant (K 士 Δκ) to polish the concave workpiece, wherein 0001R $ 0.1R and 0.001 Κ < Δ Κ < 0.1 Κ ° Another idea of the present invention is to provide a negative polishing method comprising the step 1292731 for (8) providing a concave workpiece having a central radius of curvature of R and having a The first conic constant is K; (b) provides a polishing head having a central radius of curvature of (R ± AR) and a coefficient of c圆锥nic constant (K Κ Κ Κ), and 0.001 R AR $ 0.1R and 〇·〇〇1Κ $ 0.1K ; and (c) polishing the concave workpiece by the polishing head. Another idea of the present invention is to provide a negative polishing method, the method comprising the steps of (8) providing a polishing apparatus comprising a base for carrying a workpiece; and a polishing head located at the base Above the seat, the polishing head has a polishing layer made of a resin, an abrasive grain and a graphite for polishing the workpiece, and a buffer layer connected to the polishing layer for The polishing head has a degree of freedom of inclination and side shift; and a metal shaft connected to the buffer layer, wherein the workpiece is a convex workpiece, and the central radius of curvature is R, c〇nie constant is K; And (b) adjusting the polishing head such that its central radius of curvature is (R+AR) and the conic constant is (K soil ΔΚ) to polish the convex workpiece 'where 0.001R $ 0.1R, 〇 001K £ 0.1K. Another idea of the present invention is to provide a negative polishing method comprising the steps of (8) providing a convex workpiece having a central radius of curvature of R and a constant constant of Κ; (b) providing a polishing head , the central radius of curvature is (r+aR) and the conic constant is (K 士 Κ Κ), and 0.001R £ 0.1R, 001K $ 〇·1Κ, and (c) by the polishing head, The convex workpiece is polished. [Embodiment] The negative polishing apparatus and method provided in the present invention can be understood from the following examples, and can be completed by a person familiar with the art, but the implementation mode of the present invention is not limited. In the following examples. Referring to the first drawing, which is a schematic view of a first preferred embodiment of the present invention, is used to illustrate a polishing head provided by the present invention. The polishing head 1 provided by the present invention comprises a throwing 1292731 31 2:, = 2 factory metal layer 13 and a metal shaft 14. The light-removing base diamond material is made of graphite and is made into a substrate 'and is mixed with the first layer 11 (wherein the particle size of the abrasive grain = fiber) 0 to #4_, Further, the abrasive grain is a diamond grain μ θ 1 added with graphite to add lubricity during polishing. In the preferred embodiment of the present invention, the polishing layer 11 optical layer 11 further includes a flow guiding groove 111 and a hole 112, and the conductive liquid has a polishing liquid which can flow out from the hole 112. Please refer to the second embodiment of the present invention. The function of the buffer layer 12 is: /: the material of the buffer layer 12 is foam, elastic rubber or spring, so that the layer 12 is The micro-deformation is soft, so it is possible to use the bribe to polish the head, the angle of freedom and the degree of freedom of side shift. The upper part of the third figure is a description of the case where the polishing head is 'private', and the lower part of the third figure is a case where the tilting angle of the polishing head 1 is illustrated. FIG. 4 is a view according to the present invention. A schematic view of a second preferred embodiment for illustrating a polishing apparatus provided by the present invention. The polishing apparatus 4 provided by the present invention comprises a base 41 and a polishing head 43, wherein the polishing head 43 comprises a polishing m buffer layer 432 and a metal shaft 433. The pedestal 41 is used to carry the workpiece 42. The polishing head 43 is located above the susceptor 41. The buffer layer 432 is connected to the polishing layer 431. The metal shaft 433 is connected to the buffer layer 432. The polishing layer 431 is formed by sintering a resin with a resin to form a resin-based diamond material and adding graphite to the resin-based diamond material to form the light-removing layer 431, wherein the particle size range of the abrasive particles is #800. To #4000, and the abrasive grain is diamond grain, carbonized silicon (SiC) or cubic nitrided butterfly (CBN)', and the graphite has a content of 25% to 35% in the polishing layer 431. The addition of graphite to the polishing layer 431 adds lubricity during polishing. 