1283289 九、發明說明： 【發明所屬之技術領域】 ’特別涉及一種工件表面微細結構之接觸 本發明係關於一種測量系統 式表面形貌分析系統及方法。 【先前技術】 在機械加工中，表面特徵之研究係控制機械零件表面質量之主要内 容’而表面粗链度係表面特徵的重要技術指標之一。隨著機械加工工蔽水 •平的提高，對料的表面微崎構質量提出了越來越高的要求，如導光板 網點及非球面透鏡模仁之外形輪摩，其表面粗縫度已達微米量級，如何對 其進行測量分析已成為全球學者研究的主要課題。 itf對於X餅雜廓之·方法…般分為接赋與雜觸式兩種 • 方式。接觸式制方法是靖針或探頭、感·等組合而狀接觸式機械 裝置，逐!__制表面，執行丄件外形輪廓之尺寸制。非接觸式量 測方式有多種不同量職術，大都_合影像處理技術。而自從掃描探針 • 顯微鏡(ScanningProbeMicroscoPe，SPM)出現後，各類掃描探針顯微鏡已成 為測量超精密表面粗糙度之有力手段，並發揮出技術優勢。目前，最常用 之精密表面形貌測量儀器為原子力顯微鏡(At〇mic F〇rce Micrcse〇pe， AFM)，其採用近場光學顯微技術，能獲得較高精度之表面輪廓，如美國專 利5,329,808及5,224,376。惟其設備成本相當昂貴，結構複雜，不符合經濟 效益，難以實現大範圍之應用。 為降低表面形貌分析儀之成本，適應廣泛應用之需求，2004年11月1曰 公告之台灣第092221376號專利揭示一種奈米級表面輪麂分析儀。請參閱第 5 * 1283289 一圖，該表面輪廓分析儀7包括··一XY平台71，係藉由一驅動裝置(圖未示) 並配合一光學讀取頭711對一光學記錄媒體712循執聚焦時之帶動，使其產 生位移；一探測機構72,係設於χγ平台71之上方，用以測量置於灯平台71 上待測工件721之表面輪廓；一Ζ軸位移系統73，係可將探測機構72夹固其 中，γ動棟測機構72之位移，一机號處理模組74，係與探測機構π連接， 可將探測機構72測得之訊號資料加以運算。其藉由义丫平台之精密位移，並 配合-具有奈米解析度之Ζ軸位移系統帶動，可獲得高精度之表面輪廊f 料，並具有降低成本之功效。惟，該表面輪廓分析儀僅能獲得一維之奈米 級表面輪廓資料，不能對表面輪廓進行全面之分析，而且該分析儀採用光 學聚焦觀_統，容易受探針之干擾，不能準確定位分析表面微細結構。 而採用高精密度顯微觀_統之表面形貌分析系統又都很昂責，大多為光 學非接觸式測量。 有雲於此，提供-種具有普通顯纖測系統，觀測時不受探針之干擾， 此準確疋位/貞彳里J1件表面形貌的表面形貌分析系統實為必要。 【發明内容】 為克服現有技術之表面形貌分析系統中觀測系統容易受探針之干擾， 因而無法準確粒測量卫件表面微細結構之不足，本發明的之目的在於提 仏種具有普通顯微觀測系統，觀測時不受探針之干擾，能準確定位測量 工件表面馳之表面形貌分析系統。 本發明之第二目的在於提供一種表面形貌分析方法。 —為實現上述第-個目的，本發明提供_種表面形貌分析系統，其包括 ;女置工件之承載平台；_χ_γ_ζ平台，用於調整承載平台之空間三維 6 ' 1283289 位置，-顯微觀測糸、统，用於選定工件表面之待測區域，其包括一設於承 載平σ-側且與其成射鏡及—顯微賴儀器，所述反射鏡用 於幵/成工件表面城之麟，所述賴觀測儀器时觀漸述鏡像；以及 —表面輪廓測量儀，用於探測所述待測區域之表面形貌。 其中’所述反射鏡背©設有-織所述反射鏡與承餅台所成傾角之 活動支座。 所述表面輪廓測量儀精確度為0.1微米級。 所述顯微觀測儀器選自微米量級顯微鏡。 所述表面雜分導光板_魏麵仁之表面形貌分析。 為實現上箱二個目的’本發明提供_種表面雜分析方法，其包括 以下步驟： 固定工件於一 X-Y-Z平台之承載平台上； 採用一顯微觀測儀器觀測工件表面形貌在一位於承載平台一側且與其 成一定傾角之反射鏡中所成之鏡像； 根據所述鏡像，移動X-Y-Z平台，定位出工件表面上待測區域； 根據所述鏡像，操縱一表面輪廓測量儀探測所述待測區域内； 由表面輪廓測量儀輸出數據，並記錄結果。 另，於所述顯微觀測之同時調整反射鏡與承載平台所成之傾角，所述 傾角調整通過於反射鏡背面設置一活動支座來實現。 所述顯微觀測之同時在X轴、Y轴或Z轴方向移動平二。 所述表面輪廓測量儀精確度為0.1微米級。 7 1283289 所述顯微觀測儀器選自微米量級顯微鏡。 所述表面形貌分析方法用於分析導光板網點或透鏡模仁之表面形貌。 相較於先前技術，本發明所提供之表面形貌分析系統通過於工件與顯 微觀測儀器間設置一反射鏡，藉以將工件之表面輪廓影射至觀測儀哭中， • 通過顯微觀測儀器觀測到由反射鏡傳送之表面輪廓鏡像，配合調整χ-γ_ζ平 台’能準確疋位待1測之表面區域’實現表面輪廓之定位量測。 而且，本發明所提供之表面形貌分析系統採用普通表面輪廓儀及普通 ^ 顯微觀測儀器，可大幅降低其成本。 【實施方式】 下面結合附圖對本發明作進一步詳細說明。 請參閱第二圖，為本發明提供之表面形貌分析系統結構示意圖。該表 面形貌分析系統10包括一表面輪廓測量儀; 一用於安置工件17之承載平 台12 ; — Χ-Υ-Ζ平台13 ; —位於承載平台12上方之顯微觀測儀器14 ;以及一 設於承載平台12上並與其成一定傾角之反射鏡15。其中，表面輪廓測量儀 • 11為一般表面輪廓分析儀，其具有一探針18,用於探測工件17之表面形貌。 Χ-Υ-Ζ平台13用於調整承載平台12之空間三維位置，從而可任意選擇工件17 之待測量區域。反射鏡15與顯微觀測儀器14組成顯微觀測系統，顯微觀測 儀器14可通過工件π之表面形貌在反射鏡上所成鏡像，側面觀測工件17 之表面形貌，避免正面觀測時受探針18之干擾。另於反射鏡15背面設置一 支座16 ’藉以調整反射鏡15與承載平台12之傾角，如採用高度可調支腳(圖 未不），即可實現該傾角自由調整，使工件17之表面形貌能準確清晰地影射 至顯微觀測儀器14中。 8 !283289 在本實^例中’表面輪廓測量儀u採用Surftest SJ_4〇〇型儀器(係曰木三焚 >司產品）’該儀ϋ可精確顺米量級，工件17選擇導光板或透鏡模仁，顯 ，微觀測儀⑽採航達到《量級之顯微鏡，藉以導光板網點或透鏡 ，模仁之表面形貌。下面結合導光板或透鏡模仁表面形貌之測量實施例，說 明本發明之表面形貌分析系統10之分析方法。 口月併參閱第二圖’第三圖為本發明之表面形貌分析系統1〇應用於導 鲁光板網點測量之實施例。蓉於導光板網點大小按一定規則分佈，如越接近 光源網點越小，因而本實施例分別選擇最大網點區域、最小網點區域以及 二個中間網點區域共四個網點區域來說明表面形貌分析系統1()之定位測 夏。測量時，先將導光板19U定於承載平台12上，並將具有網點之表面朝 上，先對最大網點觀測區域進行測量，即遠離光源的網點。尋找方法為： 利用顯微觀測儀器14觀測工件17表面形貌在反射鏡15中所狀鏡像(如第二 圖箭頭所示），該反射鏡位於承載平台一側且與其成一定傾角，與顯微觀測 ^ 儀态14組成顯微觀測系統；根據工件17表面形貌之鏡像，在XY2>fc一方向 移動XY-Z平口，疋位出隶大網點區域，如第三圖放大部分a所示；然後根 據區域A之鏡像，操縱表面輪廓測量儀14之探針18沿乂軸方向移動，分別探 測到兩個測量點A1及A2，由表面輪廓測量儀n輸出其在冰方向之座標值 等數據，即可推知其相對深度，測得A系列數據列於表1中。再按上述同樣 方法’先用顯微觀測系統觀測，並配合移動χ-γ-ζ平台，在導光板19相對於 表大網點區域之另—端’即靠近光源區域，定位出最小網點區域，如第三 圖放大部分Β所示；再於顯微觀測系統之觀測監控下，操縱表面輪廓測量儀 9 • 1283289 11之探針18酬網點，由_近光源之網職小分純密集，因而在該區 域B内捕獲B1、B2細三個測量點。然後由表面輪廓測娜i輸出m、B2 及B3在Z軸方向之座標鮮數據，即可推知其姉深度，翦时列數據列 於表1中。