•1286197 九、發明說明： 【發明所屬之技術領域】 本發明是錢於-種取料統，特別是指_種 取得二維/三維影像的取像系統。 ’夕 【先前技術】 、7趟程f，高延仃多道檢測工 作以確保良率。現行方法仍有利用顯微鏡人卫目&• 1286197 IX. Description of the Invention: [Technical Field of the Invention] The present invention is an image acquisition system that acquires two-dimensional/three-dimensional images. 'Earth 【Prior Art】, 7趟程f, Gao Yanyi multi-channel inspection work to ensure yield. The current method still uses the microscope to defend the eyes &
檢測工作者’不但費時且無法達到判斷—致性的要求^ 著科技發展，以及電㈣合裝置（CCD)等取像裝置的導= ’輔以微錢運算㈣’料針對取得㈣像騎處理以 得到精雜果，對於LCD或TFT_LCD #製程^管方 大幫助。 如圖1所示，以一應用CCD攝影機的取像裝置】而令 ，主要包含相對位置固^之—普通倍率⑽攝影機U、二 鏡片（lens) 12’及-針賴取影像進行運算處理的電腦（ 圖未示）。當一待測板材10置妥，該裝置1即由上往下移 動並以大肖30張/秒的速率連續取像，由於採用普通倍率 ⑽，其可視範圍（F0V)大，因此可快速且大範圍地取得 該板材10之各高程的平面影像，且有助於得知平面上點與 點之間的距離、位置，或整體的明暗色彩等資訊。 然而’受限於低倍率CCD，該裝置i僅能取得一般解 析度的平面影像，—旦待職材1G需要更精細的檢測，或 需要獲得某特定點詳細資訊，則不得不改換由另一高精度 取像裝置1針對局部再作—次檢測。高精度取像裝置丄，包 5 .1286197 含一 FOV值小、景深極小的高倍率CCD攝影機u，及一鏡 片12,，以大約1〇〇張/秒的速率針對小範圍連續密集取像。The inspection worker's not only takes time and can't reach the judgment - the requirement of the sex ^ the development of the technology, and the guidance of the image acquisition device such as the electric (four) device (CCD) = 'assisted by the micro-money operation (four)' material for the acquisition (four) image riding In order to get the fine fruit, for the LCD or TFT_LCD #process ^ tube side help. As shown in FIG. 1 , the image capturing device of the CCD camera is used, and mainly includes the relative position fixing—the ordinary magnification (10) camera U, the second lens (lens) 12′, and the needle-receiving image for arithmetic processing. Computer (not shown). When a sheet 10 to be tested is placed, the device 1 is moved from top to bottom and continuously taken at a rate of 30 sheets per second. Since the ordinary magnification (10) is adopted, the visible range (F0V) is large, so that it can be quickly and The planar images of the elevations of the sheet 10 are obtained in a wide range, and it is helpful to know the distance, the position, or the overall brightness and darkness of the dots on the plane. However, 'constrained by low-magnification CCD, the device i can only obtain a flat image with normal resolution. If the 1G needs more detailed detection, or needs to obtain detailed information of a specific point, it has to be changed by another The high-precision image capturing device 1 performs local-reproduction detection. High-precision image capture device 丄, package 5 .1286197 contains a high-magnification CCD camera u with a small FOV value and a very small depth of field, and a mirror 12, which continuously intensively captures a small area at a rate of about 1 〇〇 / sec.
