1284358 16044twf.doc/006 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種管線系統架構，且特別是有關於 一種半導體設備的管線系統架構。 【先前技術】1284358 16044twf.doc/006 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a pipeline system architecture, and more particularly to a pipeline system architecture for a semiconductor device. [Prior Art]
在半導體製程中，經常使用各種液體進行不同的製 程’例如光阻(photoresist，簡稱PR)塗佈製程（coating process)中，就使用光阻噴塗於半導體基底(Substrate)上， 以進行微影製程。 圖1繪示了習知的一種光阻塗佈機台之管線系統架構 的示意圖。光阻塗佈機台適用於光阻塗佈製程，其用來將 光阻均勻的喷塗於半導體基底上。而習知之光阻塗佈機台 的官線系統架構，請參照圖丨，配置有光阻瓶1〇1、缓衝瓶 1〇3、噴頭1〇5以及電動式幫浦11〇。其中，例如cYB〇R 幫浦的電動式幫浦11〇，會透過緩衝瓶1〇3，而從光阻瓶 ιοί中汲取光阻劑，然後將其抽送到喷頭。而喷頭 則會將光阻噴灑在半導體基底上以進行光阻塗佈製程。 =來說，在CYB〇R幫浦等的電動式幫浦中，會如 ^式幫浦11G —般，具有步進馬達112以及電磁閥114。 二而止乂進馬達112會透過緩衝瓶1〇3而從光阻瓶101内 ^用並且將其送至電磁μ 114。而電磁闕114則 劑的流量，並且將其抽送至喷頭1〇5，以 便進订光阻塗佈製程。 綜上述，f知之絲塗佈機的管路系統架構有以下的 1284358 16044twf.doc/006 缺點： 而马動式幫浦内之步進馬達的動作太過缓慢’進 台太佔電動式幫浦的體積太大，也導致了光阻塗佈機 【發明内容】 M H拔本發_目的妓在提供一種半導體設備之管 線糸齡構，可叫加半導難簡速度。 本^的再—目的是提供—種半導體設備之管線系統 木構’可崎低半導體設備的體積。 架槿本目的是提供—種半導體設備之管線系統 、β1现時監控半導體設備是否正常運作。 ^發明提供了—種半導體設紅管線 ίί，設備胁將:可軸材質分布於-半導縣底上。 氣動提供之m触構包括了盛裝容11、喷頭和 二。其中氣動式幫浦係用來從盛裝容器中沒取一 動材質，然後送至噴頭以領在半導體基底上。此外， 本發明還包括一护制楹έΒ ,, m — G Γ 作，廿^^、尸 其用來控制氣動式幫浦的運 作並且監測氣動式幫浦是否正常運作。 機m半導體設備為光阻塗佈 衣谷益則為光阻瓶，可流動材質為光阻劑。此 -緩3==瓶和_式幫浦之間的f線，還配置有 綾衝瓶，用來去除光阻劑内的氣泡。 1284358 16044twf.doc/006 ^外]上述之控制模組包括了液體調節閥和氣體調節 閥’，共同，接至氣動式幫浦。而在控制模組中，還包括 了，量控制單元、電磁閥和氣壓控制單元。其中，流量控 制單元’會透職體調_來控觀動式幫〖，以決定停 止喷灑可流動材質的時間。而電磁咖連接液體調節閥和 氣體調節閥’並且氣壓控解元會透過電顯來驅動氣動 式幫浦。 在較佳的情況下，上述之氣動式幫浦可以是IWAKI 幫浦。 從另-觀點來看，本發明提供了一種半導體設備之管 線系統架構，包括了盛裝容器、嘴頭和幫浦。其中幫浦會 從盛裝容H愤取可流崎f，然後送至旬以賴在半 導體基底上。此外，在本發明中還包括了第—感測器、第 二感測器和處理單元。其中，第—感測器和第二感測器都 配置於幫浦上，用來感測幫浦内之氣閥的第—位置和第二 ，置，並會分概出第—感測訊號和第二感測訊號至處理 單兀。而當處理單7〇接收到第—感測訊號和第二感測訊號 相距的時間超過-預設日销時，職斷幫浦無法正 作，此時就會控制半導體設備發出—警告訊息。 坏上尸坏迷 一—、，十η尔忱用軋動式幫浦，因此半 體設備的體積能夠有效地縮小，並且也可以加快製程的 率:此外，由於本發明於幫浦上加裝感測器來感測^浦二 之氣閥的位置’因此當本發明可以依據幫浦内 置來判斷幫浦是否正常運作。而當幫浦無法正常運作時立 1284358 16044twf.doc/006 本發明就會發出警告訊息以告知操作人員。 為讓本發明之上述和其他目的·、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 圖2繪不了依照本發明之一較佳實施例的—種半導體 δ又備的官線系統架構之示意圖。請參照圖2，此半導體設 # 備適於將存放在-盛裝容器2〇1内的可流動材質，藉由^ 頭203 ,在—半導體基底(未繪示)上。這個魏的動 作’可藉由-氣動式幫浦2〇5汲取盛農容器内所盛裝的可 流動材質，並將其送至噴頭2〇3而完成。 在本實施例中，上述的半導體設備可為一光阻塗佈機 台’而盛裝容器201貝為光阻瓶，可流動材質就是光阻劑。 以下為求敘述簡明，以使熟習此技藝者能夠破實明瞭本 =的精神’因此皆以光阻塗佈機台來說明本發明。然而^ ^之說明並非用來限絲發明的用^ 僅月b使用於光阻塗佈機台。 承上述，當一半導體基底要進行光阻塗佈製程時，就 二2送至喷頭2〇3之下，然後控制模組21〇就會啟動氣 ，幫浦205透過-緩衝瓶2〇7來沒取光阻瓶2〇1内的光 至Γ2G3以喷灑在欲進行光阻塗佈製程的 5 %基底上。其中，緩衝瓶207是用來去除光阻劑中的 以避免光阻劑塗佈在半導體基底上的厚度不均勾。 者被喷灑有光阻劑的半導體基底會以極高的速度進行 1284358 16044twf.doc/006 旋轉，以將光阻劑均勻的分布在半導體基底的表面上 =完成了光阻塗佈的製程。在—些實施例中，氣動式幫浦 2〇5可以利用舰幻幫浦來實現。 、倉 來說，控制模组210可以包括液體調節閥犯、 =周，214、電磁闕216、流量控制單元218和氣壓控 制早兀222。其中，液體調節_2是由流量控制單元218 並且與氣體調節間214共同連接至氣動式幫浦加。 =置控制單元218會透過液體調 丨 頭™的量。當光阻= 二、、灑先阻蜊的里達一預設標準時，流量控制單元218 曰透過液體調節閥加控制氣動式幫浦2〇5立即停止供仏 光阻劑至喷頭203。 此外，氣壓控制單元222會透過電磁閥216而共同 =液體調節閥212和氣體調節閥214，以透過液體調節 '^氣，調節閥214來控制氣動式幫浦205的運作。 —、Ϊ彳于注意的是，在本發明中，控制模組210還包括有 巧單7G 224，係用來監測氣動式幫_ 2G5是否正常運作。 :乳動式幫浦2〇5無法正常運作時，貝丨m測單元η4就合 么出警告訊息以告知操作人員。 曰 -圖3緣示了依照本發明之_較佳實施例的一種監測單 凡的電路圖。請參照圖3，在圖3所繪示的監測單元中， 包括了驅動晶片3G1和例如可程式化晶片3()3的處理單 =者在本實施例中，可程式化晶片3〇3可以利用8〇51晶片 來貝現。其中，驅動晶片3〇1是用來啟動監測單元，而可 1284358 16044twf.doc/006 程式化晶片303則耦接了感測器3〇5和3〇7。苴中，感測 器305是用來感測例如圖i或圖2之幫浦内的氣闊是否位 於-第-位置’例如最低的位置，而感測器撕則用來感 測幫浦内之氣閥是否位於-第二位置’例如最高位置/ 當感測器3 05感測到幫浦内的氣闕位於第—位置時， 會產生-第-感測訊號給可程式化晶片期，同樣地，當 感測器307感測到蕈浦内之氣閥的位置位於第二位置時: 也會產生一第一感測訊號給可程式化晶片3〇3。其中，可 程式化晶片303内可以具有—計時程式。當可程式化晶片 303接收到第一感測汛號和第二感測訊號二者其中之一 時，就會啟動内部的計時程式，以計算接收到第;:感測訊 號和第二感測訊號二者另一所經過的時間。當可程式化晶 片303發現，從接收到第一感測訊號和第二感測訊號二者 其中之一，到接收到第一感測時間和第二感 二所相距的時間超過-預設時間，則代表幫浦無紅常運 作。此時，可程式化晶片303就會發出警告訊息以告知操 作人員進行維修。 在本實施例中，可程式化晶片3〇3還 3〇9。當可程式化晶片3〇3發現幫浦無法正常運作時，就會 ，由蜂鳴11309發出警枝效以告知操作人員此故障的訊 心’以便進行維修。 綜上所述，本發明至少有以下優點： 1.在本發明所提供的管路系統架構中 幫浦。而由於氣動式幫浦的運作較快，因此對於半導體設 1284358 16044twf.doc/006In the semiconductor process, various liquids are often used for different processes, such as photoresist (referred to as PR) coating process, and photoresist is sprayed on a semiconductor substrate for lithography process. . BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the piping system architecture of a conventional photoresist coating machine. The photoresist coating machine is suitable for a photoresist coating process for uniformly spraying a photoresist onto a semiconductor substrate. For the official line system architecture of the conventional photoresist coating machine, please refer to the figure 丨, which is equipped with a photoresist bottle 1〇1, a buffer bottle 1〇3, a nozzle 1〇5 and an electric pump 11〇. Among them, for example, the electric pump 11〇 of the cYB〇R pump will draw the photoresist from the photoresist bottle ιοί through the buffer bottle 1〇3, and then pump it to the nozzle. The showerhead sprays the photoresist onto the semiconductor substrate for the photoresist coating process. In other words, in the electric pump such as the CYB〇R pump, the stepping motor 112 and the solenoid valve 114 are provided as in the case of the pump 11G. Second, the slamming motor 112 is used from the refractory bottle 101 through the buffer bottle 1 〇 3 and sent to the electromagnetic μ 114. The electromagnetic enthalpy 114 then flows the agent and pumps it to the nozzle 1〇5 to order the photoresist coating process. In summary, the piping system architecture of the wire coating machine has the following 1284358 16044twf.doc/006. Disadvantages: The stepping motor in the horse-driven pump is too slow to move into the Taiwanese electric pump. The volume is too large, which also leads to the photoresist coating machine. [Inventive content] MH is the purpose of providing a semiconductor device with a pipeline structure, which can be called semi-conducting and simple speed. The purpose of this is to provide a pipeline system for semiconductor devices, which can reduce the volume of semiconductor devices. The purpose of this architecture is to provide a pipeline system for semiconductor devices, and β1 currently monitors the normal operation of semiconductor devices. The invention provides a semiconductor red line ίί, device threat: the shaft material is distributed on the bottom of the semi-conductor. The pneumatically supplied m-contact consists of a housing 11, a spray head and two. The pneumatic pump is used to remove the material from the container and then to the nozzle for the semiconductor substrate. In addition, the present invention also includes a protective raft, m-G Γ, 廿^^, which is used to control the operation of the pneumatic pump and to monitor the normal operation of the pneumatic pump. Machine m semiconductor equipment for photoresist coating Yi Gu Yi is a photoresist bottle, the flowable material is a photoresist. This - slow 3 = = f line between the bottle and the _ type pump, also equipped with a buffer bottle to remove bubbles inside the photoresist. 1284358 16044twf.doc/006 ^External] The above control module includes a liquid regulating valve and a gas regulating valve', which are connected to a pneumatic pump. In the control module, a quantity control unit, a solenoid valve and a pneumatic control unit are also included. Among them, the flow control unit will use the physical adjustment _ to control the movement of the gang to determine the time to stop spraying the flowable material. The electromagnetic coffee is connected to the liquid regulating valve and the gas regulating valve, and the pneumatic control solution drives the pneumatic pump through the electric display. In the preferred case, the pneumatic pump described above may be an IWAKI pump. Viewed from another perspective, the present invention provides a pipe system architecture for a semiconductor device that includes a container, a mouthpiece, and a pump. Among them, the gang will take the arrogance from the attire, and then send it to the semi-conductor base. Further, a first sensor, a second sensor, and a processing unit are also included in the present invention. Wherein, the first sensor and the second sensor are disposed on the pump, and are used for sensing the first position and the second position of the air valve in the pump, and the first sensing signal is The second sensing signal is processed to the processing unit. When the processing unit 7 receives the time when the first sensing signal and the second sensing signal are separated by more than the preset daily sales, the job breaker cannot be operated, and the semiconductor device is controlled to issue a warning message. The bad corpse is a fascinating one--, ten 忱 忱 忱 with a rolling pump, so the volume of the half-body equipment can be effectively reduced, and can also speed up the process rate: In addition, because the invention is installed on the pump The detector senses the position of the valve of the second pump. Therefore, when the invention can be built according to the built-in pump, it is judged whether the pump is functioning normally. When the pump is not working properly, the 1284358 16044twf.doc/006 invention will issue a warning message to inform the operator. The above and other objects, features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] FIG. 2 is a schematic diagram showing a structure of a semiconductor line δ and a conventional line system according to a preferred embodiment of the present invention. Referring to Figure 2, the semiconductor device is adapted to store the flowable material in the container 2, 1 by means of a head 203, on a semiconductor substrate (not shown). This Wei's action can be completed by taking the pneumatic material contained in the Shengnong container by pneumatic pump 2〇5 and sending it to the nozzle 2〇3. In this embodiment, the semiconductor device described above may be a photoresist coating machine', and the container 201 is a photoresist bottle, and the flowable material is a photoresist. The following is a brief description so that those skilled in the art can clarify the spirit of the present invention. Therefore, the present invention will be described by a photoresist coating machine. However, the description of ^^ is not used to limit the invention of the wire. Only the month b is used in the photoresist coating machine. According to the above, when a semiconductor substrate is to be subjected to a photoresist coating process, it is sent to the underside of the nozzle 2〇3, and then the control module 21〇 starts the gas, and the pump 205 passes through the buffer bottle 2〇7. The light in the photoresist bottle 2〇1 was not taken to Γ2G3 to be sprayed on the 5% substrate to be subjected to the photoresist coating process. Among them, the buffer bottle 207 is used to remove the thickness unevenness in the photoresist to prevent the photoresist from being coated on the semiconductor substrate. The semiconductor substrate sprayed with the photoresist is rotated at a very high speed by 1284358 16044 twf.doc/006 to uniformly distribute the photoresist on the surface of the semiconductor substrate. The photoresist coating process is completed. In some embodiments, the pneumatic pump 2〇5 can be implemented using a ship's magic pump. For example, the control module 210 may include a liquid regulating valve, a weekly, a 214, an electromagnetic 216, a flow control unit 218, and a pneumatic control 222. Among them, the liquid adjustment_2 is connected to the pneumatic pumping unit 218 by the flow control unit 218 and the gas regulating chamber 214. The set control unit 218 will adjust the amount of the head TM through the liquid. When the photoresist = second, the pre-cracking Rida is a preset standard, the flow control unit 218 曰 directly controls the pneumatic pump 2〇5 through the liquid regulating valve to immediately stop the supply of the photoresist to the nozzle 203. In addition, the air pressure control unit 222 transmits the liquid regulating valve 212 and the gas regulating valve 214 through the solenoid valve 216 to control the operation of the pneumatic pump 205 through the liquid regulating valve 214. - It is noted that in the present invention, the control module 210 also includes a singular single 7G 224 for monitoring whether the pneumatic gang 2G5 is functioning properly. : When the ECG 2〇5 is not working properly, the Bellow m measurement unit η4 will give a warning message to inform the operator.曰 - Figure 3 illustrates a circuit diagram of a monitoring unit in accordance with a preferred embodiment of the present invention. Referring to FIG. 3, in the monitoring unit shown in FIG. 3, a processing unit including a driving chip 3G1 and, for example, a programmable wafer 3 (3) is included. In this embodiment, the programmable chip 3〇3 can be Use 8〇51 wafers to come out. The driver chip 313 is used to activate the monitoring unit, and the programmable wafer 303 is coupled to the sensors 3〇5 and 3〇7. In the middle, the sensor 305 is used to sense whether the air width in the pump of FIG. 1 or FIG. 2 is located at the -first position, for example, the lowest position, and the sensor tear is used to sense the inside of the pump. Whether the air valve is in the -second position 'for example, the highest position / when the sensor 305 senses that the air in the pump is at the first position, a -first sensing signal is generated to the programmable wafer period, Similarly, when the sensor 307 senses that the position of the air valve in the pump is in the second position: a first sensing signal is also generated to the programmable wafer 3〇3. Among them, the programmable wafer 303 can have a timing program. When the programmable chip 303 receives one of the first sensing semaphore and the second sensing signal, an internal timing program is started