Ϊ2890i8)2twf.d〇c/e 九、發明說明： 【發明所屬之技術領域】 丰霉是有關於—種魏裝置，且_是有關於-種 +導體設備之排氣裝置。 # 【先前技術】 …導體設備在製程中，常會需要化學原料 中或：二製程的進行，無可避免的在製造過程 5夕s夕15會伴隨著粉塵與廢氣產生。為了維持 製程的良率盥潔、暮，_ 4 # μ -7 J Μ寸 了糸乎廷些粕塵與廢氣會透過排氣管 2排出半導體設備外。圖1是習知之半導體廢 夕主道触广尸名圖。请芩考圖1，習知 之+¥體廢氣處理機台（Scrubber) 100透過一管路 ΙΊί 一排氣管110相通。在整個半導體製程中， =體f氣處理機台1〇〇中的粉塵ρ與廢氣，會透 過排軋管110而排出。 二然而、>’在排氣管110進行抽風時，由於所抽送 ηI $會贡有粉塵Ρ，很容易就附著於排氣管 、、:i上。經年累月下來經常導致排氣管11〇 2通？量變小甚至會有阻塞的情況發生。這除了使 排氣管110無法順利進行抽風之外，管路112之出 = 12a處也容易因粉塵p之阻塞，而造成半導體廢 氣處理機台1 〇 〇當機。 、/ — Y為了、、隹持排氣管11 〇的通暢，操作人員 必須母隔-段時間，例如每隔兩個禮拜，就必須將 5 拆除並進行清洗’但拆除排氣管n〇不 、日守且費力，且半導體廢氣處理機台^ 機，這會對於產能（Th_ghput)直接造成影^ 一般來說，排氣管110所設置的位置都相當曰高， % # Λ ^ ^ # # 4 f , 10 ΒΫ ^ =業的潛在危險。另-方面，附著於管；= =以及排氣管110中的.廢氣也會對操作人員的健 康狀況造成不良的影響。 【發明内容】 有鑑於此，本發明之目的是提供一種排氣 置，^解決習知之排氣管路容易有粉塵堵塞之問題: 穿置是其他目的，本發明提出-種排氣 t 其適於與至少一半導體設備連接，以排除丰 :體二備”程中所產生的粉塵堵塞，排氣裝置包 二:，官與一清洗單元。其中，輸送管連通半導 ^備’“洗單元配置於輸送管内，以清洗 於輸送管内之粉塵。 在本，明之—實施例中，上述之清洗單元可以 ir:t頭與一水管。其中，喷水頭配置於輸送 吕内，而水官連接至喷水頭。 括一=明之一實施例中，上述之排氣裝置更包 括一沈务槽，其配置於輸送管之出口處。 η it發明之—實施例中，上述之輪送管具有一 #口朝上之連接開口’而半導體設備可以透過連接 12890i82twf.d〇b/e 開口而連接至輪送管。 上述之排氣裝置更包 端連通連接開口，而 在本發明之一實施例中， 括一歧管組，其中歧管組之一 另一端連通半導體設備。 在本發明之一實施例 括-第-歧管與一第二歧：歧官組可以包 連接開π與半導體’其中弟—歧管連通於 通至笛吐' 間’而第二歧管之一端連 弟一歧管，而另一端連通至連接開口。 括明之一實施例中，上述之排氣農置更包 / 4态，其配置於第二歧管上。 ，本發明之一實施例中，上述之排氣裝置更包 括一弟一閥門，其配置於第一歧管上。 ^本發明之一實施例中，^^之排氣裝置更包 ΐτ:二閥門’其配置於第二歧管上，且位於洗滌 裔契弟一歧營之間。 +本發明之排氣裝置因設有清洗單元，其可以對 =著於輪送管内之粉塵喷水，以避免粉塵堵塞輸送 :而造成半導體設備當機。由於本發明之排氣 I置能有效避免堵塞，進而可以有效降低清潔保養 的人力成本，並維持半導體設備之產能。 為讓本發明之上述和其他目的、特徵和優點能 更明顯易懂’下文特舉較佳實施例，並配合所附圖 式’作洋細說明如下。 i289083twf.doc/e 【實施方式】Ϊ 2890i8) 2twf.d〇c/e IX. Description of the invention: [Technical field to which the invention pertains] Tobacco is a kind of Wei device, and _ is an exhaust device for a kind of + conductor device. # [Prior Art] ...Conductor equipment in the process, often need chemical raw materials or: two processes, inevitably in the manufacturing process 5 s s eve 15 will be accompanied by dust and exhaust gas. In order to maintain the process's good rate, _ 4 # μ -7 J Μ 糸 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷 廷Figure 1 is a diagram of a conventional semiconductor waste road. Referring to Fig. 1, a conventional scooping machine (Scrubber) 100 communicates through a pipe ΙΊί an exhaust pipe 110. In the entire semiconductor process, the dust ρ and the exhaust gas in the body of the gas processing unit 1 are discharged through the discharge tube 110. Secondly, when the exhaust pipe 110 is ventilating, it is easy to adhere to the exhaust pipe, i: because the pumped ηI$ will be contaminated with dust mites. Over the years, it often leads to the exhaust pipe 11 〇 2 pass? The amount becomes smaller and there is even a blockage. In addition to the fact that the exhaust pipe 110 cannot be smoothly ventilated, the discharge of the pipe 112 = 12a is also liable to be blocked by the dust p, causing the semiconductor waste gas treatment machine 1 to crash. , / — Y, in order to maintain the smoothness of the exhaust pipe 11 ,, the operator must be separated for a period of time, for example, every two weeks, the 5 must be removed and cleaned 'but the exhaust pipe is not removed It is a day-to-day and laborious, and semiconductor exhaust gas treatment machine, which will directly affect the production capacity (Th_ghput). Generally speaking, the position of the exhaust pipe 110 is quite high, % # Λ ^ ^ # # 4 f , 10 ΒΫ ^ = Potential hazards of the industry. On the other hand, adhering to the tube; = = and the exhaust gas in the exhaust pipe 110 may also adversely affect the health of the operator. