1270203 ， 九、發明說明 【發明所屬之技術領域】 本發明係有關於一種影像感測模組之封裝結構和方 法，特別是有關於一種具有平行對位之影像感測模組的封褒 結構與方法。 【先前技術】 #參知第1圖，係綠示習知之影像感測模組封裝結構的 剖面示意圖，其主要包含有基板10、影像感測單元（CM〇s Chip ) 20以及鏡片模組（Lens Module) 30。其中基板 係印刷電路板，具有第一面12和與第一面12相對之第二面 14,第一面12上設置有複數個電路接點16。影 20配置於基板10的第一面12上，並藉由複數條導線22電 性連接至基板10之電路接點16。鏡片模組3〇配置於基板 10的第一面12上，其係具有鏡筒（b_1)32、鏡座（H〇lder) 34、鏡片（Lens) 36、紅外線濾光片（IRFiher) 38和容置 室55。影像感測單元20以及鏡片模組3〇係用黏膠5〇分別 固定於基板10上，且鏡片模組30之容置室55整個包覆影 像感測單元20以保護其不受外界顆粒的污染和透光的干 擾0 上述習知之影像感測模組結構的封裝方法係先用黏膠 50將影像感測單元20黏結固定於基板1〇上，烘烤黏膠5〇 之後再打導線22以電性連接至基板1〇上的電路接點16, 接著，再用黏膠50將鏡片模組3〇黏點固定於基板ι〇上。 5 1270203 由於在上膠黏貼的製程中，影像感測單元2〇以及鏡片模組 3〇中之鏡片36會相對於基板1G產生傾斜（勘）。一般來 說’ 百萬晝素的產品其傾斜角度需控制在G5度，而更 高畫素的產品則需控制的更嚴謹。在影像感測模組之封裝製 私中黏貼固疋影像感測單元2〇時便在影像感測單元 ，、基板10之間產生了第一次的傾斜，之後在鏡片模組 安裝黏貼的過程中，鏡片36相對於基板1〇又產生了第二次 的傾斜’兩次傾斜誤差所累積起來的誤差便會相#的大且難 以控制。所以影像感測單元2〇與鏡片模組3〇之鏡片％之 間無法達到準確的平行對位，因此影# f彡像感測的品質。是 故，知之影像感測模組結構之封裝方法有非常嚴重的良率 門題（Yield Loss )’其係在於影像品冑（即解析度，mtf ) 無法符合要求。 ^因此，非常需要一種改進的影像感測模組之封裝結構與 製以方法，來解決影像感測單元與鏡片模組在黏貼安裝於基 板的過程中所產生的傾斜問題，以達到提升影像感測品質與 製程良率的目的。 【發明内容】 士本發明之一目的係在於提供一種影像感測模組之封裝 、、。構藉以安裝等局度結構於影像感測單元與鏡座之内面之 間使衫像感測單元與鏡片模組之鏡片之間實質地保持相等 間隔’達到平行對位的目的，就可以解決影像感測品質不佳 的問題。 6 1270203 月的另一目的就是提供一種影像感測模組之封裝 /法’鏡片模組在安裝時不再以基板為封襞基準面，而改以 :像感利單為封裝基準面，藉以使鏡片模組之鏡片實質地 -，平订於影像感測單元，可大幅提高製造的良率和降低生產時 間與成本。 ^ ^粑據本發明上述之目的，提出一種影像感測模組之封裝 $其至少包含基板、影像感測單元、鏡片模組以及等高 Φ 冓八中基板上設置有複數個電路接點，影像感測單元 \於基板上並電性連接至基板上的電路接點，鏡片模組安裝 於基板上，#高度結構安裝於影像感測單元與鏡片模級之鏡 ^的内面之間’且等高度結構之二端分別垂直接觸影像感測 單元與鏡座之内面藉以使鏡片模組之鏡片實質地平行於影 像感測單元。 / 根據本發明上述之目的，提出一種影像感測模組之封裝 方法其步驟至少包含提供一基板，其上形成有複數個電路 接點^固定影像感測單元於基板上，其中影像感測單元上形 響成有等高度結構，並電性連接至基板上之電路接點以及固定 : 鏡片模組於基板上，其中鏡片模組之内面垂直接觸等高度結 ： 構之一端藉以使鏡片模組之鏡片實質地平行於影像感測單 元。 根據本發明上述之目的，提出另一種影像感測模組之封 裝方法，其步驟至少包含提供一基板，其上形成有複數個電 路接點’固定影像感測單元於基板上，其中影像感測單元電 性連接至電路接點，以及固定鏡片模組於基板上，其中鏡片 7 1270203 模組之内面形成有等高度結構可垂直接觸影像感測單元藉 以使鏡片模組之鏡片實質地平行於影像感測單元。 " 依照本發明一較佳實施例，上述之影像感測單元例如為 互補式金氧半導體（CM0S)或電荷耦合元件（ccd)。 依照本發明一較佳實施例，上述之等高度結構例如為二 個金屬凸塊、三個金屬凸塊、一環狀結構…方框結構、二 個頂塊或三個頂塊。 一1270203, IX. Description of the Invention [Technical Field] The present invention relates to a package structure and method for an image sensing module, and more particularly to a sealing structure and a parallel sensing image sensing module method. [Prior Art] # 知知图1 is a schematic cross-sectional view of a green sensing conventional image sensing module package structure, which mainly includes a substrate 10, an image sensing unit (CM〇s Chip) 20, and a lens module ( Lens Module) 30. The substrate is a printed circuit board having a first surface 12 and a second surface 14 opposite the first surface 12. The first surface 12 is provided with a plurality of circuit contacts 16. The shadow 20 is disposed on the first side 12 of the substrate 10 and is electrically connected to the circuit contacts 16 of the substrate 10 by a plurality of wires 22. The lens module 3 is disposed on the first surface 12 of the substrate 10, and has a lens barrel (b_1) 32, a lens holder 34, a lens (Lens) 36, an infrared filter (IRFiher) 38, and The accommodation room 55 is accommodated. The image sensing unit 20 and the lens module 3 are respectively fixed on the substrate 10 with the adhesive 5, and the housing chamber 55 of the lens module 30 entirely covers the image sensing unit 20 to protect it from external particles. The interference of the image and the light transmission of the above-mentioned image sensing module structure is as follows: the image sensing unit 20 is first adhered to the substrate 1 by the adhesive 50, and the adhesive is glued 5 times and then the wire 22 is applied. The circuit module 16 is electrically connected to the circuit board 1 on the substrate 1 , and then the lens module 3 is adhered to the substrate ι by the adhesive 50 . 