CN208240632U - Baking wafer casket - Google Patents
Baking wafer casket Download PDFInfo
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- CN208240632U CN208240632U CN201820771982.8U CN201820771982U CN208240632U CN 208240632 U CN208240632 U CN 208240632U CN 201820771982 U CN201820771982 U CN 201820771982U CN 208240632 U CN208240632 U CN 208240632U
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- end plate
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- baking
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Abstract
The utility model belongs to wafer carrier field, it is intended to provide a kind of baking wafer casket, its key points of the technical solution are that including two pieces of rectangle end plates being parallel to each other, it is connected with support rod between the corresponding corner of two end plates, offers several grooves along the vertical direction on the inside of end plate, several grooves are placed equidistant with, and recess width is greater than wafer thickness, strip tray is equipped on the inside of end plate, the tray is arranged perpendicular to groove, and the tray is detachably connected with end plate;The advantages of it is detachable between each component that this baking uses wafer casket to have, and is convenient for individually processing, simple process.
Description
Technical field
The utility model relates to wafer carrier field, in particular to a kind of baking wafer casket.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, with the extensive use of IC chip,
The importance of wafer also gradually embodies.In the process of wafer, needs to use wafer casket and it is transported and is protected
Pipe, and certain process then need specific wafer casket.
After the wafer polishing grinding of well cutting, its surface oxidation is generated into layer of silicon dioxide film, this process
It is realized often through high-temperature baking, and the wafer casket for baking is needed to contain wafer.Traditional baking is by resistance to wafer casket
Made of high temperature plastics are integrally formed, the case where still will appear temperature distortion in practical baking process so that be not available, and
Baking wafer casket is made using high-melting-point alloy material, the process is more complicated during its integral cutting is polished and formed,
Difficulty of processing is big.
Utility model content
The utility model is to provide a kind of baking wafer casket, with detachable between each component, convenient for individually processing,
The advantages of simple process.
The above-mentioned technical purpose of the utility model has the technical scheme that
A kind of toast uses wafer casket, the rectangle end plate being parallel to each other including two pieces, solid between the corresponding corner of two end plates
It is connected to support rod, offers several grooves along the vertical direction on the inside of end plate, several grooves are placed equidistant with, and recess width is big
Strip tray is equipped on the inside of wafer thickness, end plate, the tray is arranged perpendicular to groove, and the tray and end plate are detachable
Connection.
By using above-mentioned technical proposal, tray is detachably connected with end plate, then is conveniently replaceable when wafer casket component is impaired,
And tray and end plate can be processed individually, and requirements for the production process is reduced.
Further setting: the tray includes the supporting part for accepting wafer, and supporting part is towards corresponding end plate side
It is installed with clamping portion, the clamping groove for link portion is offered on the inside of the end plate.
By using above-mentioned technical proposal, the clamping portion of tray is embedded in the clamping groove on the inside of end plate, thus tray and end plate
It is detachably connected;Supporting part is fixed on the inside of end plate with clamping portion, and the wafer for being put into wafer casket is held up.
Further setting: the supporting part upper surface is to another end-plate tilt, and recessed formation cambered surface.
By using above-mentioned technical proposal, recessed inclination cambered surface is bonded with the curved side of wafer, considerably increases crystalline substance
Round forced area keeps wafer not easily damaged when being contained in wafer casket.
Further setting: the supporting part bottom edge offers several notches, the groove one on several notches and end plate
One is corresponding.
By using above-mentioned technical proposal, supporting part bottom edge opens up notch, and notch and groove correspond, then are clamped in
Wafer in two end plates respective slot also is located in notch, further contains wafer interval, while wafer being made to keep vertical.
Further setting: the side wall top of the groove and notch is equipped with chamfering.
By using above-mentioned technical proposal, when wafer is put into from top to bottom in wafer casket, setting chamfering can be to avoid side wall
The sharp comer on top scratches wafer.
Further setting: the end plate top surface is installed with several tenons, and end plate bottom surface offers the mortise with tenon cooperation.
By using above-mentioned technical proposal, when multiple wafer caskets are stacked, the tenon of lower layer's wafer casket is embedded in upper layer wafer
The mortise of casket keeps upper and lower level wafer casket relatively fixed, can be stably stacked upon together.
Further setting: it is connected on the outside of the end plate and mentions handle.
By using above-mentioned technical proposal, it is arranged on the outside of end plate and mentions handle wafer casket easy to carry.