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide an exhaust gas arrangement, which solves the problem that the conventional exhaust pipe is prone to dust clogging: the piercing is another purpose, and the present invention proposes Connected to at least one semiconductor device to eliminate the dust clogging generated in the process of "Body 2", the exhaust device package 2:, the official and a cleaning unit, wherein the conveying pipe is connected with the semi-conductive device "washing unit" It is disposed in the conveying pipe to clean the dust in the conveying pipe. In the present invention, in the embodiment, the cleaning unit may be ir:t head and a water pipe. Among them, the sprinkler head is disposed in the transport levee, and the water officer is connected to the sprinkler head. In one embodiment, the exhaust device further includes a sinking tank disposed at an outlet of the conveying pipe. In the embodiment, the above-mentioned wheel feed pipe has a #口口-up connection opening' and the semiconductor device can be connected to the wheel feed pipe through the connection 12890i82twf.d〇b/e opening. The venting device described above further communicates with the connection opening, and in one embodiment of the invention, a manifold set is provided, wherein the other end of one of the manifold sets is in communication with the semiconductor device. In one embodiment of the present invention, the -th-manifold and a second-disambiguation group may be connected to open π and the semiconductor 'the sir-manifold is connected to the flute' and the second manifold One end is connected to the other, and the other end is connected to the connection opening. In one embodiment, the exhaust gas set is further in a /4 state, and is disposed on the second manifold. In an embodiment of the invention, the exhaust device further includes a valve and a valve disposed on the first manifold. In one embodiment of the present invention, the exhaust device further includes a ΐτ: two valve' disposed on the second manifold and located between the washing and the squad. + The exhaust device of the present invention is provided with a cleaning unit, which can spray water against the dust in the wheel tube to prevent the dust from being clogged and transported: causing the semiconductor device to crash. Since the exhaust gas I of the present invention can effectively prevent clogging, the labor cost of cleaning and maintenance can be effectively reduced, and the capacity of the semiconductor device can be maintained. The above and other objects, features and advantages of the present invention will become more <RTIgt; I289083twf.doc/e [Embodiment]
