TWI286220B - Device for wafer map indication when inspecting electronic components by microscope - Google Patents

Device for wafer map indication when inspecting electronic components by microscope Download PDF

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Publication number
TWI286220B
TWI286220B TW95118740A TW95118740A TWI286220B TW I286220 B TWI286220 B TW I286220B TW 95118740 A TW95118740 A TW 95118740A TW 95118740 A TW95118740 A TW 95118740A TW I286220 B TWI286220 B TW I286220B
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Taiwan
Prior art keywords
position map
indicating device
suction cup
die
die position
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TW95118740A
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Chinese (zh)
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TW200743817A (en
Inventor
Jeng-Kong Hwang
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Powertech Technology Inc
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Publication of TW200743817A publication Critical patent/TW200743817A/en

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

Disclosed is a device for wafer map indication when inspecting electronic components by microscope. The device includes a base, an adjustable vacuum stage and a light indicator. The base is configured for fixing to a linkage carrier in a microscope. The adjustable vacuum stage is pivotally connected to the base and can spin with respect to the base. The adjustable vacuum stage has a lower sucking mechanism for be fixed to the base by sucking and an upper sucking mechanism for fixing a map record locations of electronic components by sucking. Light source of the light indicator is disposed at one end of a bendable duct.

Description

•1286220 九、發明說明: 【發明所屬之技術領域】 本發明係有關於顯微觀測之同步標示技術,特別係、 有關於一種應用於檢測元件顯微鏡之晶粒位置圖门I 指示裝置。 【先前技術】 當電子元件於製程中部分會產生缺陷或沾附微 塵,需要用顯微觀(microscope)觀測其表面是否良好。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a synchronous marking technique for microscopic observation, and more particularly to a gate position indicating device for a crystal grain position applied to a microscope of a detecting element. [Prior Art] When electronic components are partially defective or contaminated with dust during the process, it is necessary to observe the surface with a microscope.

再將發現到不良或是需作附記的電子元件,同時標言己 在一晶粒位置圖(wafer map)的對應位置。以一晶圓檢 測為例’隨著1C製程精進與晶圓尺寸的放大,晶圓内 的晶粒數量疋愈來愈多’每一晶粒皆為一顆半導體類 電子元件。由於數量太多,已無法用傳統的人工計數An electronic component that is defective or needs to be attached will be found, and the corresponding position of the wafer map is already indicated. Take a wafer inspection as an example. As the 1C process is refined and the wafer size is enlarged, the number of crystal grains in the wafer is more and more. Each die is a semiconductor electronic component. Due to the large number, it is no longer possible to use traditional manual counting

的方式找到正確找到晶粒 位置,不但耗時且容易出 具有光學尺之顯微鏡解決 高且僅適用在同一種尺寸 【發明内容】 為了解決上述之問題, 供一種晶粒位置圖同步指 微鏡時,可以在顯微檢測 步地以光點標指出該電子 位置,以解決以往人工計 且具有容易安裝架設與不 位置圖上相對應之XY座標 錯。雖然可以採用全新設計 上述問題,但其造價成本過 的晶圓或基板,不符成本。 t發明之主要目的係在於提 不農置’應用於檢測元件顯 一電子元件時,能正確且同 元件相對在晶粒位置圖中之 數之錯誤發生與耗時問題, 需另購具光學尺之顯微鏡之The way to find the correct position of the grain is not only time-consuming but also easy to produce a microscope with an optical scale. It is only suitable for the same size. [Inventive content] In order to solve the above problem, a grain position map is synchronously referred to as a micromirror. The electronic position can be indicated by a spot mark in the microscopic detection step to solve the conventional manual meter and has an XY coordinate error corresponding to the easy installation and non-positional map. Although it is possible to adopt the new design of the above problems, the cost of the wafer or substrate is not cost. The main purpose of the invention is to raise the error and time-consuming problem of the number of correct and identical components in the die position map when applied to the detection component to display an electronic component. Microscope

5 1286220 功效。 _人一目的係在於提供一種晶粒位置圖同 步和示裂置’能辅助對正在一可調式真空平台上之晶粒 位置圖。5 1286220 Efficacy. The purpose of the invention is to provide a grain position map synchronization and display cleavage' to assist in the position of the die on an adjustable vacuum platform.

