TWI282255B - Conductive connecting pin and package board - Google Patents

Abstract

On the board provided with a conductive layer (5), a pad (16) is formed to fix a conductive connecting pin (100) on a package board (310). The conduction connecting pin (100) serves as electrical connection to a motherboard. The pad (16) is coated with an organic-resin insulating layer (15) having an opening section (18) from which the pad (16) is partially exposed. The conductive connecting pin (100) is fixed to the pad exposed from the opening section using a conductive adhesive (17), preventing the conductive connecting pin (100) from separating off the board at the time of mounting.

Description

• 1282255 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a conductive connecting pin and a resin package substrate to which a conductive connecting pin is fixed. [Prior Art]

A package substrate for connecting a 1C wafer or the like to a mother board or a daughter board has been required to have a low dielectric constant and a low dielectric positive connection in recent years due to high frequency of signals. Therefore, the material of the substrate is also being transferred from the ceramic (four) to the resin as the mainstream. In the case of a printed circuit board using a resin substrate, for example, a so-called multi-layer printed wiring board proposed in Japanese Patent Publication No. Hei 4-55555 is used. On the glass epoxy substrate, epoxy acrylate U is formed as a layer _ wear layer, and then 're-use imaging method to establish the opening for the via hole, and after the surface is roughened, Hanli plated photoresist' Electroplating is performed to form a conductor circuit and a via hole. In the case of using a multilayer laminated printed wiring board as described above as a package substrate, it is necessary to mount a conductive connecting pin for connecting a mother board or a daughter board. This pin is called a τ-type pin, and its shape is formed in a columnar shape by the columnar connecting portion 722 and the plate-shaped fixing portion 721 as shown in Fig. 76, and is formed by a splicing portion 722. Connecting with the socket of the motherboard, etc., the conductive connection pin 71 0 is formed by multi-layering the outermost layer (pad) 716 of the circuit board, and the conductive position of the pin 716 is conductive by solder or the like. The adhesive 717 is bonded and fixed. 2160-2888A-PF 5 ^1282255 However, in the above-mentioned structure φ mountain, since the joint area between the resin insulating layers 752 between the feet η6 is small, metal is added; the position is completely different from the material of the resin insulating layer. ,, the problem of insufficient strength. (d), as there is a joint plate in both! = ring condition τ, that is, it is found that the substrate is bent and uneven due to the difference in thermal expansion rate between the package substrate side and the mother board or the daughter board side, and the interface between the chatter 716 and the interlayer resin insulating layer 752 is Production = electrical connection lock 710 together with the foot position 716 stripped by the substrate = ask 26. In addition, when the conductive substrate (4) is used to encapsulate the mother board of the substrate 3, if there is a positional error between the position of the conductive connection lock and the socket to be connected to the mother board, the stress is concentrated on the connection portion. The conductive connection lock is peeled off together with the foot. At this time, the conductive lock may be detached or skewed due to the heat in the two temperature fields of the execution or the actual mounting of the IC chip, and thus the electrical connection cannot be achieved. The present invention has been made to solve the above problems, and an object thereof is to provide a conductive connecting pin which is less stress-constrained under thermal cycle conditions or when an electronic component such as an lc wafer is actually mounted, and conductivity even if subjected to stress The resin package substrate which is not easily peeled off or peeled off to achieve electrical continuity. On the other hand, a multi-layered wiring board used as a package substrate is provided with a flat layer composed of a power supply layer capable of instantaneously supplying a large amount of power to the IC chip, or a ground layer for the purpose of reducing noise. The flat layer of the structure———------------------------------------ However, the flat layer is via the interlayer The holes are connected to the pins used to connect the external substrate (for example, the daughter board). Since the current from the side of the sub-board flows through the fine hole of the 2160-2888A-PF 6 1282255, the flat layer constituting the power supply layer is limited in its ability to be supplied to the π electric power, and thus the sufficient function cannot be exerted. Therefore, in the flat layer constituting the ground layer, the grounding line on the side of the sub-board is connected by the fine interface with high impedance, so that the multi-layer printing used for the anti-cutting Yoshida package substrate cannot be fully utilized. The circuit board is attached to the daughter board. Therefore, it is necessary to install a conductive connection pin on the position set up on the multilayer printed circuit board. However, even if the metal foot is set on the package substrate made of resin, the joint strength of the two is very low, and the conductive lock is combined with the foot when stress is applied to the conductive connection pin. Stripped. The present invention has been made to solve the above problems, and an object thereof is to provide a package substrate having a flat layer capable of exhibiting a sufficient function. In addition, the purpose of Shuming is to provide a resin encapsulation base having a flat layer capable of exerting sufficient functions and having a conductive connection pin which is difficult to be peeled off, in order to obtain a connection with an external substrate in the phoenix-rich circuit board. A BGA composed of solder or the like is disposed, and is mounted on the surface of the external substrate by means of a shawl. - It is hot, good, and good, and cracks are damaged. However, if the BGA is connected to the external substrate, the joint area of the bga and the bright tin resist opening is small, so the tensile strength is It becomes very 4 i: when the stress is concentrated on the surface, or when the reliability test is formed in the multi-layered circuit board, it will experience the interlayer resin.

2160-2888A-PF 7 , 1282255 The drying and hardening of the insulating layer, the solder resist (organic resin insulating layer), and the drying, annealing treatment, etc. after the formation of the electric bell film, so on the substrate Produces bends or bumps. Further, due to the bending and unevenness, it becomes impossible to achieve the connection between the multilayer laminated wiring board and the external substrate by a small number of BGAs. The BGA of a multi-layered circuit board can also be considered by replacing the external substrate with a PGA. That is, since the pga is electrically connected by the pin inserted in the connection portion of the external substrate, the problem of poor connection is caused unlike the BGA described above.配 曰 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配 配Fill in a reinforcing material such as glass epoxy resin. Therefore, the support force of the PGA is very weak and cannot withstand the tensile strength of the newspaper. In addition, the electro-mineral liquid formed by forming the conductor layer in the through-hole after opening and the subsequent heat treatment, or the heating performed when the fresh tin is melted in the through-hole to fix m, will cause the interlayer insulating layer to The resin dissolves and flows out, making the PGA unusable. In the PGA, since the through holes are formed, it is impossible to make the configuration of the lower layer in the multilayer wiring board as small as BGA. Set the line. Therefore, the freedom of substrate design

The present invention has been made to solve the problem of D U and the like, and the object thereof is to provide a tensile strength stronger for PGA, and also have a content of the invention.

2160-2888A~PF 8 1282255 The inventors of the present invention have forgotten the results of the review, and finally completed the present invention: in the invention of claim 1 of the patent application, the fixed conductive pin is used to make the pin The layer of the exposed portion is partially covered to be covered. When the y substrate is mounted on another substrate such as a mother board by the conductive connection pin, even if there is a positional error between the power-receiving pin and the socket of the mother board, for example, When the stress is applied to the material (4), or under the various heat treatments of the _ ring condition, the substrate may be f-curved or the like, and the crucible may be prevented from being pressed by the cover of the organic resin insulating layer. The substrate is peeled off. In particular, even when it is difficult to obtain a sufficient bonding force by bonding the interlayer resin insulating layers of the metallic material to the completely different materials, it is also possible to provide the coating by the organic resin insulating layer from the surface of the crucible. Its height is 4 peel strength. Further, in the invention of claim i, it is important to make the size of the foot slightly larger than the opening of the organic resin insulating layer which exposes the position. Thereby, the foot can be partially exposed by the opening. That is, the edges of the feet are covered by an organic resin insulating layer. The size of the foot is preferably 1 to 02 to 100 times the diameter of the opening of the organic resin insulating layer exposing the position of the foot. If the diameter of the foot is less than n times the diameter of the opening, the periphery of the foot cannot be reliably covered by the organic resin insulating layer, and the peeling of the conductive connecting pin cannot be prevented. On the other hand, if it is larger than 1 〇 〇 , the density of the conductor layer is impaired. Specifically, the diameter of the organic resin - ^ - is 110 to 2000 μm. In the invention of claim 2, the extension of the 2160-28 88A-PF 9 1282255 disposed around the foot is covered by the organic Xie Rizhen right m...^, the edge layer. Therefore, even when there is stress applied to the conductive technology, the pedigree, the male pin, and the male pin, the foot is already covered with the organic tree, and it can be prevented. The substrate is peeled off. On the other hand, since the body portion of the foot is exposed by the opening of the Ningtian organic resin insulating layer, the organic resin insulating layer does not contact the body portion of the ankle, so that the organic resin insulation does not occur (3) A phenomenon occurs in which a body portion of the leg portion is in contact with each other to cause a crack. In the invention of claim 5, since (4) and (4) are layered by the interface and connected to the conductor extension of the inner layer a, the contact area between the foot and the substrate is increased so that the two can be strongly joined. Further, as described above, in comparison with the case where the position in which the conductive connecting pin is fixed and the interlayer resin insulating layer joined to the foot are joined by different materials, in the invention of the first application of the patent application, The foot in the invention shown in claim 5 of the patent application is connected to the conductor layer of the inner layer. Therefore, the metal is brought into contact with each other, so that the connection can be made more reliable and the peeling strength of the foot can be improved. Yu (4)'s foot can also be used! More than one via hole is connected to the inner layer of the conductor layer. Thereby, the joint area of the foot can be further increased, and the month b forms a structure which is less likely to be peeled off. Further, when the pin is connected to the conductor layer of the inner layer by the via hole, it is effective to improve the continuity if the via hole is disposed in the peripheral portion of the pin. Therefore, the via hole can also be formed into an annular shape, and the foot can be set by covering the ring. The pins of the pin are formed by connecting the conductor layers of the inner layer by two or more via holes, or may be based on the shape or type of the package substrate by the layer 2 2160-2888A-PF 10 1282255 or more. The mesopores are composed of one or more mesopores. The above theory can increase the surface area of the foot because it can increase the contact degree. Further, when the via hole provided with the pin is covered with the organic resin insulating layer having the opening portion in which the pin portion is partially exposed, the peeling of the foot can be surely prevented. In the invention of claim 6, the conductor layer on the core substrate is strongly adhered to the core substrate by the roughened surface (matte surface).

On the surface of the resin substrate, by the contact with the pin on the conductor layer as described above, the pin position is less likely to be peeled off by the interlayer resin insulating layer. Further, when the pin is bonded to the conductor layer of the inner layer by one or more via holes and two or more via holes, the conductor layer of the inner layer may be formed on the core substrate. According to the invention of claim 7 of the patent application, the length of the line between the conductive connecting pin of the external terminal and the other substrate on the opposite side of the side where the conductive connecting pin is set can be shortened. Specifically, in the core substrate, the land is formed in the land around the through hole and the resin filler filled in the through hole is connected to the pin by the via hole. Further, by coating the through hole with the conductor layer to perform a so-called cover clock, the conductor layer may be connected to the pin by the via hole. Furthermore, it is also possible to continue the connection with the foot by the via hole only on the land of the through hole. In the invention of claim 14, the bonding strength of the conductive bonding pin is ensured to be strong after the melting point of the conductive adhesive is 180 to 280 ° C or after the -2" kiss-resistance test or It is only a small decrease in the strength after the application of heat required for mounting the IC chip. In the case of less than 18 〇 I, the joint strength 2160-2888A-PF 11 , 1282255 is still about 2. 〇Kg/pin, but in this case only shows the extent of L5Kg/pin. Further, since the conductive adhesive is melted during the mounting of the κ wafer, the detachment and tilting of the conductive connecting pin are caused finally. If it exceeds 280 ° C, the resin insulating layer and the solder resist layer of the resin layer will melt out the excellent temperature system 2 0 0~2 60 °C with respect to the melting temperature of the conductive interface agent. . This is because the conductive bonding agent having the temperature allows the variation in the bonding strength of the conductive connecting pins to be changed, and the actual applied heat does not damage the resin reed constituting the package substrate. 9 In the invention of claim 15 of the invention, the conductive interface 1 is formed by at least one of tin, lead, antimony, silver, gold, and copper, thereby forming the melting point. Conductive bonding agent. In particular, the conductive bonding agent having tin or tin-recording can be formed in the above-mentioned melting state, so that it is easily re-solidified and adhered even if it is melted by heat, so that the conductive connecting pin does not fall off, tilt. Since the above conductive adhesive is tin/wrong, tin/recorded, tin/silver, tin/bismuth/wrong alloy, especially the joint strength is up to 2. GKg/pin = so even under thermal cycling conditions or not Guide:: The joint strength of the connecting lock is reduced, so that the pin is not tilted, and the electrical connection can be read. The invention of the patent application (4) is based on the choice of free electric steel or copper alloy, tin, rhyme, and force, so that the conductive connection of iron is not easily used by the conductive connection lock. For copper alloys,

2160-2888A-PF 12 1282255 Copper is suitable. This is because it is excellent in electrical properties, good in electrical properties, and excellent in processability as a conductive connection. In the conductive connecting pin, a so-called τ-type pin composed of a plate-like fixing portion and a columnar connecting portion which is provided at a center position of the plate-shaped fixing portion is preferably used. The plate-like fixing portion is fixed to the portion of the conductor layer forming the foot by conductivity, which can be appropriately formed in a round shape or a polygonal shape depending on the small position of the foot. Further, the shape of the connecting portion is not limited as long as it can be inserted into another substrate, and may be a cylindrical type, a prism type, a conical type, a pyramid type or the like. The splicing portion is substantially one turn for the pin at the normal position. However, there are no particular problems in establishing two or more pins, and it can be appropriately formed in accordance with other substrates to be mounted. In the conductive connecting pin, the column-shaped connecting portion has a diameter of 〇.u, and the length is preferred; and the plate-shaped fixing portion is preferably in the range of 5.5 to 2.0 mm; The size of the foot can be appropriately selected in accordance with the type of other substrates to be assembled, and the like. Further, in the invention of claim 19, when the package substrate is worn to an external electronic component or the like, stress is applied to, for example, a positional error between the conductive connection pin and the other substrate. In the case of the conductive continuous lock, the stress can be absorbed by the bending of the joint portion, and in the case where the heat treatment of the heat is used to cause the occurrence of 'Zengqu, etc. on the substrate, The fixing portion can be flexed to correspond to the deformation thereof, so that the conductive connecting pin can be prevented from being peeled off from the substrate, and the package substrate having the high reliability of the package base can be fixed and electrically conductive! The pin of the performance pin is covered by a 2160-2888A-PF 13 , 1282255 organic resin insulating layer provided with an opening portion for partially exposing the pin. Thereby, even if stress concentration occurs in the conductive pin (or the deformation of the substrate) as described above, the foot can be prevented from being peeled off from the substrate because the foot is covered by the organic resin insulating layer. In particular, even if it is difficult to obtain sufficient bonding force between the metal foot and the interlayer resin insulating layer, it is difficult to obtain sufficient bonding force, and the surface of the foot can be made of an organic resin insulating layer. It can be covered to give it a high peel strength. When the foot is covered with the organic resin insulating layer, it is important that the size of the pin is slightly larger than the opening of the organic resin insulating layer from which the foot is made. Thereby, the foot can be partially exposed by the opening. That is, the edges of the feet are covered by an organic resin insulating layer. The size of the foot is preferably L 02 to 1 times the diameter of the opening of the organic resin insulating layer exposing the position of the foot. If the diameter of the foot is less than n times the diameter of the opening, the periphery of the foot cannot be reliably covered by the organic resin insulating layer, so that peeling of the conductive connecting pin cannot be prevented. On the other hand, if it is more than 1〇〇, the density of the conductor layer is impaired. Specifically, when the diameter of the opening portion set in the organic resin insulating layer is "1 〇〇 15 15", the diameter of the foot position is 110 to 2000 / zm. The conductive connecting pin is formed of at least one or more kinds of copper or copper alloy, tin, rhodium, aluminum, or noble metal, which is excellent in flexibility, and the pin of the conductive connecting pin is fixed by the via hole. Since the contact layer of the inner layer is continuous, the contact area between the conductive substrates is increased, so that the two can be strongly bonded. Further, as described above, the invention is fixed in the invention of claim 19 2160-2 8 8 8A~Pf1 14 Ϊ282255 The position of the conductive connecting pin is the same as that of the basin p /, and the interlayer resin insulation layer joined with the different feet is joined by different materials. The foot position in the invention shown in the scope of the patent application is continuous with the inner layer and the body layer of the inner layer. Therefore, the two are white and the two are connected to each other, and the Afc does not pick up. Can be more surely joined and the peel strength of the foot is also The outer leg can also be connected to the inner conductor layer by more than one via hole. This can further increase the joint area of the foot and form a peeling less. In addition, when the conductor layer of the inner layer is connected by the via hole, it is effective to improve the continuity when the via hole is disposed in the peripheral portion of the pin. The via hole can be formed into a ring shape and the foot can be set by covering the ring. Further progress can be made in the 'with the base plate' to fix the position of the conductive joint lock. Two or more via holes may be formed in contact with the inner layer of the conductor layer, or one or more via holes may be formed by the two or more via holes depending on the shape or type of the package substrate. No matter which of the above, the surface area of the foot can be increased, so it is effective for improving the joint strength. If the interlayer hole is provided, the organic layer having the opening portion of the foot is partially used. When the resin insulating layer is coated, the peeling of the foot can be surely prevented. In the invention of claim 24, the conductor layer on the core substrate is strongly adhered to the surface of the resin substrate on which the core substrate is formed by the roughened surface (matte surface), and As described above, the conductor layer and the pin are on the other side. When the pin is joined to the conductor layer of the inner layer by using one or more via holes and two or more via holes, the inner layer is The conductor layer can also be set on the core substrate of 2160-2888A-PF 15 Ϊ 282255. If the date and time of the 25th patent range is applied according to the towel, the connection pin can be shortened and the conductive connection pin is established. The other "reverse line length" on the opposite side of the side. Specifically, in the core substrate, the land is penetrated by the land and the resin filler filled in the through hole is connected to the pin by the via hole... the through hole is covered with the conductor layer. The cover plating can also be used to connect the pin to the pin via the via hole. Further, it can also be connected to the foot through the via hole only on the land of the through hole. In the invention of claim 32, the bonding strength of the conductive bonding agent is made stronger by 2·OKg/pin or more by making the melting point of the conductive adhesive 18 〇 to 2 sn 〇r C. This strength is reduced even after the heat resistance test such as thermal cycling or the heat application required at the time of mounting the Ic wafer. In the case of less than 18 (rc, the joint strength is still about 2.0 Kg/pin, but in this case only shows the degree. In addition, since T "曰μ, the heating of the cymbal shells leads to conduction. Sexually _dissolved, so the last _ electrical connection of the pin off, tilt.: In the case of more than 28G C, compared to the f-type bonding agent, the dissolution of the tree 曰 layer of the tree 曰 曰 insulation layer, Solder photoresist layer will be melted. The special / dish degree, 200 ~ 260 C. This is because the conductive bonding agent with this temperature can make the variation of the joint strength of the conductive joint lock less, and at the same time The applied heat does not damage the resin layer constituting the package substrate. The mixture is formed by at least one or more of tin, erroneous, recording, silver, gold, and copper to form a conductive joint having an upper n point. In particular, to 2160-2888A-PF 16 1282255, a conductive bonding agent containing less tin-lead or tin-bismuth can be formed within the above-mentioned melting point range. Therefore, even if it is melted by heat, it is easy to be solidified again, so it is not It will cause the conductive connecting pin to fall off and tilt. The above-mentioned conductive adhesives are tin/wrong, tin/recorded, tin/silver, tin/bismuth/lead alloys, especially the joint strength is 2 〇Kg/pin, and the deviation is small: even in the thermal cycle Under the condition or the heat of the ic chip is not installed, the bonding strength of the conductive connecting pin is not lowered, so that the pin is not peeled off and tilted, and the electrical connection is also ensured. According to the invention, since the bee waist portion having a diameter smaller than that of the other portions is provided in the columnar joint portion of the conductive joint lock, the lock can be easily bent. Therefore, when stress is applied to the conductive joint pin, 'The shore force can be absorbed by the bending of the bee waist of the joint so that the conductive joint (4) is not easily peeled off from the substrate. u In the conductive joint lock, the plate-like fixing portion and the projection are used. A so-called T-shaped pin which is attached to the columnar center of the plate-like fixing portion is suitable. The π-shaped/shaped fixing portion is fixed to the body layer forming the foot by a conductive adhesive. Part, it can be formed according to the shape. This , the connection department:: the size of the round or multi-angled core is used to mount the boring tool on the other substrate 'as long as the 疋 can insert the shape of the electronic love „ & the part is no problem, round shape , corner column type, cone type, pyramid type #tt 131 column lock is basically u, but the connection ^ is usually 1 «solid-loaded--the base i is in the conductive connection pin, Plate-shaped: fixed part-series: straight 〇 5~2. Omm's range is formed to be more than # · ', ^ two and the columnar connection is straight

2160-2888A-PF 1282255 杈 is 0·1~〇.8_, the length of the package substrate is required to be mounted. σ