5 1270203 Due to the sizing process, the image sensing unit 2 and the lens 36 in the lens module 3 are tilted relative to the substrate 1G. Generally speaking, the product of 'Millions of Foods' needs to be controlled at G5 degrees, while the higher quality products need to be controlled more rigorously. When the image sensing unit 2 is adhered to the image sensing module, a first tilt is generated between the image sensing unit and the substrate 10, and then the film module is attached and pasted. In the middle, the lens 36 has a second tilt with respect to the substrate 1'. The error accumulated by the two tilt errors is large and difficult to control. Therefore, the image sensing unit 2 无法 and the lens module 3 〇 lens % can not achieve accurate parallel alignment, so the shadow # 彡 image sensing quality. Therefore, the packaging method of the known image sensing module structure has a very serious yield problem (Yield Loss), which is because the image quality (ie, resolution, mtf) cannot meet the requirements. Therefore, there is a great need for an improved image sensing module package structure and manufacturing method to solve the tilt problem caused by the image sensing unit and the lens module in the process of being attached to the substrate, so as to enhance the image sense. The purpose of measuring quality and process yield. SUMMARY OF THE INVENTION One object of the present invention is to provide a package for an image sensing module. The image can be solved by installing an equal-degree structure between the image sensing unit and the inner surface of the lens holder so that the lens image sensing unit and the lens of the lens module are substantially equally spaced apart to achieve parallel alignment. Sensing the problem of poor quality. 6 Another purpose of 1270203 is to provide a package/method for image sensing module. The lens module no longer uses the substrate as the sealing reference surface during installation, but instead: the sensory single is the package reference surface. By substantially aligning the lens of the lens module with the image sensing unit, the manufacturing yield can be greatly improved and the production time and cost can be reduced. According to the above object of the present invention, a package of an image sensing module is provided. The package includes at least a substrate, an image sensing unit, a lens module, and a contour Φ. The substrate is provided with a plurality of circuit contacts. The image sensing unit is electrically connected to the circuit contacts on the substrate, the lens module is mounted on the substrate, and the #height structure is mounted between the image sensing unit and the inner surface of the lens of