然後隨機選取中間區域C、D，其中c區域捕獲有四個測量點，D 區域有三個測量點’採用上述同樣方法分別測量出c、M列數據同列於朴1283289 IX. Description of the invention: [Technical field to which the invention pertains] ‘Specially related to contact of a microstructure of a surface of a workpiece. The present invention relates to a system and method for measuring surface topography of a measurement system. [Prior Art] In machining, the study of surface features is one of the important technical indicators for controlling the surface quality of mechanical parts and the surface roughness characteristics. With the improvement of the water and flatness of the mechanical processing workers, the surface micro-snagging quality of the material has been put forward higher and higher requirements, such as the light guide plate dot and the aspherical lens mold, and the surface roughness has reached On the order of micrometers, how to measure and analyze it has become a major topic for scholars worldwide. Itf is divided into two methods: the connection and the miscellaneous. The contact type method is a combined contact type mechanical device such as a needle or a probe, a sensor, and the like, and the surface is formed by the surface of the frame. The non-contact measurement method has a variety of different positions, most of which are image processing techniques. Since the appearance of Scanning Probe Microscope (SPM), various scanning probe microscopes have become a powerful means of measuring ultra-precision surface roughness and have taken advantage of the technology. At present, the most commonly used precision surface topography measuring instrument is the atomic force microscope (At〇mic F〇rce Micrcse〇pe, AFM), which uses near-field optical microscopy technology to obtain a higher precision surface profile, such as US Patent 5,329,808. And 5,224,376. However, the equipment cost is quite expensive, the structure is complicated, and it is not economically viable, and it is difficult to achieve a wide range of applications. In order to reduce the cost of the surface topography analyzer and to meet the needs of a wide range of applications, Taiwan Patent No. 092221376, published on November 1, 2004, discloses a nano-scale surface rim analyzer. Referring to FIG. 5 * 1283289, the surface profile analyzer 7 includes an XY stage 71 which is circulated to an optical recording medium 712 by a driving device (not shown) and an optical pickup 711. When the focus is driven, the displacement is generated; a detecting mechanism 72 is disposed above the χγ platform 71 for measuring the surface contour of the workpiece 721 to be tested placed on the lamp platform 71; a shaft displacement system 73 is The detection mechanism 72 is clamped therein, and the displacement of the gamma moving mechanism 72, the one-machine processing module 74 is connected to the detecting mechanism π, and the signal data measured by the detecting mechanism 72 can be calculated. It is driven by the precise displacement of the platform and coupled with the Ζ-axis displacement system with nano-resolution to obtain high-precision surface rims and reduce cost. However, the surface profile analyzer can only obtain one-dimensional nano-surface profile data, and can not comprehensively analyze the surface profile, and the analyzer adopts an optical focus view, which is easily interfered by the probe and cannot be accurately positioned. Analyze the surface microstructure. The surface topography analysis system with high precision and microscopic appearance is very blame, mostly for optical non-contact measurement. There is a cloud here, providing a kind of common fiber-optic measurement system, which is not interfered by the probe during observation. It is necessary to analyze the surface topography of the