TWI274198B - Methods of forming electronic and optical components using laser ablation - Google Patents
Methods of forming electronic and optical components using laser ablation Download PDFInfo
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- TWI274198B TWI274198B TW093138884A TW93138884A TWI274198B TW I274198 B TWI274198 B TW I274198B TW 093138884 A TW093138884 A TW 093138884A TW 93138884 A TW93138884 A TW 93138884A TW I274198 B TWI274198 B TW I274198B
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12107—Grating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12147—Coupler
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12166—Manufacturing methods
- G02B2006/12169—Annealing
- G02B2006/12171—Annealing using a laser beam
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
- G02B6/02057—Optical fibres with cladding with or without a coating comprising gratings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
- G02B6/02057—Optical fibres with cladding with or without a coating comprising gratings
- G02B6/02076—Refractive index modulation gratings, e.g. Bragg gratings
- G02B6/02123—Refractive index modulation gratings, e.g. Bragg gratings characterised by the method of manufacture of the grating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Optical Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53214503P | 2003-12-22 | 2003-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200532269A TW200532269A (en) | 2005-10-01 |
| TWI274198B true TWI274198B (en) | 2007-02-21 |
Family
ID=34573056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093138884A TWI274198B (en) | 2003-12-22 | 2004-12-15 | Methods of forming electronic and optical components using laser ablation |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20050163415A1 (enExample) |
| EP (1) | EP1550888A1 (enExample) |
| JP (1) | JP2005181958A (enExample) |
| KR (1) | KR20050063687A (enExample) |
| CN (1) | CN1645988A (enExample) |
| TW (1) | TWI274198B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010021896A1 (en) * | 2008-08-22 | 2010-02-25 | 3M Innovative Properties Company | Light guides including laser-processed light extractors and methods |
| JP4655157B2 (ja) * | 2009-04-17 | 2011-03-23 | 住友ベークライト株式会社 | 光導波路構造体の製造方法 |
| US20100307799A1 (en) * | 2009-06-06 | 2010-12-09 | Chiang Cheng-Feng | Carrier Structure for Electronic Components and Fabrication Method of the same |
| US7949211B1 (en) | 2010-02-26 | 2011-05-24 | Corning Incorporated | Modular active board subassemblies and printed wiring boards comprising the same |
| CN102248288A (zh) * | 2011-06-30 | 2011-11-23 | 昆山市正业电子有限公司 | 一种fpc板插头识别定位方法 |
| US8633956B2 (en) | 2011-09-01 | 2014-01-21 | Hewlett-Packard Development Company, L.P. | Patterning of coated printed media |
| US9490148B2 (en) * | 2012-09-27 | 2016-11-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Adhesion promoter apparatus and method |
| US9377595B2 (en) * | 2013-12-11 | 2016-06-28 | Stan C. Petrov | Photoelectric conductive motherboard and modular system |
| EP3351339B1 (en) * | 2015-09-15 | 2024-06-19 | Panasonic Intellectual Property Management Co., Ltd. | Weld structure of metal member and welding process |
| US20190193208A1 (en) * | 2016-09-02 | 2019-06-27 | Cyprus University Of Technology | Femtosecond laser inscription |
| CN110208906A (zh) * | 2019-05-21 | 2019-09-06 | 中国科学院上海光学精密机械研究所 | 一种基于反应离子刻蚀的薄膜微光学结构的制备方法 |
| CN113296178B (zh) * | 2021-06-09 | 2022-07-19 | 中国工程物理研究院激光聚变研究中心 | 一种co2激光在熔石英表面直接制备正弦相位光栅的方法 |
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| US4915981A (en) * | 1988-08-12 | 1990-04-10 | Rogers Corporation | Method of laser drilling fluoropolymer materials |
| US5169678A (en) * | 1989-12-26 | 1992-12-08 | General Electric Company | Laser ablatable polymer dielectrics and methods |
| US5059763A (en) * | 1990-06-06 | 1991-10-22 | Massachusetts Institute Of Technology | Formation of optical quality surfaces in optical material |
| US5125054A (en) * | 1991-07-25 | 1992-06-23 | Motorola, Inc. | Laminated polymer optical waveguide interface and method of making same |
