TWI271126B - Method of the three-dimensional image for the blind hole examines on a printed circuit board - Google Patents

Abstract

A method of the three-dimensional image for the blind hole examines on a printed circuit board (PCB), including a logic program and image survey instrument are setting up on the device of the blind hole examines. The basic bore diameter and measure distance of the blind hole will input and file in the logic procedure in advance to design the end and await measuring, and then to choose a scene of rate in the image examining device. The scene and await measuring blind hole location on-line in the same axis. The image survey instrument or PCB is moving to step by step in the measure distance, and then the image survey instrument can do it on file for the focus and take photo the blind hole in the layer by layer. The logic program can to pile all the photo and recombination, in order to count and reading intact three-dimensional image of the blind hole.

Description

1271126 V. INSTRUCTION DESCRIPTION (1) [Technical Field] The method of the present invention, in particular, continuous focusing to obtain blind holes [previously printed between electrical layers of ~0·10 mm, however, blind pass layers of circuit 1 can be obtained Destroy the blind hole to cut 2. Take the image of the manual adjustment and image capture operation, but know that for the micro-blind and hole type, and the display is sluggish and stupid, the stereoscopic image that can be used to capture the blind hole surface provides a kind of printing using the image volume. , image capture, file complete stereo image] between the circuit board (PCB), is the size required by the laser into a closed blind hole regardless of the large hole of the blind hole. The blind detection method is used to measure the actual rule method; it is a type of measuring device, which is used to interpret the above-mentioned destructive holes in the blind hole. It is difficult to spend extremely labor time, which is already out of the way. A single-plane image, a technique in which a stereoscopic image measuring device having a blind hole on a circuit substrate performs layer-by-layer processing on a blind hole on a substrate, and calculation of image stacking. The blind processing system is used for small, in precision, the hole precision is measured by the human inch or the CCD blind hole. The upper and lower detection method is used to slice and square, and the cost is high. The image is used without stereo three-hole aperture. The laser can be used to obtain the aperture-type image viewfinder for the lack of aperture detection. The control tube is used to measure the aperture of the aperture type to make the substrate layer conduction work the most efficient method. The method of the method is artificially paired. Measured efficiency The center breaks the blind hole. The blind hole in the industry or the stack is specified on the 0. 0 1 circuit. It is important that the blind holes include: , the focus of the microscope to be tested and the photographing, especially the size of the surface. It’s hard to calculate only the flatness when focusing

Page 5 1271126 V. Description of the invention (2) to obtain an accurate and accurate reading. However, the present invention will be described later: [Contents] The present invention is directed to a measuring device and a work to be measured, so as to perform measurement of a pile image in all images. The present invention also includes a step shift of a lens of the measuring device. Image, so it is not conducive to the actual accuracy of the blind hole. It is enough to overcome the above problems. Chen Ru provides a blind hole stereo image measurement method, which uses successive (layer) stepping continuous layer-by-layer image acquisition and Establishing the block operation, entering the industry, in order to achieve the stacking of the blind holes between the substrates obtained by the blind holes, 0 is included in the continuous and the base to be tested to facilitate the moving focus and image capturing operation, the center between the plates is The same axis focus and image capture operations can be accurately constructed by the shadow pair and will be erected for the shadow line.

The magnification of the multiple metallographic phases of the present invention is obtained by the base measurement of the blind hole and the measurement of the diameter and the measurement in the measurement microscope. The Liming is still a quasi-aperture blind hole. The upper one is composed of a CCD image vision device and a head, and each metallographic lens has a different measurement selection. The distance between the design end and the measurement to be measured in advance in the measuring device is included, and the actual volume image is supplied for calculation and comparison analysis to distinguish the correctness of the blindness. The reference hole for accessing the blind hole and the means for performing calculation and comparison analysis are within the configuration logic. The invention will be described in detail, and the drawings will be described in detail.

