1282138 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（1 ) 發明所屬之技術領域 本發明係關於一種儲存多數半導體晶圓之卡匣，其中 這些半導體晶圓在垂直方向上具有一間隔。 先前技術 對於熟知此項技術者來說，將多數半導體晶圓儲存在 一卡匣中早爲已知，且將此卡匣運送至一預定位置，以便 硏磨或切割半導體晶圓。這種卡匣具有一對側壁，在剖面 方向以一間隔垂直延伸，在此側壁的內側中，支撐肋或支 撐溝紋之間在垂直方向上形成有一間隔。藉由將半導體晶 圓的邊緣部位放置在個別支撐肋上或支撐溝紋中，可以將 半導體晶圓儲存在此卡匣內。因此，多數半導體晶圓在卡 匣的垂直方向上以一間隔儲存起來，此間隔會對應於相鄰 支撐肋或支撐溝紋之間的間隔。在頂面中具有吸引孔的一 吸附器係用以將半導體晶圓攜帶至卡匣內，或從卡匣取出 。爲了將半導體晶圓攜帶到卡匣內，半導體晶圓被真空吸 附至該吸附器上，且被攜帶至卡匣內的一預定位置，然後 釋放此真空吸附，使得半導體晶圓被釋放到卡匣內，且該 吸附器被從卡匣抽出來。爲了將半導體晶圓從卡匣抽出， 將吸附器放入卡匣內，而後放置在半導體晶圓下方，施以 真空吸附，則然後吸附有半導體晶圓的吸附器會從卡匣中 抽出來。 然而，上述的習知卡匣會產生以下的問題。也就是近 年來每個半導體晶圓的厚度通常被製成相當薄，例如小於 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -5- 經濟部智慧財產局員工消費合作社印製 1282138 A7 B7五、發明説明（2 ) 100 // m，甚至小於50 // m。當厚度極小的半導體晶圓被儲 存在卡匣內時，它可能會受到彎曲而形成凹面，致使其中 心部位會朝下方移動。由於每個半導體晶圓的曲率不一定 都相同，當半導體晶圓彎曲時，則介於卡匣中儲存的相鄰 半導體晶圓之間在垂直方向上的空間就會局部變得極小。 因此，當吸附器插入到卡匣內且放置在半導體晶圓下方時 ’很可能吸附器會碰撞到半導體晶圓因而損壞半導體晶圓 。而且，當半導體晶圓嚴重彎曲時，半導體晶圓可能會與 垂直方向配置的另一個相鄰半導體晶圓產生接觸，如此一 來也會使半導體晶圓毀損。 在JP-A- 2000-9 1400號案中揭示一種卡匣，其設有多 數支撐板，這些支撐板在垂直方向上以一間隔排列，藉以 界定卡匣中多數半導體晶圓儲存空間。每個支撐板均具有 一切口，對應於吸附半導體晶圓的一吸附器之形狀。在卡 匣中，每個半導體晶圓不僅在邊緣部位上被支撐，而且也 在其中心部位支撐起來，藉此抑制由本身重量所導致的彎 曲。由於藉由支撐板使得在垂直方向上彼此相鄰的半導體 晶圓能彼此分開，所以他們不會彼此接觸。 然而，在上述JP-A- 2000-9 1400號案中的卡匣仍然不 夠令人滿意。根據本案發明人的經驗，已經藉由硏磨背面 使半導體晶圓很薄者，由於硏磨歪斜或晶體定向的緣故， 會使得半導體晶圓以凹面或凸面的形式彎曲。因此，即使 當半導體晶圓在邊緣部位及中心部位上被支撐起來，半導 體晶圓仍舊會彎曲。於是，即使使用JP-A- 2000-9 1400號 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -6- 1282138 A7 ____ B7 五、發明説明（3 ) 案中所揭示的卡匣，當吸附器插入到卡匣內時，吸附器仍 有可能會碰撞半導體晶圓且使晶圓受損。 (請先閱讀背面之注意事項再填寫本頁) 發明內容 因此，本發明的目的是要提供一種新穎又進步的卡匣 ，即使半導體以凹面或凸面的形式彎曲時，當半導體晶圓 從卡匣攜入或抽出時，能完全防止受到吸附器的碰撞而使 半導體晶圓受損之現象。 爲了獲得上述目的，根據本發明，在垂直方向上設置 有彼此隔開的多數支撐板，而在相鄰的支撐板之間設有分 隔板。 也就是說，本發明設有一卡匣，用於在垂直方向上具 有一間隔而儲存多數半導體晶圓，此卡匣包含多數支撐板 ，這些支撐板在垂直方向上互相隔開且具有一切口對應於 吸附器的形狀，而該吸附器是用以在這些支撐板的前半部 上吸附半導體晶圓，其中分隔板係設置在相鄰的支撐板之 間。 經濟部智慈財產局員工消費合作社印製 最好，分隔板是具有對應於板導體晶圓形狀的平板。 最好，此卡匣在最上層的支撐板上面具有一頂板，而 在最下層的支撐板下方具有一底板。 實施方式 以下將參考附圖詳細說明本發明的較佳實施例。 參考圖1及2，本發明的卡匣標示爲2，其包含一頂 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇X297公釐） 1282138 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（4 ) 板4及一底板6。頂板4具有大致上碟形的形狀，而在兩 側上具有一拱形突起部8。同樣地，底板6也大致上呈現 碟形且在兩側上具有一拱形突起部1 0。垂直延伸的側壁 12係固定在頂板4的突起部8與底板6的突起部10之間 ，垂直延伸的一對後部構件1 4以一間隔固定至頂板4及 底板6的後端上，具有通道剖面的多個握持構件1 6係被 固定至頂板4的個別突起部8上。爲了以手動方式或藉由 適當的攜帶機構來攜帶卡匣2，必須將握持部1 6固定起 來。 在頂板4與底板6之間設有多數支撐板18 (在本實 施例中爲五個），在支撐板的垂直方向之間均具有一預定 的間隔，在相鄰的支撐板1 8之間設有分隔板20。現在參 考圖3到5連同圖1與2，多數支撐肋22 (在本實施例中 爲九個）係形成在側壁12的內側上，且在垂直方向上以 預定間隔排列。同樣地，多數支撐肋24 (在本實施例中 爲九個）係形成在後部構件1 4的內側上，且在垂直方向 上以預定間隔排列。藉由將支撐板1 8的外圍固定在從頂 部算來的奇數肋22與24上，而使支撐板固定在預定的位 置上，藉由將分隔板20的外圍固定在從頂部算來的偶數 肋22與24上，而使分隔板固定在預定的位置上。從圖3 可以淸楚顯示，每個支撐板1 8大致上呈現半圓形，沿著 側壁12的內表面將支撐板的兩側部位製成直線，且對應 於吸附器形狀的切口 26是形成在其前半部上。如圖4所 示，每個分隔板20均爲碟狀，以對應半導體晶圓的形狀 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -8- 1282138 A7 __B7_ 五、發明説明（5 ) ，沿著側壁1 2的內表面將分隔板的兩側部位製成直線。 (請先閲讀背面之注意事項再填寫本頁) 可以將上述卡匣2的組成元件（也就是頂板4、底板 6、側壁12、後部構件14、握持構件16、支撐板1 8及分 隔板20)藉由合成樹脂或金屬片製成，或將這些元件藉 由黏著劑等適當方式連結在一起。 經濟部智慧財產苟員工消費合作社印製 圖6顯示半導體晶圓攜帶機構2 8的一典型範例，可 用以將半導體晶圓攜入或抽出卡匣2。此半導體晶圓攜帶 機構28包含一升降軸32，係安裝在一基座30上以便上 升與下降；第一擺臂3 4，可旋轉式地安裝在升降軸3的 頂端上；第二擺臂36，可旋轉式地安裝在第一擺臂34的 尾端上；一安裝塊38，係固定至第二擺臂36的尾端，及 一吸附器42，可轉動地安裝在該安裝塊3 8上，且以一 7jc 平延伸的中心軸40作爲旋轉中心。吸附器42具有一叉狀 的形式，且多孔吸引件46係形成在兩叉指44的個別吸引 表面上（在圖6中爲頂面）。