圖2是本發明之排氣裝置與半導體設備之示意 圖。請參考圖2，本發明之排氣裝置（Exhaust) 3〇〇 適於與至少一半導體設備200 (圖2中為兩台）連 接，以排出半導體設備200於製程中所產生的粉塵 P，廢氣。在下文中之半導體設備200是以半導體 廢氣處理機台（Scrubber)作為例子以便說明，當 然此半導體設備200也可以是其他需排出粉塵p與 廢氣之半導體設備200。 生、f發明之排氣裝置300包括一輸送管31〇與一 清洗單元320。其中，輸送管310連通半導體設備 „導體廢氣處理機台）’此輸送管310用以輸 Ϊ備2°°於製造過程中所產生的粉塵P與 容般ί5兄，這些粉塵ρ會具有黏性，且相當 3附考=送管31G之内壁上。這裡要特別說明Fig. 2 is a schematic view of an exhaust device and a semiconductor device of the present invention. Referring to FIG. 2, the exhaust device (3) of the present invention is adapted to be connected to at least one semiconductor device 200 (two in FIG. 2) to discharge the dust P generated in the process of the semiconductor device 200, and the exhaust gas. . The semiconductor device 200 hereinafter is exemplified by a semiconductor exhaust gas processor (Scrubber), and of course, the semiconductor device 200 may be another semiconductor device 200 that needs to discharge dust p and exhaust gas. The exhaust device 300 of the invention of the invention includes a delivery tube 31 and a cleaning unit 320. Wherein, the conveying pipe 310 is connected to the semiconductor device „conductor exhaust gas treating machine table ′′. The conveying pipe 310 is used for conveying the dust P generated by the manufacturing process and the dust ρ is viscous. And quite 3 attached test = on the inner wall of the 31G. Here to be specifically stated
t ^明之輸送管310内配置有清洗單元320, 於：可以喷出強勁的水柱，以清洗附著 π釉迗官310内壁上之粉塵ρ。 如此一來，輸送管3〗 塵内壁便不易附著粉 作人昌ί 避免輸送管31G阻塞。此外，操 、也可以大幅縮減清潔盥 間，i隹而、去^ f M f /、保養輸达官310之時 门進而達到節省人力之目的。 才 有效避免操作人員為了拆 面，這也能 作業的危險。 ，、輸k吕31〇而面臨高空 128^ O^^twf.dofc/e 詳細地說，清洗單元320可以包括一噴水頭322 ‘ 與一水管324。其中，噴水頭322配置於輸送管310 =，而水管324之一端與喷水頭322連通，而另一 〜 端連通至—水源（未綠示）。實務上，較常使用的 水源例如是自來水或去離子水（Di-Water)，這端 視粉f P之溶解特性而作選擇，主要之目的是以能 將附著於輸送管3 10内壁之粉塵p溶解即可，在此 並不侷限。為了收集沖刷後的污水（含有粉塵p )， • 排氣裝置300可以更包括一沈澱槽350，此沈澱槽 350可以配置於輸送管31〇之出口處。 為了進一步改善半導體設備2〇〇因管路阻塞而 發生當機的現象，本發明之輸送管31〇可以具有一 開口朝上之連接開口 310a，而半導體設備2〇〇可以 透過連接開口 310a而與輸送管31〇連接。如此一 來，半導體設備200於製程中所產生的粉塵p會由 連接開口 31〇a而直接往下掉落至輸送管31〇内，而 φ 不會阻基住連接開口 310a。相較於習知之管路112 (如圖1所示）容易因粉塵P堆積於出口 112a處而 阻基，本發明之連接開口 31 〇a所設置的位置可以有 效避免此阻塞之現象，進而使半導體設備2〇〇能正 常運作以維持產能（Throughput)。 另一方面’為了有效避免半導體設備2〇〇與輸 送管310之間發生阻塞的現象，本發明之排氣裝置 300可以包括一歧管組330,此歧管組33〇連通於輸 '^^twf.ddc/e 送管310與半導體設備200之間。詳細地說，歧管 組330可以包括一第一歧管332與一第二歧管％4。 上述之第一歧管332連通於連接開口 M〇a與半導體 没備200之間，第二歧管334之一端連通第一歧管 332，而另一端連通至連接開口 31〇a。這樣一來， 由半導體設備200所產生的粉塵p與廢氣可以透過 第一歧管332與第二歧管334,而輸送至輸送管31〇。 值得留意的是，習知之排氣管11〇(如圖丨所示） • 僅靠單一管路112而與半導體廢氣處理機台 (Scmbber) 100相通，一但管路112發生阻塞，便 很可能導致半導體廢氣處理機台1〇〇當機。相 習知管路U2,本發明之歧管組33。；：有= 被粉塵P阻基之機率。實務上，本發明之排氣裝置 300更包括一洗務态340，其配置於第二歧管334 上。此洗滌340可以對位於歧管組33〇内的粉塵 P灑水，而使得粉塵P能順利流入輸送管31〇内。 • 此外，為了方便控制第一歧管332與第二歧管 334之使用，本發明之排氣裝置3〇〇可以更包括一 第一閥門A與一苐二閥門b。由圖2可以清楚得知， 第一閥門A可以配置於第一歧管332上，而第二閥 門B可以配置於第二歧管334上，且此第二閥門b 可以位於洗滌器340與第一歧管332之間。 