the lens module. The two ends of the equal height structure respectively vertically contact the image sensing unit and the inner surface of the lens holder such that the lens of the lens module is substantially parallel to the image sensing unit. According to the above object of the present invention, a method for packaging an image sensing module includes at least providing a substrate on which a plurality of circuit contacts are formed, and the image sensing unit is fixed on the substrate, wherein the image sensing unit The upper surface is twisted into an equal height structure and electrically connected to the circuit contacts on the substrate and fixed: the lens module is on the substrate, wherein the inner surface of the lens module is vertically contacted with a height knot: one end of the structure is used to make the lens module The lens is substantially parallel to the image sensing unit. According to the above object of the present invention, another method for packaging an image sensing module is provided, the method comprising at least providing a substrate, wherein a plurality of circuit contacts are formed on the fixed image sensing unit on the substrate, wherein the image sensing is performed. The unit is electrically connected to the circuit contact, and the fixed lens module is mounted on the substrate, wherein the inner surface of the lens 7 1270203 is formed with an equal height structure to vertically contact the image sensing unit so that the lens of the lens module is substantially parallel to the image. Sensing unit. " In accordance with a preferred embodiment of the present invention, the image sensing unit is, for example, a complementary metal oxide semiconductor (CMOS) or a charge coupled device (ccd). In accordance with a preferred embodiment of the present invention, the above-described equal height structures are, for example, two metal bumps, three metal bumps, a ring structure, a square structure, two top blocks, or three top blocks. One
依照本發明一較佳實施例，上述之等高度結構例如是形 成在影像感測單元上或鏡片模組上。 ^ 依照本發明-較佳實施例，上述之等高度結構例如是使 用射出成型法、印刷法或電鍍法所形成的。 應用上述影像感測模組之封裝結構，由於是藉由安裝一 :高度結構’使影像感測單元與鏡片模組之鏡片之間始終能 κ質地保持相等的間隔，達到平行對位的目的，就可 影像感測品質不佳的問題。此外，在影像感測模組進行电裝 時’由於鏡片模組不再是以基板為封裝基準面，而改以_ 感測單兀為封裝基準面， ' ^ ^, 此Γ確保鏡片模組之鏡片能實質 地平行於影像感測單元，故可大 貰質 產時間與成本。所以本發明與其它習率= 用的方法不僅可解決影像感測品質不佳的問： 製造的時間及Μ。 $大怜降低 【實施方式】 在此實施例中，揭露一種影像感測模組 ”、包含基板、影像感測單元、鏡片模〜等：度t構: 8 1270203 其中基板上設置有複數個電路接點，影像感測單元位於基板 上並電性連接至基板上的電路接點，鏡片模組安裝於基板 上’等高度結構安裝於影像感測單元與鏡片模組之鏡座的内 面之間，且等高度結構之二端分別垂直接觸影像感測單元與 鏡座之内面藉以使鏡片模組之鏡片實質地平行於影像感測 〇〇 一 早兀。 請參閱第2圖’係％示根據本發明之一較佳實施例之影 像感測模組封裝結構的剖面示意圖。影像感測模組封裝結構 至少包含基板110、影像感測單元12〇、鏡片模組130以及 等高度結構1 60。其中基板丨丨〇係印刷電路板，具有第一面 112以及與第一面112相對之第二面114，第一面Π2上設 置有複數個電路接點11 6。影像感測單元120，例如互補式 金氧半導體或是電荷偶合元件，配置於基板11〇的第一面 11 2上，藉由複數條導線1 22電性連接至基板1丨〇上之電路 接點116以及使用黏膠150將其黏貼固定於基板11〇上。鏡 片模組130 ’其至少包含鏡座134、鏡片136以及紅外線濾 光片138’配置於基板11〇的第一面η?上。其中鏡座134 具有上端面142、下端面144以及由上端面142貫通至下端 面144之容置室155,鏡座ι34之容置室155内形成有一内 面135平行於上端面142與下端面144,鏡片136與紅外線 濾光片138係平行於内面135且分別安裝於鏡座134之容置 室155内’如第2圖所繪示。將鏡片模組13〇安裝於基板 110時，係利用黏膠150將鏡座134之下端面144黏貼固定 於基板110上，且將鏡座134之容置室155整個包覆影像感 測單兀120以保護其不受外界顆粒的污染和透光的干擾。等 1270203 高度結構1 60，其係安梦於与务成 一 衣於衫像感測早TL 120與鏡座134之 内面135之間，等高度钍槿 又…構16〇之一端係分別垂直地接觸影 像感測單元120與鏡座η 4之内面135稭以使鏡片136實質 地平行於影像感測單元12〇。 