Mmm is preferably formed; it can be appropriately selected according to the type of other substrates to be used, and the bee waist portion is provided in the form of the green portion of the green portion, and the middle portion of the '' Others, the material or conductivity of the connecting pin ^: Although the thickness of the part is due to the conductivity, the straight line must be different for the size of the connecting piece 4, but the diameter of the bee waist is greater than 1; : 5〇% or more and 98% or less. • If the 强 八 他 刀 刀 〇 〇 〇 小的 小的 小的 小的 小的 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; If the deformation is not enough, the straightness of the waist can be more than 98% of the diameter of the other parts. The absorption effect is given to the jointability of the joint, and the stress q) cannot be obtained. The bee waist can also be plural. To form (Fig. 33 = the material of the conductive connecting pin of the present invention, if it is a metal, the X limit of the 铋 can be selected from gold, silver, copper, nickel, cobalt, tin, bismuth " Made of metal. The iron alloy is made of the trade name "nickel-cobalt-iron alloy" and stainless steel, and copper. R糸 is preferably made of blue steel. This is because of the electrical properties of the above substances, and it is excellent in the workability as a conductive joint pin. Especially, because it has high flexibility, it is very suitable for use. Further, in the invention of claim 37, in the case where there is a positional error between the package base and the substrate, stress is applied to the conductive! By the winding of the bee waist of the connecting part

2160-2888A-PF 18 , 1282255 This stress is applied to prevent the conductive connection lock from being peeled off by the substrate, and becomes a package substrate of the <Lü Lai surface. The package substrate of claim 37 (4) may also be provided with an organic resin insulating layer provided with an opening portion for partially exposing the pin. As a result, even if stress concentration occurs in the conductive connection lock or deformation of the substrate occurs as described above, the foot can be prevented from being peeled off from the substrate because the foot is covered by the organic resin insulating layer. In particular, even if there is a so-called mutual difference between the metallic foot and the interlayer resin insulating layer, it is difficult to obtain sufficient bonding force, and the surface of the foot can be made of an organic resin insulating layer. It can be covered to give it a high peel strength. When the foot is covered with an organic resin insulating layer, it is important to make the size of the chatter position such that the opening of the organic resin insulating layer which is located at the foot is slightly larger, thereby making it possible to partially position the foot from the opening. Exposed. That is, the edges of the feet are covered by an organic resin insulating layer. The size of the foot is preferably L100 times the diameter of the opening of the organic resin insulating layer exposing the position of the bowl. If the diameter of the foot is less than u2 times the diameter of the opening, the periphery of the foot cannot be reliably removed by the organic resin insulating layer, so that peeling of the conductive connecting pin cannot be prevented. On the other hand, if it is greater than: times, it will impair the opening of the high-density insulating layer of the conductor layer: ==2, when the diameter of the organic resin is U0 side 〇". When 〇〇~1500 (four), then the foot

镞夕拉表如, -1 Yunyun, the bee 哞 上 上 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈 戈The hole is joined to the conductor layer of the inner layer, 2160-2888A-PF = Lai Qing Fu Cai 1 Soil squid (4) The performance is 1282255. Therefore, the effect of the absorption stress can be increased by the easy connection of the conductive connection pin. And the connection between the foot and the substrate is strongly bonded. In addition, as the above, the product is also increased, so that the two can be said to be the same as the resin insulation layer of the interlayer of the conductive pin in the patent application range and the layer of the resin. The case where the material is joined and the foot in the invention shown in the scope of the present application is connected to the guide layer of the inner layer. Therefore, it is said that both of them are metal and continue to adhere to each other, so that the adhesion can be more surely adhered and the peeling strength of the foot can be improved. In addition, the foot can also be connected to the inner conductor layer by more than one via hole. Thereby, the joint area of the foot can be further increased, and 2 can form a structure which is less likely to be peeled off. Further, when the pin is placed in the conductor layer of the inner layer by the via hole, if the via hole is disposed in the peripheral portion of the pin, it is effective in improving the continuity. Therefore, the via hole can also be formed into an annular shape, and the foot can be set by covering the ring. " Further, in the laminated substrate, the pin to which the conductive connection is fixed may be formed by connecting the interlayer layers of the inner layer with the via holes of two or more layers, or may be based on the package substrate The shape or type is constituted by a plurality of via holes of the two or more via holes. No matter which of the above, the surface area of the foot can be increased, so it is effective for improving the joint strength. When the via hole provided with the pin is covered with the organic resin insulating layer having the opening portion through which the pin portion is partially provided, the peeling of the foot can be surely prevented. - a - the invention of the 42nd aspect, wherein a jg-presence conductor layer of the core is strongly adhered to the surface of the resin substrate on which the core substrate is formed by the roughened surface (matte surface), The conductor layer as described above is connected to the pin 2160-2888A-'PF 20 1282255, so that the pin position is not easily peeled off by the interlayer resin insulating layer. Further, when the pin is bonded to the conductor layer of the inner layer by one or more via holes and two or more via holes, the conductor layer of the inner layer may be formed on the core substrate. ° - In accordance with the invention of claim 43 of the patent application, the length of the line between the electrically conductive connection lock and the other substrate on the opposite side of the side where the conductive connection pin is set can be shortened. Specifically, in the core substrate, the land is formed on the periphery of the through hole and the resin filler filled in the through hole is connected to the pin by interposing the layer hole. Further, the through hole is covered with a conductor layer to perform so-called overcoat plating, and the conductor layer is connected to the pin by a via hole. The further step can also be connected to the foot only in the land of the through hole. Thick hole ^ In the invention of claim 50, the melting point of the conductive adhesive is 180 to 28 (TC to ensure the bonding strength with the conductive connecting pin is 2. OKg/pin or more. Even after the reliability test such as thermal cycling or the heat application required at the time of mounting on the IC chip, the intensity is reduced only a little. Under the condition of less than 18 〇t, the bonding strength is still 2· OKg/pin纟纟, but in this case, only 1.5Kg/pin is exhibited. In addition, since 1 (the heating during wafer mounting leads to the dissolution of the conductive adhesive, it eventually causes conduction). The detachment lock is tilted and tilted. If it exceeds 28 (in the case of rc, the conductive adhesive of the resin layer and the tin tin resist layer can be combined with respect to the dissolution temperature of the conductive bonding agent. The variation in the joint strength of the conductive joint lock is reduced, and the actual applied heat does not cause damage to the resin layer 2160-2888A'-PF οη 1282255 constituting the package substrate. In the invention of claim 51 By using a conductive joint sword with tin Conductive bonding agent having the above melting point can be formed by forming at least one of at least one of erbium, strontium, silver, total, and non-fish copper. In particular, a conductive bonding agent containing at least tin-lead or tin-bismuth It can be formed within the above-mentioned melting point range. Therefore, even if it is dissolved by heat, it is easily solidified again, so that the conductive connecting pin does not fall off or tilt.

Since the above-mentioned conductive adhesive is an alloy of tin/wrong, tin/bismuth, tin/silver, tin/bismuth/lead, especially the joint strength is up to 20 Kg/pin, and the deviation is small, so even in the thermal cycle condition The heat during the mounting of the τ or IC chip does not reduce the bonding strength of the conductive connecting pins, so that the pins are not peeled off and tilted, and the electrical connection can be ensured. In the scope of claims 53 and 54, the flat layer of the conductor layer is disposed on the surface of the substrate, and the conductive connection pin is directly connected on the flat layer to reduce the external substrate (for example, the daughter board). The resistance to the flat layer. Thereby, it is possible to supply electric power from the sub-board side so that the flat layer constituting the power supply layer can perform a sufficient function. Further, in the flat layer constituting the ground layer, it can be connected to the ground line on the side of the sub-board by a low-resistance conductive connecting pin to sufficiently prevent noise. In addition, the flat layer can also be formed as a mesh W•. The mesh is formed by arranging a square or circular conductor without forming a portion (see Fig. 5). Further, in the invention of claim 56, the organic resin insulating layer of the solid portion is covered. Therefore, when the package substrate is mounted on another substrate such as a mother board by the conductive connection pin, even if 2160-2888A-PF 22 1282255 exists between, for example, the insertion of the conductive connection pin and the mother board, Position error causes stress to be applied to the conductive connecting pin, or under various heat treatment conditions of thermal cycling, and f-curve is generated on the substrate: the lower ',,, and The insulating cover is pressed to prevent it from being peeled off from the substrate. In particular, even in the case where the metal-like pin and the interlayer resin insulating layer of completely different materials are bonded to each other and it is difficult to obtain a sufficient bonding force, the peeling strength by the coverage of the organic resin insulating layer from the surface of the foot can be obtained. . The invention of the eightth application patent item 57 is made by applying a stress to a conductive connecting pin which is free from copper or a copper alloy or at least one metal selected from the group consisting of metal. The stress is absorbed by the deflection at the time of pinning, so that the conductive connecting pin is not easily used by the substrate: it is suitable for the copper alloy used in the conductive connecting pin. This is because it is excellent not only in flexibility but also in electrical characteristics, and is also excellent in workability as a conductive joint lock. In the conductive connecting pin, a T-shaped pin which is formed by a plate-like fixing portion and a columnar connecting portion which is provided at a center position of the plate-shaped fixing portion is preferably used. The plate-shaped fixing portion is fixed to a portion of the conductor layer forming the foot by a conductive adhesive, and can be appropriately formed in a circular shape or a polygonal shape depending on the size of the foot. In addition, there is no problem with the shape of the joint, and the shape of the other substrate can be inserted into the cylindrical shape, the 11-cone type, the pyramid type, and the like in the cylindrical shape. The splicing portion is appropriately formed for one of the normal positions, which is substantially "for" - but for the other substrate of the other genre. Omm的范围in $ In the case of the conductive splicing pin, the diameter of the splicing portion is 2160-2888A-PF 23 1282255 〇·ι~〇.8, the length is preferably; the diameter is 0. 5~2. The solid part of m is selected by the type of other substrates to be assembled, etc. = the size of the bit can be set according to the column-shaped joint to be renewed in the 58th article of the patent application scope. X:!: With some parts of it, it can give the pin easy to bend. Therefore, the straight = small bee waist 1 is connected, and when the rhyme is on, the force can be absorbed by the f-bend of the bee waist of the connecting portion so that the conductive connecting pin is not easily peeled off from the substrate. On the other hand, in the conductive connecting pin, a so-called T-shaped pin which is fixed to the plate-like fixing portion by a plate shape is used. The plate-shaped fixing portion formed by the columnar joint portion at the center position is appropriately formed in a circular shape or a multi-bird shape by being fixed to the size of the foot position based on the position of the foot. In addition, the connection is used to mount the package on other substrates as long as it can be inserted into the electronic component, such as the % type, the prism type, the conical type, and the pyramid type. Question, the cylinder can be used with the cone type #. The number of the joints is usually one in j (four), but there are no particular problems in setting two or more, and it can be appropriately formed in accordance with other substrates that are attached. In the conductive connecting pin, the plate-shaped fixing portion is preferably formed in a range of 5 to 2. 〇 mm in diameter; and the column-shaped connecting portion is formed by a diameter of OH 8 mm and a length of Preferably, it can be appropriately selected according to the type of the package substrate to be fixed or the other substrate to be assembled, etc. _________________ The waist portion of the bee is disposed in the middle portion of the splicing portion, and is thinner than the other portions. Form to form. The thickness of the bee waist may vary depending on the size of the conductive 2160-2888A-PF 24 1282255 or the conductive connecting pin, but the strength of the 5th part of the bee diameter may change; If the diameter is 5°, then the ^.v will not be enough. The package substrate will be deformed when it is assembled. If the diameter of the bee waist exceeds 98% of the diameter of other parts, the discount =: :T: The continuation is expected to be flexible, and the stress cannot be obtained. The waist of the bee can also be formed in plural. The material of the conductive connecting pin of the present invention is selected from gold, silver, copper, recorded, and Ming. , tin, 4 to) one or more kinds of metals are formed. The iron alloy is sold under the trade name of ovar" (nickel iron alloy) and not (four) = preferred material is disc green steel. This is because the electrical properties of the above-mentioned material f are excellent in the workability as a conductive connecting pin. It is used for the purpose of stress absorbing. "The degree of recyclability, it is very suitable for use in the invention of the 59th patent range, by making the refining point of the conductive connector to be 28 generations to ensure the continuity with the conductivity. The bonding strength is above 2.0 Kg/pin. This strength is reduced only a little after the heat transfer test such as thermal cycling or the heat application required for mounting on the IC wafer. In the case of less than 18 ,, the joint strength is still 2. 〇Kg/pin or so but in this case only shows: h5Kg/pin. In addition, the heating of the 1C wafer during installation will prevent the lock from falling off and tilting. If it exceeds 28 (in the case of rc, the resin insulation layer and the solder resist layer of the resin layer are melted away from the resin layer and the solder resist layer of the resin layer). The temperature is particularly good. 2160-2888A-PF 25 1282255 It is 200 to 260t: This is because the temperature: the conductive bonding agent can reduce the bonding strength of the conductive bonding lock to a small amount, and the actual applied heat does not damage the resin sound constituting the package substrate. In the invention of claim 60, the conductive bonding agent is formed by at least j or more of tin, lead, antimony, silver, gold, and copper, thereby forming a conductive layer having the above melting point. A bonding agent, in particular, a conductive bonding agent containing at least tin-lead or tin-bismuth, which can be formed in the above-mentioned melting point, so that it is easily re-solidified even if it is dissolved by heat, so that it does not cause conductivity. The detachable pin is detached and tilted. Since the above-mentioned conductive adhesive is an alloy of tin/lead, tin/bismuth, tin/silver, tin/bismuth/lead, especially the joint strength is 2. 〇Kg/pin, the deviation It is also small, so even under thermal cycling conditions or 丨c. The heat of the wafer is not installed: the bonding strength of the conductive connecting pin is reduced, so that the pin does not fall and tilt, and the electrical connection can be ensured. On the other hand, in order to cope with the above problem Therefore, it was found that the crack and the position of the BGA were found to be cracked and broken by the metal plating layer and the metal electric ore layer and the joint portion of the β. It is known that the heat at the time of the compaction at the time of mounting is known. The stress is generated at a time when the stress exceeds (10) hours under the circulatory conditions of the high-temperature and low-temperature repeated operation of the continuation test. For this reason, it is considered that the joint area of the opening of the BGA and the solder resist is very large. Small, so the stress is easy to concentrate. In addition, because the joint area is small, -------------------------i-〇--___________ As a result of the review, it is proposed to dispose the 2160-2888A-PF 26 1282255 PGA in the opening of the solder and the photoresist layer by a conductive adhesive layer instead of the BGA. More joint area than BGA, so stress is not The assembly order does not cause cracks or damage at the joint interface. In addition, the joint strength is high and the connection to the external substrate is not bad. Even, since the through hole for the PGA is not formed, it can be disposed under the pGA. The circuit can maintain the same design freedom as the BGA. In addition, the method of arranging the bump pins can be performed by forming a recess around the opening of the solder resist layer and then inserting the pin into the recess; The lifting pin is disposed by a metal layer or a conductive bonding agent layer.

Further, not only the opening but also the connection between the conductor and the conductor circuit can be obtained by the recess. According to the electrical connection obtained as described above, even if the electrical and electrical signals for the Otani 1 do not malfunction, they can be transmitted to the external substrate. Although the opening of the gentleman must be electrically connected to the conductor circuit of the inner substrate, when the recess is formed around the opening, the recess is not required to take electrical connection, but the conductor circuit may be used if necessary. Get electrical continuity. The following is a preferred embodiment of the invention. The opening σ portion of the solder resist layer is formed to have a diameter i(10)~_^. If it is less than 1 00 // m, the bonding strength of the protruding pins will decrease; if it exceeds 〇V, m, the advantages of connecting the external substrates in the wafer mounting will cancel each other out, and the periphery of the opening will be established. The opening portion of the projecting pin is preferably formed at 120 to 800 // m when the recess is used. After ~~1"------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ In particular, in order to increase the bonding strength of the bump pin to the solder resist, the diameter of the recess is

2160-2888A-PF 27 1282255 25~7—, and “~8 are diagonally arranged to be better. ^ Bu Xiao σ '^ and the concave portion are preferably formed into a circular shape. The method of forming a phenomenon such as a corner crack of the opening portion is wide. In other shapes, it may be a polygon or an ellipse. The opening of the temple and the formation of the recess may utilize light, thunder. It is preferably formed by a method such as a dnll and a punching. It is preferable to form the light of the portion and the concave portion at the same time. When the gold is formed in the opening, the concave portion can be formed by _. It is also possible to form a metal layer on the conductor circuit exposed by the opening. The layer can be selected from gold, silver, nickel, tin, copper, Ming, wrong, scale, final: crane, turn, titanium, platinum, solder, etc. It is preferable that at least one or more kinds of substances in the metal are formed into a crucible, and it is preferable to form a metal layer by using gold, silver, tin, or recording. The reason is that the conductor circuit is exposed to corrosion because the metal is excellent in recording resistance. The metal layer can be used alone or in a single metal as described above. Alloys with other metals. The metal layer can also be laminated to two or more layers. In the method of forming the metal layer, electroless plating, electrolytic clock, substitution plating, (4), steaming, etc. can be used. The uniformity of the film and the cheaper viewpoint are to use solder, hard fresh material, and particulate matter to form a preferred 0-conductive adhesive layer by electroless plating. With the [snow rabbit secret marriage to form. If the car here is viewed from the above materials, then the layer is best formed by using solder. The reason is that the joint strength can be easily improved, and the formation method 2160- 2888A-PF 28 1282255 is widely used. When the conductive adhesive layer is formed of solder, the tin-based tin is used: the tin used in the general printed substrate: wrong = 1:9~4:6 Good 0 solder can also use lead-free components such as tin/bismuth, anchor tin/silver, tin/silver/copper. The reason is to make the environment better and to ensure the bonding strength. The formation method can be used by printing. , bottling method (__), photoresist button engraving, electroplating, etc., and buried in the open armor The layer of the layer of the material layer can be used to form a soldering layer by soldering the bonding surface of the bump-shaped lock, and then heat-dissolving to form a solder layer. When it is used, it is made of metal, such as gold, silver, steel, ortho, nickel, palladium, zinc, indium bismuth, etc., and θ ^ , which is specially used for the use of silver welding materials and gold welding materials. The welding material of the day/day is better. In the method of hard recording and hard unloading, it is possible to use the second method: the brazing material is placed in the opening to be melted to form the bonding method. Use a method of applying a coating other than the opening and then dipping it to fill the opening: °° or using a bonding surface of the convex metal electrode to re-heat, (4) and insert it into the opening: :: In addition to the above-mentioned methods, it is also possible to use all of the general-purpose:; in the case of a particulate matter and a sputum, the 'particles f', = thermosetting tree wax shape., mi -ϋ~HU is selected from at least ^^r:s among metal particles, non-silk, and tree-shaped particles. It can be used in the case of particulate matter. Copper, gold, silver,

2160-2888A-PF 29 *1282255 A metal such as nickel, aluminum, titanium, chromium, tin, lead, palladium or platinum (platina), which may be a single metal or a combination of two or more alloys. The shape of the metal particles is a spherical shape, a polyhedron, a mixture of a spherical shape and a polyhedron, and the like. As the inorganic particles of the particulate matter, it is possible to use silica dioxide, oxidized infusion, mu 1 1 i t e , carbonized second or the like. The shape of the inorganic particles is a spherical shape, a polyhedron, a porous body, a mixture of a spherical shape and an evening body, and the like. The inorganic particles can be made conductive by coating a conductive material such as a metal layer or a conductive resin on the surface layer. It is preferable that the resin particles of the particulate material are at least a component selected from the group consisting of epoxy resin, benzoguanamine resin, and amine resin. Further, it may be formed using a conductive resin such as an anisotropic conductive resin. The resin particles can be made electrically conductive by coating a conductive material such as metal I or a conductive resin on the surface layer. In particular, it is preferred to use an epoxy resin. The reason for this is that the adhesion to the resin to be formed is good, and the coefficient of linear expansion is also very close, so that no crack is generated in the resin to be formed. Here, the diameter of the above-mentioned metal particles, inorganic particles or resin particles is preferably from 0.1 to 5 Mm. If the particle size is less than 〇1 ", it is easy to conduct electricity; if the particle size exceeds 5Mm, it is used when filling the opening, and the filling rate of the above-mentioned metal particles or T particles is relative to the total amount. It is tied at 3 〇, weight " : Xi 1_heavy-quantity" is far from the agricultural seams ^ search - for the upper splicing and second sequel; if more than 9"% ^ and the protruding pin joint strength will be reduced: eight people fill the resin in the opening In terms of heat, you can use heat

2160-2888A-PF 30 1282255 Resin, thermoplastic resin. The thermosetting resin may be at least one selected from the group consisting of a cyclic resin, a polyimide resin, a polyester resin, and a benzene resin. In the case of a thermoplastic resin, an epoxy resin, a polytetramethylene (PTFE), a tetrafluoroethylene hexafluoropropylene copolymer (FEp), a tetrafluoroethylene perfluoroalkoxy co-polymer ( Fluorine resin such as PFA), and polyethylene terephthalate (PET), polyfluorene (PSF), polyphenylene (pps), polyphenylene ether (PPE), polyether oxime (PES), At least a resin of polyetherimide (pEI), polyphenylene sulfide (PPES), polyethylene terephthalate (ρΕΝ), polyetheretherketone (ρΕΕκ), or polyolefin resin. In particular, the @帛适 resin used in the filling of the &1 mouth is an epoxy resin. The reason for this is that the viscosity can be adjusted without using a diluent solvent, and it is excellent in high strength, richness, and chemical resistance. The resin may be filled with an organic solvent, a water component, an additive, a particle, or the like for viscosity adjustment. The particulate matter and the filled resin were stirred by a mixer to make the particles in the resin uniform, and then filled into the opening. When a thermosetting resin is used, it is filled into the opening by printing or bottling. After the crucible, the projecting pins are inserted and then thermally hardened to join. In order to exclude the air in the tree sap, "squeezing, gaps, excess solvent components, etc., vacuum decompression and vacuum defoaming may be performed before thermal hardening.