基本上，即時影像擷取需要大量的記憶體，且影像處 理對電腦而言往往是一沉重的負擔，若省略普通精度取像 裝置1的檢測步驟而全面以高精度取像裝置工，進行檢測， 不但使電腦運算負荷量過重，且將無法直接得到大範圍平 面影像；然而上述重複檢測取像卻需花費二倍以上時間， 且針對同-板材U)以二取像裝置U—先 — 後進行檢測 ，置換過程更產生定位誤差的問題。 【發明内容】 因此，本發明之目的，即在提供一種可一次取得大範 圍最佳對焦二維影像以及高精度三維資訊的二維/三維同步 取像系統。 本發明之再一目的，在於提供一種可一次取得大範圍 最佳對焦二維影像以及高精度三維資訊的二維/三維同步取 像方法。 於是，本發明二維/三維同步取像系統是針對一待測物 取得至少一對焦平面影像並同時建立高度資訊，該系統包 含一分光鏡、一低倍率取像裝置、一高倍率取像裝置，及 一運算模組。 分光鏡設於該待測物上方，使來自該待測物的光束分 歧並分別沿相互垂直之一第一光路與一第二光路進行。低 倍率取像裝置設於該第一光路上，可使其焦點沿該第一光 路前進並依序擷取多張各高程位置的大範圍平面影像。高 6 1286197 二平取像裝置設於該第二光路上，可使其焦點沿該第二光 則進並依序擷取多張各高程位置的局部平面影像。運算 :組與該低倍率、高倍率取像裝置連接，並依據該等取像 :置所擷取，測出至少一該待測物之最佳對焦平面影 ，同時推异該待測物表面之高程資訊。 本發明二維/三維同步取像方法包含以下步驟：Basically, instant image capture requires a large amount of memory, and image processing is often a heavy burden on the computer. If the detection step of the ordinary precision image capturing device 1 is omitted, the image capturing device is fully automated and detected. Not only makes the computer computing load too heavy, but also can not directly obtain a wide range of planar images; however, the above repeated detection and imaging takes more than twice the time, and for the same-plate U) two imaging devices U-first-after Detection is performed, and the replacement process causes a problem of positioning error. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a two-dimensional/three-dimensional synchronous image capturing system that can obtain a wide range of best-focus two-dimensional images and high-precision three-dimensional information at one time. Still another object of the present invention is to provide a two-dimensional/three-dimensional synchronous imaging method capable of obtaining a wide range of optimally focused two-dimensional images and high-precision three-dimensional information at one time. Therefore, the two-dimensional/three-dimensional synchronous imaging system of the present invention acquires at least one focus plane image and simultaneously establishes height information for a sample to be tested, and the system includes a beam splitter, a low magnification image capturing device, and a high magnification image capturing device. And an arithmetic module. The beam splitter is disposed above the object to be tested, and the light beams from the object to be tested are divided and respectively performed along one of the first light path and the second light path which are perpendicular to each other. The low magnification imaging device is disposed on the first optical path, and the focus thereof is advanced along the first optical path and sequentially captures a plurality of large-scale planar images of each elevation position. The high 6 1286197 two-level image capturing device is disposed on the second optical path, and the focus can be along the second light to sequentially capture a plurality of partial planar images of each elevation position. Operation: the group is connected to the low-magnification and high-magnification imaging device, and according to the image capturing device, the best focus plane image of at least one object to be tested is measured, and the surface of the object to be tested is different Elevation information. The two-dimensional/three-dimensional synchronous imaging method of the present invention comprises the following steps:
(A) 使來自一待測物的光束透過一分光鏡而分光，並 刀別沿相i垂直之—第_光路與_第二光路進行。 (B) 使一低倍率取像裝置設於該第一光路上，並使其 焦點沿該第—光路前進並依序擷取多張各高程位置的大範 圍平面影像。 (C)使一高倍率取像裝置設於該第二光路上，並使其 焦點沿該第二光路前進並依序操取多張各高程位置的局部 平面影像。 (D)依據該等取像裝置所擷取影像偵測出至少一該待 測物之最佳對焦平面影像，同時推算該待測物表面之高程 資訊。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配a參考圖式之二個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 蒼閱圖1，本發明二維/三維同步取像系統2是針對一 7 128.6197 ' #測物3取得其最佳對焦平面影像並同時建立三維高度資 • 訊。在本實施例之待測物3是以-液晶顯示板（LCD)之玻 璃基板舉例說明，其表面佈有電路，並且可能殘留有微粒 4其他缺陷。為說明方便起見，以下針對殘留之微粒或其 他不應存在於該基板表面之物或缺陷定義為異物4。透過本 發明’可進行影像檢測及高度分析而明確獲知異物4存在 • 與否，甚至其詳細資訊。 • 該系統2包含一低倍率取像裝置21、一高倍率取像裝 置22、一分光鏡23，及一運算模組24。 分光鏡23設於待測物3上方，使來自待測物3的光束 分歧並分別沿相互垂直之_第_光路31與—第三光路Μ 進行。在此以第—光路31為錯直方向、第二光路32為侧 向舉例說明。 低倍率取像裝置21設於第一光路31丨，其包含相對 距離固定之-普通倍率CCD攝影機2ΐι及—透鏡212，整 • 組裝置21可沿第-光路31位移同時以固定之正常焦距擷 取〜像。普通倍率CCD攝影機211可視範圍（f〇v)較大（ 例如3随）同時景深也較大（例如〜m)，因此可操取較大 範圍的平面影像。然而，低倍率取像裝置21並不以固定焦 距且可整組位移者為限’只要可使其焦點沿該第一光路Μ 依序擷取平面影像即可。 ^口率取像裝置22設於第二光路32 i，包含相對距 口定之同七率CCD攝影機221及一透鏡222，整組裝 可&第一光路32位移同時以固定淺焦距擷取影像。 8 ^286197 阿倍率CCD攝影機221可視範圍鲈 景深極小（例如（例如〇·5麵)且同時 。同檨妯丄古 適口擷取局部範圍的平面影像 J樣地，向率取像裝置22 者為限，只要可祛苴隹朴、不以固疋焦距且可整組位移 面影像即可。心m路前進並依序摘取平 =組24與該低倍率、高倍率取像裝置21 多種運:::包括影像頻譜分析、推算高程、整合影像等 夕種運异功能，詳細說明於下文。 冬寸 同時參閱圖2、圖3、n ς ,, 方法ϋ ^ 毛明二維/三維同步取像 万法之弟一較佳實施例執行之 過該待測物3，該實__^ 事先王面性概略檢測 ^ ^ ^ 、 十對雨要詳細檢測的部位，可快速 取得所需資訊，其步驟如下·· j厌逑 步驟51—在該待測物3 μ ^ 標定參考點。 ’針對需要—測的部位 步驟52—使低、高倍率取 接著同步進行步驟531、53^ 22對轉考點。 步驟别-低倍率取像袭置21沿第—光路 以30/sec頻率取像。 砂勒卫 步驟知-由於高倍率取像裝置22景深 以小距離的移動量密集的高速掏取影像二 像裝置22同步沿第二光路 〜仏羊取 吟移動，並以1〇〇/sec頻 像。在此取像頻率乃舉例1日 ^ 1 J η兄明，不以此為限，惟 像裝置22取像頻率應比低倍率取像裝置21密集。 步驟54—運算模組24接 接收步驟531、532所擷取之影 1286197 像貝料。由於若是取像裝置21、22取像時焦點恰好對到待 /物3或異物4表面，即正確成像，則此處的頻譜分析可 侍到特別強的訊號，藉此可篩選得最佳對焦影像，並配合 像田時取像裝置21、22對應的位置及焦距，可推算出待 】物3或異物4表面之高程資訊。 ^驟55—利用步驟54所推算得知的高程，可定義出一 祆實貝上一致之參考面，及一高程明顯有別於參考面之(A) The light beam from an object to be tested is split by a beam splitter, and the knife is moved along the phase i--the optical path and the second light path. (B) A low-magnification image capturing device is disposed on the first optical path, and the focus is advanced along the first optical path, and a plurality of large-range planar images of the respective elevation positions are sequentially captured. (C) A high-magnification image capturing device is disposed on the second optical path, and the focus is advanced along the second optical path, and a plurality of partial planar images of the respective elevation positions are sequentially processed. (D) detecting at least one of the best focus plane images of the object to be tested according to the image captured by the image capturing device, and estimating the elevation information of the surface of the object to be tested. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the accompanying drawings. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to Figure 1, the two-dimensional/three-dimensional synchronous imaging system 2 of the present invention obtains the best focus plane image for a 7 128.6197 '# object 3 and simultaneously establishes a three-dimensional height information. The object to be tested 3 in the present embodiment is exemplified by a glass substrate of a liquid crystal display panel (LCD), the surface of which is provided with an electric circuit, and other defects of the particles 4 may remain. For convenience of explanation, the following objects or defects which are residual particles or other substances which should not be present on the surface of the substrate are defined as foreign matter 4. Through the present invention, it is possible to perform image detection and height analysis to clearly know whether the foreign matter 4 exists or not, or even its detailed information. • The system 2 includes a low magnification imaging device 21, a high magnification imaging device 22, a beam splitter 23, and an arithmetic module 24. The beam splitter 23 is disposed above the object to be tested 3, so that the light beams from the object to be tested 3 are divergent and are respectively performed along the mutually perpendicular _th optical path 31 and the third optical path 。. Here, the first optical path 31 is in the wrong direction and the second optical path 32 is shown as an example. The low-magnification image capturing device 21 is disposed on the first optical path 31A, and includes a normal-magnification CCD camera 2ΐ and a lens 212, and the entire device 21 can be displaced along the first optical path 31 while being fixed at a normal focal length. Take ~ like. The ordinary magnification CCD camera 211 has a large visible range (f〇v) (for example, 3) and a large depth of field (for example, ~m), so that a wide range of planar images can be handled. However, the low-magnification image capturing device 21 is not limited to a fixed focal length and can be set as a whole as long as the focus can be sequentially taken along the first optical path. The mouth rate image capturing device 22 is disposed on the second optical path 32 i, and includes a CCD camera 221 and a lens 222 which are opposite to each other. The first assembly and the first optical path 32 are displaced and the image is captured at a fixed shallow focal length. 