如果有需要的話，也可以使 用另一個適當的吸附器，且重要的是在支撐板18中的切 口 26形狀需對應於使用中的吸附器之形狀。半導體晶圓 攜帶機構28設有一升降機構（未顯示），用以垂直移動 以下部位：升降軸32、使第一擺臂34產生擺動的第一擺 動機構（未顯示）、使第二擺臂36產生擺動的第二擺動 機構（未顯示），及使吸附器42產生旋轉的旋轉機構（ 未顯示）。而且，進一步設有一吸引機構，用以將吸附器 4的吸引件46選擇性地連接到一真空源上。 半導體晶圓48大致上呈現碟形，且在其局部外圍具 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐〉 -9- 1282138 經濟部智慧財產局員工消費合作社印製 A7 __ _B7 ___五、發明説明（6 ) 有一所謂vv定向平坦處"的直線邊緣50。爲了藉由半導 體晶圓攜帶機構28來攜帶半導體晶圓48，吸附器42的 吸引表面會與半導體晶圓48的一側產生緊密接觸，以便 將吸引件46連接到真空源上，藉此使吸附器42能夠吸引 半導體晶圓48。 例如，欲將背面已經硏磨好的半導體晶圓26從硏磨 機（未顯示）的夾頭機構上拾起時，半導體晶圓攜帶機構 28的吸附器42會從圖6所示的狀態旋轉180度，以便使 具有吸引件46的吸引表面向下翻轉。吸附器4的吸引表 面會擠壓在夾頭機構上的半導體晶圓48之面向上的背側 ，以便藉此吸引半導體晶圓48。圖7 ( A )到7 ( C )顯示 如何將受到吸附器42吸引的半導體晶圓48攜帶至位於卡 匣2最上層位置的支撐板1 8。爲了將半導體晶圓48攜帶 至卡匣2內，在藉由吸引力使半導體晶圓48從夾頭機構 拾起到吸附器42的吸引表面之後，吸附器42會旋轉180 度以便將吸引半導體晶圓48的吸引面向上翻轉。之後， 如圖7 ( A )所示，吸附器42及被其吸引面吸引的半導體 晶圓48會被插入卡匣2內，此過程係藉由將吸附器42的 兩叉指44對齊支撐板18的個別切口 26，以及將半導體 晶圓4 8定位於支撐板1 8上面而成。接著，吸附器4 2的 吸引件46會脫離真空源，且開放至空氣中以便停止吸附 半導體晶圓48，隨後降下吸附器42。當吸附器42下降到 圖7 ( B )的位置時，半導體晶圓4 8則放置在支撐板18 上。當藉由吸引件4 6對半導體晶圓4 8的吸附作用停止時 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -10- 1282138 A7 __B7__ 五、發明説明（7 ) (請先閱讀背面之注意事項再填寫本頁) ，假如半導體晶圓48極薄的話，則如圖7 ( B )所示’會 由於硏磨誤差或晶體定向而可能產生凹面或凸面形式的彎 曲。然後，如圖7 ( C )所示，吸附器4 2會進一步下降一 點，以便將支撐板1 8上的半導體晶圓48完全隔開。之後 ，吸附器42會從卡匣2抽出。以上述的方式’半導體晶 圓48可以被攜帶至除了最上層支撐板1 8以外的支撐板 18上。 經濟部智慧財產局員工消費合作社印製 圖8 ( A )到8 ( C )顯示如何將放置在最上層的支撐 板18上之半導體晶圓48從卡匣2抽出。首先’如圖8 ( A )所示，將吸附器42插入最上層支撐板1 8與位於此支 撐板1 8下面的分隔板20之間，並使吸附器的吸引面維持 面朝上。然後’如圖8(B)及8(C)所示’吸附器42 會通過支撐板18的切口 26向上移動。當吸附器42向上 移動至圖8 ( C )所示的位置時，半導體晶圓48會擠壓頂 板4的內側（若在半導體晶圓48係位於支撐板1 8的下方 時，半導體晶圓則會擠壓支撐板1 8上方的分隔板20內側 )，藉此修正半導體晶圓48的曲率，以便使半導體晶圓 變得較爲扁平。之後’吸附器42的吸引件46會連接到真 空源，以便將半導體晶圓吸附至吸引表面上。然後，吸附 器42會稍微下降以便使半導體晶圓48與頂板4 (或分隔 板20 )的內側分離’然後持續吸附半導體晶圓4 8而將其 從卡匣2抽出。 在圖7與圖8所示的實施例中，吸引半導體晶圓4 8 的吸附器會被插入卡匣2內’並以其吸引面朝上’藉此將 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨OX297公釐） -11 - 1282138 經濟部智慧財產局資工消費合作社印說 A7 B7 五、發明説明（8) 半導體晶圓48放置在卡匣2的支撐板1 8上；另外吸附器 以其吸引面朝上而插入卡匣2內，藉此將半導體晶圓48 從卡匣2抽出。然而，吸附半導體晶圓48的吸附器42也 可以其吸引面朝下而插入到卡匣2內，也就是說，半導體 晶圓48是被吸附器42的底面所吸引而放置在支撐板18 上方的分隔板20上（並非支撐板1 8上）。在這種情形中 ，爲了將放置在分隔板20上的半導體晶圓48從卡匣2抽 出，所以吸附器42可以其吸引面朝下而插入卡匣2內。 雖然已經藉由以上的較佳實施例來說明本發明，但顯 然只要在不脫離專利申請範圍中所界定的本發明之範圍與 精神之前提下，仍能產生出不同的變化與修改。 圖式簡單說明 圖1是一立體圖，顯示本發明之卡匣； 圖2是圖1所示的卡匣之前視圖； 圖3是一立體圖，顯示圖1的卡匣中之一支撐板； 圖4是一立體圖，顯示圖1的卡匣中之一分隔板； 圖5是一剖面圖，顯示圖1的卡匣的側壁與後部構件 圖6是立體圖，顯示半導體晶圓攜帶機構的一典型範 例； 圖7 ( A )到7 ( C )是剖面圖，用以說明半導體晶圓 是如何攜帶到圖1的卡匣內； 圖8 ( A )到8 ( C )是剖面圖，用以說明半導體晶圓 (請先閱讀背面之注意事項再填寫本頁)1282138 A7 B7 Ministry of Economic Affairs Intellectual Property Office Employees Consumer Cooperatives Printing 5, Invention Description (1) Field of the Invention The present invention relates to a cassette for storing a plurality of semiconductor wafers, wherein the semiconductor wafers have a vertical direction interval. Prior Art It is known for those skilled in the art to store a plurality of semiconductor wafers in a cassette and transport the cassette to a predetermined location for honing or cutting the semiconductor wafer. The cartridge has a pair of side walls extending vertically at an interval in the cross-sectional direction, and in the inner side of the side wall, a space is formed between the support ribs or the