When a thermoplastic resin is used, it is first formed into a sheet shape and then inserted into a wei-n Ρ-- or after the above-mentioned sheet is joined on a convex pin-joining surface, heating, melting, and then again The opening is inserted into the boss pin. 2160-2888A-PF 31 1282255 * The raised lock is basically raised! In the case where the branch is more than 2 or more, it can be arranged side by side, or it can be arranged around the circumference of the I branch. In the shape of a bulge, the circumference of the 々 has a ® cone, a cylinder, a quadrangular pyramid, an eccentric body, etc., but regardless of the shape, only the shape of the joint portion of the substrate can be used. d f is externally formed by the convex height of the above-mentioned convex pin. The ratio of the diameters in the range of 5 to 50 / / Π 1 is preferably 0.5 to U. In particular, if it is formed, the joint work with the opening portion is _彳| T矹S Ai Zi is better than the valley, and the above convex (3) is easier to stand at a right angle to the opening. /, Aspect 'The joint surface may be smooth or may be a convex portion. In other words, when the concave portion is formed around the opening portion, the pin-shaped convex portion can be formed on the joint surface to increase the joint strength of the pin. It is better to use sighs to form metals that are selected from gold, silver, iron, copper, bronze, quartz, iron, and iron. In particular, iron, an all-copper alloy or the like is preferred. The reason for this is, for example, a ferroalloy of a ferroalloy (four) alloy, etc., which are both made of an OGA lock and are also suitable for use in various types of processing. The above-mentioned convex pin can be shaped by a variety of metals and alloys, and can be covered with gold, mother, and can be coated with a metal layer of 楹Gula + nickel for corrosion protection. The strength of the agent and the sound of the bells and the cylinders" Ping Zhu Temple in the temperature below 250 C - Ik - 曰 I I ^ ^ plus the Ministry of metal formation, six see this two (four) 』 all-- "electric An insulator material such as a metal is molded and then coated thereon

2160-2888A-PF 32 1282255 The upper metal layer is electrically conductive. In the present invention, the above-mentioned conductive adhesive layer, the mountable, and the convex pin are formed, and the opening resist layer of the solder resist is formed, and the convex pin which can be fitted is formed. However, the :::: is inserted into the connection portion of the external substrate so that the circuit formed on the package substrate and the external substrate can be electrically connected. Since the boss-shaped lock is formed in a structure in which the joint portion of the external substrate is inserted, when the press-fit is performed on the outer substrate, since the stress concentration of the lock-up lock can be alleviated, the projection can be prevented from being placed. The conductor circuit of the pin is cracked or damaged. Further improvement, compared with the substrate on which the BGA is disposed, since the bonding area between the pGA and the interface W layer is large, the convex pin itself and the mounting portion are not cracked even if the surface is too small under thermal cycling conditions. [Destruction] [First Embodiment] A package substrate and a method of manufacturing a laminated substrate according to the first embodiment will be described with reference to Figs. 1 to 8 . In the following method, a half-layered (·addi t i ve) method can be used, or a full-force layer (f u 11-addi t ve) method can be used. (1) First, the core substrate 1 on which the conductor layer has been formed on the surface of the substrate is formed. In the core substrate, a copper-clad laminate in which copper foil 8 is attached to both surfaces of a resin-impregnated substrate such as a glass epoxy substrate, a polyimide substrate, or a dust-proof substrate can be used (see FIG. )). One surface of the copper foil 8 is formed into a roughened surface (rough surface) to be strongly adhered to the resin substrate. On the substrate, a through hole is formed by a drill on 2160-2888A-PF 33 1282255, and then electroless plating is applied to form a through hole 9. In the case of electroless plating, copper plating is preferred. Next, a plating resist is formed, and an etching treatment is applied to form the conductor layer 4. Further, in order to cause a thick coating of the copper foil, the electric current can be further supplied. The electroplating plating is also preferably performed by copper plating. Further, after the electroplating, the surface of the conductor layer 4 and the inner wall surface of the through hole 9 may be regarded as the rough faces 4a and 9a (see Fig. 1(b)). In the roughening treatment, for example, blackening (reaction at the redox site, spray washing treatment using a mixed aqueous solution of an organic acid and a second copper complex, and needle-shaped alloy plating using copper-nickel-phosphorus) Next, the obtained substrate is washed with water and then dried. Thereafter, the resin filler 10 is filled between the conductor layers 4 on the surface of the substrate and within the through hole 9, and dried (Fig. 1 (c) Then) 'Using a belt sander or the like to remove excess resin filler on both sides of the substrate to expose the conductor layer 4 and harden the resin filler. By connecting the conductor layers 4 with The recessed portion in the through hole 9 is filled to smooth the substrate (see Fig. 1(d)). Next, a rough layer u is formed on the surface of the exposed conductor layer 4 (see Fig. 2 (a) In addition, the portion shown by the circle in Fig. 2(a) is an enlarged display of the conductor layer 4 in which the roughened layer 11 has been established. The rough layer U is used to utilize the previous The copper-nickel-phosphorus needle-like or porous alloy layer is preferably formed, but other Blackening (oxidation)_reduction treatment> + ^Winter needle-shaped or porous alloy layer is used to use Miaoyuan: "...bu; quotient-product name 7 > Xiyi ^- Bu" is preferred; 2160-2888A-PF 34 1282255 is preferably sold under the trade name "MEC etch B〇nd" manufactured by MAKE Co., Ltd. (2) on both sides of the wiring substrate having the conductor layer 4 made of the above (1). The resin insulating layer 2 composed of the resin layers 2a and 2b is formed (see Fig. 2(1)). The function of the resin insulating layer 2 is an interlayer resin insulating layer 52 used as a package substrate as will be described later. The constituent material of the resin insulating layer (hereinafter referred to as the interlayer resin insulating layer 52) may, for example, be a thermosetting resin, a thermoplastic resin or a composite resin such as the above. The interlayer resin insulating layer 2 is made of electroless plating. The adhesive for electroless plating is obtained by dispersing heat-resistant resin particles which are soluble in the hardened acid or oxidizing agent in an uncured heat-resistant resin which is poorly soluble in an acid or an oxidizing agent. Most suitable. Use as after In the treatment of the acid and the oxidizing agent solution, the heat-resistant resin particles are dissolved and removed, and a roughened surface composed of a stripe-shaped anchor can be formed on the surface. Among the above-mentioned electroless plating adhesives, The heat-resistant resin particles which have been subjected to the hardening treatment are a heat-resistant resin powder having an average particle diameter of 1 〇 #m or less; 2 a particle having a relatively large average particle diameter and particles having a relatively small average particle diameter; The particles are preferably formed because a complex adhesion-promoting layer can be formed by the above conditions. Examples of the heat-resistant resin that can be used include epoxy resin (double type A epoxy resin, cresol novolac) Solids (cres〇; ln〇valak type epoxy resin, etc.), polyethylamine resin and epoxy resin and thermoplastic resin complex - Quanfu. etc. - 丄复可龙 can see polyether - (PES) Polypyrene (PSF), polyphenylene ruthenium (pps), polyphenylene sulfide (ppEs) ^ polyphenylene (PPE) and polyetherimide (pi). In addition, in the case of heat-resistant resin particles dissolved in an acid or oxidized 2160-2888A-PF 35 1282255 solution, it is possible to use an amine-based enamel epoxy resin (a special amine-based hardener). To harden the epoxy resin is better), ammonia resin; polyethylene-based rubber 'polybutane rubber 2 and polybutylene, ί* 嫱 j 一 橡胶 橡胶 橡胶 橡胶 橡胶 橡胶 橡胶 橡胶 橡胶 橡胶 橡胶 橡胶 橡胶 橡胶 橡胶. The interlayer insulating cloth, the resin film are heated and pressed, and the like. For the stomach to be coated with the target, it is possible to use a resin which can make the scent of the scent of the scented scent (hereinafter referred to as soluble particles). Hereinafter, in the case of a poorly soluble resin or an oxidizing agent, in the case of "丄"::: two "poorly soluble" and "soluble", for the sake of convenience, "the same as the π bubble in the sputum liquid," is convenient. For example, 'relatively faster dissolution rate is called ' ♦ sex J, and the relative dissolution rate is slower. For the above soluble particles, = is a soluble tree t + f, +. In the acid or oxidant Wangzhishu It is known that particles (hereinafter referred to as "soluble in soluble oxidant", in acid or in acid or oxidizing agent, and in "human acid to cold 11 inorganic resin" resin particles). The above-mentioned: genus particles (hereinafter referred to as soluble species and above combined methods. The read particles may be singly singly or smashed, and the above-mentioned soluble particles may be smashed or broken, etc. Further, upper/outer/specially limited, for example For example, the ball is preferred because the shape of the stalker grain particles is the same as each other to form a roughened surface with a degree of unevenness. - Preferably: if:::: grain: the average particle size, phase It is also possible to contain two or more kinds of particles having a particle size, that is, a soluble particle having an average particle size and an average particle diameter of 可^, which can be formed.

2160-2888A-PF 36 1282255 More complex roughened surface, and also very good in adhesion to the conductor circuit. Further, in the present invention, the particle diameter of the soluble particles means the solubility: the length of the longest portion of the sub-portion. In the above-mentioned soluble resin particles, for example, a thermosetting resin or a thermoplastic resin is used, and when it is immersed in a solution composed of an acid or an oxidizing agent, the dissolution rate is faster than the above-mentioned poorly soluble resin. It is not specifically limited. Specific examples of the above-mentioned soluble resin particles include, for example, an epoxy resin, a benzene, a polyimide resin, a polyphenylene resin, a polyolefin resin, and a fluorine resin. Such as the composition, and can be from the above resin! The composition of the species may be a mixture of two or more types of trees. Further, as the above-mentioned soluble resin particles, resin particles composed of rubber can be used. Examples of the above rubber may include polybutadiene, rubber, epoxy modified, urethanekf, (meth) acrylonitrile modified, various modified polybutadiene rubber; carboxyl group-containing The (meth) acrylonitrile, butyl rubber, etc. By using the above-mentioned rubber, the soluble resin particles can be easily dissolved in an acid or an oxidizing agent, that is, the acid resin is used to dissolve the soluble resin particles. In the case of using an acid other than a strong acid, it can be dissolved. When an oxidizing agent is used to dissolve the soluble resin particles, even a permanganic acid having a weak oxidizing power can be dissolved. Further, even when chromic acid is used. Further, it can be dissolved at a low concentration. Therefore, the acid or oxygen table 1 can be described later, and when the roughened surface is formed and the catalyst such as palladium chloride is added, the catalyst side does not occur. 2160-2888A-PF 37 I282255, the z-capable inorganic particles, can be used as a compound, a dance compound, a potassium compound, and a town: for example, choose a free group Particle 1 and Shi Xi, composed of at least one species The compound is composed of the above-mentioned aluminum compound, etc., and the above-mentioned (tetra) compound may be exemplified by oxidative saturation, ammoxidation, etc.; in the case of the above potassium compound, carbon_, hydrogen and oxygen (tetra) magnesiumation Humans; ^ a phantom such as potassium carbonate; etc.; to the above, "for example, such as: magnesium oxide test shirt, etc., in the above dream compound;: two), strontium, zeolite (zeolite), etc. The above-mentioned chylomicron is used in combination. The shellfish may be used alone or in combination, and two or more kinds of bismuth soluble metal particles may be used, for example, a group consisting of free copper, group/mm 1 and Shi Xi... In addition, the surface layer may be coated with a resin or the like in order to ensure the insulating properties of the above-mentioned spheroidal metal particles. The soluble particles may be mixed in two or more kinds, and the mixture may be mixed. The combination of the clofiable particles is based on the resin particles and the inorganic particles, and the mouth is relatively thin. This is because the conductivity of both is low, so that the resin film spoon, and the edge of the resin can be ensured. Shou also because it is easy to adjust between the poorly soluble resin Since it expands, no crack occurs in the interlayer resin insulating layer composed of the resin film, and peeling does not occur between the interlayer resin insulating layer and the conductor circuit. The shape in which the roughened surface can be maintained in the layer m when the roughened surface is formed by using an acid or an oxidizing agent is not particularly limited, for example, thermosetting resin, thermoplastic resin, and 2160-2888A-PF 38 1282255 Λ 4 In addition, it is also possible to impart a photosensitive resin capable of imparting the above-mentioned, etc., by using a photosensitive resin, it is possible to use an exposure on the insulating layer of the sound n-tree.曰 ^ ^ ^ ^ 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖. After the heat treatment, the shape of the roughened surface can be maintained as a specific example of the above-mentioned poorly-soluble resin, and phenol can be used, for example, epoxy resin and resin-containing resin, polyphenylene resin, and __; The above-mentioned resin may be used singly or in combination of two or more kinds of I/steps, and it is more preferable if it is an oleoresin having two or more epoxides in one molecule. Because it is excellent in the resistance to education, such as h Μ 返, and rK_一::. is also very good, even in the thermal cycle ea cycle) will not ti ± n Λ - concentration - The shape is formed, so it is not easy to cause the peeling of the metal layer. "month

For the production of gas, the epoxy resin can be exemplified by a type of solid-state type mechanical moon, a double-type epoxy resin, and a double-aged F =: ?-k) epoxy resin and a base. Epoxides of benzene di-pivalanyl resin, diphenyl fluorene type F epoxy resin, nematic epoxy resin, oxygen resin, benzene age and '% compound of aromatic vector-4 with stupid base , three, _ ^ 贰 义 义 虱 虱 以及 以及 and: two: coffee and so on. These may be used singly or in combination of two. Thereby, heat resistance and the like can be made excellent.匕 匕 1 1 2 -> 1 / 谷 τ king fox: and: the ground is dispersed in the above-mentioned poorly soluble resin is preferred. This is "for: a roughened surface with a uniform rough rotation, to ensure that it is soluble in the resin thin area." _ ..... 39

2160-2888A-PF J282255 Adhesion between the via hole or through hole formed on the film and the layer on the 1 layer. / Forming the v-body circuit gold The resin film containing the soluble L only in the surface portion a of the roughened surface is used. Therefore, since the tree can be made into a film: (4): (4) It is not exposed to an acid or an oxidizing agent, so 22: μ is insulative between the conductor circuits between the interlayer resin insulating layers. In the fat film of the product, the soluble particle in the poorly soluble resin is 3 to 4 Å in the right side of the resin film. If the amount of the particles is less than 3% by weight, the shape cannot be formed. a roughened surface of the unevenness; if it exceeds 4% by weight, the conductor which is finally dissolved in the bottom of the resin film when the soluble particles are dissolved by the acid or the oxidizing agent, so that the interlayer resin insulating layer composed of the resin film is interposed The insulation cannot be maintained between the circuits, thus causing a short circuit. The resin film preferably contains a curing agent and other components in addition to the above-mentioned soluble particles and the above-mentioned poorly soluble dendrimer. The hardening agent may, for example, be an imidazole curing agent, an amine curing agent, a gUanidine curing agent, an epoxy addition compound of the above curing agent, or a microcapsule of the above curing agent, or a triphenyl group. A ruthenium-based compound such as ruthenium, tetraphenylphosphonium tetraphenyl borate or the like. The content of the above-mentioned curing agent is preferably from 5% to 10% by weight based on the resin film. If it is less than 0.05% by weight, the curing of the resin film is insufficient. Therefore, the degree of penetration of the acid or the oxidizing agent into the resin film is increased, and the insulating property of the resin film is impaired. On the other hand, if the excess hardener-a exceeding i 〇 -heavy-奚~^- changes the composition of the resin, and finally the reliability is lowered. The other components mentioned above may, for example, be an inorganic compound or a filler such as a resin which does not affect the roughened surface of 2160-2888A-PF 40 1282255. The inorganic compound may, for example, be cerium oxide, aluminum oxide or dolomite; and in the case of the above resin, y1, ox, polyimine resin, polypropylene resin, polyamine: eucalyptus , phenylene resin, melamine resin, olefin resin, and the like. Hunting 3 allows the above-mentioned filler to improve the thermal expansion coefficient and improve the heat resistance and chemical resistance, thereby improving the performance of the printed wiring board. . The above resin film may also contain a solvent as 1 = 1. In the case of the above solvents, ketones such as acetone, methyl ethyl ketone, cyclohexenone, etc.; _ acetoacetate, butyl acetate, glycerol ethyl acetate (cellosolve acetate) Or an aromatic hydrocarbon such as toluene or xylene. These may be used singly or in combination of two or more. The above-mentioned substance is applied by a roll coater, a curtain coater or the like to form a semi-hardened film. (3) Next, a via hole forming opening 6 for ensuring electrical connection with the conductor layer 4 is provided on the interlayer resin insulating layer 2 (see Fig. 2 (◦)). In the case of using the above-mentioned adhesive for electroless plating, a mask having a circular pattern for forming a via hole is formed by spring, and then an opening 6 is formed by thermal hardening after exposure and development treatment. On the other hand, when a thermosetting resin is used, an opening 6 for a via hole is formed on the interlayer insulating layer by laser processing after thermal curing. Further, in the case where a resin film is attached to form an interlayer insulating layer, it is processed by using a laser such as carbonic acid, YAG, liquid strontium magnesium, UV laser or the like to provide --------- The layer-fkl-two-check and the second-worry _ can be subjected to a desmear treatment by an impregnation method using a suspected acid or the like or a dry etching method using a plasma or the like. 2160-2888A-PF 41 1282255) Next, the interlayer tree wax/# surface of the opening for forming the via hole 6 is roughened (see Fig. 2 (4)). Inter-layer resin insulation: When an adhesive for electroless plating is used, 'there is no electrolysis on the side, and the thermal resin particles on the surface of the U-use adhesive layer are removed by acid or oxidant to remove the 'electrolytic The surface of the adhesive layer 2 for the electric clock has the purpose of forming a stripe-shaped adhesion-promoting layer. Here, as the above acid, for example, a strong acid such as linonic acid, hydrochloric acid, sulfur = or the like, or an organic m such as formic acid or acetic acid can be preferably used in particular. This is because the metal conductor layer 4 exposed by the opening 6 of the via hole is less likely to be corroded when the roughening treatment is performed. In the case of the above oxidizing agent, an aqueous solution using a complex acid or a perchlorate (potassium permanganate or the like) is preferred. ▲ The above roughening is such that the maximum surface roughness is preferably 〇1~2〇#m. If it is too thick, the roughened surface itself is easily damaged and peeled off; if it is too thin, the adhesion is lowered. (6) Next, an electroless ore is applied to the entire surface of the interlaminar resin insulating layer which has been roughened and imparted to the catalyst core to form an electroless electricity (four) 12 (refer to 丄二复无-电电电) The rabbit is made by 〇·Bu Jia. One dies - (5) Secondly, the catalyst core is given on the circuit substrate which has been roughened on the surface of the layer insulating layer 2. The catalyst core is used to use precious metal ions or precious metal colloids ( (3) lloid) and the like, generally, a chlorination-free or surface colloid is used. In addition, it is preferred to fix the catalyst core and perform heat treatment. In the catalyst core as described above, (4) Next, a plating resist 3 is formed on the surface of the electroless plating film U (refer to Fig. 2160-2888A-PF 42 1282255 T, Fig. 3(b)). Photosensitive is laminated on the formed electroless plating film 12. a resin film (dry film), and a photomask (a glass substrate) on which a plating resist pattern is drawn is attached to the photosensitive resin film, and an electric money photoresist is formed by performing exposure and development processing. 3. (7) Secondly, electroplating is applied to the electroplated photoresist on the electroless plating film 12 The formed portion is formed with an electroplated film, and the conductor layer 5 and the via hole 7 are formed. The film thickness is preferably 5 to 20 / / Π]. In the electroplating, it is preferable to use copper electricity. At least one method in the mining method is used to form the record (4) with reference to the third = (c)). Because the alloy electric clock composed of copper scales can be easily deposited on the recording film 14. In addition, since the recording film has the function of being able to be used as a metal photoresist, there is also an effect of preventing excessive etching of the subsequent engineering. (8) After the electroplating photoresist 3 is removed, the electroless clock film 12 existing under the electroplating photoresist is made of a mixture of sulfuric acid and hydrogen peroxide or an aqueous solution of sulfur (tetra) or persulfate (tetra). The composition of the liquid can be two: to the independent conductor layer 5 and the via hole 7 composed of the electroless magnetic film 12 and the electrolytic ruthenium (refer to Fig. 3, Fig. 2), the roughening exposed in the non-conductor portion The palladium catalyst core on the surface can be dissolved and removed by chromic acid, persulfate water, etc. % Secondly, a rough layer is formed on the surface of the conductor j 5 and the via hole 7 as determined by the above. a layer forming an adhesive for electroless plating. (a)) The surface of the interlayer resin I edge layer 2 is roughened at the same time (see Fig. 4).

2160-2888A-PF 43 1282255

Cb)) 〇 (11) Next, the electroless plating film 12 is formed after the catalyst core is applied to the surface of the roughened interlayer resin insulating layer 2 (see Fig. 4(c)). (12) A plating resist 3 is formed on the surface of the electroless plated film 12, and the electroplated film 13 and the nickel plating film 14 are formed on the unformed portion of the plating resist 3 as described above (see FIG. 4). ((〇).