surface shape of the J1 piece. SUMMARY OF THE INVENTION In order to overcome the problem that the observation system in the surface topography analysis system of the prior art is easily interfered by the probe, it is impossible to accurately measure the fine structure of the surface of the guard. The object of the present invention is to provide an ordinary microscope. The observation system is not subject to the interference of the probe during observation, and can accurately locate the surface topography analysis system for measuring the surface of the workpiece. A second object of the present invention is to provide a surface topography analysis method. - In order to achieve the above-mentioned first object, the present invention provides a surface topography analysis system comprising: a load bearing platform for a female workpiece; a _χ_γ_ζ platform for adjusting a spatial three-dimensional 6 ' 1283289 position of the load bearing platform, - microscopic observation糸, system, for the selected area of the workpiece to be tested, including a set on the bearing σ-side and its mirror and microscopic instrument, the mirror for the 幵 / into the surface of the workpiece And the surface observation instrument is used to detect the surface topography of the area to be tested. Wherein the mirror back © is provided with an active support for the angle of inclination of the mirror and the platform. The surface profilometer has an accuracy of 0.1 micron. The microscopic observation instrument is selected from a micron-scale microscope. Surface topography of the surface hybrid light guide plate_Wei Noodle. In order to achieve the two purposes of the upper case, the present invention provides a surface heterogeneous analysis method, which comprises the steps of: fixing a workpiece on a bearing platform of an XYZ platform; observing the surface topography of the workpiece on a carrying platform by using a microscopic observation instrument a mirror image formed on one side and at a certain angle to the mirror; according to the mirror image, the XYZ platform is moved to locate the area to be tested on the surface of the workpiece; according to the mirror image, a surface profilometer is manipulated to detect the to-be-tested Within the area; output data from the surface profilometer and record the results. In addition, the tilt angle of the mirror and the carrying platform is adjusted while the microscopic observation is performed, and the tilt adjustment is realized by providing a movable support on the back of the mirror. The microscopic observation simultaneously moves the flat two in the X-axis, Y-axis or Z-axis direction. The surface profilometer has an accuracy of 0.1 micron. 7 1283289 The microscopic observation instrument is selected from the group consisting of micron-sized microscopes. The surface topography analysis method is used to analyze the surface topography of the light guide plate dot or the lens mold. Compared with the prior art, the surface topography analysis system provided by the present invention provides a mirror between the workpiece and the microscopic observation instrument, thereby mapping the surface contour of the workpiece to the crying of the observer, and observing through the microscopic observation instrument. To the surface profile image transmitted by the mirror, the χ-γ_ζ platform can be accurately adjusted to accurately position the surface area to be measured. Moreover, the surface topography analysis system provided by the present invention can reduce the cost