1292731 The material of the buffer layer 432 is foam, elastic rubber or spring. Therefore, since the buffer layer 432 is a soft material which can be slightly deformed, the polishing head 43 can be used with a slight inclination and side shifting degree of freedom. . The polishing layer 431 further includes a flow guiding groove 4311 and a hole 4312, and the flow guiding groove 4311 has a polishing liquid which can flow out from the hole 4312 as a lubricating liquid for polishing the workpiece. The present invention is not only applicable to the polishing of a general spherical lens, but more particularly, the present invention is more applicable to the evacuation of an aspherical lens. Referring to the fourth figure, when polishing a workpiece 42 (for example, an aspherical lens) by using the light-receiving device 4 of the present invention, a flow guiding path (not shown) is designed in the metal shaft 433 of the polishing head 43. A polishing liquid is supplied to the polishing layer 431, and then the polishing liquid flows out from the hole 4312 to the surface of the workpiece 42 through the flow guiding groove 4311. Further, since the buffer layer 432 is a soft material which is slightly deformable, the polishing is performed. The head 43 has a slight degree of inclination and lateral movement, so that the polishing layer 431 and the workpiece 42 can achieve a good degree of adhesion, and then the workpiece 42 is polished by the particle diamond in the polishing layer 431 to remove the puncture of the workpiece surface. In addition to the scratch, the effect of the calendering is achieved; in addition, in the polishing apparatus of the present invention, since the polishing liquid is uniformly filled between the polishing layer 431 and the surface of the workpiece 42, the polishing efficiency is further increased. And stability. Furthermore, after careful examination by the inventor of the present invention, it is known that when the workpiece to be polished is a concave workpiece having a central radius of curvature R, the center curvature radius of the polishing head is adjusted to R±AR, which is the most Good polishing effect, where 0·〇〇1汉^0.1, the value of C depends on the actual size of the workpiece; however, when the workpiece to be polished is a convex workpiece with a central radius of curvature R, The center radius of curvature of the polishing head is adjusted to R±AR, which gives the best polishing effect. In the ARCR, 0.001孓<0.1, the value of C depends on the actual size of the workpiece. 0 The conic coefficient of the polishing head (conic Constant) K can also be adjusted to κ+Ακ, where AK-DK, 0.001SDS0.1, the value of D depends on the actual size of the workpiece and 1292731 can accurately correct the polished shape: set its uniform polishing 'more fine Traces and punctures throwing ,:, and side shifts: mechanism two = = lens (four) Therefore, the present invention specifically treats aspherical optical lenses as ίίίίίϊ, 'in step-measurement surface shape accuracy, to t] π ^ When the system represents 1 = ~ Γ Γ, See FIG sixth sixth FIG ⑻ ⑻, which shown a schematic view of the concave mirror polishing ^ correction sheet. As shown in the sixth figure (8) M, when the shape needs to correct the shape error, the polishing head is controlled to approach the first I = error side shift δ1 and rotate 6 degrees to make the convex domain, and the 4:: domain is batched and the polishing head is shaken left and right. To evenly touch the first zone illusion time to perform the first zone correction polishing work. Among them, ~ and 0 1 are adjusted in