(13) removing the plating resist 3, removing the electroless plating film 12 under the plating photoresist, and then establishing a conductor layer (including a conductor layer as a pad 16 for fixing the conductive connection lock) 5 and a via hole 7, a stack of three layers of three layers can be obtained (see Fig. 5). (14) A rough layer u is formed on the conductor layer 5 and the via hole 7 of the laminated substrate obtained through the above steps, and the organic resin insulating layer 15 having the opening portion 18 in which the pin 16 is partially exposed is used. Covered. The thickness of the organic resin insulating layer may be 5 to 4 G//ni. If it is too thin, the insulation property will be lowered. If it is too thick, it will be difficult to cause the opening to come into contact with the solder, which may cause it. In the constituent resin of the organic resin insulating layer, various materials can be used, for example, bisphenol A type epoxy resin, bisphenol A type epoxy resin acrylate vinegar, phenolic solid type epoxy resin, phenolic solid can be used. A type of epoxy resin such as acrylic acid or the like which can be hardened with an amine hardener or a sodium salivary hardener. The organic tree (four) edge layer constructed as described above has the advantage of having less (four) conversion color - td - QJllL super - whole phenomenon in the organic resin @ & one phenomenon. Further, the organic resin insulating layer is excellent in heat resistance and alkali resistance, so even in soldering, etc., the melting temperature of the raw material is about

2160-2888A-PF 1282255 does not deteriorate under 200 ° C), and does not decompose in a strong alkaline plating solution such as nickel plating or gold plating. Here, as the acrylate of the above phenolic solid type epoxy resin, an epoxy which can react a phenol phenolic solid or a cresol novolac solid with a propylene glycol ether and acrylic acid or methacrylic acid can be used. Resin and so on. The above (4) hardener is preferably one in which the muscle is liquid. Since ^ is liquid, it can be uniformly mixed.

In the above-mentioned so-called liquid imidazole hardener, diterpene-2-methylimidazole (product name: 1B2MZ), 1-cyanoethyl-2-ethyl-4-yl/imidazole (product name: 2E4MZ-CN) can be used. And 4-methyl-2-ethylimidazole (product name 2E4MZ). The amount of the (4) hardener added is preferably Η〇% by weight based on the total solid content of the above-mentioned organic resin insulating layer. The reason is that if the amount of addition is within the above range, it is more (4)-mixed. The above organic resin

The pre-hardening composition of the insulating layer is preferably a solvent using a glycol ether-based solvent. The organic resin insulating layer using the above composition does not generate free oxygen, and the surface of the foot does not oxidize, and the harm to the human body is also small. In the case of the above-mentioned glycol ether solvent, at least one of the components selected from the group consisting of diethylene glycol dimethyl ether (10) DG) and triethylene glycol ethylene glycol (four) is employed. The above solvent can be completely dissolved by the reaction initiators: benzophenone (benzQph_e) and Michler (s ketone) by heating at a temperature of 3 () to 501. It is preferably from 10 to 40% by weight based on the total weight of the resin of the resin. n Other materials such as various antifoaming agents or flat agents (1 eve 1 ing) may be added to the organic resin insulating layer composition as described above, for improving heat resistance or resistance. A thermosetting resin which is alkaline and imparts flexibility; and a photosensitive monomer for improving image resolution. For example, it is preferred to use a polymer of acrylate as a flattening agent. In addition, the initial knowledge is that "the 彳 方 方 二 7 7 7 7 7 (4) 7 is better, and the sensitizer is preferably DETX-S manufactured by Nippon Kayaku Co., Ltd. Further, in the organic resin insulation layer A coloring matter and a pigment may be added to the composition, whereby the circuit pattern can be concealed. The pigment is preferably phthalocyanine φ Green. The thermosetting resin as an additive component can be used. Two-year-old epoxy resin. In the double-anti-epoxy resin, bisphenol A-type epoxy is included, and F-type epoxy resin is also expected. In the case of focusing on the testability, the former is used. In the case where low viscosity is required (when the applicability is important), it is preferable to use the latter. Further, the viscosity of the above-mentioned organic resin insulating layer composition at 25 ° C is 〇·5~1〇Pa'S. 'It is preferably 1 to 10 Pa.s. It is easy to apply at this viscosity. ・ Coating is performed by a roll coater. (15) A gold plating film, a nickel plating film, and a gold plating film are formed in the opening portion 18. After the metal film 19 of the corrosion resistant metal is used as the package substrate In the opening 16 of the surface side (the connection surface with the sub-board and the mother board), the solder paste of the conductive adhesive 17 is preferable. The viscosity of the solder paste is preferably in the range of 5 to 400 Pa·s. The fixing portion 101 of the conductive connecting pin _ ^ t 14 ^ # ^ ! 正 is directly connected to the conductive portion 777 in the opening portion 16: then re-soldering (ref low) is performed at 240 to 27 ° C Connect the conductivity

2160-2888A-PF 46 1282255 The lock 100 is fixed to the conductive adhesive 17 (refer to Fig. 7). In addition, it is also possible to add a spherical or the like to the γ j splicer in the opening, or to connect the conductive shackle on the side of the V-electrically connected slab-like fixing portion.

^ 矣 矣 re-welding ^ 在 in the ^ circle circled part of the injury system indicates the establishment of the conductive connection pin 10Q is an enlarged view. Footnotes, and Fig. 4 • In addition, in the package base 130, the solder bumps 6 which are connected to the 1C wafer and the like are formed in the opening σ 18 of the upper side. The conductive connecting pin (10) used in the present invention is a so-called τ which is formed by a plate-shaped fixing portion 1〇1 and a columnar connecting groove 102 which is provided at a center position of the plate-shaped fixing portion m. Type pins are more suitable. The plate-like fixing portion 101 is fixed to the crucible on the outermost conductor layer 5 of the package substrate on which the pin 16 is formed by conductivity and then d Η, depending on the size of the foot. It is suitably formed in a circular shape or a polygonal shape. Further, the shape of the joint portion m may be a columnar shape, a prismatic shape, a conical shape, or a pyramidal shape which can be inserted into a joint portion of another substrate terminal or the like.材质 When the material of the conductive connecting pin 100 is metal, it is not particularly limited. It can be formed using at least one metal selected from the group consisting of gold, silver, copper, iron, nickel, cobalt, tin, and lead. Especially for example, ferroalloys, quotients. The name "K〇varj (nickel-cobalt-iron), stainless steel and copper alloy such as phosphor bronze. This is because the above substances are in electrical properties and as a conductive connection pin - Lishan this side is not - often - excellent - Dissimilar metal or alloy to form 'can also be based on anti-corrosion or joint ~ ~ suction strength and coated with other metal layers on the surface. More advanced, can also use pottery: is equal insulation 2160-2888A-PF 47 1282255 substances The surface is formed with a metal layer. The conductive connecting pin 100 has a diameter of 8 mm and a length of UdOmm. The plate-shaped fixing portion 1 is a diameter. 5~2. It is preferable to use the range of the foot; the size of the foot can be appropriately selected according to the type of the socket of the mother board of the desired women, etc. The conductive used in the package substrate of the present invention. For the adhesive agent 17, 'solder (tin-wrong, tin-pound, silver-tin-copper, etc.), conductive resin, conductive front solder paste, etc. can be used. The melting point can also be used in the range of 18〇~28 generation. A conductive adhesive inside. Thereby, the bonding of the conductive connection lock can be broken, and the degree is 2. Above 0Kg/pin, and in the case of thermal cycling, the installation of &: On the occasion of the smashing film, the conductive connection lock will not fall off or tilt due to heat, but the electrical connection. The above materials are made of solder. The result is better because the connection strength with the conductive connecting pin is very good, and the heat resistance is also strong, so the work is very difficult. When using the solder to form the conductive adhesive 17, it is used. Solder consisting of tin/lead = 95/5, 60/40, etc. is suitable. The solder used is also suitable for melting points in the range of 180 to 28 (rc). More preferably, the dispersion of the bonding strength of the conductive connecting pins can be made small, and the heat applied during the solid mounting can be prevented from damaging the constituent resin layers of the package substrate. As shown in Fig. 8, the opening portion 18 in which the pin portion 16 is partially exposed is covered with the organic resin insulating layer (through-hole layer) 15 and the guiding property is followed by the guiding property 7 ^ ® ^ ^ t # ^ ^ ,00 ^ 0 ^ # 2〇ι 〇^ κ Because the organic resin insulation layer 15 is covered with a cover? The method around the feet 6 is covered by 2160-2888A-PF 48 1282255, so that even when heat is applied or the package substrate is mounted on the mother board, even if stress is applied to the conductive connection lock 100, the foot 16 can be prevented. It is caused by breakage and peeling from the interlayer resin insulating layer 15. Further, it is also possible to make it difficult to separate the materials of different materials such as metal and resin, and to form a multilayer formed of an interlayer resin insulating layer. The package substrate formed of the printed wiring board is taken as an example, but the package substrate composed only of the i-sheet substrate can also be applied to the configuration of the first embodiment. [First Modification] Fig. 9 is a view showing a package substrate 139 of a third modification of the second embodiment. Here, Fig. 9 is a cross-sectional view of an important part of the package substrate 139, and Fig. 9 (8) is a view of Fig. 9 (a straight view of the direction of the arrow 6 in the direction of the arrow. Here, the aA section in Fig. 9(B)) That is, corresponding to Fig. 9. As shown in Fig. 9(B), the land 16 is composed of a circular body portion 16b for mounting a conductive connecting pin, and an extending portion 16& disposed around the body portion 16b. It is constructed and further connected to the signal line... at the main body portion 16b. Referring to Fig. 8 and as described in the above example, the edge of the land 16 is made of an interlayer resin insulating layer (organic resin insulating layer). In this case, in the first modification, the extending portion 16a disposed at the edge of the foot (main portion 16b) is covered with the solder resist layer 15. The body portion (10) is formed by soldering. The opening portion 18 of the photoresist layer 15 is exposed. In the first modification, since the extending portion 16a of the magic edge of the main body portion 16 is also covered by the solder resist layer i 5 , Even if the ϋ-------------------------------------------------------------------------------------------------------------------------- The opening portion 18 of the insulating layer 15 is exposed and the organic resin insulating layer 15 is not in contact with the body portion 16a of the pin portion 2160-2888A-PF 49 1282255, so that the organic tree is made of the insulating layer i5 and the foot. The contact of the main body portion 16a of the portion allows the organic resin insulating layer 15 side to be free from cracks. [Second Modification] The package substrate m can be basically the same as the first embodiment described above with reference to Figs. 7 and 8 . However, the chatter 16 of the fixed conductive contact pin is connected to the inner conductor layer 66 (5) of the interlayer resin insulating layer 52 on the outermost layer side via the via hole 7. In this example, the organic resin insulating layer 15 is not used to cover the foot. Bit 16 (refer to Fig. 1). Since the manufacturing process to (14) is completely the same as that of the first embodiment, the following description will be given from the following (10). (15) The layer hole 7 is filled with solder as a conductive adhesive. Paste (tin/record -95 · 5) 17. Here, a mask # (not shown) is placed on the surface of the organic resin insulating layer 15 to make it dense, and then the solder paste is printed. And re-welding at a maximum of 27 (TC). (16) Fixing the position of the conductive connecting pin, the system and the third The same applies to the embodiment. In this example, since the bonding area between the pin 16 and the substrate is made larger by the via hole 7, the peel strength of the pin 16 is improved. Further, since the inner conductor layer 66 is a metal layer, Therefore, it has good adhesion to the foot 16 which is also made of metal, and thus forms a structure which is not easily peeled off. Further, the position of the inner conductor layer can be set in the core from the roughened surface and the core The substrate is strongly adhered, so the foot position is more difficult to peel off. a. Example 1 2160-2888A-PF 50, 082255 is basically the same as the second modification, but the package substrate 32 will be provided with the pin 16 The via hole 7 is covered with an organic resin insulating layer 15 having an opening portion 18 for partially exposing the pin position (see Fig. u). Since the package substrate 132 is provided with the pin 16 on the via hole 7 and the surface thereof is covered with the organic resin insulating layer 15, the peel strength between the pin 16 and the substrate is excellent. b. The other example 2 is basically the same as the other example 1. However, the package substrate 133 is provided with a plurality of via holes 7 by a plurality of via holes 16 of a fixed pin 1*. Connected to the inner conductor layer 66 of the interlayer resin insulating layer 52 (refer to Fig. 12, in this example, as shown in Fig. 12 (β), the via hole 7 is formed in a circular shape: 6: 6 And forming the foot position so as to cover each of the via holes 7 - Fig. 12 (Β) is a straight view of β seen from the side of the via hole 7 of Fig. 12 (Α). In the case where the position of the via hole 7 shown in Fig. 8 (8) is not the same as the σ] plane, although a via hole 7 as in Fig. 12 (Α) does not appear, the Β 疋 疋 疋For the sake of convenience, the opposite layer of the via hole is indicated by a dotted line. c. Other example 3 is basically the same as the other you I 9 1 , but the package substrate 134 is the shape of the via hole ^ It is made into a ring shape as shown in Fig. 咏 咏 13 (B) (Fig. 13). Fig. 13 (B) is a flute 1 〇 "Fig. 13 (A) B arrow direction straight view Use the mesopores 7 in the hard number of φ + ^ in this case 2 or the circle in the other example 3 The form m _ j , ^ τ, 圃螂 d. the exception 4 - is basically as illustrated in the figure i i and is the same as the case 2, but this

2160-2888A-PF 51 1282255 The package substrate 135 is also provided with a plurality of via holes 7 arranged in a circular shape in the interlayer resin insulating layer 52 of the inner layer, and the interlayer layer 7 and the inner layer provided with the pin position 6 are provided. The via holes 7 are joined together. (Refer to Figure 4). Since a plurality of via holes 7 are bonded to each other in the package substrate 135, the pin 16 becomes extremely difficult to peel off. Further, as described above, in each of the above-described modifications, it is preferable that the inner conductor layer provided with the pin is formed on the core substrate 1J1. Since the conductor layer on the anger substrate is strongly adhered to the insulating substrate forming the core substrate by the roughened surface (matte surface), the conductor on the writhing substrate is as described above. When the layers are connected, the pin 16 becomes difficult to be peeled off by the interlayer resin insulating layer 52. 9 [Third Modification] The 〃 is basically the same as the second modification (4) 2, but the package substrate 136 is provided with the inner conductor layer of the connection pin 16 on the through hole 9 of the core substrate 作为 as a conductor layer (groove) 91) 'And it is formed by covering the edge of the foot 16 with an organic resin insulating layer (see item 15). As shown in the figure, the (four) core of the perforation 9 and the tree material in the through hole 9 are purely connected to the pin 16 by the via hole 7. That is to say, the foot 16 is characterized in that the conductor layers of the fish mold Y substrate are connected by the via holes 7. Since the conductor layer of the core base is a two roughened surface (a matte surface) and is strongly adhered to the insulating substrate forming the core substrate, the hunting layer is connected to the conductor layer on the core substrate as described above. 1 - peeling off. Further, through, the gap between the 9 and the foot 16 is also connected by the via hole 7. Therefore, outside

The length of the line between the conductive connection locks of the koji and the ic wafer (semiconductor wafer) on the opposite side of the vertical side of the conductive connection lock (10) 2160-2888A-PF 52 1282255 can be shortened. a. the other example 1 is basically the same as the third modification, but the package substrate; [37] forms the conductor layer 90 covering the through hole 9 on the through hole 9, and the via hole is formed on the conductor layer 90. 7 and connected to the foot 16 (refer to Figure 16). b. Example 2 is basically the same as the third modification, but the pin 16 in the package substrate 138 is connected to the land 91 of the through hole 9 only by the via hole (see Fig. 17). In the above example, the foot position 丨6 is formed not only by the bonding with the body layer 4 of the core substrate, but also by the structure of the body layer 4, and is particularly shortened by the combination of the ridges 91 of a shell hole. The length of the line with the inside of the substrate. [Fourth Modification] Basically the same as the f 2 modification example ‘But the tin is first made into a spherical shape.

Continuation of trust. According to the method of the package substrate of the embodiment, the degree of peeling between the conductive properties can be effectively prevented, and

2160-2888A-PF J282255 The status of each connecting pin, minimum joint strength, and conductivity test are used as the ping project. (2nd embodiment) The following is a description of the manufacturing method of the package substrate of the second embodiment. Here, the works of (1) to (13) can be referred to the jth to the 5th. The figure is the same as that of the above-described first embodiment, and therefore the illustration and description thereof are omitted. Field (14) The conductor layer of the rich substrate as shown in Fig. 5 obtained in the above (1) to (13) 5 and the via hole 7 is formed with a rough layer u, and is covered with an organic resin insulating layer having an opening portion 18 in which the pin portion 16 is partially exposed (refer to Fig. 19). The thickness of the organic resin insulating layer may be 5 to 4 〇/zm. If it is too thin, the insulation property is lowered. If it is too thick, it is difficult to make the opening contact with the solder, which causes the crack. (15) A gold plating film is formed in the opening portion 18. After the metal film 19 of the residual metal such as the nickel plating film to the gold plating film, the printing is performed as an electric conduction in the opening portion 16 for the lower side of the sealing base (the connection surface with the sub-board and the mother board). Solder paste for the adhesive 17. The viscosity of the solder paste is at 5 〇 ~, Na ~ (4)

The conductive connection _ lock i0 is mounted in a suitable lock supporting device to support it, and the fixing portion ι ι of the conductive connecting pin 11 正 is directly connected to the conductive adhesive 17 in the opening, and then at 220~ Remelting at 27 Gt = fixing the conductive joint lock m to the conductive adhesive" (Refer to -b. Alternatively, a conductive T-turn may be added to the opening, or the sister may be joined. In the special electric--Thai-I------------------: After the electrical connection lock is installed, re-welding is performed. Also, in the 20th, ... The part indicates that the position of the conductive connection pin 2160-2888A-PF 54 1282255 is set, and the figure 21 is the enlarged view β. In addition, in the package substrate 23, the opening on the upper side thereof is established. A solder bump 230 to which a component such as a 1C wafer is connected. The conductive connecting pin 〇1〇 used in the present invention, the plate-shaped fixing portion m and the protrusion are provided in the plate-shaped fixing portion 1〇=== The so-called τ-type pin formed by the columnar connecting portion 较2 is made of a conductive adhesive 17 by a plate-like fixing portion m'. The portion of the outermost conductor layer 5 of the package substrate fixed to the bit 16 is appropriately formed in a circular or polygonal shape, and the shape of the connection portion 102 is as long as it can be inserted into another substrate. In the connection part of the terminal, etc., there is no column in the column shape. The cylindrical type, the prism type, the conical type, the pyramid type, etc. The materials of the conductive connection 10 are made of copper or copper alloy, tin, and It is preferred that at least one of the metals of the noble metal and the noble metal is formed because it has a high degree of flexibility, in particular, a phosphor bronze such as a copper alloy. This is because the above materials are electrically conductive and serve as a conductive connection. The workability of the lock is excellent. In addition, the conductive joint pin can also be coated with other metal layers on the surface based on corrosion prevention or lifting strength. In the conductive connecting pin 11 ,, the columnar joint i02 is The diameter is 〇·; 1~0. 8mm, and the length is 1·0~i〇mm is preferable; and the plate-shaped fixing portion 1〇1 is preferably in the range of 0·5~2· Omra; The size can be as desired - female - loaded - mother board - plug - mouth - etc. - kind---------- ------------------------------- ---.....----------------------------------------- In the present invention For the conductive adhesive 1 used in the package substrate, the same solder as the first embodiment (tin-lead, tin-pound, silver 2160-2888A-PF 55 1282255 tin-copper, etc.) or conductive resin can be used. And a conductive fresh solder paste, etc. A conductive adhesive having a melting point in the range of 180 to 28 〇t can also be used. - When the conductive adhesive 17 is formed by solder, the same method as in the first embodiment is used. Fresh tin consisting of tin/error=95/5, 6〇/4() $ is more suitable. The melting point of the solder of (4) is also suitable in the range of (10)~2. In particular, it is more preferably in the range of 200 to 26 (TC). As can be seen from Fig. 21, the conductive connecting pin 110 is composed of steel or copper, which is excellent in flexibility (4). When the package substrate is mounted on another substrate and stress is applied to the conductive connecting pin 110, it can be sucked by the bending of the connecting portion 102 as shown by the dotted line in the figure. In the case of the package substrate 2 of the example 1 of the first embodiment, the position of the leg 16 is as shown in Fig. 2, and the organic village is formed by the opening portion 18 in which the opening portion 18 is partially exposed. The layer (beefhole layer) 15 is covered, and the conductive contact is fixed on the pin 16 exposed by the opening 18, and the fixed portion of the pin 110 is fixed. As can be seen from the figure, since the organic resin insulating system is covered [in the manner of the periphery of the pin 16, the stress is applied to the conductive pin 110 even when the heat is cycled or the package substrate is mounted on the mother board. In addition, it is also possible to prevent the destruction of the foot 16 and the peeling of the interlayer resin insulating layer 15. Further, it is also possible to prevent metal and resin. The bonding between the same materials is difficult to peel off. In addition, although a layer-to-resin insulating resin is used as an example, a package substrate composed of only one substrate is also applicable. Configuration of the second embodiment. 2160-2888A-PF 56, 1282255% [First Modification] The package substrate 2 3 2 can basically refer to the second and second drawings and the second embodiment. Similarly, the pin 16 of the fixed conductive connection pin is connected to the inner conductor layer 16 0 of the interlayer resin insulating layer 200 through the via hole 7. Then, the pin is positioned by the organic resin insulating layer 15. A part of 16 is covered (refer to Fig. 22). The steps of manufacturing processes (1) to (14) are identical to those of the second embodiment. (15) The via hole 7 is filled with a conductive adhesive. Solder paste _ (tin/record = 95: 5) 17. A mask material (not shown) is placed on the surface of the organic resin insulating layer 15 and sealed, and the solder paste is printed and applied at a maximum of 27 〇C. Re-soldering. (16) Fixing the position of the conductive connecting pin is the same as in the second embodiment. In the example, since the conductive connecting pin increases the stress and the bonding surface of the pin 16 and the substrate is enlarged by the via hole 7, the peeling strength of the pin 16 can be improved. Further, since the conductor layer 160 of the inner layer is a metal layer, it can be formed well with the foot 16 which is also a metal crucible, so that it is formed into a structure which is not easily peeled off. Further, since the surface thereof is covered with the organic tree insulating layer 15 Therefore, the peel strength between the pin 16 and the substrate is excellent. In addition, the pin connecting the inner conductor layer can also be set on the core substrate 1__ as described above because the conductor layer on the core substrate is thick _ / KU substrate - strong close, so ^ ^ ^ _____________________ _--- a_ other example 1 basically Pan Chu 1,