步指示裝置, 固定。 &一目的係在於提供一種晶粒位置圖同 能使該可調式真空平台可作快速旋轉調整與 t發明的目的及解決其技術問題是採用以下技術 方案來實規的。& Μ 1 依據本發明,一種應用於檢測元件顯 微鏡之晶粒位晉® ^ 置圖冋步指示裝置包含一底座、一可調式 真空平台、以及一 一 九才曰不器。該底座係用以結合至一顯微鏡 ㈣台α ^可調式真空平台係樞設於該底座上,可相對 作旋:動作’該可調式真空平台係具有一下吸盤結構與一上 吸盤、。構’該下吸盤結構係用以吸附固定至該底座I該上吸 瓜、、’ 口構係用以吸附固定一晶粒位置圖,該晶粒位置圖係標示 有至少一電子元件之位置。該光指示器之光源係設於一可彎 曲調整之導管末端。 本發明的目的及解決其技術問題還可採用以下技 術措施進一步實現。 前述的晶粒位置圖同步指示裝置,其中該可調式真 空平台之承栽面係設有複數個指示燈,用以辅助對正該晶粒 位置圖。 日日" 刖述的晶粒位置圖同步指示裝置,其中該些指示燈係 為藍光LED,而該光源係可發射一紅光點。 6 .1286220 ♦ 1 . 前述的晶粒位置圖同步指示裝置,其中該光指示器係 為一雷射光發射模組。 前述的晶粒位置圖同步指示裝置,另包含有一控制 器,用以控制真空吸附與電源之供應。 前述的晶粒位置圖同步指示裝置,其中該電子元件係 為晶粒並形成於一晶圓,而該晶粒位置圖係為一等比晶粒位 置圖。 前述的晶粒位置圖同步指示裝置,其中該上吸盤結構 係具有複數個不相連之溝槽,每一溝槽内設有一吸孔。 刖述的晶粒位置圖同步指示裝置,其中該些溝槽係為 同心圓。 前述的晶粒位置圖同步指示裝置,其中該下吸盤結構 係為板狀並具有一第一軸孔,該上吸盤結構係為板狀並具有 一軸桿,而該底座係具有一凸軸,用以柩接該第一轴孔,該 凸轴内設有一第二轴孔,以供該轴桿之柩接。 φ 【實施方式】 在本發明之一具體實施例中,揭示一種晶粒位置圖 同步指示裝置。該晶粒位置圖同步指示裝置係可應用 於檢測元件顯微鏡。如第1與6圖所示,一顯微鏡1〇 係能高倍率放大在一連動載台20上之待測基板3 〇,以 觀測該待測基板3 0内之電子元件。當檢測到不良品或 應標記點時,利用該晶粒位置圖同步指示裝置丨00能 在其固定之一晶粒位置圖40上作正確與快速的標 示。在本實施例中,該待測基板3 0係為一晶圓,該電 7 .I286220 子元件係為形成於該晶圓内晶粒,而該晶粒位置圖4〇係可 為一等比晶粒位置圖(如第5圖所示),該晶粒位置圖40繪 製有方格狀,每一方格尺寸大小如同待測晶粒之電子元件, 比一等尺」t,便可將電子元件之位置標示至該晶粒位置 圖40。該晶粒位置圖同步指示裝置丨〇〇之具體結構說 明如後。 如第1圖所示,該晶粒位置圖同步指示裝置1 〇 〇係 鲁 主要包含一底座110、一可調式真空平台120、以及一光指 示器130。該底座11〇係用以結合至該顯微鏡1〇之連動載台 2〇。如第2與3圖所示,該可調式真空平台120係具有一 下吸盤結構121與一上吸盤結構122,該下吸盤結構121係 用以吸附固定至該底座11〇,該上吸盤結構122係用以吸附 固定該晶粒位置圖40。該下吸盤結構121與該上吸盤結構 122可相互螺接固定。該可調式真空平台12〇係樞設於該底 座110上,可在該下吸盤結構121吸附固定之前相對作旋轉 % 動作。一種具體較佳的樞設方式可參見第3圖,該下吸盤結 構121係為板狀並具有一第一軸孔126,該上吸盤結構122 係為板狀並具有一軸桿127,而該底座11〇係具有一凸轴 111’用以樞接該第一轴孔126,該凸轴111内設有一第二轴 孔112,以供該軸桿127之樞接。藉由此一雙樞接方式,可 使該可調式真空平台120在該底座110上作無偏斜的水平旋 轉的調整。當調整完成,可以開啟該下吸盤結構121之吸附, 以使該可調式真空平台120快速固定至該底座11〇。較佳 地’該晶粒位置圖同步指示裝置丨〇〇另包含有_控制器 8 1286220 用以刀別控制該下吸盤結構121與該下吸盤結構l2i 之真空吸附與提供電源之供應。 如第4圖所示,該上吸盤結構122係具有複數個不相 冓槽124 ’每一溝槽124内設有一吸孔125。當該晶粒 :置圖40放置於該上吸盤結構122之承載面,啟動真空抽 孔乳閥,該些不相連的溝槽124可使各種不同材質之晶粒位 置圖40皆可平貼在該上吸盤結構122,該晶粒位置圖4〇之 • 材質可為紙張、壓克力、晶圓等平滑薄片。較佳地’該些溝 :24係為同心圓。另,在本實施例中該上吸盤結構1 Μ 可為鋁合金材質,其承載面施以陽極硬化處理。再如第4 圖所示,較佳地,該可調式真空平台12〇之承載面係設有 複數個指示燈123,用以輔助對正該晶粒位置圖40。例如, 該些指示燈123可為藍光LED。 如第1與2圖所示,該光指示器13〇之光源131係設於 一可彎曲調整之導管132末端。該導管132係可任意調整, • 在無外加調整力量時該導管132會定形不晃動。該導管132 之底端係連接至一配重底座,該導管132之木端則為該光源 在本實施例中,該光指示器13 〇係為一雷射光發射模 組,使該光源13 1係可發射一紅光點或其它光點,可打向該 可調式真空平台120之承載面,其中以紅光點為較佳,能與 X二扣示燈123之藍光作顏色區隔。此外,該光指示器 係為獨立設置,不與該可調式真空平台12〇有任何連動關係。 如第ό圖所示,該晶粒位置圖4〇可放置於該可調式真空 平台120上,調整其晶粒位置圖4〇内標畫的基板邊緣與該 9 .1286220 . · * 些才曰不燈123為對齊之後,利用該控制器14G之驅動令該晶 粒位置圖40被該上吸盤結構122所吸附固定。旋轉調整該 可調式真工平台12〇,使該晶粒位置圖4〇之χγ向座標與待 測基板30之χγ向座標為相同。由該顯微鏡觀測該待測 基板30内一個易於辨認位置之電子元件或一基準點,之後 對照該晶粒位置圖4〇找到相對應的位置,調整該導管m 使該光源131照射至上述相對應的位置。因此,在進行顯微 目測時,在同—連動載台2G上該待測基板3G與該晶粒位置 圖40為同步移動,該待測基板3〇内被顯微觀測的電子元件 可由該晶粒位置圖40上被該光源131照射之照射點,快速 且正確的找到該晶粒位置圖4〇之相對應位置,不需要^工 計數。因此,可以沿用原有的顯微鏡1〇,依其原有的預備孔, 可供結合該底座110,無須有任何修改與加工即可完成該晶 粒位置圖同步指示裝置1〇〇之架設組裝與固定。此外,解除 下吸盤結構121之吸附,便能更換上不同尺寸的可調式真空 • 平台I20於同一底座110上即可應用於不同尺寸待測基板30 之顯微觀測。 以上所述,僅是本發明的較佳實施例而已,並非對 本發明作任何形式上的限制,雖然本發明已以較佳實 施例揭露如上,然而並非用以限定本發明,任何熟来 本項技術者,在不脫離本發明之技術範圍内,所作的 任何簡單修改、等效性變化與修飾,均仍屬於本發明 的技術範圍内。 【圖式簡單說明】 .1286220 第1圖:本發明之一種晶粒位置圖同步指示裝 之檢測元件顯微鏡之立體示意圖。 置與其應 第2 圖:本發明 圖0 之晶粒位置圖同步指示裝置之侧向八Step indicator device, fixed. The purpose of the present invention is to provide a grain position map which enables the adjustable vacuum platform to be used for rapid rotation adjustment and t-invention and to solve the technical problems thereof. & Μ 1 According to the present invention, a die position indicator applied to a detecting element microscope includes a base, an adjustable vacuum platform, and a nine-in-one device. The base is used to be coupled to a microscope (4). The α^adjustable vacuum platform is pivotally mounted on the base, and can be rotated relative to each other. The adjustable vacuum platform has a lower suction cup structure and an upper suction cup. The lower suction cup structure is configured to be adsorbed and fixed to the base I, and the mouth structure is used for adsorbing and fixing a grain position map indicating the position of at least one electronic component. The light source of the light indicator is disposed at the end of a bendable catheter. The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. The foregoing grain position map synchronization indicating device, wherein the adjustable surface of the vacuum platform is provided with a plurality of indicator lights for assisting in aligning the grain position map. The grazing position