Page 6 1271126 V. Description of invention (3) As after: [Embodiment]

As shown in the first view, it is disclosed that the measuring device of the substrate 4 is arranged: the image measuring device 1 includes a CCDj image vision device 1 erected above a pivot line 1 以及, and another A group of metallographic microscopes 1 2 at the bottom of the CCD image vision device 1 . The metallographic microscope 12 includes a plurality of metallographic lenses 121, 122 and 123 of different magnifications, which are carried on a turntable 13 and are connected to the stationary drive. During implementation, the metallographic lens 121 of the required amount of magnification can be selected and transferred to the same axial line 底部 at the bottom of the CCD image vision device i i . At the same time, the hole center of the blind hole 2 to be tested on the substrate 4 must also be aligned and fixed on the same axis line. Figure 2 shows the reference dimension (in the section and its top view) of the blind hole 2 when the design end is planned, including the blind hole 2 formed between the two conductive layers 2 and 28, having an upper aperture 21, the aperture diameter 22 ^ required blind hole depth 23. Place

Figure 3 reveals the relationship between the stepped distance h of the blind hole shown in Figure 2 and the measurement stroke Η of the design end plan and the layer line 3; wherein, the distance of the stroke Η is slightly larger than the blind hole depth 23 And measuring the stroke HU image measuring device 1 or the substrate 4 is a multiple of the stepping distance h. On ^ ^, if the blind hole machining depth 23 required for the design is 8·2, then the stroke of the amount ^ stroke can be set to a slightly larger value of 1 1 vm ( > 8 · 2 μ m ). The stepping distance h of the device 1 or the substrate 4 can be planned as im

From 丨11, 洚丨I is used for eleven-time focusing and image-taking operations. Figure 4 discloses a flow block diagram of the measurement method of the present invention, including .

V. INSTRUCTIONS (4) The device 3 is equipped with a blind hole reference aperture value. The blind hole 2 diameter 21 and the lower aperture 22 The reference blind hole depth shows the image measuring device 1 the metallographic lens 1 2 1 and the difference, and the metallographic lens with different light receiving ability of the water is automatically corrected and 1 Only a single magnification of the bottom, and the scope of application to be invented

The side is a two-dimensional system 〇 〇; is measured on a substrate 4 logic private 31 and the above-mentioned image measuring device 1. The logic program 31 can receive the input of the 3-way value 25 of the design terminal 3 and then create the file. The value of 20 can include the distance of the upper aperture 23 of the blind hole 2. The illusion is slightly larger than b, 曰 select lens 120; select the metallographic lens 丨 2 i of the required magnification as shown in Figure 1, so that the blind hole 2 to be tested is on the same axis. Among them, due to the wet process of the washing line on the material used for the circuit board 4, after exposure or plating, there will be 'so that the C CD image vision device must match the parameters and images of the light source when selecting different magnifications. 4. In the implementation, the metallographic lens 121 can also be fixed on the axis line 丨〇 in the CCD image vision device 1 1 The blind hole 2 is on the same axis line, which is also the same as the c 'focus 1 3 0 According to the above-mentioned measurement stroke value stroke, the stepwise moving image measuring device 丨 or the substrate 4 is measured, and the step distance h is measured (as shown in FIG. 3), so that each minute has a freeze. The focal length image measuring device 1 can be moved from ^^9 to the middle to the bottom (or from the bottom 'middle to the top 2 of the second hole 2; continuous

1271126 V. Description of the invention (5) The reason for the position of a single designated layer line 32: refers to the position of the layer line 32, including the upper == Yiye, and the position of each of the sections is ... to the lower aperture 22 In the inter-hole wall JL, the image measuring device 1 or the base cylinder >1, can rely on a stepping drive, such as; 4 steps = 2 rods, for stepping the image measuring device! Or drive the substrate 4 to move: the same axis of the same axis 10 in the direction of the proximity of the carrier production d, take image 140; is in each of the above displacements. 'The CCD image vision η in the image measuring device 1 Blind

The specified layer line 32 position can be obtained by blind hole 2 in each specified layer line μ clear multi-layer plane image 2 9 . °M clear clear e, file 150; the above-mentioned blind hole 2 layers of the program 31 file.篆 stored in logic f, calculation 160; the logic program 31 is to stack and reorganize the above-mentioned multi-layer images of 2, to obtain _ 廿 廿 盲 blind hole hole detection image uo, so that the blind hole reference aperture value 2 The measurement end 17 measures the image 17 for the stereo blind hole. The measured size: the blind hole depth 23 of 22 鳊 30 and the blind edge of the upper aperture 21 and the lower aperture 22 = whether the leaf hole control value 2 0 is within the allowable range to judge the accuracy of the second quasi-machining. Also, do not blind hole 2

υ η Ϊ invention in the above measurement process can also be used to focus on 1 3 0 and take you 140 s, so that the CCD image vision device 丨 1 only on the blind hole on the aperture 2 image

The layer line Sichuan...the lower aperture 22 specifies the layer line 3 22 position (:J