8 ^286197 A-capacity CCD camera 221 visible range 极 very small depth of field (for example (〇 5 · 5 faces) and at the same time. With the same level of the local area of the plane image J sample, the rate of image capture device 22 Limit, as long as it can be simple, not fixed by the focal length and can be a complete set of displacement surface images. The heart m road advances and sequentially picks up the flat = group 24 and the low magnification, high magnification imaging device 21 ::: Includes image spectrum analysis, estimated elevation, integrated image, etc., as detailed below. Winter inch also refers to Figure 2, Figure 3, n ς, method ϋ ^ Mao Ming 2D / 3D synchronization The preferred embodiment of the method is executed by the object to be tested 3, and the actual __^ is preliminarily scanned for the ^^^, and the parts of the ten pairs of rain to be detected in detail can quickly obtain the required information. The steps are as follows: · j 逑 step 51 - calibrate the reference point at 3 μ ^ of the object to be tested. 'Target step 52 for the need-measurement--take the low and high magnifications to follow the steps 531, 53^22 Test point. Steps - low magnification take image 21 along the first - optical path at 30 / sec frequency The procedure of the sander is known as a high-speed image capturing device 22 with a small depth of movement of the high-magnification image capturing device 22, and the image capturing device 22 is synchronously moved along the second light path to the 仏 吟 ,, and at 1 〇〇 / sec. In this case, the image capturing frequency is an example of 1 day ^ 1 J η brother, not limited to this, the image capturing frequency of the image device 22 should be denser than that of the low magnification image capturing device 21. Step 54 - The computing module 24 is connected The image 1286197 captured by the steps 531, 532 is received. If the focus of the image capturing device 21, 22 is just right to the surface of the object 3 or the foreign object 4, that is, the image is correctly imaged, the spectrum analysis here may be Serving a particularly strong signal, the best focus image can be screened, and the position and focal length of the image capturing device 21, 22 can be used to calculate the elevation information of the surface of the object 3 or the foreign object 4. ^ Step 55—Using the elevation calculated by step 54 to define a uniform reference surface on a solid shell, and an elevation is clearly different from the reference surface.
"物面。當然，若待測物3表面因線路而有些不平整，則 其起伏落差在此一列入考量。 步驟56-整合低倍率取像裝置21所擷取參考面的最佳 對面影像，與高倍率取像裝置22所擷取該異物位置之 局部二維高度資訊，顯示為三維影像。 步騾57—輸出上述整合影像8。 藉由上述裝i 2及方法，在檢測作業中可快速地一次 取得平面影像及高精度的三維高度資訊，極為方便、有效 、、同時參閱圖2、圖4、圖5,本發明二維/三維同步取像 方^之第二較佳實施例與第_較佳實施例之差異，在於本 實加例主要是在概略檢測過程中若發現需要詳細檢測的部 位· 了進仃切換而取得高精度的三維高度資訊，其步驟如 沿第一光路31移動同 步驟61 —使低倍率取像裝置2工 時以30/sec頻率取像。 利用前述頻譜分 v驟62運算模組24針對取得影像 10 1286197 析技術偵測待測物3表面之高程。 步驟63—定義—矣土 / 我參考面與一異物面（細節參考步驟55 )° 步驟64—計算參考面與異物面之高程差。 步驟65—判斷高程差是否落入一預定之異常範圍，誃 章色圍的界定乃依妳緣土 ^ 、…驗去則決定。若落入該異常範圍，則進 行步驟66,否則則進行步驟65〇結束。 、 步驟66—標定異物面位置為參考點。 步驟67-使高倍率取像裝置22對準該參考點。 步驟68—使高倍率取像裝置22沿第二光路32移動同 時以100/sec頻率密集取像。 步驟69—整合參考面的最佳對焦平面影像與異物位置 之局部3D影像（細節參考步驟兄）。 步驟70—輸出上述整合影像8。 本發明不限於上述實施例之檢測對象，由於其無須如 同習知技術分二次進行取像檢測，因此具有減少與時間有 關的二維及三維特性變異干擾的特性，可適用於如生^觀 察之應用。此外，也由於本發明一次取得普通精度較大視 野範圍的平面資訊以及高精度三維量測，更可達到機構相 對精度的要求，確實可達到本發明高效率、高精度之目的 〇 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 11 屬本發 明專利涵蓋之範圍内 圖式簡單說明】 圖1是-習知取像裝置的示意圖. 圖;是是―本本::二維/，步_^ 3疋一本發明二維/三 圖3是太菸日日一、’、5步取像系統之示意圖; 例之流程圖本發明二維/三維同步取像方法第-較佳實施 β疋本發明-維’三維同步取像第二較佳實施例之流 私圖；及 圖5疋利用本發明取得之平面影像及局部三維影像。"