在上述結構中，由於箄古 Μ έθ ^ ^ ^ , 、專冋度、，、口構160的存在，使得鏡片 模組13 0在安裝時不再县 纪饰六r 〇 疋乂基板110為封裝基準面，而是以 衫像感測皁元120為封f其進 玎瑕基旱面，如此一來，可以實質地確 保鏡片模組1 3 0之鏡片n、 現月136與影像感測單元12〇之間且 行對位和相等間隔的笋 /、 ^ u “、、距避免了習知方法中鏡片模組130In accordance with a preferred embodiment of the present invention, the above-described equal height structure is formed, for example, on an image sensing unit or on a lens module. According to the preferred embodiment of the invention, the above-described equal height structure is formed, for example, by injection molding, printing or electroplating. Applying the package structure of the image sensing module, since the height of the image sensing unit and the lens of the lens module are always maintained at equal intervals between the image sensing unit and the lens module, the parallel alignment is achieved. The problem of poor image quality can be detected. In addition, when the image sensing module is electrically mounted, 'because the lens module is no longer based on the substrate as the package reference surface, the _ sensing unit is used as the package reference surface, ' ^ ^, which ensures the lens module The lens can be substantially parallel to the image sensing unit, so that the production time and cost can be greatly increased. Therefore, the present invention and other methods of use = not only solve the problem of poor image sensing quality: manufacturing time and flaws. In the embodiment, an image sensing module is disclosed, including a substrate, an image sensing unit, a lens module, and the like: a degree t structure: 8 1270203, wherein a plurality of circuits are disposed on the substrate The image sensing unit is disposed on the substrate and electrically connected to the circuit contact on the substrate, and the lens module is mounted on the substrate. The height structure is installed between the image sensing unit and the inner surface of the lens holder lens assembly. And the two ends of the equal height structure respectively vertically contact the image sensing unit and the inner surface of the lens frame so that the lens of the lens module is substantially parallel to the image sensing 〇〇 early morning. Please refer to FIG. 2 A schematic diagram of a package structure of an image sensing module according to a preferred embodiment of the present invention. The image sensing module package structure includes at least a substrate 110, an image sensing unit 12, a lens module 130, and an equal height structure 160. The substrate 印刷-type printed circuit board has a first surface 112 and a second surface 114 opposite to the first surface 112. The first surface Π 2 is provided with a plurality of circuit contacts 11 6 . The image sensing unit 120 For example, a complementary MOS or a charge-coupled component is disposed on the first surface 11 2 of the substrate 11 , electrically connected to the circuit contacts 116 on the substrate 1 by using a plurality of wires 1 22 , and using the adhesive The lens module 130' has at least a lens holder 134, a lens 136, and an infrared filter 138' disposed on the first surface η of the substrate 11A. The lens holder 134 has The upper end surface 