map synchronization indicating device of the day &day; wherein the indicator lights are blue LEDs, and the light source emits a red light spot. 6.1286220 ♦ 1. The foregoing die position map synchronization indicating device, wherein the light indicator is a laser light emitting module. The foregoing die position map synchronization indicating device further includes a controller for controlling the vacuum suction and the supply of the power source. The above-described die position map synchronization indicating device, wherein the electronic component is a die and formed on a wafer, and the die position map is an equal grain position map. The foregoing grain position map synchronization indicating device, wherein the upper chuck structure has a plurality of unconnected grooves, and each of the grooves is provided with a suction hole. The die position map synchronization indicating device is described, wherein the grooves are concentric circles. The above-mentioned die position map synchronization indicating device, wherein the lower suction cup structure is plate-shaped and has a first shaft hole, the upper suction cup structure is plate-shaped and has a shaft, and the base has a convex shaft, The first shaft hole is connected to the first shaft hole, and a second shaft hole is disposed in the protruding shaft for the shaft to be connected. φ [Embodiment] In a specific embodiment of the present invention, a die position map synchronization indicating device is disclosed. The die position map synchronization indicating device is applicable to a detecting element microscope. As shown in Figs. 1 and 6, a microscope 1 can amplify the substrate 3 to be tested on a linked stage 20 at a high magnification to observe the electronic components in the substrate 30 to be tested. When the defective product or the marked point is detected, the grain position map synchronization indicating device 丨00 can be used to correctly and quickly indicate on one of the fixed grain position maps 40. In this embodiment, the substrate to be tested 30 is a wafer, and the sub-element of the I. I286220 is formed in the wafer, and the die position can be a ratio. The grain position map (as shown in Fig. 5), the grain position map 40 is drawn in a square shape, and each square size is like the electronic component of the die to be tested, and the electron can be compared with the first-order ruler t The position of the component is indicated to the die position map 40. The specific structure of the die position map synchronization indicating device is as follows. As shown in Fig. 1, the die position map synchronization indicating device 1 mainly includes a base 110, an adjustable vacuum platform 120, and an optical indicator 130. The base 11 is for coupling to the linkage stage 2 of the microscope. As shown in FIGS. 2 and 3, the adjustable vacuum platform 120 has a lower suction cup structure 121 and an upper suction cup structure 122 for suction-adhering to the base 11 〇. The upper suction cup structure 122 is Used to adsorb and fix the grain position map 40. The lower suction cup structure 121 and the upper suction cup structure 122 can be screwed to each other. The adjustable vacuum platform 12 is pivotally disposed on the base 110, and is relatively rotatable relative to the lower suction cup structure 121 before being fixed. A specific preferred pivoting manner can be seen in FIG. 3. The lower suction cup structure 121 is plate-shaped and has a first shaft hole 126. The upper suction cup structure 122 is plate-shaped and has a shaft 127, and the base is The elbow has a convex shaft 111' for pivotally connecting the first shaft hole 126. The second shaft hole 112 is disposed in the protruding shaft 111 for pivoting the shaft 127. By means of this double pivoting manner, the adjustable vacuum platform 120 can be adjusted on the base 110 without deflection. When the adjustment is completed, the adsorption of the lower suction cup structure 121 can be turned on to quickly fix the adjustable vacuum platform 120 to the base 11A. Preferably, the die position map synchronization indicating device further includes a controller 8 1286220 for controlling the supply of the vacuum suction and power supply of the lower chuck structure 121 and the