support grooves in the vertical direction. The semiconductor wafer can be stored in the cassette by placing the edge portions of the semiconductor wafer on individual support ribs or supporting the grooves. Therefore, most of the semiconductor wafers are stored at an interval in the vertical direction of the cassette, which interval corresponds to the interval between adjacent support ribs or support grooves. An adsorber having a suction aperture in the top surface is used to carry the semiconductor wafer into the cassette or to be removed from the cassette. In order to carry the semiconductor wafer into the cassette, the semiconductor wafer is vacuum adsorbed onto the adsorber and carried to a predetermined position in the cassette, and then the vacuum adsorption is released, so that the semiconductor wafer is released to the cassette. Inside, and the adsorber is extracted from the cassette. In order to extract the semiconductor wafer from the cassette, the adsorber is placed in the cassette and then placed under the semiconductor wafer, and vacuum adsorption is applied, and then the adsorber to which the semiconductor wafer is adsorbed is extracted from the cassette. However, the above-mentioned conventional card causes the following problems. That is, in recent years, the thickness of each semiconductor wafer is usually made quite thin, for example, less than (please read the back of the page and fill out this page). The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm). -5- Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1282138 A7 B7 V. Invention Description (2) 100 // m, even less than 50 // m. When a semiconductor wafer having a very small thickness is stored in the cassette, it may be bent to form a concave surface, so that the center portion thereof moves downward. Since the curvature of each semiconductor wafer is not necessarily the same, when the semiconductor wafer is bent, the space in the vertical direction between adjacent semiconductor wafers stored in the cassette is locally extremely small. Therefore, when the adsorber is inserted into the cassette and placed under the semiconductor wafer, it is likely that the adsorber will collide with the semiconductor wafer and damage the semiconductor wafer. Moreover, when the semiconductor wafer is severely bent, the semiconductor wafer may come into contact with another adjacent semiconductor wafer disposed in the vertical direction, which may also damage the semiconductor wafer. A card cartridge is disclosed in the case of JP-A-2000-9 1400, which is provided with a plurality of support plates which are arranged at intervals in the vertical direction to define a plurality of semiconductor wafer storage spaces in the cassette. Each support plate has a slit corresponding to the shape of an adsorber that adsorbs the semiconductor wafer. In the cassette, each semiconductor wafer is supported not only at the edge portion but also at its center portion, thereby suppressing the bending caused by its own weight. Since the semiconductor wafers adjacent to each other in the vertical direction can be separated