| US5368900A (en) * | 1991-11-04 | 1994-11-29 | Motorola, Inc. | Multistep laser ablation method for making optical waveguide reflector |
| DE4212208A1 (de) * | 1992-04-10 | 1993-10-14 | Bosch Gmbh Robert | Verfahren zur Herstellung optischer Polymerbauelemente mit integrierter Faser-Chip-Kopplung in Abformtechnik |
| IL105925A (en) * | 1992-06-22 | 1997-01-10 | Martin Marietta Corp | Ablative process for printed circuit board technology |
| DE4240266A1 (de) * | 1992-12-01 | 1994-06-09 | Bosch Gmbh Robert | Verfahren zur Herstellung optischer Polymerbauelemente mit integrierten vertikalen Koppelstrukturen |
| DE69418698T2 (de) * | 1994-04-14 | 1999-10-07 | Hewlett-Packard Gmbh | Verfahren zur Herstellung von Leiterplatten |
| US5500540A (en) * | 1994-04-15 | 1996-03-19 | Photonics Research Incorporated | Wafer scale optoelectronic package |
| JPH10123357A (ja) * | 1996-10-24 | 1998-05-15 | Nippon Sheet Glass Co Ltd | 光導波路に対するレーザ加工方法 |
| US5895263A (en) * | 1996-12-19 | 1999-04-20 | International Business Machines Corporation | Process for manufacture of integrated circuit device |
| JP3133039B2 (ja) * | 1998-10-05 | 2001-02-05 | 日本電信電話株式会社 | 光導波路用感光性組成物およびその製造方法および高分子光導波路パターン形成方法 |
| US6611635B1 (en) * | 1998-10-09 | 2003-08-26 | Fujitsu Limited | Opto-electronic substrates with electrical and optical interconnections and methods for making |
| US6177143B1 (en) * | 1999-01-06 | 2001-01-23 | Allied Signal Inc | Electron beam treatment of siloxane resins |
| US6313434B1 (en) * | 1999-05-27 | 2001-11-06 | International Business Machines Corporation | Method for creation of inclined microstructures using a scanned laser image |
| TWI239798B (en) * | 1999-05-28 | 2005-09-11 | Toppan Printing Co Ltd | Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate |
| JP4401540B2 (ja) * | 2000-06-30 | 2010-01-20 | 浜松ホトニクス株式会社 | レーザー装置及びこれを用いた光信号増幅装置 |
| CN1555387A (zh) * | 2000-07-28 | 2004-12-15 | 古德里奇公司 | 制造光学波导管的聚合物组合物、由此制造的光学波导管及制造此波导管的方法 |
| TWI226103B (en) * | 2000-08-31 | 2005-01-01 | Georgia Tech Res Inst | Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same |
| KR100841597B1 (ko) * | 2000-09-13 | 2008-06-26 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 | 전자 디바이스 제조 |
| WO2002054120A1 (en) * | 2000-12-28 | 2002-07-11 | Keio University | Optical signal processing circuit and method of producing same |
| US6671950B2 (en) * | 2001-03-08 | 2004-01-06 | Ppg Industries Ohio, Inc. | Multi-layer circuit assembly and process for preparing the same |
| US6731857B2 (en) * | 2001-03-29 | 2004-05-04 | Shipley Company, L.L.C. | Photodefinable composition, method of manufacturing an optical waveguide with the photodefinable composition, and optical waveguide formed therefrom |
| US7011932B2 (en) * | 2001-05-01 | 2006-03-14 | E. I. Du Pont De Nemours And Company | Polymer waveguide fabrication process |
| JP2003131001A (ja) * | 2001-05-25 | 2003-05-08 | Shipley Co Llc | 多孔性光学物質 |
| US6661642B2 (en) * | 2001-11-26 | 2003-12-09 | Shipley Company, L.L.C. | Dielectric structure |
| US6856745B2 (en) * | 2002-07-02 | 2005-02-15 | Lucent Technologies Inc. | Waveguide and applications therefor |
| EP1434068A3 (en) * | 2002-12-02 | 2004-07-28 | Shipley Company, L.L.C. | Methods of forming waveguides that are rounded in cross section and waveguides formed therefrom |
| US6842577B2 (en) * | 2002-12-02 | 2005-01-11 | Shipley Company L.L.C. | Photoimageable waveguide composition and waveguide formed therefrom |
-
2004
- 2004-03-29 JP JP2004096538A patent/JP2005181958A/ja not_active Withdrawn
- 2004-12-15 TW TW093138884A patent/TWI274198B/zh not_active IP Right Cessation
- 2004-12-17 KR KR1020040107485A patent/KR20050063687A/ko not_active Ceased
- 2004-12-18 EP EP04257942A patent/EP1550888A1/en not_active Withdrawn
- 2004-12-21 CN CNA2004100821387A patent/CN1645988A/zh active Pending
- 2004-12-22 US US11/020,521 patent/US20050163415A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1550888A1 (en) | 2005-07-06 |
| TW200532269A (en) | 2005-10-01 |
| KR20050063687A (ko) | 2005-06-28 |
| US20050163415A1 (en) | 2005-07-28 |
| CN1645988A (zh) | 2005-07-27 |
| JP2005181958A (ja) | 2005-07-07 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |