1279531 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種多維溫度參數自動化量測系統，尤 指一種以紅外線熱電堆組成多維陣列感測模組，搭配電腦 人機介面的控制與顯示設計，能即時量測多點熱源的溫度 分布，並重建待測物體之溫度分布，而完成空間量測之多 維溫度參數自動化量測系統。 【先前技術】 隨著科技的進步，溫度信號量測需求的趨勢已從單點 到局部，由區域到整體現象的掌握，使得量測系統要求曰 漸提高，因此多點式陣列量測的前景和重要性已不言可 喻，相關系統目前可被應用於曰常生活、產業科技、生醫 工程和高科技探險等領域。由於溫度陣列量測足以偵測平 面及空間信號，進而分析多維度的複雜問題，因此利用價 值大於卓點分佈量測，若將各種傳統單功能分離式溫度感 測器以陣列示連接或直接設計成多維陣列溫度感測器使 用，可以改善動態量測效果，而達成多點溫度智慧型感測 系統的目的。 目前多參數溫度感測量測與自動化數據處理系統單價 極高，使用功能僅限於尖端科技產業與探險應用。另外， 傳統的溫度監控系統只能告知使用者點或是部份區域溫度 分布，若應用於多維環境，無法得知整體溫度分布。例如 紅外線熱像儀可輕易得知物體表面的溫度分布與變化趨 勢，但是該設備價格昂貴，且對於小尺寸缺陷解析度不佳。 1279531 ，外，傳統接觸式元件的量測需要與待測環境達到平衡狀 態，才可得到待測實際情形，且接觸式量測對於待測環境 會產生插入干擾且變化，未作可視化顯示，不能滿足精密 感測量測的實際需求。 因此，開發成本低與應用廣泛之自動化多維溫度感測 與即時數據可視化處理系統，以應用於探視不可視環境，1279531 IX. Description of the invention: [Technical field of invention] The present invention relates to a multi-dimensional temperature parameter automatic measurement system, in particular to a multi-dimensional array sensing module composed of an infrared thermopile, which is matched with a computer man-machine interface for control and display. The design can instantly measure the temperature distribution of the multi-point heat source and reconstruct the temperature distribution of the object to be measured, and complete the multi-dimensional temperature parameter automatic measurement system for spatial measurement. [Prior Art] With the advancement of technology, the trend of temperature signal measurement demand has gone from single point to local, from the regional to the overall phenomenon, so that the measurement system requirements are gradually increasing, so the prospect of multi-point array measurement And the importance has been said to be, the relevant systems can now be applied to the fields of life, industrial technology, biomedical engineering and high-tech exploration. Since the temperature array measurement is sufficient to detect planar and spatial signals, and then analyze multi-dimensional complex problems, the utilization value is greater than the point distribution measurement. If various conventional single-function discrete temperature sensors are connected in an array or directly designed The use of a multi-dimensional array temperature sensor can improve the dynamic measurement effect and achieve the purpose of a multi-point temperature intelligent sensing system. At present, multi-parameter temperature sensing and automated data processing systems are extremely priced, and their use is limited to cutting-edge technology industries and adventure applications. In addition, the traditional temperature monitoring system can only inform the user of the temperature distribution of the point or part of the area. If applied to a multi-dimensional environment, the overall temperature distribution cannot be known. For example, an infrared camera can easily know the temperature distribution and changing trend of the surface of the object, but the device is expensive and has poor resolution for small size defects. 1279531, in addition, the measurement of the traditional contact components needs to be in equilibrium with the environment to be tested, and the actual situation to be tested can be obtained, and the contact measurement will cause insertion interference and change for the environment to be tested, and no visual display is possible. Meet the actual needs of precision measurement. Therefore, an automated multi-dimensional temperature sensing and real-time data visualization processing system with low development cost and wide application is applied to visit an invisible environment.
例如人體内溫度參數變化或產業界需要量測溫度等環境， 實在為本發明之研究重點。 【發明内容】 本發明之主要目的，在於解決上述的問題而提供一種 多維溫度參數自動化量測系統’此系統整合多維感測、機 電參數量測、資訊圖形處理及工程應用量測等功能，並使 用非接觸式紅外線熱電堆陣列感測元件，含自__償 結構，其感測元件應用範圍廣、尺寸小，塑應 二 減少對待測環境範圍的干擾，増加量測時二；全二丑有： 顯示多維度之數據，快速及穩定分析4測結果，並將所^ 析^空間溫度場分佈作視覺化影像顯示，而有效量測不ς 視環境參數。可用㈣免在I業環境巾，@人為疏失的量 測導致錯誤判讀，而造成不必要的人員傷亡及成本浪費。里 為達前述之目的，本發明係包括·· 、 -主電腦’其内部安裝有-操作介面，以蚊多维方 =的量測參數設定，該主電腦透過—第—串列傳輸件而將 幻呆作介面所妓之量測參數寫人—單晶片控制電路。 -量測平台，該量測平台接受來自該單晶片控制電路 6 1279531 的控制訊號，該控制訊號控制該量測平台作χ — γ軸方向 的平面移動及Ζ軸的軸向旋轉。 一多維陣列感測探頭，其設置在該量測平台上，當該 該量測平台移動時，該多維陣列感測探頭則進入一待測環 境範圍，並量測到該待測環境範圍之多數溫度值資料，再 將所量測到的各該溫度值資料送至一信號處理電路及該單 晶片控制電路作處理及轉換。 該單晶片控制電路將經過處理的各該溫度值資料經由 一第二串列傳輸件輸入至原該主電腦的操作介面，而完成 量測。 最後，該操作介面會儲存各該溫度值資料及所設定之 f測參數’並將各該溫度值貧料進行矩陣數據分析處理’ 以及視覺化影像顯示。 本發明之上述及其他目的與優點，不難從下述所選用 實施例之詳細說明與附圖中，獲得深入了解。 當然，本發明在某些另件上，或另件之安排上容許有 所不同，但所選用之實施例，則於本說明書中，予以詳細 說明，並於附圖中展示其構造。 【實施方式】 請參閱第1圖至第8圖，圖中所示者為本發明所選用 之實施例結構，此僅供說明之用，在專利申請上並不受此 種結構之限制。 本實施例之多維溫度參數自動化量測系統，其包括： 一主電腦1，其内部安裝有一操作介面1 1，以決定 7 1279531 多維方式的量測參數設定，該主電腦i透過一第一串列傳 輸件2 1而將該操作介面1 ^所設定之量測參數寫入一單 晶片控制電路3。 “ 一量測平台4，該量測平台4接受來自該單晶片控制 電路3的控制訊號，該控制訊號控制該量測平台4作又— Y軸方向的平面移動及Z軸的軸向旋轉。 一 一多維陣列感測探頭5，其設置在該量測平台4上， 當該量測平台4移動時，該多維陣列感測探頭5則進入一 待測環境範圍6，並量測到該待測環境範圍6之多數溫度 值貝料7，再將所量測到的各該溫度值資料7透過匯流排 線傳送至-信號處理電路8及該單晶片控制電路3 及轉換。 該單晶片控制電路3將經過處理的各該溫度值資 經由一第二串列傳輸件22輸入至原該主電腦工的操作介 面1 1，而完成量測。For example, changes in temperature parameters in the human body or the need to measure temperature in the industry are the focus of research in this invention. SUMMARY OF THE INVENTION The main object of the present invention is to solve the above problems and provide a multi-dimensional temperature parameter automatic measuring system 'this system integrates multi-dimensional sensing, electromechanical parameter measurement, information graphic processing and engineering application measurement and the like, and The non-contact infrared thermopile array sensing component is included in the __compensation structure, and its sensing component has a wide application range and small size, and the plasticity should reduce the interference of the environment to be tested, and increase the measurement time; There are: Display multi-dimensional data, quickly and stably analyze the results of 4 measurements, and display the spatial temperature field distribution of the ^ spatial visual display, and the effective measurement does not regard the environmental parameters. Available (4) Free from the I industry environment towel, @man-made loss measurement leads to misinterpretation, resulting in unnecessary casualties and cost waste. For the purposes of the foregoing, the present invention includes a main computer's internal installation-operation interface, which is set by the measurement parameter of the mosquito multi-dimensional side, and the main computer transmits through the -first serial transmission component. The measurement parameters of the illusion-free interface are written by a single-chip control circuit. a measuring platform that receives a control signal from the single-chip control circuit 6 1279531, the control signal controlling the measuring platform to perform a plane movement in the γ-axis direction and an axial rotation of the Ζ-axis. a multi-dimensional array sensing probe is disposed on the measuring platform. When the measuring platform moves, the multi-dimensional array sensing probe enters a range of the environment to be tested, and measures the range of the environment to be tested. Most of the temperature value data is sent to the signal processing circuit and the single chip control circuit for processing and conversion. The single-chip control circuit inputs the processed temperature data to the operation interface of the host computer via a second serial transmission component to complete the measurement. Finally, the operation interface stores each of the temperature value data and the set f measurement parameter 'and performs the matrix data analysis process for each of the temperature