The change is the same, but the package substrate 233 is such that the pin 16 of the fixed conductive contact pin 110 of the 1 2160-2888A-PF 57 1282255 is connected to the inner conductor of the interlayer resin insulating layer by the plurality of via holes 7 The layers (10) are connected (refer to the figure (A)). In this example, as shown in Fig. 24(B), the via holes and the holes 1 are set to 6 ' and the respective via holes are used. 7 is formed in such a way as to form the foot 16. Fig. 24 (8) is a straight view in the direction of the arrow B seen from the side of the via hole 7 of Fig. 24 (1). In the case where the via hole 7 shown in Fig. 24 (8) is placed as shown in the cross section, although the "Fig. (1): 71-layer hole 7 does not appear, for the sake of convenience of illustration. Therefore, the via holes on the opposite side are indicated by dotted lines. b. The other example 2 is basically the same as the others, but the package substrate 234 has the shape of the via hole 7 as shown in Fig. 25 (5). Fig. 25 (B) is a straight view in the direction of the β arrow in Fig. 25(A). The plural hole 7 or another example in the other example 1 is used. The ring-shaped via hole 7 in 2 can make the bonding area with the substrate larger. c. The other example 3 is basically the same as that of the other example 1 as shown in Fig. 24, but the package is The substrate 235 is an interlayer resin insulating layer 2 of the inner layer, and a plurality of via holes 7 arranged in a circular shape are also provided, and the interlayer via holes 7 provided with the pins 16 are bonded to the via holes 7 of the inner layer. (refer to Fig. 26). The plurality of via holes 7 are bonded to each other in the package substrate 235, so that the foot 16 becomes extremely difficult to peel off. - ' ~ ^ ^ such as - front poison Said"--in i - each of the mutagens - Good Examples are provided Dong Shin -: position of the conductor layer is formed in the core substrate] * than those on. Two-mode - the conductor layer on the i-substrate is formed by a roughened surface (a matte surface)

2160-2888A-PF 58 1282255 The insulating substrate of the board is strongly adhered, so by connecting the conductor layer on the core substrate as described above, the foot 16 becomes difficult to be made of the interlayer resin insulating layer 20 0 peeling. [Second Modification] Basically, it is basically the same as the second example of the first modification. However, the package substrate 236 has the inner conductor layer of the connection pin 16 provided on the through hole g of the core substrate 作为 as a conductor layer (slot). The ridge 91) is formed by covering the edge of the foot 16 with the organic resin insulating layer 15 (refer to Fig. 27). As shown in the figure, the land 91 of the perforation 9 and the resin filler in the through hole 9 are formed. It is connected to the pin 16 by the via hole 7. That is, the pin 16 is characterized by being connected to the conductor layer of the core substrate 1 via the via hole 7. Since the conductor layer on the core substrate 1 is strongly adhered to the insulating substrate forming the substrate by the roughened surface (five), it is connected to the conductor layer on the core substrate as described above. The pin 16 becomes difficult to be peeled off by the interlayer resin insulating layer 2〇〇. Further, the through holes 9 and the pins 16 are also connected by the via holes 7. Therefore, the length of the line between the conductive connection lock 110 of the external terminal and the 1C wafer (semiconductor wafer) on the opposite side of the conductive (four) side can be shortened. a. The other example 1 is basically the same as the second modification, but the package substrate 237 is formed in the through-hole 9 to form the conductor layer 9 覆盖 covering the through-hole 9 and is on the conductor layer-- 〇———— b. Other example 2

Basically, it is the same as the second modification. However, the legs 2160-2888A-PF 59 1282255 of the package substrate 238 are connected to the land 91 of the through hole 9 only by the via hole (refer to FIG. 29). . In the above example, the foot position 16 is not only formed by the "layer bonding" with the body layer on the surface of the core substrate 1, but is also formed by the combination of the ridges 91 of the bead holes. The length of the line on the back side of the substrate. [Third Modification] Basically, it is basically the same as the first modification. However, the spherical solder is attached to the conductive connecting pin, and then the conductive connecting pin is disposed. According to the embodiment of the second embodiment, since the conductive connecting pin is made of a highly flexible material such as a copper alloy or the like, it is sufficiently absorbed on the connecting pin during the mounting of the thermal cycle or the package substrate. The stress can prevent the splicing pin from being peeled off from the substrate. The general conductive splicing pin is sealed by the beauty of the door. Only the yew PIN substrate is difficult to concentrate on the conductive splicing pin, so the conductive splicing pin and the foot and the foot The bonding strength between the bit and the substrate is very good, and the connection reliability is excellent. Fig. 30 shows the evaluation results of the package substrate of each embodiment, which is the minimum bonding strength and heating test of the conductive connecting pin after bonding. (reproduced false The 1C measured state is evaluated by feeding the substrate equipped with the interlock lock into a 25 〇C nitrogen reheating furnace and under the thermal cycle conditions (°C/3 min +-65 t/3 min as the i cycle) , the state of each of the subsequent pins after the implementation of the i-cut cycle, the minimum joint strength, the conductivity test, etc. <Third embodiment>, , ———. Here, the engineering of (1) to (13) can be referred to. The drawings and the fifth embodiment are the same as those of the above-described first embodiment, and thus the illustration and description thereof are omitted. 2160-2888A-PF 60 -1282255 (14) The first item obtained in the above (1) to (13) The conductor sound 5 of the dry-bonded substrate and the Μ Γ Γ Γ 口 用 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机 有机It is covered by 15 (refer to Fig. 31). The thickness of the organic resin insulating layer is '5 to 40/ΖΠ1. If it is too thin, the insulation will be lowered; if it is too thick, it will be difficult to make the opening contact with the solder, and it will become a crack. The reason. "The wide opening of the electric dream film, etc." 8 formed gold plating film, nickel plating film - gold, and film resistance After the metal film 19 of the metal is used in the opening portion 16 for the lower side of the board (the connection surface with the daughter board and the mother board): = 5 〇 4 η π ρ The knowledge of the d 17 is poor. The viscosity of the solder paste is : 'The range of 〇Pa.s is better. Further, the conductive connecting pin 12G of the waist 1G3 on the splicing portion (10) is attached to an appropriate lock support (to support the 'and to fix the conductive connecting pin 120' For example, the conductive material that is directly connected to the opening portion 16 is used to bond the raw material agent 17, and then re-weld at 240 to 270 以 to fix the conductive joint lock 120 to the conductive adhesive agent ( Refer to Figure 32. In addition, a spherical conductive adhesive may be added to the opening, or a conductive connecting pin that has been bonded to the side of the conductive plate-shaped fixing portion may be attached and then applied. =^, the portion circled in the circle in Fig. 32 indicates that the conductive connection, "the pin portion of the pin 120" is established, and the figure 33 is an enlarged view. In addition, in the package substrate 330, the opening "the middle δ is a solder bump which can be connected to a part such as an IC chip. ^, the use of the plate-shaped fixing portion Γ〇1 and the convex portion is used. A so-called T-shaped pin which is provided in the columnar connecting portion 102 of the center position in the plate-like fixing portion 1〇1 is suitable.

2160-2888A-PP 61 -1282255 The plate-shaped fixing portion 1 〇1 is fixed to the outermost conductor layer 5 of the package substrate forming the pin 16 by the conductive adhesive 7, which can be based on the foot The size of the bit is appropriately formed in a circular shape or a polygonal shape. Further, the shape of the joint portion 1〇2 is not particularly problematic as long as it can be inserted into the joint portion of the other substrate terminal or the like, and the cylindrical shape, the prismatic column type, the conical shape, the pyramid type, and the like are all set. In the middle part of the splicing part 1〇2, it is formed in the form of a thin part of the car. The thickness of the bee waist 1〇3, the diameter, must be 5〇% or more of the diameter of the joint. The diameter of the waist is 5 compared to the diameter of the other parts. (If the U is small, the strength of the joint will become insufficient, and the base of the seal will be deformed and broken at the time of fitting; If the diameter of the waist exceeds the amount of money of other materials, 1 =: the material that is imparted to the joint portion and the stress that cannot be obtained is the material of the conductive joint lock of the present invention, and if it is not particularly limited, the pendulum can be used. In the case of metal, it is formed by at least one of gold, silver, copper, and lead bismuth, and is a genus of iron, alloy, var, quotation, iron, and iron. Phosphor bronze is preferred. This I is good in copper and is used as a mine guide. The electrical properties of the above materials are the properties of the conductive pin. Phosphorus steel is used because it is different from the right. Special stress absorption. There are 4 wrapability's, so it is very suitable for 0 1 η η SI t ^ ^ 〇· Bu 〇 · 8mm, length j. 〇 ~ 1 〇 _ with diameter in the fixed part 101

The size of the 2160-2888A-PF L ’ foot can be appropriately selected according to the type of socket of the motherboard to be installed in the main body of 62 1282255. For the conductive adhesive used in the package substrate of the present invention, it can be used and the first! The solder of the same example (tin-lead, tin-record, silver-tin-copper, etc.), conductive resin, conductive solder paste, and the like. A conductive adhesive having a melting point in the range of 180 to 280 ° C can also be used. When the conductive adhesive 17 is formed by soldering, it is preferable to use a tin composed of a composition of tin/error = 95/5, 60/40 or the like which is the same as the embodiment of the disk. The solder used has a melting point which is also suitable in the range of 18 () to 2 δ generation. And especially in the range of 200 to 260t is better. As can be seen from Fig. 33 (1) and Fig. 33 (8), since the conductive contact 120 is provided with the bee waist portion 1〇3 on the (m)m, it becomes flexible and easily bent, so the package substrate is mounted. When it is applied to the mother board or the like: when stress is applied to the conductive joint lock 12, it can be absorbed by the bending of the bee waist portion 103 on the joint portion. a. Example 1 is a resin insulating layer (through-hole layer) 15 in which an opening portion 18 in which the foot portion 16 is partially exposed is formed as shown in FIG. 34w. It is covered and is made up of the top of the opening; the exposed foot is 16 by the Moreira basin. The fixing portion 1〇1 of the conductive renewal pin 120 is fixed by the electric connector 17. As can be seen from the figure, since the organic resin layer 15 is covered by the cover around the pin 16, even when the package substrate is mounted on the mother board during the thermal cycle, The layer 15 is peeled off or the like. In addition, the package substrate formed of the multilayer printed wiring board formed of the insulating layer is used as the package substrate of 2160-2888A-PF 63 !282255 sub-, but only one substrate is applicable to the third embodiment. Composition. [First Modification] The package substrate 332 can be basically the same as the above-described first embodiment by referring to Figs. 32 and 33, but the pin 16 of the fixed conductive contact 12 is fixed by the via hole 7 Further, it is connected to the inner layer of the interlayer resin insulating layer 52. Then, a part of the foot position μ is covered with the organic resin insulating layer 1 &amp; (refer to Fig. 35). The steps of manufacturing engineering (1) to (14) are identical to those of the third embodiment. (15) A solder paste (tin/锑 = 95: 5) 17 as a conductive adhesive is filled in the via hole 7. A mask material (not shown) is placed on the surface of the organic resin insulating layer 15 and adhered thereto, and the solder paste is printed, and re-soldering is performed at a maximum of 27 ° C. (16) The fixing of the position of the conductive connecting pin is the same as that of the third embodiment. In the 苐1 modification, since the bee waist portion 1 〇3 of the conductive splicing lock 11 提高 improves the absorbability to be handled, and the interlayer hole 7 makes the joint area between the foot position 16 and the substrate become large, Increase the peel strength of the foot 16. Further, since the conductor layer 66 of the inner layer is a metal layer, it has good adhesion to the foot 16 which is also made of metal, and thus a structure which is not easily peeled off is formed. Further, since the surface is covered with the organic resin insulating layer 15, the peeling strength between the foot 16 and the substrate is extremely excellent. - Meat - I guide - body ~ 晷 foot position - also I set - Liben mold - core ~ base _ board - i - above. As described above, since the conductor layer on the core substrate is strongly adhered to the core substrate by the roughened surface, the foot is more difficult to peel off. 2160-2888A-PF 64 .1282255 a_Other example 1 2 is the same as the first modification, but the package substrate 333 is the pin 16 of the i-port conductive connection lock 110 by a plurality of via holes 7 Further, it is connected to the inner conductor layer 66 of the interlayer resin insulating layer 52 (refer to Fig. 1(A)). In this example, as shown in Fig. 36(B), the via holes 7 are arranged in a circular shape, and the pins 16 are formed so as to cover the respective via holes 7. Figure 36. A straight view in the direction of the arrow B seen from the side of the mesopores 7 of Fig. 36 (person). Further, in the case where the position of the via hole 7 # 1 shown in Fig. 36 (B) is as shown in the cross section, although the three layers &amp; 7' as in the % (Fig. 1) are not present, For the sake of convenience in the illustration, the via holes on the opposite side are indicated by dotted lines. b. The second example is basically the same as the other example 1, but the package substrate 334 has the shape of the via hole 7 as shown in Fig. 37 (see the π 囷) as shown in Fig. 37. (Β) is a straight view of the arrow direction in Fig. 37 (Α). The substrate can be made by using the plurality of via holes 7 in the other example 1 or the via hole 7 in the other example 2. The bonding area becomes larger. c. The other example 3 is basically the same as that of the other example 1 as shown in FIG. 3, but the package substrate 335 is also provided on the interlayer resin insulating layer 52 of the inner layer. The plurality of via holes 7 are arranged in a circular shape, and the via layer 7 provided with the pin layer 6 is bonded to the via hole 7 of the inner layer (refer to the figure (Α), the -38® The system is combined with each other, so that the feet will become extremely difficult to peel off. In addition, as described above, in the above various examples, 2160-2888A is provided. -PF 65 1282255 The inner conductor layer of the pin is preferably formed on the core substrate. Since the conductor layer on the core substrate is formed by the roughened surface (matte surface) and the core substrate is formed, Since the rim substrate is strongly adhered to each other, the foot 16f particularly becomes difficult to be peeled off by the _resin insulating layer 52 by being connected to the conductor layer on the core substrate as described above. Example] ^ is basically the same as the second example of the first modification, but the package substrate 336 is provided with the inner conductor layer of the connection pin 16 on the through hole 9 of the core substrate 1 as a conductor layer (groove 91). And the edge of the j-pin 16 is covered with the organic resin insulating layer 15 (refer to the 39th mesh). As shown in the figure, the resin lining 10 in the ridge 91 and the through-hole 9 is formed by the via hole. 7 is connected to the pin 16. In this case, the pin 16 is characterized by being connected to the conductor layer of the core substrate 1 through the via hole 7. The conductor on the wedge substrate 1 is invaded by # The layer is made of a roughened surface (a matte surface) and the insulating substrate forming the core substrate is strongly densely 5, so that it is connected to the conductor layer on the core substrate as described above, J7 &lt; 16 is awkward. It is difficult to peel off the interlayer resin insulating layer. Moreover, the through hole 9 and the pin 16 are also connected by the via hole 7. , outside: the length of the line between the conductive connection lock 12 of the terminal and the IC chip (semiconducting Μ曰H, 千日日日片) on the opposite side of the conductive connection lock 12〇 side • Example 1 '----This special-purpose substrate is in the wrong--"layer hole 7 and connected to the foot 16 (refer to Figure 4).

2160~2888A~PF 66 .1282255 b. The other example 2 is basically the same as the second modification, but the pin 16 in the package substrate 338 is connected only to the land 91 of the through hole 9 through the via hole ( Refer to Figure 41). In the above example, the pin 16 is formed not only by the bonding with the conductor layer 4 on the surface of the core substrate, but also by the groove f 91 of the through hole, and can be shortened. The length from the inside of the substrate. [Third Modification] Basically, it is basically the same as the first modification. However, a spherical solder is attached to the conductive connecting pin, and then a conductive connecting pin is disposed. As described above, according to the conductive connecting pin of the third embodiment, the columnar connecting portion and the plate-shaped fixing portion are formed, and the column-shaped connecting portion is provided with more than the other. Since the diameter of the splicing portion is also fine, the embossing of the squeezing plate can be prevented by sufficiently absorbing the stress applied to the splicing lock by the bending of the bee waist during the mounting of the thermal cycle or the package substrate. In addition, the package base of the conductive connection pin as described above is ^ ^ ^ ^ ^ f f ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ and the joint strength between the foot and the foot and the substrate is high, and the reliability is continued. Very good. Fig. 42 is a view showing the evaluation result of the package substrate of the third embodiment. It is based on the minimum joint strength and the heating of the conductive joint lock after the jointing (representing the 1C measured state of the rendition, and feeding the substrate equipped with the joint lock into the scale NOx-(four) welding body* to... 30C/3 knives +-65c/3 points as the J cycle, the state of each splicing after the cycle), the minimum joint strength, the conduction test, etc. are evaluated as 2160-288 8A-PF 67 ^ 1282255 item. <Fourth embodiment> A method of manufacturing a sealing substrate of the fourth embodiment will be described below. Here, since the items (1) to (12) can be referred to the first embodiment to the fourth embodiment, the drawings and descriptions are omitted. (13) The electroplating photoresist 3 of the substrate shown in Fig. 4(d) is removed, and the electroless plating film 12 under the plating photoresist is removed, and then the via hole 7 is formed and flat (plain # 21 is obtained). One of the three layers of 6 laminated substrates is shown in Fig. 43). &gt; (14) A roughened layer jj is formed on the conductor layer 5, the via hole 7 and the flat layer 21 of the laminated substrate obtained as described above, and has an opening which exposes the foot 16 and the flat layer 21 The organic resin insulating layer η of the portion 18 is covered (see Fig. 44). The thickness of the organic resin insulating layer; If it is too thin, the insulation will be lowered; if it is too thick, the second will become the contact between the opening and the Xuexi, which will become the cause of the crack. (5) After the metal film 19 of the metal such as the gold-plated ore plating film is formed in the opening portion 18, (4) comes to the lower side of the plate (the connection surface with the 柘, 瓜^: my mother mother board) The opening is used as a conductive adhesive. In the range of 5 〇 to 4 〇〇 Pa.s, the opening is printed in the range of 10 degrees in the flat. 1 Further, the conductive connection is attached to the appropriate lock support. Dream, 固定100 fixed part 101 is connected, pin------24. ―Tear e τ: Conductive adhesive in the mouth" Fixed in conductive adhesive. 'Call.- Add the ball into the opening (1) This may also be in the form of a conductive adhesive, or will be joined

2160-2888A-PF 68 .1282255 ^The (four) continuity on the side of the plate-shaped fixing portion of the conductive connection lock is then re-soldered. In addition, in the package substrate 431, the solder bumps 6 连接 which are connected to the 1C solar chip of the μ 1 8 are provided on the upper side of the package substrate 431. The conductive connection (four) 10 plate-shaped fixture used in the present invention and the so-called τ-type pin which is formed by the columnar connection portion m which is provided at the central portion of the plate-like fixing portion 10 = the central portion is smaller than the medium-plate-shaped fixing portion. The crucible is fixed to the outermost conductor layer 5 of the package substrate of the pin 16 by the conductive adhesive 17, and is formed in a circular or polygonal shape by the size of the pin. In addition: = the shape of the portion 102, the mouth i sJ Λ ^ ^ 疋 month b inserted into the connection portion of the other substrate terminal or the like = no problem, 'cylindrical, prismatic, conical, pyramidal, etc. are all in the present invention The conductive adhesive 17 used in the package substrate and δ can be used in the same manner as in the first embodiment, such as tin (tin-dislocation, tin-record, silver-tin-copper, etc.), conductive resin, and conductive solder. Solder paste and so on. It can also be used: A conductive adhesive in the range of 18 0~2 8 〇 °C. When the conductive adhesive 17 is formed by soldering, tin/lead = 95/5, 6 is used in the same manner as in the first embodiment. Soldering ruts composed of /4〇, etc. are suitable. The solder used has a melting point of 18 〇 28 〇. It is more suitable within the scope of 〇. And particularly preferably in the range of 200 to 260 ° C. Figure 50 is a plan view showing the flat layer 21. In the flat layer 21,