lower chuck structure 12i. As shown in Fig. 4, the upper suction cup structure 122 has a plurality of non-phase grooves 124'. Each of the grooves 124 is provided with a suction hole 125. When the die 40 is placed on the bearing surface of the upper chuck structure 122, the vacuum pumping valve is activated, and the unconnected grooves 124 can be used to flatten the die position maps of various materials. The upper suction cup structure 122, the grain position of the material, can be a smooth sheet of paper, acrylic, wafer, or the like. Preferably, the grooves: 24 are concentric circles. In addition, in the embodiment, the upper suction cup structure 1 Μ may be made of an aluminum alloy, and the bearing surface is subjected to an anodic hardening treatment. As shown in FIG. 4, preferably, the adjustable vacuum platform 12's bearing surface is provided with a plurality of indicator lights 123 for assisting in aligning the die position map 40. For example, the indicator lights 123 can be blue LEDs. As shown in Figures 1 and 2, the light source 131 of the light indicator 13 is disposed at the end of a bendable catheter 132. The catheter 132 is arbitrarily adjustable, and the catheter 132 will be shaped without shaking when no additional force is applied. The bottom end of the duct 132 is connected to a counterweight base, and the wooden end of the duct 132 is the light source. In the embodiment, the light indicator 13 is a laser light emitting module, so that the light source 13 1 The red light spot or other light spot can be emitted, and the bearing surface of the adjustable vacuum platform 120 can be driven. The red light spot is preferably used, and can be separated from the blue light of the X two-button light 123. In addition, the light indicator is independently set and does not have any interlocking relationship with the adjustable vacuum platform 12A. As shown in the figure, the die position map 4 can be placed on the adjustable vacuum platform 120, and the grain position thereof is adjusted. The edge of the substrate marked in FIG. 4 is the same as the 9.1286220. After the lamp 123 is not aligned, the die position map 40 is adsorbed and fixed by the upper chuck structure 122 by the driving of the controller 14G. Rotate and adjust the adjustable platform 12〇 so that the γ of the die position map is the same as the χ γ of the coordinate to the substrate 30 to be tested. An electronic component or a reference point of the easily identifiable position in the substrate 30 to be tested is observed by the microscope, and then the corresponding position is found according to the die position map. The guide m is adjusted to illuminate the light source 131 to the corresponding position. s position. Therefore, in the microscopic visual inspection, the substrate to be tested 3G and the die position map 40 are synchronously moved on the same-linking stage 2G, and the electronic components which are microscopically observed in the substrate 3 to be tested can be crystallized by the crystal. The illumination point illuminated by the light source 131 on the particle position map 40 quickly and correctly finds the corresponding position of the die position map, and does not require a count. Therefore, the original microscope can be used, and the original preparation hole can be combined with the base 110, and the arranging assembly of the die position map synchronization indicating device can be completed without any modification and processing. fixed. In addition, the adsorption of the lower suction cup structure 121 is released, and the adjustable vacuum of different sizes can be replaced. The platform I20 can be applied to the microscopic observation of the substrate 30 to be tested of different sizes on the same base 110. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. It is still within the technical scope of the present invention to make any simple modifications, equivalent changes and modifications made by the skilled artisan without departing from the technical scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 186220 Fig. 1 is a perspective view showing a microscope for detecting a component of a crystal grain position map of the present invention. Figure 2 is a side view of the present invention.