substantially by using a common surface profilometer and a common ^ microscopic observation instrument. [Embodiment] The present invention will be further described in detail below with reference to the accompanying drawings. Please refer to the second figure, which is a schematic structural diagram of a surface topography analysis system provided by the present invention. The surface topography analysis system 10 includes a surface profilometer; a load bearing platform 12 for positioning the workpiece 17; a Χ-Υ-Ζ platform 13; a microscopic observation instrument 14 above the load bearing platform 12; A mirror 15 is mounted on the platform 12 and at an angle to it. Among them, the surface profilometer 11 is a general surface profile analyzer having a probe 18 for detecting the surface topography of the workpiece 17. The Χ-Υ-Ζ platform 13 is used to adjust the three-dimensional position of the space of the carrying platform 12, so that the area to be measured of the workpiece 17 can be arbitrarily selected. The mirror 15 and the microscopic observation instrument 14 form a microscopic observation system. The microscopic observation instrument 14 can mirror the surface of the workpiece π through the surface topography of the workpiece π, and observe the surface topography of the workpiece 17 from the side to avoid the frontal observation. Interference from probe 18. In addition, a seat 16' is disposed on the back of the mirror 15 to adjust the inclination angle of the mirror 15 and the carrying platform 12. If the height-adjustable leg is used (not shown), the inclination can be freely adjusted to make the surface of the workpiece 17 The topography can be accurately and clearly mapped into the microscopic observation instrument 14. 8 !283289 In this example, 'surface profile measuring instrument u adopts Surftest SJ_4 〇〇 type instrument (system of 曰木三燃> division product)', the instrument can accurately calibrate the meter, workpiece 17 selects the light guide or The lens mold, the display, and the micro-observer (10) are used to achieve the "magnitude of the microscope, by means of the light guide plate dot or lens, the surface morphology of the mold." The analysis method of the surface topography analysis system 10 of the present invention will be described below in conjunction with a measurement embodiment of the surface topography of the light guide plate or the lens mold. The second section is also referred to as the second figure. The third figure is an embodiment of the surface topography analysis system 1 of the present invention applied to the measurement of the grid position of the guide light panel. The size of the dots on the light guide plate is distributed according to a certain rule. For example, the closer to the source dot is, the smaller the mesh point is. Therefore, in this embodiment, the maximum dot area, the minimum dot area, and the two intermediate dot areas are respectively selected to indicate the surface topography analysis system. 1 () positioning summer. In the measurement, the light guide plate 19U is first set on the carrying platform 12, and the surface having the dot is directed upward, and the maximum dot observation area is measured first, that is, the dot away from the light source. The method of searching is: observing the surface topography of the workpiece 17 in the mirror 15 by using the microscopic observation instrument 14 (as indicated by the arrow in the second figure), the mirror is located on one side of the carrying platform and has a certain