from each other by the support plates, they do not contact each other. However, the cassette in the above-mentioned case of JP-A-2000-9 1400 is still not satisfactory. According to the experience of the inventors of the present invention, semiconductor wafers have been bent in the form of concave or convex surfaces due to honing skew or crystal orientation by honing the back side to make the semiconductor wafer thin. Therefore, even when the semiconductor wafer is supported at the edge portion and the center portion, the semiconductor wafer is still bent. Therefore, even if you use JP-A-2000-9 1400 (please read the note on the back and then fill out this page) This paper size applies to the Chinese National Standard (CNS) A4 specification (210X 297 mm) -6- 1282138 A7 ____ B7 V. INSTRUCTION DESCRIPTION (3) In the case disclosed in the case, when the adsorber is inserted into the cassette, the adsorber may still collide with the semiconductor wafer and damage the wafer. (Please read the note on the back and then fill out this page.) SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a novel and improved cassette in which a semiconductor wafer is removed from a cassette even when the semiconductor is bent in the form of a concave or convex surface. When carried in or withdrawn, the semiconductor wafer can be completely prevented from being damaged by the collision of the adsorber. In order to achieve the above object, according to the present invention, a plurality of support plates spaced apart from each other are disposed in the vertical direction, and a partition plate is provided between adjacent support plates. That is, the present invention is provided with a cassette for storing a plurality of semiconductor wafers with a space in the vertical direction, and the card includes a plurality of support plates which are vertically spaced apart from each other and have a corresponding port In the shape of the adsorber, the adsorber is used to adsorb the semiconductor wafer on the front half of the support plates, wherein the partition plates are disposed between the adjacent support plates. Printed by the Ministry of Economic Affairs Zhici Property Bureau employee consumption cooperative. The partition plate is a flat plate having a shape corresponding to the plate conductor wafer. Preferably, the card has a top plate on the uppermost support plate and a bottom plate below the lowermost support plate. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Referring to Figures 1 and 2, the cassette of the present invention is designated as 2, which includes a top paper scale applicable to the Chinese National Standard (CNS) A4 specification (21〇X297 mm) 1282138 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative System 5, invention description (4) board 4 and a bottom plate 6. The top plate 4 has a substantially dish-shaped shape and has an arched projection 8 on both sides. Similarly, the bottom plate 6 also has a substantially dish shape and has an arched projection 10 on both sides. The vertically extending side wall 12 is fixed between the protrusion 8 of the top