values and the visual image display. The above and other objects and advantages of the present invention will be readily understood from Of course, the invention may be varied on certain components, or in the arrangement of the components, but the selected embodiments are described in detail in the specification and their construction is shown in the drawings. [Embodiment] Please refer to Fig. 1 to Fig. 8 for the structure of the embodiment selected for the present invention, which is for illustrative purposes only and is not limited by this structure in the patent application. The multi-dimensional temperature parameter automatic measurement system of the embodiment includes: a host computer 1 having an operation interface 1 1 installed therein to determine a measurement parameter setting of the 7 1279531 multi-dimensional mode, the host computer i transmitting a first string The column transmission member 21 writes the measurement parameters set by the operation interface 1^ into a single chip control circuit 3. A measuring platform 4 receives the control signal from the single-chip control circuit 3, and the control signal controls the measuring platform 4 to perform a plane movement in the Y-axis direction and an axial rotation of the Z-axis. a multi-dimensional array sensing probe 5 disposed on the measuring platform 4, when the measuring platform 4 moves, the multi-dimensional array sensing probe 5 enters a range 6 to be tested, and measures the The majority of the temperature values of the environment range 6 to be tested are 7 and the measured temperature data 7 are transmitted to the signal processing circuit 8 and the single chip control circuit 3 and converted through the bus bar. The control circuit 3 inputs the processed temperature values to the operating interface 1 of the main computer operator via a second serial transmission unit 22 to complete the measurement.
最後，該操作介面1 1會儲存各該溫度值資料7及所 設定之量測參數’並將各該溫度值資料7進行矩 I 析處理，以及視覺化影像顯示。 據刀 如第2圖至第6圖本系统中夕旦、日丨T y -X轴移動件4卜二::二結構包括 ，係設置於該X軸移動件4丄上，並具有一連結 該連結件43-端裝設有該多維陣列感測探， 該多維陣列感測探頭5具有可進行二維X-Y轴方;；= 面量測及第三維Ζ軸之軸向旋轉。而該多維= 8 1279531 =有多數紅外線熱電堆感測器51，該紅外線熱電堆感 冽裔5 1係作為非接觸溫度感測使用，並内設有〜熱 阻作為溫度補償用。 、、、/ 如第7圖所示本發明在使用者操作介面i 功能規 ^與设计。基本功能有串列傳輸件的開啟與關閉、结束系 統及存檔。存檔功能包括量測溫度值資料7的儲存，及量 ，平台之相關量測參數設定的存檔。輸入控制功能主要二 定是控制量測平台4之X軸移動件4 1與γ軸移動件4 2 • 作X — Y軸方向的平面移動、連結於多維陣列感測探頭5 之連結件4 3作Z軸方向的轴向旋轉，以及設定量測平台 4的量測範圍、移動及軸向旋轉取樣間距。顯示功能方面 ，當陣列量測溫度值資料7分析處理後，再經過環場連續 影像之鑲嵌與重建製作，會在Matlab數學軟體之影像處 理工具盒與GUI介面（Graphic User Interface)視覺化 顯不，標示待測物的最高溫度值與最低溫度值，並以不同 顏色區塊顯示整體溫度分布，使得使用者能直接明瞭待測 •" 物的溫度分布情形。 ' • 當待測物溫度與紅外線熱電堆感測器5 1溫度有差異 時，紅外線熱電堆感測器5 1會輸出電壓變化信號，溫度 差異越大其輸出電壓也越大。如第8圖所示為本發明之溫 度感測之實施方式，利用本發明之紅外線熱電堆感測哭5 1、信號處理電路8、輩曰y桃生丨㊆政q ^ 口口 早晶片控制電路3、第二串列傳輸 件2 2與主電腦1之操作介面丄工所連結構成的多維陣列 感測電路設計來完成。紅外線熱電堆感測器5工經過溫度 9 1279531 補償處理後，再經由比較電路將感測器冷端的參考電壓與 熱端的電壓相比較，得到溫差電壓，經過歸零校準及放大 電路，而得到感測資料信號，接著所得到的感測資料信號 透過多通道類比多通道類比多工器，再藉由該單晶片控制 電路3的控制，並切換感測器1到η的輸出信號，使其經 類比數位轉換後，將數位電壓信號透過第二串列傳輸件2 2輸送至主電腦1之操作介面1 1端，操作介面1 1會將 感測電壓值在轉換成原來溫度值資料7，以進行空間溫度 場分佈之數據分析處理，及待測物空間溫度場分佈之視覺 化影像顯示。 如第2圖至第4圖及第9圖所示，將本系統實施於二 維環境的溫度場分佈量測。先開啟操作介面1 1，選擇二 維的量測操作，使量測平台歸位，輸入二維的量測參數設 定（包括有量測範圍、量測間距、量測點數、量測平台之 之X軸移動件4 1與Υ軸移動件4 2作X — Υ軸方向的平 面行進速度）於單晶片控制電路3，藉由多維陣列感測探 頭5上的紅外線熱電堆感測器5 1量測到多數溫度值訊號 ，並經由信號處理電路8及單晶片控制電路3的處理與轉 換成數位電壓訊號，透過第二串列傳輸件2 2而送至該操 作介面1 1，再令操作介面1 1儲存溫度值矩陣資料及本 次所設定之量測參數，並將溫度值矩陣資料進行矩陣數據 分析處理，以及作視覺化影像顯示，最後儲存結果，而完 成本次二維環境的溫度場分佈量測。 當然，本發明仍存在許多例子，其間僅細節上之變化 1279531 。請參閱第5圖、第6圖及第1 0圖，其係本發明之第二 實施例，其差異在於進行的是三維的量測，操作介面1 1 不同在於參數設定部份（包括有轴向量測範圍、軸向量測 間距、軸向量測點數、量測平台之之X軸移動件4 1與Υ 軸移動件4 2作X — Υ轴方向的平面行進速度及連結於多 維陣列感測探頭5之連結件4 3作Ζ軸方向的軸向旋轉速 度），並且所得到的是立體溫度值矩陣資料，再經過矩陣數 據分析處理，以產生立體空間溫度場之視覺化影像顯示。 ϋ 由於具有溫度的物體都會放射出紅外線的熱輻射，熱 輻射量由物體的溫度所決定，溫度越高，被激發的粒子輻 射出的能量就越多。故，本發明之紅外線熱電堆感測器5 1的作用原理是利用熱電堆之熱電效應來感測溫度，由多 個熱電偶組成熱電堆結構，並總輸出電壓為多數熱電偶電 壓輸出的總合，適用於量測微小的溫度變化。 