to calculate the received first: the sensing signal and the second sensing signal. The other time passed by the two. When the programmable chip 303 finds that one of the first sensing signal and the second sensing signal is received, the time between receiving the first sensing time and the second sensing time exceeds - the preset time , on behalf of the pump, no red often operates. At this point, the programmable wafer 303 will issue a warning message to inform the operator of the repair. In this embodiment, the programmable wafer 3〇3 is also 3〇9. When the programmable chip 3〇3 finds that the pump is not functioning properly, the buzzer 11309 will issue a warning to inform the operator of the faulty message for maintenance. In summary, the present invention has at least the following advantages: 1. In the piping system architecture provided by the present invention, the pump. Since the pneumatic pump operates faster, it is designed for semiconductors 1284358 16044twf.doc/006
備 >，例如光阻塗佈機台，進行半導體製程的速率就可 效地提昇。 2·承上述，也由於氣動式幫浦的體積較小， 以有 因此本發 地降低半導體設備的體積’並進而降低半導: 3.由於在本發明中，還配置有監控單元， 路系統架構中幫浦的運作是否正常。因此， 二官 常運作時，本發明可以即時告知操作人員來法= 得半導體製程的良率不致受到影響。 、一 雖然本發明已以較佳實施例揭露如上，铁 限J本發明，任何熟習此技藝者，衫麟本發 和範圍内’當可作些許之更動與潤飾，因此 =申 对圍當視_之申請專職騎界定 J之保護 【圖式簡單說明】 ” 的示^纷示了習知的—種光阻塗佈機台之管線系統架構 圖2繪示了依照本發明 設備的管線系統架構之示意 圖3繪示了依照本發明 元的電路圖。 之一較佳實施例的一種半導體 圖。 之較佳實施例的_種監測單 【主要元件符號說明】 101、201 :光阻瓶 103、207 ·緩衝瓶 105、203 ·•噴頭 11 1284358 16044twf.doc/006For example, a photoresist coating machine can effectively increase the rate of semiconductor processing. 2. In view of the above, also because the volume of the pneumatic pump is small, so as to reduce the volume of the semiconductor device in the present invention and thereby reduce the semiconductor: 3. Since in the present invention, the monitoring unit is also provided, the road system Whether the operation of the pump in the architecture is normal. Therefore, when the second official is in operation, the present invention can immediately inform the operator that the yield of the semiconductor process is not affected. Although the present invention has been disclosed in the above preferred embodiments, the invention is limited to the invention. Anyone skilled in the art, the shirt and the scope of the present, can be used for some changes and retouching. _ The application for full-time riding definition J protection [schematic description of the drawing] ” shows the well-known line system architecture of the photoresist coating machine Figure 2 shows the pipeline system architecture of the equipment according to the invention Figure 3 is a circuit diagram of a cell according to the present invention. A semiconductor device of a preferred embodiment. A monitoring form of a preferred embodiment [Recognition of main component symbols] 101, 201: photoresist bottles 103, 207 ·Buffer bottle 105, 203 ·•SP 11 11284358 16044twf.doc/006
110 :電動式幫浦 205 :氣動式幫浦 210 :控制模組 212 :液體調節閥 214 :氣體調節閥 216 ·電磁闕 218 :流量控制單元 222 :氣壓控制單元 224 :監測單元 301 ·驅動晶片 303 :可程式化晶片 305、307 :感測器 309 :蜂鳴器110 : Electric pump 205 : Pneumatic pump 210 : Control module 212 : Liquid regulating valve 214 : Gas regulating valve 216 · Electromagnetic 阙 218 : Flow control unit 222 : Air pressure control unit 224 : Monitoring unit 301 · Driving wafer 303 : Programmable Wafers 305, 307: Sensor 309: Buzzer
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