plate 4 and the protrusion 10 of the bottom plate 6, and a pair of vertically extending pair of rear members 14 are fixed to the rear ends of the top plate 4 and the bottom plate 6 at an interval with a passage. A plurality of grip members 16 of the cross section are fixed to the individual projections 8 of the top plate 4. In order to carry the cassette 2 manually or by a suitable carrying mechanism, the grip 16 must be secured. A plurality of support plates 18 (five in this embodiment) are provided between the top plate 4 and the bottom plate 6, with a predetermined interval between the vertical directions of the support plates, between adjacent support plates 18. A partition plate 20 is provided. Referring now to Figures 3 through 5 together with Figures 1 and 2, a plurality of support ribs 22 (nine in this embodiment) are formed on the inner side of the side wall 12 and are arranged at predetermined intervals in the vertical direction. Similarly, a plurality of support ribs 24 (nine in the present embodiment) are formed on the inner side of the rear member 14 and are arranged at predetermined intervals in the vertical direction. The support plate is fixed at a predetermined position by fixing the periphery of the support plate 18 to the odd ribs 22 and 24 from the top, by fixing the periphery of the partition plate 20 at the top. The even ribs 22 and 24 are placed to fix the partition plate at a predetermined position. As can be seen from Fig. 3, each of the support plates 18 is substantially semi-circular, and the both sides of the support plate are made straight along the inner surface of the side wall 12, and the slits 26 corresponding to the shape of the adsorber are formed. On its front half. As shown in FIG. 4, each of the partitioning plates 20 is in the shape of a dish to correspond to the shape of the semiconductor wafer (please read the back of the page and then fill in the page). The paper size is applicable to the Chinese National Standard (CNS) A4 specification ( 210X297 mm) -8- 1282138 A7 __B7_ V. Inventive Note (5), the two sides of the partition plate are made straight along the inner surface of the side wall 12. (Please read the note on the back and then fill out this page) The components of the above-mentioned cassette 2 (ie, the top plate 4, the bottom plate 6, the side wall 12, the rear member 14, the holding member 16, the support plate 18, and the partition) The plate 20) is made of a synthetic resin or a metal sheet, or these elements are joined together by an appropriate means such as an adhesive. Ministry of Economics Smart Property 苟 Employee Consumption Cooperative Printing Figure 6 shows a typical example of a semiconductor wafer carrier 28 that can be used to carry or extract a semiconductor wafer into or out of the cassette 2. The semiconductor wafer carrying mechanism 28 includes a lifting shaft 32 mounted on a base 30 for ascending and descending; a first swing arm 34 is rotatably mounted on the top end of the lifting shaft 3; and a second swing arm 36, rotatably mounted on the tail end of the first swing arm 34; a mounting block 38 fixed to the rear end of the second swing arm 36, and an adsorber 42 rotatably mounted on the mounting block 3 8 and a central axis 40 extending in a 7jc plane as a center of rotation. The adsorber 42 has a forked form, and a porous attracting member 46 is formed on the respective attraction surfaces of the two fingers 44 (top surface in Fig. 6). Another suitable adsorber can be used if desired, and it is important that the shape of the slit 26 in the support plate 18 corresponds to the shape of the adsorber in use. The semiconductor wafer carrying mechanism 28 is provided with a lifting mechanism (not shown) for vertically moving the lower portion 32, the first swinging mechanism (not shown) for causing the first swing arm 34 to swing, and the second swing arm 36. A second swinging mechanism (not shown) that produces a swing and a rotating mechanism (not shown) that causes the adsorber 42 to rotate. Further, a suction mechanism is further provided for selectively connecting the attracting member 46 of the adsorber 4 to a vacuum source. The semiconductor wafer 48 is generally in the shape of a dish, and has a paper size on its local periphery. The Chinese National Standard (CNS) A4 specification (210X297 mm) -9- 1282138 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed A7 __ _B7 ___ V. DESCRIPTION OF THE INVENTION (6) There is a straight edge 50 of the so-called vv oriented flat portion. In order to carry the semiconductor wafer 48 by the semiconductor wafer carrying mechanism 28, the attracting surface of the adsorber 42 and the semiconductor wafer 48 One side creates a close contact to connect the attracting member 46 to the vacuum source, thereby enabling the adsorber 42 to attract the semiconductor wafer 48. For example, the semiconductor wafer 26 that has been honed on the back side is to be honed from the honing machine ( When picked up by the chuck mechanism, the adsorber 42 of the semiconductor wafer carrying mechanism 28 is rotated 180 degrees from the state shown in Fig. 6 to invert the suction surface having the attracting member 46. The adsorber 4 The attracting surface will be pressed against the upwardly facing back side of the semiconductor wafer 48 on the collet mechanism to thereby attract the semiconductor wafer 48. Figures 7(A) through 7(C) show how the attractor 42 will be attracted The semiconductor wafer 48 is carried to the support plate 18 at the uppermost position of the cassette 2. To carry the semiconductor wafer 48 into the cassette 2, the semiconductor wafer 48 is picked up from the chuck mechanism by suction. After the attraction surface of the device 42, the adsorber 42 is rotated 180 degrees to invert the attraction side of the attracting semiconductor wafer 48. Thereafter, as shown in Fig. 7(A), the adsorber 42 and the semiconductor crystal attracted by the attraction surface thereof The circle 48 is inserted into the cassette 2 by aligning the two fingers 44 of the adsorber 42 with the individual slits 26 of the support plate 18 and positioning the semiconductor wafer 48 over the support plate 18. Next, the attracting member 46 of the adsorber 42 will be detached from the vacuum source and opened to the air to stop adsorbing the semiconductor wafer 48, and then the adsorber 42 is lowered. When the adsorber 42 is lowered to the position of FIG. 7(B), the semiconductor The wafer 4 8 is placed on the support plate 18. When the adsorption of the semiconductor wafer 48 by the attracting member 46 is stopped (please read the back note before filling in the page) This paper scale applies to the Chinese national standard. (CNS) A4 specification (210X 297 public) -10- 1282138 A7 __B7__ V. Invention description (7) (Please read the note on the back and fill in this page). If the semiconductor wafer 48 is extremely thin, as shown in Figure 7 (B), The grinding error or crystal orientation may result in a bend in the form of a concave or convex surface. Then, as shown in Fig. 7(C), the adsorber 42 will be further lowered a little to completely separate the semiconductor wafer 48 on the support plate 18. After that, the adsorber 42 will be withdrawn from the cassette 2. The semiconductor wafer 48 can be carried to the support plate 18 other than the uppermost support plate 18 in the above manner. Printed by the Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperatives Figures 8(A) through 8(C) show how the semiconductor wafer 48 placed on the uppermost support plate 18 is withdrawn from the cassette 2. First, as shown in Fig. 8(A), the adsorber 42 is inserted between the uppermost support plate 18 and the partition plate 20 located below the support plate 18, and the suction surface of the adsorber is maintained face up. Then, as shown in Figs. 8(B) and 8(C), the adsorber 42 is moved upward through the slit 26 of the support plate 18. When the adsorber 42 is moved up to the position shown in FIG. 8(C), the semiconductor wafer 48 is pressed against the inner side of the top plate 4 (if the semiconductor wafer 48 is located below the support plate 18, the semiconductor wafer is The inside of the spacer 20 above the support plate 18 is pressed, thereby correcting the curvature of the semiconductor wafer 48 to make the semiconductor wafer flat. The attractor 46 of the adsorber 42 is then connected to a vacuum source to adsorb the semiconductor wafer onto the attraction surface. Then, the adsorber 42 is slightly lowered to separate the semiconductor wafer 48 from the inside of the top plate 4 (or the separator 20) and then continuously sucks the semiconductor wafer 48 to extract it from the cassette 2. In the embodiment shown in Figures 7 and 8, the adsorber attracting the semiconductor wafer 48 will be inserted into the cassette 2 and with its suction side facing up, thereby applying the paper scale to the Chinese national standard (CNS). A4 size (2丨OX297 mm) -11 - 1282138 Ministry of Economic Affairs Intellectual Property Bureau Owners and Consumers Cooperatives Printed A7 B7 V. Invention Description (8) The semiconductor wafer 48 is placed on the support plate 18 of the cassette 2; Further, the adsorber is inserted into the cassette 2 with its suction side facing upward, whereby the semiconductor wafer 48 