綜上所述’本發明之排氣裝置因設有清洗單 π，其可以對附著於輸送管内之粉塵喷水，以避免 10A cleaning unit 320 is disposed in the delivery tube 310, and a strong water column can be sprayed to clean the dust ρ adhering to the inner wall of the π glaze. In this way, the inner wall of the dust pipe 3 is not easy to adhere to the powder, and the pipe 3G is prevented from being blocked. In addition, the operation can also greatly reduce the cleaning time, and then go to ^ f M f /, and maintain the door of the operator 310 to save manpower. It is effective to avoid the danger of the operator working in order to dismantle the face. In detail, the cleaning unit 320 may include a water jet head 322 ‘and a water pipe 324. Wherein, the water jet head 322 is disposed on the conveying pipe 310 =, and one end of the water pipe 324 is in communication with the water jet head 322, and the other end is connected to the water source (not shown in green). In practice, the more commonly used water source is, for example, tap water or deionized water (Di-Water), which is selected depending on the dissolution characteristics of the powder f P , and the main purpose is to be able to adhere to the inner wall of the conveying pipe 3 10 . p dissolves, and is not limited here. In order to collect the flushed sewage (containing dust p), the exhaust unit 300 may further include a sedimentation tank 350 which may be disposed at the outlet of the delivery tube 31. In order to further improve the phenomenon that the semiconductor device 2 is crashed due to blockage of the pipeline, the transport tube 31 of the present invention may have an opening-up opening 310a with the opening facing upward, and the semiconductor device 2〇〇 may pass through the connection opening 310a. The delivery tube 31 is connected. As a result, the dust p generated by the semiconductor device 200 during the process is directly dropped downward into the transfer tube 31 by the connection opening 31〇a, and φ does not block the connection opening 310a. Compared with the conventional pipe 112 (shown in FIG. 1), it is easy to block the base due to the accumulation of dust P at the outlet 112a. The position of the connection opening 31 〇a of the present invention can effectively avoid the phenomenon of blocking, thereby enabling The semiconductor device 2 can operate normally to maintain throughput (Throughput). On the other hand, in order to effectively avoid the occurrence of clogging between the semiconductor device 2 and the delivery tube 310, the venting apparatus 300 of the present invention may include a manifold set 330, which is connected to the transmission '^^ The twf.ddc/e is placed between the tube 310 and the semiconductor device 200. In detail, the manifold set 330 can include a first manifold 332 and a second manifold %4. The first manifold 332 is connected between the connection opening M〇a and the semiconductor device 200. One end of the second manifold 334 communicates with the first manifold 332, and the other end communicates with the connection opening 31〇a. Thus, the dust p and the exhaust gas generated by the semiconductor device 200 can be transmitted to the transfer pipe 31A through the first manifold 332 and the second manifold 334. It is worth noting that the conventional exhaust pipe 11〇 (shown in Figure )) • communicates