inclination angle with it. The micro-observation^ state 14 constitutes a microscopic observation system; according to the mirror image of the surface topography of the workpiece 17, the XY-Z flat opening is moved in the direction of XY2>fc, and the large mesh area is enlarged, as shown in the enlarged part a of the third figure. Then, according to the mirror image of the area A, the probe 18 of the surface profile measuring instrument 14 is moved in the direction of the x-axis, and two measurement points A1 and A2 are respectively detected, and the surface contour measuring instrument n outputs the coordinate value in the ice direction, etc. The data can be inferred to the relative depth, and the measured A series data are listed in Table 1. According to the same method as above, the micro-observation system is first observed, and with the mobile χ-γ-ζ platform, the minimum dot area is located at the other end of the light guide plate 19 relative to the large dot area of the watch, that is, close to the light source area. As shown in the enlarged part of the third figure, under the observation and monitoring of the microscopic observation system, the probe surface of the surface profilometer 9 • 1283289 11 is 18 points, and the net position of the _ near-light source is purely dense. Three measurement points of B1 and B2 are captured in this area B. Then, from the surface profile, i, m, B2, and B3, the coordinates of the coordinates in the Z-axis direction, can be inferred, and the data of the time column is listed in Table 1. Then, the intermediate regions C and D are randomly selected, wherein the c region captures four measurement points, and the D region has three measurement points. The same method is used to measure the c and M column data in the same manner.
表1A、B、C、D四個系列各測量點深度數據Table 1A, B, C, D four series of measurement point depth data
從表中可看出’由表面形貌分析系統1〇所測出之數據可達到微米量 級’通過這齡舰據即可評_導输19之表面雜，並且能做到定位 測量’根據測量所得數據，可分析導光板19_分佈或缺陷情況等相關性 月匕 請-併參閱第二圖及第四圖，第四圖為本發明之表面形貌分析系統1〇 _應祕透鏡模仁測量之實施例。與導光板糊點測量方法相同，將透鏡模 仁20固疋於承載平台12上，移動χ-γ-Ζ平台13，並配合顯微鏡14觀測由反射 鏡所成之透鏡模仁20表面形貌鏡像，根據該鏡像選定_凹面區域，如第四 圖放大部分E所示。然後觀測該區域鏡像，選擇三個特定點£1、£2及£3， 如E2為該凹面最底端；操縱表面輪廓測量儀u之探針以沿义轴方向移動，很 快可探測出耵、E2及E3三點Z軸方向之座標值。然後由表面輪廓測量儀n 輸出相應數據，即可推知其相對深度，測得匕系列數據列於表2中。表2結果 顯示，該透鏡模仁凹面深度，即E2點之Y座標值為132猶米，結合表中其 1283289 他資料，即可對該透鏡模仁20相關性能進行考量及分析。 表2E卜E2及E3三點座標(χ，ζ)It can be seen from the table that 'the data measured by the surface topography analysis system can reach the micron level'. The surface of the ship can be evaluated by this age ship, and the surface measurement can be performed. Measure the data, analyze the correlation of the light guide plate 19_ distribution or defects, etc. - and refer to the second and fourth figures. The fourth figure is the surface topography analysis system of the present invention. An embodiment of the kernel measurement. In the same manner as the light guide plate paste measuring method, the lens mold core 20 is fixed on the carrying platform 12, the χ-γ-Ζ platform 13 is moved, and the surface morphology of the lens mold core 20 formed by the mirror is observed in conjunction with the microscope 14. According to the image, the _ concave area is selected, as shown in the enlarged part E of the fourth figure. Then observe the area image, select three specific points £1, £2 and £3, such as E2 is the bottom end of the concave surface; the probe of the surface profile measuring instrument u moves in the direction of the sense axis, which can be detected quickly.座, E2 and E3 coordinate values of the Z-axis direction of three points. Then, the corresponding data is outputted by the surface profilometer n, and the relative depth is inferred. The measured 匕 series data are listed in Table 2. The results in Table 2 show that the concave depth of the lens mold, that is, the Y coordinate of the E2 point is 132 cm, and the relevant performance of the lens mold 20 can be considered and analyzed by combining the data of 1283289 in the table. Table 2E, E2 and E3 three-point coordinates (χ, ζ)