綜上所述，本發明之多維溫度參數自動化量測系統主 要優點是以非接觸式紅外線陣列感測器來作即時溫度量測 #' ，改善單一感測元件之解析度，及分析大空間溫度場分佈 • 情形，有效應用於待測環境非侵入、非破壞的量測，並提 供自動化監控與多維多元感測應用的思維，且將原感測量 測資料重整還原，以達到監控待測物與環境的溫度分布範 圍及熱源位置之功能。 另外，本發明整合多維感測、機電參數量測、資訊圖 形處理及工程應用量測等功能，並使用非接觸式紅外線熱 電堆陣列感測元件，其感測元件應用範圍廣、尺寸小，響 11 1279531 應時間短，溫度自熱補償可減少對待測環境範圍6的干擾 ，增加量測時的安全性，有效顯示多維度之數據，快速及 穩定分析量測結果，並將所分析的空間溫度場分佈作視覺 化影像顯示，而有效量測不可視環境參數。可用以避免在 工業環境中，因著人為疏失的量測導致錯誤判讀，而造成 不必要的人貝傷亡及成本浪費。 以上所述實施例之揭示係用以說明本發明，並非用以 限制本發明，故舉凡數值之變更或等效元件之置換仍應隸 屬本發明之範疇。 由以上詳細說明，可使熟知本項技藝者明瞭本發明的 確可達成前述目的，實已符合專利法之規定，爰提出專利 申請。 【圖式簡單說明】 第1圖係本發明之系統整合示意圖 第2圖係本發明之二維陣列感測探頭與紅外線熱電堆 感測器放大示意圖 第3圖係本發明之二維陣列感測探頭與匯流排線示意 圖 第4圖係本發明之二維量測平台示意圖 第5圖係本發明之三維陣列感測探頭與紅外線熱電堆 感測器放大不意圖 第6圖係本發明之三維量測平台示意圖 第7圖係本發明之操作介面功能規劃設計方塊圖 第8圖係本發明之多維陣列感測電路設計方塊圖 12 1279531 第9圖係本發明之第一實施例操作流程圖 第1 0圖係本發明之第二實施例操作流程圖 【主要元件符號說明】 (本發明部分） 主電腦1 操作介面11 第一串列傳輸件21 第二串列傳輸件2 2 單晶片控制電路3 量測平台4 X軸移動件4 1 Y軸移動件4 2 連結件4 3 多維陣列感測探頭5 紅外線熱電堆感測器5 1 待測環境範圍6 溫度值資料7 信號處理電路8 13Finally, the operation interface 1 1 stores each of the temperature value data 7 and the set measurement parameter ' and performs temperature analysis on each of the temperature value data 7 and visualized image display. According to the figure, as shown in Fig. 2 to Fig. 6, in the system, the U-day, the Japanese-Ty-X-axis moving member 4b:: the second structure includes, is disposed on the X-axis moving member 4丄, and has a link The multi-layer array sensing probe is mounted on the connecting member 43-end. The multi-dimensional array sensing probe 5 has a two-dimensional XY axis; the surface measurement and the axial rotation of the third dimensional axis. And the multi-dimensional = 8 1279531 = there are many infrared thermopile sensors 51, which are used as non-contact temperature sensing, and have a thermal resistance as temperature compensation. , , , / / As shown in Figure 7, the present invention operates on the interface i function and design. The basic functions are the opening and closing of serial transmissions, the end of the system and the archiving. The archiving function includes the storage of the measured temperature value data 7, and the archive of the relevant measurement parameters of the platform. The input control function is mainly to control the X-axis moving member 4 1 of the measuring platform 4 and the γ-axis moving member 4 2 • The plane movement in the X-Y-axis direction, and the connecting member 4 3 connected to the multi-dimensional array sensing probe 5 The axial rotation in the Z-axis direction, and the measurement range, movement and axial rotation sampling interval of the measurement platform 4 are set. In terms of display function, when the array is measured and analyzed, the mosaic and reconstruction of the continuous image of the ring field will be visualized in the image processing toolbox and the GUI interface of the Matlab math software. , indicating the highest temperature value and the lowest temperature value of the object to be tested, and displaying the overall temperature distribution in different color blocks, so that the user can directly understand the temperature distribution of the object to be tested. • When the temperature of the object to be tested differs from the temperature of the infrared thermopile sensor 51, the infrared thermopile sensor 51 outputs a voltage change signal, and the larger the temperature difference, the larger the output voltage. As shown in FIG. 8 , the embodiment of the temperature sensing of the present invention utilizes the infrared thermopile sensing of the present invention to sense the crying 5 1 , the signal processing circuit 8 , the generation 曰 桃 桃 丨 政 政 q q q 口 口 口 early control circuit 3. The second serial transmission device 2 2 is designed to be connected to the multi-dimensional array sensing