1271126 Quasi-blind aperture and simple description of the following figure [Simple description of the diagram] Figure 1: The composition of the measuring instrument of the present invention and the blind image to be tested 2: It is the blind hole of the design end of the design of the invention. Figure 3 is a diagram illustrating the relationship between the reference blind hole and the layer line at the design end. Figure 4: shows the implementation steps of the present invention. Figure 5 is a perspective view of the present invention, illustrating the relationship between only the upper aperture and the stepwise image acquisition. [No. Description] Image measuring instrument --------1 Compilation -------*-------100 Metallographic microscope --------12 Metallographic lens - ---------121 Compensation ---------------124 Focus --------------130 ------ --------150 Stereo blind hole measurement image--170 Reference aperture value--------2 0 Configuration diagram of the measurement device, indicating that the image hole must be on the same axis The cross-section of the reference blind hole and the top view, the reference specifications. The second step of the reference blind hole is not shown in the figure. The step-by-step distance of the planned measurement stroke is shown in the flow block diagram, and the second layer position of the aperture of another specified layer line in the present invention is performed.

Axis line ------------10 CCD image vision device-----11 Select lens----------120 123 turntable--------- ----- 13 Take image --------------140 Calculate --------------160 Blind hole --------- -----2 Upper aperture ------------21

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Claims (1)

1271126 VI. Patent application scope 1. A blind hole stereoscopic image a. Compilation: is a blind hole reference hole of a CCD image on a base image measuring device, b. Select a metallographic lens of the mirror, c. : The sub-step moving shadow is assigned to the specified layer line in each single pass d. Take image: CCD in the detector to take a picture of the image; e. File, built-in file; f, calculation: like stacking and The measurement size, the comparison calculation, to 2. If the application, the measurement of the image volume vision device and the diameter value and the quantum head: the selection and the position to be measured according to the position of the above-mentioned image measuring device after the positioning is determined above For each image vision, to obtain the photometric method of the measuring instrument, at least the bottom of the measuring stroke value of the image blind hole position in the measuring stroke or the substrate to the image grid to focus on a single-time alignment of the blind blind The hole designation includes the following steps: the logic program is arranged on the device and includes a metallographic microscope mounted on a single axis; the input of the design end is located on the same axis of the measurement in the built-in measuring device of the logic program; Value, in measurement Within a sub-sub-sub-step process Η distance h, the gauges and the blind holes of each sector; fixed after focusing, the amount of holes so that the image line position designated layer, the layers of the multilayer planar line portion Movies The image of each layer of the blind hole is stored in a logic program to reorganize the logic and the above-mentioned judgment of the patented range travel value is a multi-layer shadow of the single blind hole obtained by the above method, and a stereo blind hole measurement image is obtained. The real aperture value and the blind hole depth are used for the finishing accuracy. The blind hole stereo image measurement method The distance of the blind hole depth. Blind hole reference Blind hole completion The first item is slightly larger than the base Page 13 1271126 VI. Scope of Application for Patent 3. As mentioned in the first paragraph of the patent application, the reference aperture value of the blind hole contains the reference value of the blind path. 4. In the case of claim 1, the blind, wherein the metallographic lens on the image measuring device is a phase lens. 5. As described in the first paragraph of the patent application, the metallographic lens on the image measuring instrument is a metallographic lens, and can be adjusted to the CCD image axis. 6. Blind as described in item 1 of the patent application, in which the light-receiving ability of the metallographic lens of different magnifications is selected as the light source parameter and image compensation. 7. As described in the first paragraph of the patent application scope, wherein the measurement stroke is a stepped step distance 8. As described in the first application of the patent scope, wherein the image measuring instrument or the substrate is divided. The stepping of the steppings on the step axis is 9. The blinding according to the first item of the patent application, wherein the focusing and taking of the specified layer line position to the plurality of sectional positions of the hole wall between the lower apertures. 1 0. According to the scope of claim 1 of the patent, the focus and the image of the specified layer position hole stereo image measurement method of the upper aperture and the lower hole stereo image measurement method a single rate of gold Hole stereo image measurement method The same hole stereo image measurement method at the bottom of most different magnifications of the vision device can be based on the multiple correction of the base plate degree and the multiple of the hole stereo image measurement method. The hole stereo image measurement method is in the same displacement. Hole stereo image measurement method, including the stereoscopic image measurement method of the aperture hole on the blind hole, which is the upper hole of the blind hole Page 14 1271126 Page 15