第3圖:本發明之晶粒位置圖同步指示裝置之可調式真 平台與底座之截面分解圖。 第4圖:本發明之晶粒位置圖同步指示裝置之可調式真 平台之承載面示意圖。 第5圖:一種等比晶粒位置圖之示意圖。 第6圖:本發明之晶粒位置圖同步指示裝置於使用狀態 側向示意圖。 【主要元件符號說明】 用 意 空 空 之Fig. 3 is a cross-sectional exploded view of the adjustable true platform and the base of the crystal position map synchronization indicating device of the present invention. Fig. 4 is a view showing the bearing surface of the adjustable true platform of the grain position map synchronization indicating device of the present invention. Figure 5: Schematic diagram of a similar grain position map. Figure 6 is a side elevational view of the grain position map synchronization indicating device of the present invention in use. [Main component symbol description]

10 顯微鏡 20 連動載台 30 待測基板 40 晶粒位置圖 100 晶粒位置圖同步指示裝置 110 底座 111 凸軸 112 第二轴孔 120 可調式真空平台 121 下吸盤結構 122 上吸盤結構 123 指示燈 124 溝槽 125 吸孔 126 第一轴孔 127 軸桿 130 光指示器 131 光源 132 導管 140 控制器 1110 Microscope 20 Linkage stage 30 Substrate to be tested 40 Grain position diagram 100 Grain position map Synchronous indication device 110 Base 111 Convex shaft 112 Second shaft hole 120 Adjustable vacuum platform 121 Lower suction cup structure 122 Upper suction cup structure 123 Indicator light 124 Groove 125 Suction hole 126 First shaft hole 127 Shaft 130 Light indicator 131 Light source 132 Catheter 140 Controller 11

Claims (1)

.1286220 十、申請專利範固: 一種晶粒位置圖同步指示裴置,包含: 底座,用以結合至一顯微鏡之連動載台; 可調式真空平台,其係樞設於該底座上,可相對作旋 轉動作,4可調式真空平台係具有一下吸盤結構與一上 吸盤、%構,该下吸盤結構係用以吸附固定至該底座,該 上吸盤結構係用以吸附固定一晶粒位置圖,該晶粒位置 圖係標示有至少一電子元件之位置;以及.1286220 X. Patent application: A grain position map synchronization indication device, comprising: a base for coupling to a microscope linkage stage; an adjustable vacuum platform, the system is pivotally disposed on the base, and is relatively For the rotating action, the 4 adjustable vacuum platform has a lower suction cup structure and an upper suction cup and a % structure. The lower suction cup structure is used for adsorption fixing to the base, and the upper suction cup structure is used for adsorbing and fixing a grain position map. The die position map is indicative of the location of at least one electronic component; 一光扎示器,其光源係設於一可彎曲調整之導管末端。 2、如申吻專利範圍第1項所述之晶粒位置圖同步指示裝 置,其中該可調式真空平台之承載面係設有複數個指示 燈,用以輔助對正該晶粒位置圖。 3、如申凊專利範圍第2項所述之晶粒位置圖同步指示裝 置其中該些扣示燈係為藍光LED,而該光源係可發射 一紅光點。 4、 如申請專利範圍第1項所述之晶粒位置圖同步指示裝 置,其t該光指示器係為一雷射光發射模組。 5、 如申叫專利範圍第i項所述之晶粒位置圖同步指示裝 置,另包含有一控制器,用以控制真空吸附與電源之供 應。 6、 如申請專利範圍第1項所述之晶粒位置圖同步指示裝 置,其中該電子元件係為晶粒並形成於一晶圓,而該晶 粒位置圖係為一等比晶粒位置圖。 7、 如申請專利範圍第1項所述之晶粒位置圖同步指示裝 12 1286220 置’其中該上吸盤結構係具有複數個不相連之溝槽 > 一溝槽内設有一吸孔。 8、 如申請專利範圍第7項所述之晶粒位置圖同步指示裝 置’其中該些溝槽係為同心圓。 9、 如申請專利範圍第1項所述之晶粒位置圖同步指示裝 置’其中該下吸盤結構係為板狀並具有一第一軸孔,該 上及盤結構係為板狀並具有一轴桿,而該底座係具有一 凸轴,用以枢接該第一軸孔,該凸軸内設有一第二軸孔, 以供該轴桿之柩接。A light-drawing device has a light source disposed at the end of a bendable catheter. 2. The die position map synchronization indicating device according to claim 1, wherein the adjustable vacuum platform has a plurality of indicator lights for assisting alignment of the die position map. 3. The die position map synchronization indicating device according to claim 2, wherein the indicator lamps are blue LEDs, and the light source emits a red spot. 4. The die position map synchronization indicating device according to claim 1, wherein the light indicator is a laser light emitting module. 5. A die position map synchronization indicating device as described in claim i of the patent scope, further comprising a controller for controlling the supply of vacuum adsorption and power. 6. The die position map synchronization indicating device according to claim 1, wherein the electronic component is a die and is formed on a wafer, and the die position map is a parity grain position map. . 7. The grain position map synchronization indicating device described in claim 1 is 12 1286220, wherein the upper suction cup structure has a plurality of unconnected grooves > a groove is provided in a groove. 8. The grain position map synchronization indicating device as described in claim 7 wherein the grooves are concentric circles. 9. The die position map synchronization indicating device of claim 1, wherein the lower suction cup structure is plate-shaped and has a first shaft hole, the upper plate structure being plate-shaped and having an axis The rod has a protruding shaft for pivoting the first shaft hole, and a second shaft hole is disposed in the protruding shaft for the shaft to be connected. 1313
TW95118740A 2006-05-26 2006-05-26 Device for wafer map indication when inspecting electronic components by microscope TWI286220B (en)

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Publication number Priority date Publication date Assignee Title
CN111505018A (en) * 2020-04-22 2020-08-07 全球能源互联网研究院有限公司 Detection equipment for semiconductor wafer

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US11265449B2 (en) * 2017-06-20 2022-03-01 Academia Sinica Microscope-based system and method for image-guided microscopic illumination

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111505018A (en) * 2020-04-22 2020-08-07 全球能源互联网研究院有限公司 Detection equipment for semiconductor wafer

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