the first region of the second region of the lens. When the lens instrument has a positive shape error, please refer to the seventh figure (8) and the seventh frame, and the correction polishing diagram of the face mirror i and the concave lens. As shown in the seventh figure (8), the polishing age is reduced by the county and the contact area between the polishing head and the lens is concentrated in the eleventh region. Since the ancient layer is a soft material that can be slightly deformed, the polishing head is made. With the degree of freedom of the side shift, the polishing head is shaken left and right, so as to achieve the density of the eleventh, and the 11th area correction polishing work is performed. When the 111th area of the lens requires a positive shape, refer to Figure 8 (8) and Figure 8 (8), which respectively represent the modified wire-drawing intention of the convex lens and the concave lens of 11 1292731. As shown in the eighth figure (8), the third area of the concave lens needs to correct the shape error, and the control head is close to the first melon area, and then the polishing head main shaft is gradually moved laterally according to the lens error and rotated by 3 angles, so that the polishing head and the polishing head The contact area of the concave lens is incident on the second region, and the polishing head is gradually deformed by the buffer layer and the polishing head is swayed to the left and right to achieve a close-fitting polishing effect, and the concave lens correction reddening is concentrated in the mth region. As apparent from the above, since the polishing apparatus of the present invention has a micro-deformable polishing head, it is possible to perform tilting and side shifting in response to the surface condition of the workpiece, thereby achieving a good polishing correction effect. According to the invention, the polishing layer is a resin-based diamond material, which can complete a delicate polishing effect, and a buffer layer which can be deformed, so that the polishing head of the invention has a mechanism of micro-displacement and inclination. It is able to achieve a close-fitting polishing effect with the workpiece to be polished. In summary, it is conceivable that the present invention not only has a good polishing effect for a spherical lens, but more particularly, the present invention provides a polishing apparatus and a polishing method suitable for an aspherical lens, for correcting an aspherical lens. Shape accuracy ^ Improves the surface roughness of aspherical surfaces. Accordingly, the present invention is not only novel, progressive, but also industrially applicable. The case may be modified by those who are familiar with the art, but they are all protected by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a schematic view of a first preferred embodiment of the present invention for use in a polishing head. ^^ The second figure is a schematic view of the polishing layer in the first preferred embodiment of the present invention. The third figure is a functional diagram of the buffer layer in the first preferred embodiment of the present invention. Figure 4 is a schematic view of a second preferred embodiment of the present invention for illustrating a negative polishing apparatus. Month Figure 5 (8) is a schematic diagram of the polishing of the convex lens. 12 1292731 Figure 5 (b) is a schematic view of the polishing of a concave lens. Figure 6 (a) is a schematic diagram of the modified polishing of the convex lens. Figure 6 (b) is a schematic diagram of the modified polishing of the concave lens. Figure 7 (8) is a schematic diagram of the modified polishing of the convex lens. Figure 7 (b) is a schematic diagram of the modified polishing of the concave lens. The eighth figure (8) is a schematic diagram of the modified polishing of the convex lens. Figure 8 (b) is a schematic diagram of the modified polishing of the concave lens. [Main component symbol description] 1 polishing head 11 polishing layer 12 buffer layer 13 metal layer 14 metal shaft 111 flow guiding groove 112 hole 4 polishing device 41 pedestal 42 workpiece 43 polishing head 431 polishing layer 432 buffer layer 4311 flow guiding groove 4312 Hole 13