142, the lower end surface 144, and the accommodating chamber 155 extending from the upper end surface 142 to the lower end surface 144, the inner surface 135 of the lens housing 135 is formed parallel to the upper end surface 142 and the lower end surface 144, the lens 136 and the infrared ray The filter 138 is parallel to the inner surface 135 and is respectively mounted in the accommodating chamber 155 of the lens holder 134 as shown in Fig. 2. When the lens module 13 is mounted on the substrate 110, the mirror is applied by the adhesive 150. The lower end surface 144 of the seat 134 is adhered and fixed to the substrate 110, and the housing chamber 155 of the lens holder 134 is entirely covered with the image sensing unit 120 to protect it from external particles and light interference. 1270203 Height Structure 1 60, which is a dream in the shirt Between the early TL 120 and the inner surface 135 of the lens holder 134, one end of the height 钍槿 ... ... 〇 垂直 垂直 垂直 垂直 垂直 垂直 垂直 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 136 136 136 136 Parallel to the image sensing unit 12 〇. In the above structure, due to the existence of the έ Μ θ ^ ^ ^ , the degree of specialization, and the mouth structure 160, the lens module 130 is no longer in the county when installed. The hexa r 〇疋乂 substrate 110 is a package reference surface, and the smear-like sensing soap element 120 is used as a sealing surface, so that the lens of the lens module 130 can be substantially ensured. n, the current month 136 and the image sensing unit 12 且 between the row and the equally spaced bamboo shoots, ^ u ", distance from the conventional method of the lens module 130
之鏡片136與影像4、、目,丨g tΛ Q 心’、】早το 120之間會有傾斜的問題。此 外在本具&例中’等冑度結構16〇係利用凸塊製程 ( B^mpingProcess)，例如印刷法或電錄法，形成在影像感 測早兀12 0上的二個金麗 盔屬凸塊（Bump )或三個金屬凸塊之 結構，另一種選擇是，蓉古许处 评疋寺同度結構160也可以是利用射出成 型法直接形成在鏡座】^4 度134之内面135上的一環狀結構、一方 框結構、二個頂塊或個 榮古危& 4 〜一丨LJ J貝塊，換吕之，等咼度結構1 6〇 與鏡座134係一體成型。 明參閱第3圖’其係繪示根據本發明之另一較佳實施例 之衫像感測模組封農結構的剖面示意圖。影像感測模級封裝 釔構，二包合基板31〇、影像感測單元32〇、鏡片模組 以及等局度結構360。其中基板31〇係印刷電路板，具有第 一面312以及與第一面312相對之第二面314，第一面312 上e又置有後數個電路接點31 6以及定位孔31 8。影像感測單 元3 20例如互補式金氧半導體或是電荷偶合元件，配置於 基板31G的第-面312上，藉由複數條導線322電性連接至 10 1270203 基板31 0上之電路接點31 6以及使用黏膠3 5 〇將其黏貼固定 於基板310上。鏡片模組330，其係至少包含有鏡筒332、 鏡座334、鏡片336、紅外線濾光片338以及複數個定位銷 340，配置於基板310的第一面312上，其中鏡座334具有 上端面3 42、下端面3 44以及由上端面3 42貫通至下端面344 之容置室355,鏡座334之容置室355内形成有一内面335 平行於上端面342與下端面344,鏡筒332係由鏡座334之 上端面342容置安裝於鏡座334之容置室3 55内，鏡片336 女裝於鏡筒332之貫通之容室357内並且平行於鏡座334 之内面335，紅外線渡光片338係也平行於内面335且安裝 於鏡座334之容置室355内，複數個定位銷34〇係設置於鏡 座334之下端面344上。將鏡片模組33〇安裝於基板31〇 時，係利用定位銷340插入基板310上的定位孔318來進行 定位接合，接著用黏膠350將鏡座334之下端面3料黏貼固 定於基板310上，且將鏡座334之容置室355整個包覆影像 感測單元320以保護其不受外界顆粒的污染和透光的干 擾。等高度結構360,其係安裝於影像感測單元32〇與鏡座 334之内面335之間，等高度結構36〇之二端係分別垂直接 觸影像感測單元320與鏡座334之内面335藉以使鏡片3刊 實質地平行於影像感測單元320。在上述結構中，由於等高 度結構360的存在，使得鏡片模組33〇在安裝時不再是以2 板3 1 0為封裝基準面，而是以影像感測單元為封裝基準 面，如此一來，可以實質地確保鏡片模組33〇之鏡片 與影像感測單元320之間具有平行對位和相等間隔的焦 11 1270203 距’避免了習知方法中鏡描4 ， 片槟組330之鏡片336與影像感測 早元320之間會有傾斜的問題。此外，在本實施例中，等高 度結構360係利用凸塊製靼，y ^ 尤i，例如印刷法或電鍍法，形成在 影像感測單元320丨的二個金屬凸塊或三個金屬凸塊之結 構，另-種選擇是，等高度結構36〇也可以是利用射出成型 法直接形成在鏡座334之内面335上的-環狀結構、一方框 結構、二個頂塊或三個頂塊’換言之，等高度之結構360 與鏡座334係一體成型。 請參閱第3圖，料示根據本發明之另—較佳實施例之 影像感測模組封裝結構的剖面示意圖。此影像感測模組封裝 結構之製造方法，包含以下步驟：首先，提供一基板η。