circuit formed by the operation interface of the host computer 1 . The infrared thermopile sensor 5 works through the temperature 9 1279531 after the compensation process, and then compares the reference voltage of the cold end of the sensor with the voltage of the hot end through the comparison circuit to obtain the temperature difference voltage, and after obtaining the zero calibration and amplification circuit, the sense is obtained. The data signal is measured, and then the obtained sensing data signal is transmitted through the multi-channel analog multi-channel analog multiplexer, and then controlled by the single-chip control circuit 3, and the output signals of the sensors 1 to η are switched to be After analog-to-digital conversion, the digital voltage signal is transmitted to the operation interface 11 end of the host computer 1 through the second serial transmission device 2 2, and the operation interface 1 1 converts the sensing voltage value into the original temperature value data 7 to The data analysis processing of the spatial temperature field distribution and the visual image display of the temperature field distribution of the object to be tested are performed. As shown in Figures 2 to 4 and Figure 9, the system is implemented in a temperature field distribution measurement in a two-dimensional environment. First open the operation interface 1 1, select the two-dimensional measurement operation, make the measurement platform homing, input the two-dimensional measurement parameter settings (including the measurement range, measurement interval, measurement points, measurement platform) The X-axis moving member 4 1 and the x-axis moving member 4 2 are X-axis traveling speed in the x-axis direction) in the single-chip control circuit 3, and the infrared thermopile sensor 5 1 on the multi-dimensional array sensing probe 5 The majority of the temperature value signals are measured, and processed and converted into digital voltage signals by the signal processing circuit 8 and the single chip control circuit 3, and sent to the operation interface 1 through the second serial transmission unit 2, and then operated. The interface 1 1 stores the temperature value matrix data and the measurement parameters set by the current time, and performs matrix data analysis processing on the temperature value matrix data, and visualizes the image display, and finally stores the result, and completes the temperature of the two-dimensional environment. Field distribution measurement. Of course, there are still many examples of the present invention, only the details of which vary 1279531. Please refer to FIG. 5, FIG. 6 and FIG. 10, which is a second embodiment of the present invention. The difference is that three-dimensional measurement is performed, and the operation interface 11 differs in the parameter setting part (including the axis). Vector measurement range, axis vector measurement distance, axis vector measurement point, X-axis moving part of measurement platform 4 1 and Υ Axis moving part 4 2 X-axis plane speed and connection to multi-dimensional The coupling member 4 of the array sensing probe 5 serves as the axial rotation speed in the x-axis direction, and the obtained matrix data of the stereo temperature value is subjected to matrix data analysis processing to generate a visual image display of the stereoscopic temperature field. . ϋ Since objects with temperature emit infrared radiation, the amount of heat radiation is determined by the temperature of the object. The higher the temperature, the more energy the emitted particles radiate. Therefore, the principle of the infrared thermopile sensor 51 of the present invention is to utilize the thermoelectric effect of