^ — into the net—eye X (four) hX shape. The splicing portion 21b which is continuous with the conductive connecting pin is formed to avoid the conductor unformed portion 21a. In addition, if the mesh is not round, the 2160-2888A-PF 69 -1282255 can be square, and further, the mesh can be omitted on the flat layer. As shown in FIG. 45, in the package substrate 431 of the fourth embodiment of the present invention, a flat layer 21' for forming a power supply layer is disposed on the surface of the substrate and is electrically connected directly to the flat layer 21. The contact pin is 1 〇〇 to reduce the resistance from the external substrate (e.g., the daughter board) to the flat layer 21. Thereby, it is possible to supply electric power from the sub-board side, and it is also possible to supply a large current to the 1C wafer so that the flat layer 21 constituting the power supply layer can perform a sufficient function. [First Modification] Fig. 46 is a cross-sectional view showing a package substrate 432 according to a first modification of the present invention. Fig. 47 is a circular connection provided with a conductive connecting pin 11 in FIG. A magnified view of the foot part. The pin 16 of the package substrate 432 of the first modification is an organic insulating layer (through-hole layer) 利用5 which is formed by the opening portion 18 having the foot portion 16 partially exposed as shown in Fig. 47. The fixing portion 1〇1 of the conductive connecting pin 110 is fixed by a conductive adhesive (tin/锑: 5) 17 on the foot 16 which is opened by the opening 18. As can be seen from the figure, since the organic resin insulating layer 15 is covered so as to be pressed around the pin 16, the heat is applied or the package substrate is mounted on the mother board, even if stress is applied to the conductive connection pin. In the case of 11 ,, it is also possible to prevent the destruction of the foot 16 and the situation from the layer f 曰 1 resin insulating layer 15 _. Further, it is also possible to make it difficult to separate the materials such as metal and resin. As shown in FIG. 46, in the package substrate of the first modification of the present invention, the conductive connection pin 100 is directly connected to the flat layer 21 to reduce the external substrate (for example, the sub-board) to the flat layer 21. resistance. Therefore, even if 2160-2888A-PF 70 .1282255 is in the flat layer constituting the ground layer, it can be connected to the ground line on the daughter board side by low-continuous locking to fully achieve tamper resistance = (noise ) The purpose. In the package substrate 432 of the hybrid nucleus, the conductive connection _(1), I, μμ is selected from copper or copper alloy, tin, sui, Ming, precious metal: two::: f has a high flexible metal Composition. In particular, for example, steel to moon copper. This is because the above substances are excellent in the electrical properties of the conductive joint lock. In addition, the conductive: the lock can also be coated with a metal layer on the surface based on corrosion prevention or strength enhancement. /, m [Second Modification Example] The "Fig. d" is a view showing a d-side view of the package substrate 433 according to the second modification of the present invention. The 49th mesh is provided with a conductive connection pin in a circle in the 帛48 mesh. An enlarged view of the pin portion of 120. As can be seen from Fig. 49, the conductive pin 120 of the package substrate 433 of the second modification is provided with a bee waist portion 103 on the connecting portion 1〇2, so that it becomes rich. Since it is flexible and easy to bend, when the package substrate is mounted on the mother board or the like and stress is applied to the conductive connecting pin 12, the curl of the bee waist portion 1〇3 on the connecting portion 102 can be used. Scratching and absorbing it. [Different Example 3] It is basically the same as the first modified example, but the spherical solder I is attached to the conductive connecting pin and then the conductive connecting pin is disposed. 4, one of the known examples, - shoulder-use - in the continuity of the pin to reduce the resistance from the outer substrate to the flat layer. Thereby, the function of the flat layer can be fully utilized.

2160-2888A-PF 71 .1282255 * , Figure 5 shows the results of the compensation of the package substrate of the M. It is based on the minimum joint strength and heating test of the octagonal steel of the conductive splicing pin after the joining (reproduction of the imaginary IC, and the use of the substrate with the splicing pin. 5 0 C nitrogen re-melting furnace in the inflammatory bee > ^ Mu Mubei) and thermal cycling conditions (13 〇 C / 3 points +-65 〇 C / 3 points as a four ^ knife After the horse 1 cycle, the application of 1 000 cycles) - the status of the continuous pin, the minimum access to the % sore, the previous + ut port strength, conductivity test, etc. as evaluation items. <Embodiment 5> Hereinafter, a method of manufacturing the package substrate of the fourth embodiment will be described. Lu first 1 is a wiring substrate on which a conductor circuit is formed on the surface of the substrate. For the substrate, a glass epoxy substrate, a polyimide substrate, or a double can be used.

Maleic anhydride imide-II Y 1H 匕 Gan 1 # L 丫 丫 丫 树 树 树 树 树 树 树 树 树 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂Forming an interlayer insulating layer on the substrate and roughening the surface of the interlayer insulating layer into a roughened surface, and then applying a thin coating of electroless plating on the entire roughened surface, and then forming a plating light P and then plating the photoresist After the thick coating of the electrolytic electric ore is applied, the 'electroplating photoresist is removed' and the etching treatment is performed, that is, the conductor formed by the electrolytic plating film and the electroless electrocardiogram is formed. The conductive circuits can also all be copper patterns. The concave portion is formed by a conductor circuit or a through hole on the substrate on which the conductor circuit is formed. In order to fill the concave portion, the resin filler is applied by printing or the like, and after drying, the excess resin filler is ground. The method is ground and the resin filler is hardened after the conductor circuit is exposed. ------The second one is in the winter body-electric-road-up-set soil system using the money engraving treatment, grinding treatment, oxidation treatment, oxygen (four) original treatment to form the roughened surface 'in addition, using the key Rough surface formed by the film 2160-2888A-PF 72 1282255 锃: The maximum height Ry of the unevenness of the layer can also be formed in the crucible. &quot;Between. ^, an interlayer insulating resin layer is formed on the roughened surface of the conductor circuit. The interlayer insulating resin layer can be formed using an electroless electrolytic adhesive. ^The adhesive for electrolytic plating is a thermosetting resin as a base, and is particularly resistant to heat-treated resin particles, heat-resistant resin particles soluble in an acid or an oxidizing agent, inorganic particles or fibrous fillers. It can be included in the time. The resin insulating layer is formed by forming an interlayer resin insulating layer between the lower conductor circuit and the upper conductor circuit. The above resin insulating layer may also be formed in a plurality of layers. For example, the lower layer may be composed of inorganic particles or a fibrous filler and a resin base: the upper layer of the reinforcing layer may be an adhesive layer for electroless money. Further, the heat-resistant tree eucalyptus particles having an average particle diameter of ? dissolved in an acid or an oxidizing agent may be dispersed in a heat-resistant resin which is hardly soluble in an acid or an oxidizing agent as a lower layer, and used for electroless plating. The agent is then used as the upper layer. A thin coated electroless plated film is formed on the entire surface of the interlayer insulating resin layer after roughening and imparting a catalyst core. The electroless plating film is preferably made of electroless copper ore having a thickness of 〇 5 5 5 /z m, and is preferably a film. Next, a photosensitive resin film (dry film) is laminated on the electroless plated film formed as described above, and a photomask on which the plating resist pattern is drawn is attached to the photosensitive resin film (a glass substrate may be used) Then, a non-conductor portion provided with a plating resist pattern is formed by exposure and development processing. Further, it is formed on the electroless plating except for the non-conductor portion on the electroless copper plating film. Electrolytic plating is preferably carried out using electrolytic copper plating, and the thickness thereof is preferably 5 to 20 // m. 2160-2888A-PF 73 1282255 Nano, step, using a mixture of sulfuric acid and hydrogen peroxide or sodium persulfate, ammonium persulfate, second iron chloride, helmet lei snow 睹 /, b brother one steel special etching solution By removing the electroless plating film, a separate conductor circuit and via hole composed of two layers of the n ^ ^ ^ -free plating film and the electrolytic plating film can be obtained. Further, the palladium catalyst core exposed on the non-conducting portion may be dissolved and removed by using chrome, persulfate or the like. Next, a roughened layer is formed on the conductor circuit of the surface layer. The formed rough layer is preferably a copper roughened layer formed by an etching treatment, a broadening treatment, or a oxidative reduction treatment. 10% of the roughened layer of the line (4) Next, a solder-resist layer of the insulating layer is formed on the conductor circuit. The organic resin of the present example is thick in the solder resist layer of the month; f# is in the range of 5 to 150 // m. It is also better to use the thickness of 5~4〇(4). If the right side is too thin, it will not be able to function as a solder baffle. If it is thick, it will become difficult to open. The P P P “歹” Μ 4 causes cracks in the zinc-tin which is in contact with the solder. ... Thereafter, the opening of the solder resist layer is opened. In the opening, an alloy composed of at least one of gold, silver, copper, iron-copper, titanium, platinum, and bismuth: at least: :&quot;°, scale, road, crane, and m) may be formed. Gold [layer. The metal layer can be formed by a method of forming a full layer by electric forging, steaming, sputtering or the like. In the following description, a metal layer is formed as a layer, and when a metal layer is formed as a T I - 丄t opening portion, a metal layer of a word or a gold may be formed by way of example. The reason for this is to prevent the exposed conductor circuits 2160-2888A-PF 74, 1282255 from being rotted. In the opening portion, the electroless magnetic recording is used to form the electrification Γ / (4) Example can be exemplified as follows, nickel "~:::, sodium silicate 40g / 1, butterfly acid i2g / i, sulfur / nano 0.1g / l (pH =ll). The degreasing solution is used to clean the surface of the solder resist layer, and then the conductor portion exposed by the opening portion is given a name bar: etc., after the table is activated, it is immersed in the plating solution to form nickel. Electroplating layer. ', the thickness of the nickel bond layer is 〇5~2Mm, and the thickness is more than m~. If it is below the above range, then the solder bump and the recording 2 will be worse if it is in the above range. In the above case, the solder bumps in the opening and the v; the solder bumps are peeled off due to difficulty in storage. After the nickel plating layer is formed, gold plating is used to form a gold plating layer of 0.01 to 0.1&quot; 0 03 //m is preferably used. After the solder resist is formed, a recess for improving the bonding property of the bump-like lock is formed around the opening or the opening for exposing the conductor circuit. The concave portion is formed by exposure and development processing, or may be formed by using a laser such as carbonic acid, liquid Shixia, YAG, or the like. In addition, it is also advantageous to use a perforator to open the opening, etc. The above method can also be used in combination. - The diameter of the opening is in the range of (10), and the straight portion of the recess is in the range of 5-7. The shape of the opening portion and the shape of the recess 4 are preferably formed into a circular shape, but may be formed into a polygonal shape such as a square shape, a star shape, or the like. - In the case of - open-mouth-le-and-concave materials, Solder, a hard recording material, a conductive particulate material, a thermosetting resin, a conductive particulate material, and a thermoplastic resin can be used.

2160-2888A-PF .1282255 ^Temple is better to use solder to form the backing layer. The reason is because the strength of the connection is strong and the selection method is wider. When the contact layer is formed by soldering a tin-shaped dot or pulling t 2 , a blending ratio of lead of 3 5 to 7 μm can be used. In addition, it is also very suitable for materials such as Sisters/Bus/锑, Tin/Silver, Tin/Silver/Copper that do not use Gold L. 'σ When a brazing material is used to form a backing layer, one or more metals such as copper, niobium, nickel, niobium, zinc, indium, and satium can be used to form a gold alloy. The gold solder material and the silver solder material formed of a silver alloy are preferred. The reason is because the conductivity is good and it is not good. When a conductive particulate material and a thermosetting resin and a thermosetting resin are used to form a backing layer, the particulate matter f can be made of a metal, an inorganic or a cerium, and the reason is a linear expansion coefficient or dissolution with the resin. The dots and the like are easily adjusted, and the dispersion and aggregation are less likely to occur when mixed with the tree. However, it can also be formed using the material f of the above material. Examples of the case where it can be used as a conductive particle=like substance are as follows: • using metal, (tetra) resin 4^4 t ^ ^ ^ ^ a ^ f ^ 4 # ^ ^ ^ ; ^ ^ ^ The conductive material is formed after the metal layer or the like is formed; or is formed by coating with a genus layer, a conductive resin, or the like. The above-mentioned conductive resin is used as a binder layer in a thermosetting resin or a thermoplastic resin, and is uniformly used as a binder layer. In the case of a resin, it is preferred to use a thermosetting resin. This is because the workability at room temperature is better than that of the Miyazaki ^_-! conductive layer is formed by printing, electric bonding, bottling, and photoresist. The above method is applied to the opening of the solder green 2160-2888A-PF 7 6 1282255

Electrical metal to achieve electrical continuity.

But in the convex part. In the package substrate of the embodiment of the present invention, since the convex locks disposed on the substrate are connected to the connection portions of the external substrate and are connected, the stress concentration during the thermocompression bonding can be alleviated, so that the protrusions can also be designed to be capable of being When the insertion into the concave portion is actually attached to the external substrate, the pin and the mounting portion of the convex pin are cracked and damaged. In addition, even under the thermal cycle conditions of the reliability test, it is less likely to be cracked or damaged in the joint portion than the substrate on which the BGA is disposed. Hereinafter, the package substrate of the fifth embodiment and a method of manufacturing the same will be specifically described with reference to the drawings. First, the configuration of the package substrate 510 of the fifth embodiment will be described with reference to Figs. 5 and 60. Fig. 59 is a cross-sectional view showing the package substrate 510 before the IC wafer 590 device of the semiconductor component. Fig. 60 is a cross-sectional view showing the package substrate 510 in a state in which the 1C wafer 590 is mounted and mounted on a mother board (external substrate). As shown in Fig. 60, in the package substrate 510 board: 554-phase-connected-. — The configuration of the package substrate will be described in detail with reference to Fig. 59. In the package substrate 510, laminated circuit layers 580A, 580B are formed on the surface of the multilayer core substrate 530 and the surface of the inner layer 2160-2888A-PF 77 1282255. The laminated wiring layer 58A is composed of an interlayer resin insulating layer 55A on which the via hole 506 and the conductor wiring 558 are formed, and an interlayer resin insulating layer 650 in which the via hole 660 and the conductor wiring 658 are formed. Further, the laminated wiring layer 580B is composed of an interlayer resin insulating layer 550 formed with a via hole and a conductor wiring 558, and an interlayer resin insulating layer 650 formed with a via hole 660 and a conductor wiring 658. A convex pin 5 7 6 A for splicing with the splicing portion 5 9 2 of the IC chip 590 (inflammation photo 60) is disposed on the upper side. On the other hand, a convex pin 576A which is not connected to the splicing portion 596 (see Fig. 60) of the sub-board (subboard) 594 is attached to the lower side. The raised lock 576A is connected to the via hole 660 and the conductor line 658 by solder 575. Further, in this embodiment, the projection pin 576A is also disposed on the sub-plate side, but the same ridge as the prior art may be disposed on the sub-plate side. The projecting pin 5 7 6 A is a conical projection having a joint portion 596 for inserting the joint portion 592 of the I ◦ wafer 590 and the sub-plate 594, and is formed by mistake. The mounting of the 1C chip 59 on the package substrate 51 is described with reference to Fig. 61. Fig. 61(A) shows an Ic wafer before actual mounting, and Fig. 61(B) is an enlarged view of a convex pin 576A referred to in Fig. 60. As shown in Fig. 61(A), after the corresponding position between the connecting portion 5 92 of the IC chip 59 and the protruding pin 576 of the package substrate 51 is selected,

—在|旗 I 592 (Fig. 61 (B)). Further, an example will be described with reference to the seventh diagram. In the alternative example 2160-2888A-PF 78 1282255, a through hole as a joint portion is formed on the sub-plate 594. Here, after the relative position of the substrate 510 and the sub-board is selected (Fig. 7 (1)), the substrate 1G is pressurized in an unheated state so that the convex pin 5m is inserted into the through hole (connecting portion) 596. Medium (Fig. 70 (B)). In the case of the card, since the convex pin 576A of the package substrate is inserted into the electrode on the side of the sub-plate 594 (the joint portion 596) when the application is performed without heating, the stress of the press-fit is relaxed, so that it can be prevented. In the actual mounting, the projection pin and the mounting portion (solder) 575 of the projection pin are cracked and broken. Further, since the joint area between the boss-shaped lock 576A and the bonding agent layer (solder) 575 is large, the joint strength is higher than that of the prior art which is formed by the fresh tin bump. An embodiment of the projecting pin will be described with reference to Fig. 71. The projection pin 576A is basically a projection 576a as shown in Fig. 1 (1), but may be two or more projections as shown in Fig. 71 (6). In the case of two or more, it may be arranged side by side or may be arranged around one. In the shape of the projection 576a, it is known to have a conical shape as in Fig. 71(A) or a cylindrical shape like the convex pin 576B shown in Fig. 71 (above). The lower surface (joining surface) of the convex pin 576A is preferably smooth. However, in the case where the recessed portion is provided in the fourth portion of the opening portion, the convex portion 576b as shown in Fig. 71 (8) can be used to raise the convex portion by setting the lock-like convex portion 576b on the joint surface (bottom surface). The joint strength of the pin. - All gold 丄 丄 ～ ~ gold formed by phosphor bronze. Here, the 'bulge pin 576 eight is formed by using a metal or an alloy as shown in Fig. 71 (8) (〇, 0)), and may be as described in the 2160-2888A-PF 79 !282255 71 The convex pins 576B and 576 shown in Fig. (B) and Fig. 7i (e) are formed by using a ceramic 577 for reinforcing the strength of the pin as a trunk and coating a metal layer thereon. &amp; Next, an example of a method of manufacturing the package substrate of the fifth embodiment will be specifically described. Manufacture of Package Substrate (1) Lamination of 18# m copper foil on both sides of a substrate 53 made of a glass epoxy resin or a yttrium (bis-malealeimide) resin A copper-clad laminate 53A formed of 532 was used as a starting material (engineering (A) of Fig. 52). First, the copper-clad laminate 53A is drilled with a drill, and then subjected to an electroless plating treatment, and an inner layer copper pattern 534 and a through hole 536 are formed on both surfaces of the substrate 530 by etching in accordance with the pattern shape. Project of Figure 52 (B)). (2) The substrate 53 having the inner layer copper pattern 534 and the through hole 536 formed is washed with water and dried, and then used in an oxidation bath (blackening bath).