， 此基板310上具有第一面312以及與第一面312相對之第二 面314’在第一面312上形成有複數個電路接點316以及定 位孔318 ;接著，固定影像感測單元32〇於基板3ι〇的第一 面312上，在本實施例中，係使用黏膠35〇將影像感測單元 320黏貼固定於基板31〇上，烘烤之後再打導線322以電性 連接至基板310上之電路接點316，其中此影像感測單元32〇 上形成有一等高度結構360，在本實施例中，此等高度結構 360可以是以凸塊製程的方法，例如印刷法或電鍍法，形成 的凸塊結構，例如是銅柱塊（Cu piUar)或銅凸塊，其數量 至少包含有二個或三個；接著，固定鏡片模組33〇於基板 3 10上，以完成影像感測模組之封裝結構，其中此鏡片模組 330包含鏡筒332、鏡座334、鏡片336、紅外線濾光片338 以及複數個定位銷340。另外，此固定鏡片模組33〇的步驟 12 1270203 之下端面344的定位銷340插入基板31〇 接著，將鏡座334之内面335垂直地接觸 之最後，再用黏膠350將鏡座334 係先將鏡座3 3 4 上的定位孔3 1 8， 等高度結構360 之下端面344黏貼固定在基板31()上。在本實施例中，鏡座 3+34之内面335垂直地接觸到等高度結構36〇之後才上膠固 疋鏡片模組330’所以鏡片模組33〇實際上是以影像感測單 凡320/為封裝基準面來進行組裝，兩者之間因等高度結構 360而形成平行對位’此時就算先前固定影像感測單元320 於基板300上的過程中，影像感測單元320相對於基板300 ^生傾斜’也不會影響鏡片模組330之鏡片336與影像感測 單元2 2 0之間的平行度，故可有效避免黏結固定製程中所造 成=影像感測品質的下降。所以利用本發明的方法，影像感 測單元320與鏡片模組33〇之鏡片336之間的平行度可以得 到有效的控制’因此可以確保影像感測品質而提升良率。 π參閱第4圖，係繪示根據本發明之又另一較佳實施例 之封裝方法所製得之影像感測模組結構的剖面示意圖。首 先，提供一基板51〇，此基板51〇上具有第一面512以及與 第面512相對之第二面514，第一面512上形成有複數個 電路接點516以及定位孔518。接著，固定影像感測單元52〇 於基板510的第一面512上，在本實施例中，係使用黏膠 55〇將影像感測單元520黏結固定於基板510上，烘烤之後 再打導線522以電性連接至基板510上之電路接點516。接 著固定鏡片模組5 3 0於基板510上，以完成影像感測模組 之封裝結構。其中此鏡片模組530至少包含鏡筒532、鏡座 13 1270203 5 34、鏡片536、紅外線濾光片538、複數個定位銷54〇以及 等高度結構560。另外，此固定鏡片模組53〇的步驟係先將 鏡座534之下端面544的定位銷540插入基板51〇上的定位There is a problem that the lens 136 and the image 4, the mesh, the 丨g tΛ Q heart, and the early το 120 are inclined. In addition, in the present & example, the 'equal structure 16' uses a bump process (B^mpingProcess), such as printing or electro-recording, to form two golden helmets on the image sensing early 120. It is a structure of bumps or three metal bumps. Alternatively, the same structure of 160 can also be directly formed on the mirror base by the injection molding method. A ring structure on the 135, a box structure, two top blocks or a Ronggu dangerous & 4 ~ a 丨 LJ J shell block, for Lu, such as the twist structure 1 6 〇 and the mirror base 134 system . BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a cross-sectional view showing a closure structure of a shirt image sensing module according to another preferred embodiment of the present invention. The image sensing module package structure, the two-package substrate 31, the image sensing unit 32, the lens module, and the equal-degree structure 360. The substrate 31 is a printed circuit board having a first surface 312 and a second surface 314 opposite to the first surface 312. The first surface 312 is further provided with a plurality of circuit contacts 316 and a positioning hole 318. The image sensing unit 3 20 is disposed on the first surface 312 of the substrate 31G, and is electrically connected to the circuit contact 31 on the substrate 31 0 by a plurality of wires 322. 6 and adhesively attaching to the substrate 310 using the adhesive 3 5 〇. The lens module 330 includes at least a lens barrel 332, a lens holder 334, a lens 336, an infrared filter 338, and a plurality of positioning pins 340 disposed on the first surface 312 of the substrate 310. The lens holder 334 has an upper surface. The end surface 3 42 , the lower end surface 3 44 and the accommodating chamber 355 extending from the upper end surface 3 42 to the lower end surface 344, the inner surface 335 