Claims (1)

1292731 十、申請專利範圍: 1·一種負形拋光裝置,其包含·· 一基座,用以承載一工件;以及 一拋光頭,其係位於該基座之上方,且該拋光頭具有: 一拋光層,其係由一樹酯、一磨粒以及一石墨所製成,用 以對該工件進行拋光; 一緩衝層,其係連接於該拋光層,用以使該拋光頭具有傾 斜與側移的自由度;以及 ’、' 一金屬軸,其係連接於該緩衝層。 2·如申請專利範圍第1項之拋光裝置,其中該磨粒係為鑽石粒、 碳化矽(SiC)與立方晶氮化獨(CBN)其中之一。 3·如申請專利範圍第1項之拋光裝置,其中該磨粒的粒度範 係#800 至#4000。 4·如申請專利範圍第1項之拋光裝置,其中該拋光層中該石墨 的含量係為25%至35%。 ^ 5.如申請專利範圍第1項之拋光裝置,其中該拋光層更包含一 導流槽。 6·如申請專利範圍第5項之拋光裝置,其中該導流槽中具有一 抛光液。 7·如申請專利範圍第6項之拋光裝置,其中該導流槽具有至少 一孔洞,以供該拋光液流出。 8·如申請專利範圍第1項之拋光裝置,其中該緩衝層的材質係 選自於泡綿、彈性膠以及彈簧其中之一。 、 9·如申請專利範圍第1項之拋光裝置,其中該工件係一非球面 鏡片。 10·—種拋光頭,用以將一工件拋光,其包含: 一拋光層,其係由一樹酯、一磨粒以及一石墨所製成;以及 一緩衝層,其係連接於該拋光層,用以使該拋光頭具有傾斜 與側移的自由度。 14 1292731 藉由該拋光頭,對該凹面工件進行搬光。 21·—種負形拋光方法,該方法包含下列步驟·· 提供如申請專利範圍第1項之該拋光裝置,其中該工件係一 凸面工件,其具有一第一中心曲率半徑R與一第一圓錐係數 (conic constant) K ;以及 調整該拋光頭,使其具有一第二中心曲率半徑與一第 二圓錐係數(conic constant) Κ±ΔΚ,以對該凸面工件進行拋光’ 其中 0.001R SAR S 0.1R 且 0.001Κ 5ΔΚ S 0.1Κ。 22.—種負形拋光方法,該方法包含下列步驟: 提供一凸面工件,其具有一第一中心曲率半徑R與一第一圓 錐係數(conic constant)K±AK ; 提供一拋光頭,其具有一第二中心曲率半徑R土且0.001R ^△RS0.1R以及具有一弟—圓錐係數(conic constant)K土ΔΚ,且 0.001Κ5ΔΚ5 0.1Κ ;以及 藉由該拋光頭,對該凸面工件進行抛光。 161292731 X. Patent application scope: 1. A negative polishing device comprising: a base for carrying a workpiece; and a polishing head located above the base, and the polishing head has: a polishing layer made of a resin, an abrasive grain and a graphite for polishing the workpiece; a buffer layer connected to the polishing layer for tilting and laterally moving the polishing head Degree of freedom; and ',' a metal shaft that is attached to the buffer layer. 2. The polishing apparatus of claim 1, wherein the abrasive grains are one of diamond particles, cerium carbide (SiC) and cubic nitriding (CBN). 3. The polishing apparatus of claim 1, wherein the abrasive grains have a particle size range of #800 to #4000. 4. The polishing apparatus of claim 1, wherein the content of the graphite in the polishing layer is 25% to 35%. 5. The polishing apparatus of claim 1, wherein the polishing layer further comprises a flow guiding groove. 6. The polishing apparatus of claim 5, wherein the baffle has a polishing liquid therein. 7. The polishing apparatus of claim 6, wherein the flow guiding groove has at least one hole for the polishing liquid to flow out. 8. The polishing apparatus of claim 1, wherein the buffer layer is selected from the group consisting of a foam, an elastic glue, and a spring. 9. The polishing apparatus of claim 1, wherein the workpiece is an aspherical lens. a polishing head for polishing a workpiece, comprising: a polishing layer made of a resin, an abrasive grain, and a graphite; and a buffer layer connected to the polishing layer It is used to make the polishing head have the freedom of inclination and side shift. 14 1292731 The concave workpiece is transferred by the polishing head. A negative-polishing method comprising the following steps: The polishing apparatus according to claim 1, wherein the workpiece is a convex workpiece having a first central radius of curvature R and a first Conic constant K; and adjusting the polishing head to have a second central radius of curvature and a second conic constant Κ±ΔΚ to polish the convex workpiece' wherein 0.001R SAR S 0.1R and 0.001 Κ 5ΔΚ S 0.1Κ. 22. A negative-polishing method comprising the steps of: providing a convex workpiece having a first central radius of curvature R and a first conic constant K±AK; providing a polishing head having a second central radius of curvature R soil and 0.001R ^ ΔRS0.1R and having a conic constant K Δ Κ, and 0.001 Κ 5 Δ Κ 5 0.1 Κ; and polishing the convex workpiece by the polishing head . 16
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US4019289A (en) * 1976-02-23 1977-04-26 Clayton Paul Korver Replaceable lens surfacing pad with integral wear indicating pattern
US5095660A (en) * 1988-10-25 1992-03-17 Dillon Laurence A Polishing means for lens generating apparatus
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US6942554B1 (en) * 2002-07-22 2005-09-13 Optimax Systems, Inc. Apparatus and process for polishing a substrate
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