In conclusion the utility model has the following beneficial effects:
1, the tray of wafer casket and end plate can be processed individually, reduce requirements for the production process;
2, wafer can be preferably protected, wafer casket is avoided to cause to damage to wafer therein is held;
3, wafer casket reasonable integral structure, and can cooperate.
Detailed description of the invention
Fig. 1 is in embodiment 1 for embodying baking wafer box structure schematic diagram;
Fig. 2 is in embodiment 1 for embodying supporting block structure schematic diagram;
Fig. 3 is in embodiment 1 for embodying junction cross-sectional view of the structure when two baking wafer caskets stack;
Fig. 4 is in embodiment 2 for embodying baking wafer box structure schematic diagram;
Fig. 5 is connection relationship diagram between tray and end plate in embodiment 2;
Fig. 6 is in embodiment 3 for embodying baking wafer box structure schematic diagram;
Fig. 7 is in embodiment 3 for embodying supporting bar structure schematic diagram.
In figure, 1, end plate;2, support rod;3, groove;4, tray;5, tenon;6, mortise;7, handle is mentioned;11, clamping groove;12,
Chamfering;21, extension bar;22, sleeve;23, pin hole;24, location hole;25, bolt;41, supporting part;42, clamping portion;43, notch.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing.
Embodiment 1: a kind of baking wafer casket, as shown in Figure 1, being connected with four between two pieces of rectangle end plates 1 parallel to each other
Root support rod 2,1 inside of end plate offer several grooves 3 along the vertical direction, and groove 3 is placed equidistant with, and 3 width of groove is greater than crystalline substance
To justify thickness, is additionally provided with strip tray 4 on the inside of end plate 1, tray 4 is vertical with groove 3, and tray 4 is detachably connected with end plate 1,
It is connected on the outside of end plate 1 and mentions handle 7.
As shown in Fig. 2, tray 4 includes clamping portion 42 and supporting part 41, clamping portion 42 is embedded in the card for being provided with 1 inside of end plate
In access slot 11, tray 4 is detachably connected on end plate 1.41 upper surface of supporting part is tilted to another end plate 1, and recessed
Cambered surface is formed, for accepting wafer.41 bottom edge of supporting part offers several notches 43, and the groove 3 of 1 inside of notch 43 and end plate
It corresponds.Cambered surface on supporting part 41 is bonded with the curved side of wafer, is greatly increased the forced area of wafer, is being contained wafer
Put with it is not easily damaged in handling process;Notch 43 and groove 3 cooperate, and so that wafer is kept vertical, and wafer interval is held.
As depicted in figs. 1 and 2, the top of 43 side wall of groove 3 and notch is equipped with chamfering 12.Wafer is put into crystalline substance from top to bottom
When in circle casket, it is easy to collide with the side wall top of groove 3 and notch 43, is arranged on the side wall top of groove 3 and notch 43
Chamfering 12 can then be scratched to avoid wafer by original sharp comer.
As shown in figure 3,1 top surface of end plate is installed with several tenons 5,1 bottom surface of end plate offers the mortise 6 cooperated with tenon 5.
When two wafer caskets, which stack, to be placed, the tenon 5 of lower layer's wafer casket is embedded in the mortise 6 of upper layer wafer casket, protects two wafer caskets
Hold it is relatively fixed, can it is neat, be stably stacked upon together.
Specific implementation process:
More wafers are put into the corresponding groove 3 in the inside of two end plates 1 from top to down respectively, each wafer lower side with hold
The arcwall face in support portion 41 is inconsistent, and is held in the notch 43 of supporting part 41, to by more wafers interval, vertically contain
In wafer casket.Multiple wafer caskets are stacked and are placed, the mortise 6 and lower layer's wafer casket end plate 1 of 1 bottom surface of upper layer wafer casket end plate
The tenon 5 of top surface is aligned, and tenon 5, which is embedded in mortise 6, keeps two wafer caskets holding up and down relatively fixed.
Embodiment 2: a kind of baking wafer casket, difference from example 1 is that, as shown in Figure 4 and Figure 5, clamping
Portion 42 is installed in 41 both ends of supporting part, and clamping groove 11 is arranged in pairs in the two sides of 1 inboard groove 3 of end plate, and clamping groove 11 is along perpendicular
Histogram is to equidistant arrangement.Clamping portion 42 is embedded in the clamping groove 11 of different height, the height of adjustable tray 4 adapts to wafer
Different splendid attire demands.