the thermopile to sense the temperature, the thermopile structure is composed of a plurality of thermocouples, and the total output voltage is the total output of most thermocouple voltages. Combined, suitable for measuring small temperature changes. In summary, the main advantage of the multi-dimensional temperature parameter automatic measuring system of the present invention is that the non-contact infrared array sensor is used for instant temperature measurement, improving the resolution of a single sensing component and analyzing the large space temperature. Field distribution • The situation is effectively applied to the non-invasive and non-destructive measurement of the environment to be tested, and provides the idea of automatic monitoring and multi-dimensional multi-sensory application, and the original measurement data is reformed and restored to achieve monitoring of the object to be tested. The function of the temperature distribution range of the environment and the location of the heat source. In addition, the invention integrates functions of multi-dimensional sensing, electromechanical parameter measurement, information graphic processing and engineering application measurement, and uses a non-contact infrared thermopile array sensing component, and the sensing component has a wide application range and small size, and the ringing 11 1279531 The time should be short, the temperature self-heat compensation can reduce the interference of the environment range 6 to be tested, increase the safety during the measurement, effectively display the multi-dimensional data, analyze the measurement results quickly and stably, and analyze the space temperature. The field distribution is used for visual image display, while the effective measurement of invisible environmental parameters. It can be used to avoid erroneous interpretation due to human error measurement in the industrial environment, resulting in unnecessary human casualties and cost waste. The above description of the embodiments is intended to be illustrative of the invention, and is not intended to limit the scope of the invention. From the above detailed description, it will be apparent to those skilled in the art that the present invention can achieve the above-mentioned objects, and is in accordance with the provisions of the Patent Law. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of system integration of the present invention. FIG. 2 is an enlarged schematic view of a two-dimensional array sensing probe and an infrared thermopile sensor of the present invention. FIG. 3 is a two-dimensional array sensing method of the present invention. FIG. 4 is a schematic diagram of a two-dimensional measuring platform of the present invention. FIG. 5 is a three-dimensional array sensing probe and an infrared thermopile sensor of the present invention. FIG. 6 is a three-dimensional amount of the present invention. Figure 7 is a schematic diagram of the operation interface design of the present invention. Figure 8 is a block diagram of the multi-dimensional array sensing circuit of the present invention. Figure 12 1279531 Figure 9 is a flow chart of the first embodiment of the present invention. 0 is a flow chart of operation of the second embodiment of the present invention [Description of main components] (part of the invention) main computer 1 operation interface 11 first serial transmission member 21 second serial transmission member 2 2 single wafer control circuit 3 Measuring platform 4 X-axis moving member 4 1 Y-axis moving member 4 2 Connecting member 4 3 Multi-dimensional array sensing probe 5 Infrared thermopile sensor 5 1 Environment to be tested 6 Temperature value data 7 Signal processing circuit 8 13