NaOH (10g / l), NaCl 〇 2 (4 〇 g / i), Na3P 〇 4 (6g / 1), in the reduction bath k with NaOH (l 〇 g / l), NaM4 (6g / l) oxidation The reduction treatment is performed to form a rough layer 538 on the surface of the inner layer copper pattern 534 and the through hole 536 (work (C) of Fig. 52). (3) The raw material composition for preparing a resin filler is mixed and kneaded to obtain a resin filler. (4) By the resin filler obtained in the above (3), after the preparation, the coating of the inner layer copper pattern 34 - the inner layer copper pattern 534 Inter- or through-hole 536, then dried at 70 C for 2 〇 minutes, the other faces are also the same as above

In the manner of 2160-2888A-PF 80 1282255, the resin filler 540 is filled between the inner layer copper patterns 534 or through the through holes 536, and dried by heating at 7 (rc for 2 minutes (Fig. 52 (D)) (5) One side of the substrate 530 which had been subjected to the above (4) treatment was ground by a belt-shaped sander using a #600 strip-shaped abrasive paper (manufactured by Tri-Chemical Chemicals), followed by buff polishing. Then, heat treatment is performed at 120 ° C for 1 hour and 150 ° C for 1 hour to cure the resin filler 540. (6) Soft etching by alkaline degreasing on a package substrate on which a conductor circuit has been formed, followed by use It is treated with a catalyst solution composed of palladium chloride and an organic acid, and then a Pd catalyst is added, and after the catalyst is activated, it is 3.2xl (T2m〇l/l, nickel sulfate 3·9xl). T3m〇l/l, complexing agent 5.4xl (T2m〇l/l, sodium hypophosphite 3.3/10^01/1, boric acid 5.0·10x10 'mol/l and surfactant (made by Nissin Chemical Industry, surf in 〇l 465)0. Immersion in electroless plating solution consisting of conditions such as lg/1 and pH = 9, and immersing for 1 minute, then performing vertical and horizontal every 4 seconds. Vibrating, a needle-shaped alloy coating layer made of Cu-Ni-P and a roughened layer 542 are provided on the surface of the conductor circuit 534 and the land 536a of the through hole 536 (work (F) of Fig. 53). The maximum height of the concavities and convexities of the layer 542 is 3/m. After the formation of the rough layer, it is carried out under the conditions of bismuth monofluoride hydride, thiourea 1·Omol/1, temperature 35° C., and ρΗ=1·2. Cu-Sn substitution reaction 'to provide a Sn layer with a thickness of 0.3#!!! on the surface of the roughened layer (not ____________B1——〇_ ___ — ~------* ··-', . . . (1) The raw material composition for preparing the interlayer resin insulating agent was stirred and mixed to obtain an interlayer resin insulating agent having a viscosity adjusted to 1.25 Pa·s (for the lower layer 2160-2888A-PF 81 1282255).曰 着 , , , 将 将 将 将 将 将 将 将 将 将 将 将 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料 原料On both sides of the substrate 530 of (6), the interlaminar resin insulating agent (for the lower layer) 544 having the degree of 1 obtained in the above (7) of 1.5 Pa.s is used to adjust the use of the roller within 1 2 ib. The cloth was coated, and after standing for 20 minutes in a horizontal state, it was dried at 60 ° C for 30 minutes (prebake), and then, the viscosity obtained in the above (7) was 7 Pa s. The adhesive solution (upper layer) 546 is applied within 24 hours after preparation, and is allowed to stand in a horizontal state for 2 minutes, and then dried at 6 ° C &gt; c for 3 minutes (pre-baking) to form The adhesive layer 550α having a thickness of % #ffl (engineering (g) of Fig. 53). (9) The photomask film 551 on which the 85//πιφ black circle 551a has been printed is closely dried on both sides of the substrate 530 on which the adhesive layer 550α has been formed in the above (8), and the super-use is used. The high pressure mercury lamp is exposed at 5 〇 0 mj/cm 2 (engineering (η ) of Fig. 5). Then, it was spray-developed with a dm% solution, and the substrate was further exposed at 3 〇〇〇mj/cm 2 using an ultrahigh pressure mercury lamp, and was applied at 1 Torr for 1 hour at i20 ° C for 1 hour. And subsequent heat treatment (postbake) at 150 ° C for 3 hours to form an 85// _ opening (opening for forming a via hole) having an excellent precision corresponding to the size of the mask film. Interlayer resin insulation layer of thickness 38# m (2.....®—Working. X丄_) 丄: “Alternative—I”—in the opening 548 of the tin The plating layer (not shown) is partially exposed. Alternatively, a via hole or a laser may be used on the resin film to form a via hole as an interlayer resin 2160-2888A-PF 82 J282255 ψ insulating layer. 1)) by immersing the substrate 530 having the opening 548 in chromic acid, the gutta-percha, the epoxy resin present on the surface of the interlayer resin insulating layer 550 can be removed and simultaneously roughened. The surface of the interlayer resin insulating layer 550 (work (J) in Fig. 54). Thereafter, the obtained substrate was immersed in a neutralizing solution (manufactured by シyY Co., Ltd.) and then washed with water. Further, on the surface of the substrate after the roughening treatment (the roughening depth...), the catalyst &gt; nuclei (not shown) are attached by the palladium catalyst (7 于 V V )) The surface of the interlayer resin insulating layer 55 is on the inner wall surface of the opening 548 for the via hole. (11) The substrate is immersed in an electroless copper plating aqueous solution having the composition shown below, and is on the entire roughened surface. An electroless copper plating film 552 having a thickness of OH is formed (engineering (K) of Fig. 54) [aqueous solution of electroless electrophoresis] EDTA 〇.08 mol/l copper sulfate (K Ohol/l ® HCHO 0.05ffl〇l/l

Na0H 〇. 05mol/l - bis 2 bite 80mg/1 (a , a J -bipyridy 1 ) PEG 0.10g / l [electroless plating conditions] - temperature - degree _.6 -5 - C - - liquid - Body-2ϋ-minute, a-.._____________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________ Dry film), then install the mask, 2160-2888A-PF 83 1282255 and expose it at 100mJ/cm, and develop it with 〇·8% sodium carbonate, and set the plating resistance of 15 // m thickness. 554 (Fig. 54 ^ 不王CL) ) 〇 (13) Next, electrolytic copper plating is performed on the portion where no photoresist is formed, and a thickness electrolytic copper plating film 556 is formed (the construction of the fifth drawing ( Μ)). [electrolytic plating aqueous solution] sulfuric acid copper sulfate

2.24mol/l 〇.26mol/l made of Japan, the product name is eight VIII> Bu, HL) Additives (7 Bu in 7 eve 19.5ml / 1 [Electrical clock conditions] 1 λ / am time 65 minutes

Temperature 22±2〇C (14) After the plating resist 554 is peeled off by 5% K〇H, the electroless steel plating film 52 under the light blocking resistance is treated by a mixture of sulfuric acid and chlorine peroxide. The solution is dissolved and removed, and a conductor line (4) having a thickness of 18 (four) composed of an electroless copper plating film is formed to form a via hole 560 (working item (n) of Fig. 55). (15) The process of the same step as (6) is performed to form a roughened surface 562 of 10,000, and the process of performing a Sn-substituting U map on the surface thereof is further advanced (10). In addition, instead of using the plating alloy, the process of (7) to (10) may be repeated by the operation of the above steps (7) to (10) to: step: the upper conductor track 658 and the via hole 66Q (conductor circuit), and get 2160- 2888A-PF 84 1282255 Multilayer printed circuit board (Project (p) of Figure 55). However, Sn substitution is not performed here. (17) On the other hand, a 60% by weight cresol phenolic acid solid type epoxy resin (manufactured by Sakamoto Chemical Co., Ltd.) dissolved in DMDG is acrylized with 5 〇% of an epoxy group to impart photosensitivity oligomers. (oligomer) (molecular weight: 4000) 46.67 g, 80% by weight of bisphenol A epoxy resin dissolved in methyl ethyl ketone (oiled > X, EPC 〇 AT1 〇〇 1) 15. gram, imidazole hardener (4E4MZ-CN), 6 grams, multi-valent propylene monomer of photosensitive monomer (made by 曰本化制药, r6〇4) 3 grams, the same type The propylene monomer (manufactured by Kyoeisha Chemical Co., Ltd., DPE6A) 1. 5 g and the dispersion defoamer (female &gt; y / a company, S - 6 5) 0 · 71 g of the mixture, further to the mixture 2 g of benzophenone (manufactured by Kanto Chemical Co., Ltd.) as a photoinitiator and rice ketone (manufactured by Kanto Chemical Co., Ltd.) as a sensitizer were added, and 2 g was obtained, and the obtained degree of drilling was adjusted to 2 at 25 ° C. OPa · s solder resist composition. (18) The solder resist composition is applied to both surfaces of the multilayer wiring board obtained in the above (16). Next, after finishing the drying treatment at 70 ° C for 2 及 minutes and at 70 ° C for 30 minutes, a photomask film having a circular pattern (curtain pattern) and having a thickness of 5 mm was formed ( It is fixed by being adhered tightly, and is exposed to ultraviolet rays of 1 〇〇〇mJ/cm 2 and subjected to DMTG development treatment. Then go further at 80 ° C for 1 hour, loo ^ under } hours, 12 〇 t: down! After the heat treatment was carried out under the conditions of 5 hours and 15 hours under 15 ° C, a solder resist layer (thickness 2 〇 / thick tin foot ^ ^ p 5 7 ^ ^ ^ p ^ 200 / ΙΠ) was formed. Zm) 57〇 (the work of the πth figure (8)). 2160-2888A-PF 85 1282255 η ', (19) Next, the tin/lead=4:6 solder 575 used as the adhesive layer on the opening 571 of the solder resist film 570 is printed by the mask It is formed in the thickness of M/zm (engineering (R) of Fig. 56). On the other hand, the projecting pin 576A formed of the 42 alloy is supported by a pin-up tool (not shown). After the flux is applied to the opening 571, reflow welding (ref low) is performed by abutting the tool supporting the projecting pin 576A against the package substrate side to make the bump The pin 576A is connected to the solder 575 to obtain a package substrate 510 having a protruding metal shape (Fig. 57). (First modification) Basically, it is completely the same as the fifth embodiment, but is applied to the opening. The metal layer is formed from (1) to (18) in the same manner as in the fifth embodiment to form a solder resist 570 having an opening 571 (engineering (Q) of Fig. 58). (1 9) Secondly, The substrate applied to the solder resist layer is immersed in an electroless nickel having a pH of 5, which is composed of 30 g/l of vaporized nickel, 10 g/l of sodium hypophosphite, and 1 g/l of sodium citrate. 2 minutes in the plating solution, and a recording clock layer 572 having a thickness of 5/m was formed on the opening portion. Then, the substrate 530 was immersed in a condition of 93 C at 2 g/l of gold cyanide. An electroless gold electroplating liquid composed of ammonium chloride 75 g/i, sodium citrate 50 g/l and sodium hypophosphite 10 g/l was used for 23 seconds to form a gold having a thickness of 〇〇3#m on the nickel plating layer 572. Electricity Layer 574 (Project (R) of Fig. 58.) C2 〇〇.^ ^ ^ im-来—ϋ—m 1 Membrane “The tin/lead of the adhesive layer of the opening part 5 71 = 4: 6 solder 575 is formed by a mask printing and is formed to have a thickness of 18/m. 2160-2888A-PF 86 1282255 In addition, the projecting pin 5m formed of the 42 alloy is supported by a pin-up tool (not shown). After the flux is applied to the opening, the mold is supported by the mold supporting the projecting pin 576A at a position of 200 t: re-welding to connect the two, thereby obtaining a protrusion. The package substrate 51 of the metal pin (Fig. 59). (Second modification) Basically, the same as the fifth embodiment, but four recesses are provided around each opening 571. From (1) to (1) 17) It is the same as that of the fifth embodiment. (18) The solder resist composition 570 is applied to the surface of the multilayer wiring substrate 1A obtained in the above (16) at a thickness of 2 Å//[11]. Coating (Project (A) of Fig. 62). Secondly, after drying for 2 minutes and 30 minutes at 70 C, it is used to form an opening. The concave portion around the opening and the recessed portion are drawn with a circular pattern (the mask pattern) and have a thickness of 5 _ 1 (not shown), which is closely adhered and fixed, and then exposed to ultraviolet rays of 5 〇〇 mJ/cm 2 . A concave portion 571b is formed around the opening portion (engineering (B) in Fig. 62). Thereafter, a mask film having a circular pattern (mask pattern) and a thickness of 5 mm is formed to form an opening portion (not shown) It is shown that it is closely adhered and fixed, and exposed to ultraviolet rays of 1000 mJ/cm 2 and subjected to mtg development treatment. Then, after further stepping into the step of 8 (TCT 1 hour, i 〇 (rcT J hour, 12 〇 tT 1, hour and 15 Gt under 3 hours), the solder pin portion (including The layer hole and its land portion) is a solder resist layer (thickness 20/^111) 570 having a recessed portion 57ib having a diameter of 10, m and a depth of 10/m as a predetermined portion (the work of Fig. 62 (c) ))) 2160-2888A-PF 87 1282255 (丨9) Next, the solder 575 which is used as the adhesive layer of the opening portion of the solder resist film 57 is tin/lead=4:6, which is printed by the mask. The thickness of 18#m is formed (the engineering (D) of Fig. 63). "On the other hand, the convex pin 576D formed by the 42 alloy (refer to the drawing (D)) is not shown. The lock is erected and supported by the metallurgical tool. After the retaining agent (4) is placed in the opening 571, the refinishing is performed by abutting the tool supporting the convex lock 576D against the sealing plate side to make the two phases The package substrate 51G having a protruding metal lock is obtained by connecting '(Fig. 63 (E)). (Third modification) Basically, it is the same as the second modification, but as shown in Fig. 64 A metal layer is applied to the opening 5A. The metal layer is formed of a nickel layer 572 and a gold plating layer 574 in the same manner as the first modification. (Fourth modification) Basically, the first metal is used. The aluminum layer of the layer is the same. 1 The modification is the same, but the steps of applying (1) to (18) in the opening are all complete with the ith modification (19) for forming an opening on the solder diode 1 DiU A plate 530 of the portion 571, on the opening portion e 71 , , the conductor line 658 from the jinji road and the via hole 6 6 0, is used as a money-saving method to form a 4#m aluminum layer 672 ( Figure 65, Project CA)) 银 Add silver solder on the aluminum layer 6 7 2 of the opening 5 71; j ~ (-BA g 2 8 ) 5 7 -5-C-0 · -1 夯, and ▲ — At the time of the work (Fig. 65, work 3 (B)), the convex pin 576A made of cobalt is attached and pressed.

Package substrate (Project of Fig. 65 (〇). 2160-2888A-PF 88 1282255 ψ , (Variation 5 modified example) Basically the same as the fifth embodiment, but copper is used as the metal particle in the subsequent layer Further, a polyimide resin is used as the thermoplastic resin. The steps (1) to (18) are all the same as those of the first modification. (19) The material is then made of metal particles and a thermoplastic resin. The copper of the particles is formed by a spherical shape with a diameter of 1 # m and a diameter of 0 · 6 // m. The ratio of the diameter of the formed copper particles to the diameter #·6 // m is 3:1. The prepared substance is used as a thermoplastic resin, and is stirred in a polyether imide tree so as not to cause coagulation to form a sheet having a filling rate of 85%, a diameter of 50 // m, and a thickness of 10 /zm ( Tablet) 675. (20) After the formed sheet 675 is inserted into the opening portion 571 (the engineering (A) of Fig. 6), the substrate is heated at 200 ° C, and then the projection is recorded as a projection. The pin 576A is press-fitted to be joined, that is, the package substrate is obtained (the work (B) of Fig. 65). (6th modification) The above is the same as the modified example of the younger brother, but the tin layer is formed by a spring copper-tin substitution reaction in the metal layer. Further, inorganic particles, cerium oxide as a thermosetting resin, and the like are used in the adhesive layer. The steps of epoxy resin (丨)~(i 6) are exactly the same as those of the fifth embodiment. (17) Before the formation of the solder resist layer, the tin is replaced by tin on the roughened layer of the conductor circuit to form 0. ·3//πι tin layer. (18) On the other hand, the cresol phenol which is dissolved in DMDG by weight of 〇 - 〜 醛 醛 醛 醛 垂 垂 垂 垂 垂 垂 111 ― ― ― ― ― ― ― ― The base ship 1 charm winter gives a photosensitive polymer (molecular weight 4000) 46 · 67 grams, 80% by weight of bisphenol A epoxy resin dissolved in methyl ethyl ketone (oilification > work 2160-2888A - PF 89 1282255, EPCOATl001) 1. 0 g, imidazole hardener (manufactured by Shikoku Chemical Co., Ltd., 2E4MZ-CN) 1. 6 g, multivalent propylene monomer of photosensitive monomer ("604" manufactured by Nippon Kasei Co., Ltd.)克, the same type of multivalent propylene monomer (Kyoeisha Chemical, DPE6A) 1.5 grams and disperse 糸 defoamer (廿 > 夕 7 ^ company system, $ — 6 5) 0 · 71 grams mixed, Further, 2 g of benzophenone (manufactured by Kanto Chemical Co., Ltd.) as a photoinitiator and 0. 2 g of ketone (manufactured by Kanto Chemical Co., Ltd.) as a sensitizer are added to the mixture to obtain a viscosity at 25 ° C. Adjusted to 2. OPa · s solder resist composition. In addition, the viscosity measurement uses a B-type viscometer (Tokyo gauge, DVL-B type), at 60 rpm, the rotor (rot〇r) N〇. 4, and in the case of 6 rpm, a rotor No. 3 is used. (19) The solder resist composition 570 is applied to the both sides of the multilayer wiring board obtained in the above (17) at a thickness of 20 / / m (the item (A) of Fig. 67). Next, after finishing the drying process of 7 〇χ: τ 2 〇 minutes and 30 minutes at 7 〇 C, a mask film (not shown) having a circular pattern (mask pattern) and having a thickness of 5 mm was formed. It is tightly bonded and fixed, and exposed to ultraviolet light of 100°ra J/cffl2, and subjected to dmTG treatment. Then, further heat treatment is performed under conditions of 8 (1 hour under TC, 100t: T} hour, 12 (1 hour under rc, and 3 hours at 150 °c), and the solder pin portion is formed. The layer hole and its land portion) are used as the solder resist layer (thickness 2〇//m) of the opening 571 (opening diameter: // //m) 57〇 (the engineering (B) of Fig. 67). Table - 63 to form two recesses 571b having a diameter of 50/zm and a depth of 15/m (engineering (C) of Fig. 67). 2160-2888A-PF 90 1282255 (21) The subsequent use of inorganic particles and thermal hardening A dioxic system of inorganic particles is formed in a polygonal shape of a diameter. The formed inorganic particles are immersed in a nickel electro-mineral liquid to apply a nickel layer to the inorganic particles/surface layer. The inorganic particles loaded are added to the epoxy resin as a bismuth curable resin, and are mixed without causing condensation to form a filling rate of 90%, and then loaded into the container without allowing air to enter. In the bottle for potting (p〇t). ' (22) The above-mentioned material 575] by the bottling method is inserted into the opening 571 (Fig. 68) After the heating (C), the convex lock 576D made of cobalt is attached and hardened at 20 (TC) to obtain a package substrate (Project (E) of Fig. 68). 7 Modified Example) Basically, a is the same as the first modified example, but nickel plating 572 is applied as a metal layer as shown in Fig. 6 (A), and gold plating is not performed. A ' is the one that is internally used and painted on the surface by a gold electron microscope. (8th modification) Basically, it is the same as the first modification, but it is not as shown in Fig. 71 (E). The convex pin 576E of the obtained package substrate is formed by using the inside to be formed by ceramics and coated with nickel or copper on the surface layer. (Nineth modification) Referring to Fig. 72 and Fig. 73, In the ninth modification, the convex pin 57 6F which is not the side surface and the bottom surface of Fig. 71 (F) is used. Here, the convex pin 576F is attached to the bottom. 2160-2888A~Pf 91 , 1282255 surface is formed with 5 protrusions 576b. First, an opening portion 5 71 is formed on the solder resist 507 of the package substrate as shown in Fig. 72(A), and is opened there. A recess 571b (Fig. 72(B)) that can be connected to the conductor circuit 658 is provided in the portion 571. Next, a metal layer 573 made of nickel or the like is formed in the opening 571 (Fig. 72 (〇), and further, Further, an adhesive layer 575 made of solder or the like is formed on the metal layer 573 (Fig. 73(D)). Finally, the convex pin 576F is housed in the opening 571. In the ninth modification Since the conductor circuit 658 is electrically connected not only through the opening 571 but also by the recess 571b, it can be transmitted to the external substrate even if the electrical and electrical signals of a large capacity are not broken. (Tenth Modification) Basically, it is the same as that of the fifth embodiment, but tin and antimony are used for the solder layer. (Comparative Example) Basically, it is the same as that of the fifth embodiment, but the electrode from the opening is formed into a solder ball, and the Ic wafer is actually mounted. With respect to the above-described package substrates of the fifth to eighth modified examples and the comparative examples, the joint strength was tested, and the tensile test C of the external substrate was tested for reliability. The occurrence of cracks, damages, and the like were compared, and the results are shown in the graph of Fig. 74. It can be seen from the results of the change of the first Budi 8 that the direct person is stronger than the above. ^The crack and damage of the electrode are not observed under the condition of the regression test or the thermal cycle. Everyone

2160-2888A-PF 92 • 1282255 ♦ <6th embodiment>

The package substrate of the sixth embodiment will be described with reference to Fig. 75. In the multilayer printed wiring board 10, laminated wiring layers 80U, 80D are formed on the surface and inside of the core substrate 3 (). The laminated wiring layer 8〇u, 8〇D is composed of a lower interlayer resin insulating layer 5〇 formed with a via hole 46, an upper interlayer resin insulating layer 6〇 formed with an upper via hole 66, and a resin insulating layer in the upper layer. The solder resist layer 7 formed on the layer 6 is formed. By the opening portion 71 of the solder resist 7 turns, a solder bump (external connection terminal) for IC chip (not shown) is formed on the upper via hole 66, and is on the lower side. A 1-layer hole 6 6 is connected to a conductive connection pin (external connection terminal) 78 for connecting a sub-board (not shown). In the sixth embodiment, the through holes 36 connecting the laminated wiring layers 8〇u and 8〇d are formed in such a manner as the Beton core substrate 3 〇 and the lower interlayer resin insulating layer 〇. The through-hole 36 is filled with a resin filler 54 and covered with electroplating 5 8 in the sweat. Similarly, the via hole 46 formed on the lower interlayer resin insulating layer 50 is filled with a resin filler, and a cap plating 5 is disposed at the opening portion. In the sixth embodiment, a through hole is formed by a drill or a laser so as to penetrate the core substrate 30 and the lower interlayer resin insulating layer 50 to form a through hole 36, and a via layer is formed directly above the through hole 36. Hole 66. Thereby, the bead hole 36 and the via hole 66 can be linearly shortened to shorten the line length, and thus the signal transmission speed can be improved. Further, since the through hole 36 is directly connected to the connection -78), the reliability is excellent. In particular, in the sixth embodiment, the filler 54 filled in the through hole 36 is first used.