Embodiment 3: a kind of baking wafer casket the difference is that, as shown in Figure 6 and Figure 7, is supported with embodiment 2
Bar 2 includes the extension bar 21 and sleeve 22 for being installed in 1 inside of two end plates respectively, and extension bar 21 is offered towards 22 one end of sleeve to be run through
Pin hole 23, sleeve 22 offers several perforative location holes 24 towards 21 one end of extension bar, and several 24 equidistant arrangements of location hole exist
On sleeve 22.Pin hole 23 is aligned with a positioning hole 24, separately has bolt 25 by pin hole 23 and location hole 24, thus by 21 He of extension bar
Sleeve 22 is affixed.
By changing the location hole 24 that is aligned with pin hole 23, the length of adjustable support rod 2, then with it is height-adjustable
Tray 4 cooperates, then can change the size of wafer casket accommodation space, be adapted to the wafer of different-diameter.
The above embodiments are only the explanation to the utility model, are not limitations of the present invention, ability
Field technique personnel can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but
As long as all by the protection of Patent Law in the scope of the claims of the utility model.
Claims (7)
1. it is a kind of baking use wafer casket, the rectangle end plate (1) being parallel to each other including two pieces, the corresponding corner of two end plates (1) it
Between be connected with support rod (2), offer along the vertical direction several grooves (3) on the inside of end plate (1), several grooves (3) are equidistant
Setting, and groove (3) width is greater than wafer thickness, is equipped with strip tray (4) on the inside of end plate (1), the tray (4) perpendicular to
Groove (3) setting, it is characterized in that: the tray (4) is detachably connected with end plate (1).
2. baking wafer casket according to claim 1, it is characterized in that: the tray (4) includes for accepting wafer
Supporting part (41), supporting part (41) are installed with clamping portion (42) towards corresponding end plate (1) side, are opened on the inside of the end plate (1)
Equipped with the clamping groove (11) for being used for link portion (42).
3. baking wafer casket according to claim 2, it is characterized in that: the supporting part (41) upper surface is to another end plate
(1) it tilts, and recessed formation cambered surface.
4. baking wafer casket according to claim 3, it is characterized in that: the supporting part (41) bottom edge offers several slots
Mouth (43), several notches (43) correspond with the groove (3) on end plate (1).
5. baking wafer casket according to claim 4, it is characterized in that: the side wall top of the groove (3) and notch (43)
End is equipped with chamfering (12).
6. any baking wafer casket according to claim 1~5, it is characterized in that: the end plate (1) is if top surface is installed with
Dry tenon (5), end plate (1) bottom surface offer the mortise (6) with tenon (5) cooperation.
7. baking wafer casket according to claim 6, mentions handle (7) it is characterized in that: being connected on the outside of the end plate (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820771982.8U CN208240632U (en) | 2018-05-22 | 2018-05-22 | Baking wafer casket |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820771982.8U CN208240632U (en) | 2018-05-22 | 2018-05-22 | Baking wafer casket |
Publications (1)
Publication Number | Publication Date |
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CN208240632U true CN208240632U (en) | 2018-12-14 |
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ID=64580831
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CN201820771982.8U Active CN208240632U (en) | 2018-05-22 | 2018-05-22 | Baking wafer casket |
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CN (1) | CN208240632U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110364465A (en) * | 2019-07-21 | 2019-10-22 | 常州时创能源科技有限公司 | Quartz boat is used in a kind of carrying of silicon wafer |
CN115440636A (en) * | 2022-08-30 | 2022-12-06 | 广东高景太阳能科技有限公司 | Silicon chip bearing material support and carrying water tank with same |
-
2018
- 2018-05-22 CN CN201820771982.8U patent/CN208240632U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110364465A (en) * | 2019-07-21 | 2019-10-22 | 常州时创能源科技有限公司 | Quartz boat is used in a kind of carrying of silicon wafer |
CN110364465B (en) * | 2019-07-21 | 2023-08-29 | 常州时创能源股份有限公司 | Quartz boat for bearing silicon wafer |
CN115440636A (en) * | 2022-08-30 | 2022-12-06 | 广东高景太阳能科技有限公司 | Silicon chip bearing material support and carrying water tank with same |
CN115440636B (en) * | 2022-08-30 | 2024-03-22 | 高景太阳能股份有限公司 | Silicon wafer bearing material support and carrying water tank with same |
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