object. Of course, if the surface of the object to be tested 3 is somewhat uneven due to the line, its fluctuation is considered here. Step 56 - Integrate the optimal opposite image of the reference surface captured by the low magnification imaging device 21, and the local two-dimensional height information of the foreign object position captured by the high magnification imaging device 22, and display it as a three-dimensional image. Step 57 - Output the above integrated image 8. With the above-mentioned device 2 and the method, the planar image and the high-precision three-dimensional height information can be quickly obtained in the detection operation, which is extremely convenient and effective, and at the same time, referring to FIG. 2, FIG. 4 and FIG. 5, the present invention is two-dimensional/ The difference between the second preferred embodiment of the three-dimensional synchronous image capture unit and the first preferred embodiment is that the actual addition example is mainly found in the rough detection process if a part requiring detailed detection is obtained. The accuracy of the three-dimensional height information, the steps of which are moved along the first optical path 31 as in the step 61 - the low magnification imaging device 2 is operated at a frequency of 30/sec. Using the aforementioned spectrum division, the operation module 24 detects the elevation of the surface of the object to be tested 3 for the acquired image 10 1286197. Step 63—Define—Aluminum/My reference surface and a foreign object surface (see step 55 for details) ° Step 64—Calculate the elevation difference between the reference surface and the foreign object surface. Step 65—Determine whether the elevation difference falls within a predetermined abnormal range, and the definition of the color range is determined according to the edge of the soil ^, .... If it falls within the abnormal range, step 66 is performed; otherwise, step 65 is ended. Step 66—Calibrate the position of the foreign object as a reference point. Step 67 - Align the high magnification imaging device 22 to the reference point. Step 68 - The high magnification image capturing device 22 is moved along the second optical path 32 while taking images intensively at a frequency of 100/sec. Step 69—Integrate the best focus plane image of the reference plane and the local 3D image of the foreign object position (details refer to the step brother). Step 70 - Output the above integrated image 8. The present invention is not limited to the detection object of the above embodiment, and since it does not need to perform the image capturing detection twice as in the prior art, it has the characteristics of reducing the time-dependent two-dimensional and three-dimensional characteristic variation interference, and is applicable to the observation of the life. Application. In addition, since the present invention achieves the flat information of a large precision and a high-precision three-dimensional measurement at a time, the relative accuracy of the mechanism can be achieved, and the high efficiency and high precision of the present invention can be achieved. The present invention is only a preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are still 11 genus. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional image capturing device. FIG. 1 is a book: a two-dimensional/step _^ 3 疋 a two-dimensional/three-dimensional image of the invention It is a schematic diagram of a smoked day, a '5-step image capturing system; a flow chart of the present invention. The two-dimensional/three-dimensional synchronous image capturing method of the present invention is the first preferred embodiment of the present invention. A flow chart of a preferred embodiment; and Figure 5: a planar image and a partial three-dimensional image obtained by the present invention.
12 1286197 【主要元件符號說明】 2 · · · · 二維/三維同步取像系統 3 · · · · 21 ··· 低倍率取像裝置 31· · · · 211 · · 普通倍率CCD攝影機 32· · · · 212、222 透鏡 4 · · · · 22 · · · 高倍率取像裝置 51〜57 · 221 · · 高倍率CCD攝影機 61〜70 · 23 · · ·分光鏡 8 · · · · 24 · · · 運算模組 待測物 第一光路 第二光路 異物 步驟 步驟 整合影像12 1286197 [Description of main component symbols] 2 · · · · 2D/3D synchronous image capture system 3 · · · · 21 ··· Low magnification image capture device 31 · · · · 211 · · Normal magnification CCD camera 32 · · · 212, 222 Lens 4 · · · · 22 · · · High-magnification imaging device 51~57 · 221 · · High-magnification CCD camera 61~70 · 23 · · · Beam splitter 8 · · · · 24 · · · Operation module test object first optical path second optical path foreign matter step step integration image
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