由上述兩個實施例可知’本㈣之表面形貌分㈣統1〇通過 於工件17It can be seen from the above two embodiments that the surface topography of (4) is passed through the workpiece 17
與顯微觀測魅_設置-反機15，藉崎辑17之絲職在反射鏡 15中形成鏡像，通過顯微觀測儀器Μ觀測其鏡像，配合χ_γ_ζ平台13之移 動’即可迅速準確定位待量測之表面，避免無觀齡統之盲目搜尋，或者 無反射鏡時’正錢測時受探針18賴而影響觀觀果。而麟反射鏡底 部設有-活動支座16，使反射鏡15與承載平台12所成之傾角可調，從而使 顯微儀器14能迅速精確選擇所需測量位置’實現表面形貌之定位測量。而 且，本發贿提供之表®雜分普通表面輪賴及普通顯微 觀測儀器，與原子力顯微鏡之高成本設備相較，其成本大幅度降低。 綜上所述’本發明確已符合發明專利之條件，兹依法提出專利申請。 另外’以上所碰為本發明之雛實關，自不如此_本案之申^專 利範圍。舉凡熟悉本案技藝之人士，在援依本案發明精神所解效^或 變化，皆應包含在以下專利權利要求書内。 【圖式簡單說明】 第一圖係先前技術之形貌分析系統示意圖。 第二圖係本發明之形貌分析系統示意圖。 第三圖係本發明之形貌分析系統應用於導光板網點測量之實施例。 第四圖係本發明之形貌分析系統應用於透鏡模仁表面測量之實施例With the microscopic observation charm _ set-reverse machine 15, the singularity of the singularity of the singularity of the syllabus is reflected in the mirror 15 and observed by the microscopic observation instrument, and the movement of the χ_γ_ζ platform 13 can be quickly and accurately positioned. Measuring the surface, avoid blind search without observing the age, or when there is no mirror, the positive impact is affected by the probe 18. The bottom of the lining mirror is provided with a movable support 16, so that the inclination angle of the mirror 15 and the carrying platform 12 can be adjusted, so that the micro-instrument 14 can quickly and accurately select the required measuring position to achieve the positioning measurement of the surface topography. . Moreover, the table provided by the bribery® miscellaneous ordinary surface wheel and ordinary microscopic observation instruments, the cost is greatly reduced compared with the high cost equipment of the atomic force microscope. In summary, the present invention has indeed met the conditions of the invention patent, and a patent application is filed according to law. In addition, the above is the key to the invention, and it is not the case. Anyone who is familiar with the skill of this case shall be included in the following patent claims in the context of the invention. [Simple description of the diagram] The first diagram is a schematic diagram of the topographical analysis system of the prior art. The second figure is a schematic diagram of the morphology analysis system of the present invention. The third figure is an embodiment in which the topography analysis system of the present invention is applied to the measurement of the light guide plate dot. The fourth figure is an embodiment of the topography analysis system of the present invention applied to the surface measurement of a lens mold
II 1283289 【主要元件符號說明】 測量區域 測量點 - 形貌分析系統 • 承載平台 顯微觀測儀器 支座 • 探針 透鏡模仁 A、 B、C、D、E A1 、A2、B1〜B3、C l〜C4 、D1〜D3、E1〜E3 10 表面輪廓測量儀 11 12 X-Y-Z平台 13 14 反射鏡 15 16 工件 17 18 導光板 19 20II 1283289 [Description of main component symbols] Measurement area measurement point - Topography analysis system • Bearing platform microscopic observation instrument support • Probe lens mold core A, B, C, D, E A1, A2, B1~B3, C l~C4, D1~D3, E1~E3 10 Surface profilometer 11 12 XYZ platform 13 14 Mirror 15 16 Workpiece 17 18 Light guide 19 20
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