2160-2888A-PF 93 J282255 鹓/ After polishing and planarization, a cap plating (conductor layer) 58 covering the filler 54 is disposed and a via hole 66 is formed thereon, so that the smoothness of the surface of the through-hole is high. At the same time, the connection reliability between the through hole 36 and the via hole 66 is also excellent. Further, in the multilayer printed wiring board of the seventh embodiment, the through hole 36 and the lower via hole 46 are filled with the same filling resin w, and the filling resin 54 is simultaneously polished and planarized. Therefore, the composition can be made very cheaper. Moreover, since the above configuration can maintain the strength of the inside of the through hole and the inside of the via hole, the reliability of the multilayer printed wiring board can be improved. In addition, since the filler 54 filled in the via hole 46 is first planarized by polishing, then the cap plating (conductor θ) 58 covering the filler 54 is disposed and opened thereon. Since the layer holes 66 are provided, the smoothness of the surface of the lower interlayer holes 46 is high, and the connection reliability between the lower interlayer holes 46 and the upper via holes 66 is also excellent. In order to fix the conductive connecting pin on the lower via 66, a solder layer 77 such as tin/germanium, tin/silver, tin/silver/copper is formed. [Simple description of the diagram] Figure 1 (a), Figure 1 (b), and the first! Figure (c) and the first! Figure (d) is a manufacturing drawing of the package substrate of the first embodiment of the present invention. +Fig. 2(a), Fig. 2(b), Fig. 2 (phantom and Fig. 2(d) are manufacturing drawings of the package substrate of the first embodiment. - 3 WUc) A^ 3 ( d) #^g 1 See the manufacturing drawing of the package substrate of the embodiment. Fig. 4(a), Fig. 4(b), Fig. 4(C), and Fig. 4(d) are the 2160-2888A-PF 94, 1282255 ♦ · 1 embodiment of the package substrate manufacturing drawings . Fig. 5 is a manufacturing drawing of the package substrate of the i-th embodiment. Fig. 6 is a manufacturing drawing of the package substrate of the first embodiment. Fig. 7 is a manufacturing drawing of the package substrate of the first embodiment. Fig. 8 is an enlarged cross-sectional view showing the portion where the conductive connecting pin and the pin are connected in Fig. 7. Fig. 9(A) is a cross-sectional view showing an alternative example 1 of the first embodiment, and Fig. g(B) is a straight view in the direction of the arrow B of Fig. 9(A). Fig. 10 is a cross-sectional view showing a package substrate of a second modification of the first embodiment. Fig. 11 is a cross-sectional view showing another example 1 of the second modification. Fig. 12(A) is a cross-sectional view showing the pin portion of the package substrate shown in the second example of the second modification, Fig. 12. ) Figure 12 is a straight view of the arrow direction of Figure 6. Fig. 13(A) is a cross-sectional view showing the pin portion of the package substrate shown in the third example of the second modification, and Fig. 13(8) is the arrow direction of Fig. 12(1)b. Figure 14 is a cross-sectional view of the second modification (column 4). Fig. 15 is a cross-sectional view showing a package substrate of a third modification. Fig. 16 is a cross-sectional view showing an alternative example of the third modification. The figure is a cross-sectional view of the second example of the third modification. A brother 18 shows the evaluation results of the package substrate of the modified example of the first embodiment--------------------------- thought-graph-table -〇,一一-------------------------------- - Figure 19 is the second embodiment of the substrate Manufacturing: Cheng Tu: - a second. The drawing is a cross-sectional view of a package substrate of a second embodiment.

2160-2888A—PF 1282255 Renewal and Pinion Connections Figure 21 is an enlarged cross-sectional view of the conductive interface in Figure 20.

Fig. 22 is a cross-sectional view of a package substrate in another example of the second embodiment. Fig. 23 is a view showing a package substrate in a first modification of the second embodiment. The cross section of the first example is shown in Fig. 24 (Fig. 24). Fig. 24 (A) is the second embodiment! Change the cross-sectional view of the pin portion of the mounting substrate, and Fig. 24 (β) is a straight view in the direction of the arrow. Figure 25 (Α) is the second embodiment! # μ Example of the brother 1 change example of the exception 2 seal section (four) 25 diagram (8) is the 25th diagram (Α) Β front direction straight view. Fig. 26 is a first modification of the second embodiment. Fig. 27 is a cross-sectional view showing a third example of the second modification of the second embodiment. Cross section of the package substrate of the modification Fig. 28 is a cross-sectional view showing another example i of the second modification of the second embodiment. Fig. 29 is a cross-sectional view showing a second modification of the second embodiment. 130 ® ^ J 2^ Μ ^ ^ # t % ^ Unintentional chart. Fig. 31 is a manufacturing drawing of the package substrate of the third embodiment. Figure 32 is a cross-sectional view showing a package substrate of a third embodiment. Figure 33 (1) is an enlarged cross-sectional view of the 1M knife of the conductive joint lock and the foot in the 32nd figure. Figure 33 (B) is a modified example of the conductive joint pin s_gas-surface-graph"- ^—_________ Figure 34 is a cross-sectional view of the package substrate of the seventh embodiment of the third embodiment. 2160-2888A-PF 96 4 ^ 282255 FIG. 5 is a cross-sectional view of a package substrate according to a first modification of the third embodiment. FIG. 36 is a third example of the first modification of the third embodiment. A cross-sectional view of the foot of the cover plate, Fig. 36 (B) is a straight view of the direction of the arrow B of Fig. 36 (A). Fig. 37(A) is a cross-sectional view showing the pin portion of the package substrate of the second example of the first modification of the third embodiment, and Fig. 37(B) is a perspective view of the arrow arrow direction of Fig. 37(A).

Fig. 38 (Α) and Fig. 38 (Β) are sectional views of another example 3 of the ith modification of the third embodiment. FIG. 39 is a second embodiment of the third embodiment of the third embodiment, and a second modification of the third embodiment is a cross-sectional view: FIG. 41 is a second example of the second modification of the third embodiment. Schematic diagram of the section view. The package substrate evaluation of each modification of the third embodiment is shown in Fig. 4 is a block diagram of the fourth embodiment. A cross-sectional view of the sealing substrate of the 46th (fourth) embodiment. Figure 46 is a diagram of the fourth embodiment. The cross section of the package substrate of the modified example of the first embodiment is shown in Fig. 46. The conductive connection lock and the pin are connected to each other. 分 杳 | | | | | | | | | 第 第 第 第 第 第 第 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Profile of the package substrate

2160-2888A-PF 97 1282255 Fig. 49 is an enlarged cross-sectional view showing the connection portion of the conductive connecting pin and the pin in Fig. 48. Fig. 50 is a plan view of the flat layer of the fourth embodiment. Fig. 51 is a schematic diagram showing the results of evaluation of the package substrate of the fourth embodiment. Fig. 52 (A), Fig. 52 (B), Fig. 52 (C) and Fig. 52 (8) are manufacturing drawings of the package substrate of the fifth embodiment. Fig. 53 (8), Fig. 53 (7), Fig. 53 (8), and Fig. 53 (8) are manufacturing drawings of the package substrate of the fifth embodiment. Fig. 54 (1), Fig. 54 (1), Fig. 54 (1), and Fig. 54 (1) A manufacturing drawing of a package substrate according to a fifth embodiment. Fig. 55 (M), Fig. 55 (N), Fig. 55 (〇), and Fig. 55 (?) are manufacturing drawings of the package substrate of the fifth embodiment. Fig. 56 (Q) and Fig. 56 (Fig. 5 is a manufacturing drawing of the package substrate of the fifth embodiment. Fig. 5 is a sectional view of the package substrate of the embodiment of Fig. 5. Fig. 58 (Q), 58 (" and Fig. 58 (manufacture drawing of the package substrate of the first embodiment of the fifth embodiment of the phantom system). Fig. 59 is a cross-sectional view of the package substrate of the ith modification of the fifth embodiment. Figure 7 is a cross-sectional view showing a state in which a wafer is mounted on a package substrate of a fifth embodiment. Fig. 61(A) is a cross-sectional view of the IC wafer of the fifth embodiment, and an enlarged view of the U JI portion of Fig. _________________ Fig. 62 62, (B) and 62 (c) are manufacturing drawings of the package substrate of the second modification of the fifth embodiment. 2160-2888A-PF 98 I282255 Fig. 63 (D) and Fig. 63 (E) is a manufacturing drawing of the package substrate of the second modification of the fifth embodiment. Fig. 6 is a manufacturing drawing of the package substrate of the third modification of the fifth embodiment. - Fig. 65 (A) Fig. 65(B) and Fig. 65(c) are diagrams showing the manufacturing process of the package substrate of the fourth modification of the fifth embodiment. 苐6 6 (A) and 6 6 (B) 5th modification of the embodiment Fig. 67(A), Fig. 67(B) and Fig. 67(C) are diagrams showing the manufacturing process of the package substrate of the sixth modification of the fifth embodiment. (D) and (E) are the manufacturing drawings of the sealing substrate of the sixth modification of the fifth embodiment. Fig. 69(A) shows the packaging substrate of the seventh modification of the fifth embodiment. FIG. 6 is a cross-sectional view of a package substrate according to an eighth modification of the fifth embodiment. FIGS. 7(A) and 7(0) are modifications of the fifth embodiment. Manufacturing drawings of the package substrate. Brother 71 (A), 71 (B), 71 (C), 71 (D), 71 (E) and 71 (F) Fig. 72(A), Fig. 72(B) and Fig. 72(C) are packages of a ninth modification of the fifth embodiment. [Manufacturing drawing of the substrate] The structure of the package substrate of the modification of the fifth embodiment of the fifth embodiment is the manufacturing process of the package substrate of the fifth embodiment of the fifth embodiment. Test knot 2160-2888A-PF 99 W2255 fruit diagram. Figure 75 is a cross-sectional view of a package substrate of the sixth and the array. Fig. 76 is a conventional technique [description of main components] 1 to a core substrate; 2a to a resin layer; 3 to electroplating photoresist; 4a to rough surface; 6~interlayer opening; 8~copper foil; 9 a~rough surface; Π~roughened layer; 13~electroplated film; 15~organic resin insulating layer 16 a~extension; 16 c~signal line; ~ opening portion; 21~ flat layer; 21b~ contiguous portion; 3 4~ inner layer copper pattern; 4 6~ via hole; --------- two layer" [榭] | 8 to electric boat; 66 to inner conductor layer · a cross-sectional view of the package substrate. 2~resistive insulating layer; 2b~resin layer; 4~conductor layer; 5~conductor layer; 7~ via hole; 9~through hole; 10~resin filler, 12~electroless plating film; 1β~foot position; 16b~ body part; 17~ solder paste; 19~ metal film; 2 la~ conductor unformed part; 30~ core substrate; 36~through hole; 50~ lower interlayer resin insulation layer

MrjjtJ is a filler; ________________________ 6〇~ solder bumps; 7 0~ solder resist layer;

2160-2888A-PF 100 1282255

7 6~ fresh tin bumps; 78~ conductive connecting pins; 80U~ laminated circuit layers; 91~ lands; 1 01~ fixed parts; 103~ bee waist; 120~ conductive connecting pins; 131~ package substrates; 133~ package substrate; 135~ package substrate; 137~ package substrate; 139~ package substrate; 231~ package substrate; 233~ package substrate; 235~ package substrate; 237~ package substrate; 330~ package substrate; 332~ package substrate; 334~ package substrate; 336~ package substrate; 338~ package substrate; 4 3 2~ package substrate; 5丄0~ package-substrate; 530A~ copper-plated laminate; 534~ inner copper pattern; 7 7~ fresh tin layer; 80D~ superimposed wiring layer; 90~ conductor layer; 100~ conductive connecting pin; 102~column connecting portion; 110~ conductive connecting pin; 130~ package substrate; 132~ package substrate; 134~ package substrate; Package substrate; 138~ package substrate; 230~ package substrate; 232~ package substrate; 234~ package substrate; 236~ package substrate; 238~ package substrate; 331~ package substrate; 333~ package substrate; 335~ package substrate; A mounting substrate; 431~ package substrate; 433~ package substrate; 5 3 Q~ multi - layer of the core substrate; 532~ foil; 536~ through hole;

2160-2888A-PF 101 J282255

5 3 8~ roughened layer; 5 4 2~ resin filler, 5 4 8~ opening; 550~ interlayer resin insulating layer; 551~mask film; 552~electroless copper plating film; 556~ electrolytic copper plating film; 570~ solder resist layer; 57lb~ recess; 574~ gold plating; 5 7 5 C~ silver solder; 576A~ bump pin; 576B~ bump pin; 576C~ bump pin; 576E~ convex Lifting pin; 577~ ceramic; 580B~ laminated circuit layer; 592~ connection part; 596~ connection part; 650~ interlayer resin insulation layer; 6 6 0~ interlayer hole; 675~ sheet; 72b fixing portion; 752~ interlayer resin insulating layer. 540~resin filler; 544~interlayer resin insulating agent; 546~photosensitive adhesive solution; 550α~adhesive layer; 5 51 a~black circle; 554~electroplated photoresist; 558~ conductor line; 571~opening 572~nickel layer; 575~adhesive layer; 575D~substrate; 576a~protrusion; 576b~protrusion; 576D~bully pin; 576F~bully pin; 580A~superimposed circuit layer; 1C wafer; 5 9 4~ daughter board; 630~ drill bit; 658~ conductor line; 6 7 2~ Ming layer; 710~ conductive connection pin; 717~ conductivity followed by 1; 722~ connection;

2160-2888A-PF 102

Claims (1)

I28@S54Q779 Application for Fine Revision This revision date: 96.1.16 X. Patent application scope: 1 · A package substrate is fixed on a substrate provided with a conductor layer on a resin insulating layer between layers to be used with other substrates. The electrically conductive connecting pin is composed of a columnar connecting portion and a plate-shaped fixing portion, and is formed on the columnar connecting portion. a portion of the bedding waist portion having a smaller diameter; forming a foot portion for fixing the conductive conductive connecting pin on a part or all of the conductor layer; the interlayer insulating layer has a roughened surface; The fixing portion of the conductive 'sending pin is fixed to the above-mentioned foot by a conductive adhesive. The package substrate according to the first aspect of the invention, wherein the conductor layer is covered with an organic resin insulating layer formed with an opening portion for partially exposing the foot portion, and exposed by the opening portion The conductive pin is fixed to the pin position φ by a conductive adhesive. 3. The package substrate according to claim 2, wherein the diameter of the foot is 0.1 to 100 times the diameter of the opening. 4. The package substrate of claim 2, wherein the substrate has at least one of a superposed substrate having a structure in which a conductor layer and an interlayer resin insulating layer are alternately laminated. 5. A package substrate, which is fixed on a laminated substrate having at least j or more layers of a conductor layer and an interlayer resin insulating layer, which can be electrically connected to other substrates. The present invention is characterized in that: 2160-2888A-PF1 103 1282255 ^ The conductive connecting pin is composed of a columnar connecting portion and a plate-shaped fixing member, and is formed on the columnar connecting portion. a bee waist portion that is smaller than the direct control of the other portions; forming a portion or all of the conductor layer on the interlayer resin insulating layer of the outermost layer of the laminated substrate to fix the conductive pin; the interlayer insulation The layer has a roughened surface; and the pin is connected to the inner layer of the conductor layer by a via layer, and the conductive bond is fixed on the pin by the conductive adhesive. The base is reversed, and has at least, on both sides of the core substrate on which the conductor layer is formed. More than one conductive substrate having a structure in which the conductor layer and the interlayer resin insulating layer are alternately f-pressed, and a conductive connecting pin which can be used for connection with other substrates as a battery, is characterized in that: the conductive connection The pin system is composed of a columnar connecting portion and a plate-shaped fixing portion, and a bee waist portion having a smaller diameter than the other portions is formed on the columnar connecting portion; the conductive property is formed on the resin insulating layer a splicing pin formed on a part or all of the layer layer of the outermost layer of the laminated substrate for fixing a foot; the interlayer insulating layer has a roughened surface; and the foot is formed by a layer The hole is in acoustic phase with the conductor of the above-mentioned core substrate. At the same time, the conductive connecting pin is fixed by the conductive adhesive on the pin. 7. A package substrate, which is formed on both sides of a core substrate having a conductor layer and formed with a through hole 2160-2888A-PF1 104 1282255, and the layer and the interlayer resin insulating layer are alternately laminated for use with other substrates. Electrically characterized by: a continuous conductive connecting pin having a structure on which at least one or more conductors are formed, and the electrical connection of the portion is electrically connected (4) by a column-shaped connecting portion and a plate shape The fixing 2 constitutes 'and a bee waist portion having a smaller diameter than the other portions is formed on the column-shaped connecting portion; and the conductive connecting pin is guided on the resin insulating layer Forming a part or all of the layer layer of the outermost layer of the laminated substrate to fix the foot; and the foot is connected to the conductor layer of the through hole through the via hole at the same time and at the same time The conductive connecting pin is fixed to the foot by a conductive adhesive. 8. The package substrate of claim 5, 6 or 7, wherein the foot is connected to the inner conductor layer by at least one of the via holes. 9. The package substrate according to claim 5, 6 or 7, wherein the foot is connected to the conductor layer of the inner layer by an annular via hole. The package substrate of claim 5, 6 or 7, wherein the pin is connected to the inner conductor layer by a via hole formed in at least two or more layers. The package substrate according to claim 5, 6 or 7, wherein the outermost conductor layer is covered with an organic resin insulating layer formed with an opening portion for partially exposing the foot portion, and The conductive connection is fixed by the conductive adhesive on the pin of the opening portion 2160-2888A-PF1 105 1282255. The package base is as described in the first aspect of the patent application. The diameter is 1·02 to 1〇〇 times the diameter of the upper opening and the upper one of the soil. 13:^Please use the sealing substrate described in item 5, 6 or 7 to make the above-mentioned conductive performance pin made of phosphor bronze. 14. If the scope of the patent application is not limited to 0 b 6 or 7, the melting point of the above conductive adhesive is 18〇~28 (rc. π. (4) The (four) board according to Item 2, 3, 5, 6 or 7, wherein the conductive adhesive is formed of at least one of tin, lead, antimony, silver, gold, and copper. 16. The package substrate of claim 2, 3, 5, 6 or 7 wherein said conductive adhesive is tin/lead, tin/bismuth, tin/silver, tin/bismuth/wrong alloy A package substrate is formed by forming an organic resin insulating layer on a substrate provided with a conductor circuit on an interlayer resin insulating layer, and an opening portion is formed on the organic resin insulating layer, and a part of the conductor circuit is formed. The exposed layer is characterized in that: the interlayer insulating layer has a roughened surface; and a concave portion is formed around the opening portion, and a protruding pin is inserted into a connecting portion that connects the external substrate of the package substrate Arranged in such a manner as to be embedded in the recessed portion, and the above-mentioned convex pin and The body circuit is bonded by a conductive adhesive layer. 1 8. A package substrate is formed by forming an organic resin insulating layer on a substrate provided with a conductor circuit on a layer of resin insulating layer, and then the above organic resin 106 2160 -2888A-PF1 • 1282255 An opening is formed in the insulating layer, and a portion of the conductor circuit is exposed, wherein the interlayer insulating layer has a roughened surface, and a, in the opening A concave portion is formed around the concave portion, and a protruding pin inserted in a connecting portion of the external substrate that connects the package substrate is inserted into the concave portion, and the protruding pin and the conductor circuit are made of a metal layer and conductive. I. The package substrate according to claim 17 or 18, wherein the opening portion is formed to have a diameter of 100 to 900 Å. 2 〇 · as claimed in claim 17 or 18 The package substrate according to the item, wherein the concave portion around the opening portion is formed in a diameter of 1 〇 to 75 qing, and is formed in a manner of 21 or more. The package substrate according to the above-mentioned aspect, wherein the recessed portion around the opening portion is formed to have a depth of 1 to 3 〇. The package substrate according to claim 17 or 18, wherein the opening portion and the opening portion The surrounding recess is formed by using a light, a laser beam, a drill bit, and a perforator. The package substrate according to claim 17 or 18, wherein the conductive adhesive layer is selected from solder and hard. a solder material, a conductive particulate material, a thermoplastic resin, and at least one of a conductive particulate material and a thermosetting resin. 24) The package substrate according to claim 23, The lead ratio of the above solder is 35 to 97%. The package substrate according to claim 23, wherein the first dry tin is selected from the group consisting of tin/wrong, tin/bismuth, tin/silver, tin/silver/copper towel, and more than 2160-2888A. -Component of PF1 107 1282255. The package substrate according to claim 23, wherein the hard solder material is composed of one or more selected from the group consisting of gold, silver, and steel manganese. The package substrate according to Item 23, wherein the particulate material is composed of at least one selected from the group consisting of metal particles, inorganic particles, and resin particles. Narrative The package substrate according to claim 23, wherein the filling ratio of the particulate matter of the electric sputum is 3 G to 90% by weight. The package substrate according to claim 23, wherein the upper = thermal and chemical resin is selected from at least one selected from the group consisting of epoxy resin, polyimide resin, polyester resin, and phenol resin. Composition of matter. The package substrate according to claim 23, wherein the thermoplastic resin is reinforced by a phthalocyanine resin, a polyethylene fluororesin, a poly argon resin, a polyimide resin, At least one of a polyester resin and a polyolefin resin is used. The package substrate according to claim 23, wherein the upper layer of the '4 electrode is made by a method selected from printing, photoresist remanufacturing, bottling, and electroplating. form. The package substrate of claim 1 or claim 18, wherein at least a portion of the raised pin is formed of a metal. The package substrate according to claim 17 or 18, wherein the convex pin is made of one or more selected from the group consisting of gold, silver, iron, copper, nickel, diamond, tin, and lead. form. 34. The package substrate of claim 17 or 18, wherein the joint surface of the convex pin is formed to be 〇·5 to 1.4 times the area of the opening. The package substrate according to claim 17 or claim 18, wherein the joint surface of the convex pin is formed into a smooth shape or two or more convex portions. 3 6 _ The package substrate according to claim 18, wherein the above-mentioned genus layer is selected from the group consisting of gold, silver, nickel, tin, copper, aluminum, lead, phosphorus, crane key, chin, platinum, solder At least one or more of the substances are formed by one or more layers. 37. The package substrate of claim 18, wherein the metal layer is formed by a method selected from the group consisting of electricity, machine plating, and steaming. 2160-2888A-PF1 109