is taken out from the cassette 2. However, the adsorber 42 that adsorbs the semiconductor wafer 48 can also be inserted into the cassette 2 with its suction side facing downward, that is, the semiconductor wafer 48 is attracted by the bottom surface of the adsorber 42 and placed above the support plate 18. On the partition plate 20 (not on the support plate 18). In this case, in order to draw the semiconductor wafer 48 placed on the partitioning plate 20 from the cassette 2, the adsorber 42 can be inserted into the cassette 2 with its suction side facing downward. While the invention has been described by the preferred embodiments of the present invention, it is understood that various changes and modifications can be made without departing from the scope and spirit of the invention as defined in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a cassette of the present invention; FIG. 2 is a front view of the cassette shown in FIG. 1; and FIG. 3 is a perspective view showing one of the cassettes of FIG. 1; Is a perspective view showing one of the cassettes of FIG. 1; FIG. 5 is a cross-sectional view showing the side wall and rear member of the cassette of FIG. 1. FIG. 6 is a perspective view showing a typical example of a semiconductor wafer carrying mechanism. Figure 7 (A) through 7 (C) are cross-sectional views showing how the semiconductor wafer is carried into the cassette of Figure 1; Figures 8 (A) through 8 (C) are cross-sectional views illustrating the semiconductor Wafer (please read the notes on the back and fill out this page)
本紙張尺度適用中國國家標準（CNS ) A4規格（2l〇x297公釐） -12- [282138五、發明説明（9 ) 是如何從圖1的卡匣抽出。 A7 B7 主要元件對照表 2 卡匣 經濟部智慧財產局員工消費合作社印製 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 頂板 底板 拱形突起部 拱形突起部 側壁 後部構件 握持構件 支撐板 分隔板 支撐肋 支撐肋 切口 半導體晶圓攜帶機構 基座 升降軸 第一擺臂 第二擺臂 安裝塊 中心軸 吸附器 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -13- 1282138 A7 五、發明説明（10) 44 叉指 46 吸引件 48 半導體晶 50 直線邊緣 (請先閱讀背面之注意事項再填寫本頁) •裝 、矿 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐〉 -14-This paper scale applies to the Chinese National Standard (CNS) A4 specification (2l〇x297 mm) -12- [282138 V. The invention description (9) is extracted from the cassette of Fig. 1. A7 B7 Main components comparison table 2 Cards Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Printed 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 Roof plate arched protrusions Arched protrusion side wall Rear member grip member support plate partition plate support rib support rib cut semiconductor wafer carrying mechanism base lift shaft first swing arm second swing arm mounting block central axis adsorber (please read the back note first and then fill in this page This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) -13- 1282138 A7 V. Invention description (10) 44 Interdigitated 46 Suction member 48 Semiconductor crystal 50 Straight edge (please read the back note first) Fill in this page again. • Department of Mines and Mines, Ministry of Mines, Intellectual Property Bureau, Staff Cooperatives, Printed Paper Scale, Applicable to China National Standard (CNS), A4 Specification (210X297 mm) -14-