with the semiconductor waste gas treatment machine (Scmbber) 100 by a single line 112, but once the line 112 is blocked, it is likely This led to the semiconductor exhaust gas treatment machine 1 crashing. The manifold U2, the manifold set 33 of the present invention, is known. ;: There is a probability of being blocked by dust P. In practice, the venting apparatus 300 of the present invention further includes a wash condition 340 disposed on the second manifold 334. This washing 340 can sprinkle the dust P located in the manifold group 33, so that the dust P can smoothly flow into the conveying pipe 31. In addition, in order to facilitate control of the use of the first manifold 332 and the second manifold 334, the exhaust device 3 of the present invention may further include a first valve A and a second valve b. As can be clearly seen from FIG. 2, the first valve A can be disposed on the first manifold 332, and the second valve B can be disposed on the second manifold 334, and the second valve b can be located in the scrubber 340 and Between a manifold 332. In summary, the exhaust device of the present invention is provided with a cleaning single π, which can spray water against the dust attached to the conveying pipe to avoid 10
12890®2twf.d〇c/e =附；=輸Γ，進而有效避免半導體設備 ⑼備Λ ::t排乳裝置有助於維持半導體 -備之產咸，幻青潔與保養輪$管的人力成本也可 降Γ操作人員也不需因為保養與清潔的需 要而拆卸輸达官，這樣不但可以避免操作人員直接 面對可能具有毒性之粉塵與廢氣，也不需承擔高空 作業的風險。 。工 雖然本發明已以較佳實施例揭露如上，然其並 非用以限定本發明，任何熟習此技藝者，在不脫離 本發明之精神和範圍内，當可作些許之更動與潤 飾，因此本發明之保護範圍當視後附之申請專利 圍所界定者為準。 【圖式簡單說明】 一 圖1是習知之半導體廢氣處理機台與排氣管 示意圖。 V圖2是本發明之排氣裝置與半導體設備之示意圖。 【主要元件符號說明】 100:半導體廢氣處理機台 11 〇:排氣管 112 :管路 112a :出口 2QQ :半導體設備 3QQ :排氣裝置 :輸送管 11 128901^¾^ dob/e 310a :連接開口 320 清洗單元 322 噴水頭 324 水管 330 歧管組 332 第一歧管 334 第二歧管 340 洗滌器 350 沈澱槽 A :第一閥門 B :第二閥門 P :粉塵 1212890®2twf.d〇c/e=attachment;=transmission, which effectively prevents semiconductor equipment (9) preparation ::t milking device helps to maintain the semiconductor-prepared salty, magical blue and maintenance wheel $tube The labor cost can also reduce the operator's need to dismantle the delivery officer for maintenance and cleaning needs, which not only prevents the operator from directly facing the dust and exhaust gas which may be toxic, nor the risk of working at height. . Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. The scope of protection of the invention is subject to the definition of the patent application enclosure attached. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a conventional semiconductor exhaust gas treatment machine and exhaust pipe. V is a schematic view of an exhaust device and a semiconductor device of the present invention. [Description of main component symbols] 100: Semiconductor exhaust gas treatment machine 11 〇: Exhaust pipe 112: Pipe 112a: Outlet 2QQ: Semiconductor device 3QQ: Exhaust device: Duct 11128901^3⁄4^ dob/e 310a: Connection opening 320 cleaning unit 322 water jet head 324 water pipe 330 manifold group 332 first manifold 334 second manifold 340 scrubber 350 sedimentation tank A: first valve B: second valve P: dust 12