of the accommodating chamber 355 of the lens holder 334 is formed parallel to the upper end surface 342 and the lower end surface 344, the lens barrel The 332 is received in the receiving chamber 3 55 of the lens holder 334 by the upper end surface 342 of the lens holder 334. The lens 336 is disposed in the cavity 357 of the lens barrel 332 and parallel to the inner surface 335 of the lens holder 334. The infrared ray 338 is also parallel to the inner surface 335 and is mounted in the accommodating chamber 355 of the lens holder 334. A plurality of positioning pins 34 are disposed on the lower end surface 344 of the lens holder 334. When the lens module 33 is mounted on the substrate 31 , the positioning pin 340 is inserted into the positioning hole 318 of the substrate 310 for positioning and positioning, and then the lower end surface 3 of the lens holder 334 is adhered to the substrate 310 by the adhesive 350 . The imaging chamber 355 of the lens holder 334 is entirely covered with the image sensing unit 320 to protect it from external particles and light. An equal height structure 360 is mounted between the image sensing unit 32 and the inner surface 335 of the lens holder 334. The two ends of the equal height structure 36 are vertically contacted with the image sensing unit 320 and the inner surface 335 of the lens holder 334, respectively. The lens 3 is substantially parallel to the image sensing unit 320. In the above structure, due to the presence of the equi-high height structure 360, the lens module 33 is no longer mounted with the 2 plate 3 10 as the package reference surface, but the image sensing unit is used as the package reference surface. Therefore, it can be substantially ensured that the lens of the lens module 33 and the image sensing unit 320 have parallel alignment and equal spacing of the focal point 11 1270203 distance 'avoiding the conventional method of mirroring 4, the lens of the tablet group 330 There is a problem of tilt between 336 and image sensing early 320. In addition, in the present embodiment, the equal height structure 360 is formed by bumps, y ^ y, such as printing or electroplating, and two metal bumps or three metal bumps formed on the image sensing unit 320 丨The structure of the block, alternatively, the height structure 36〇 may also be an annular structure formed directly on the inner surface 335 of the lens holder 334 by injection molding, a square structure, two top blocks or three tops. In other words, the structure 360 of equal height is integrally formed with the mirror base 334. Referring to FIG. 3, a cross-sectional view of an image sensing module package structure according to another preferred embodiment of the present invention is shown. The manufacturing method of the image sensing module package structure comprises the following steps: First, a substrate η is provided. The first surface 312 of the substrate 310 and the second surface 314 ′ opposite to the first surface 312 are formed with a plurality of circuit contacts 316 and positioning holes 318 on the first surface 312 . Then, the image sensing unit 32 is fixed. On the first surface 312 of the substrate 3 ι, in the embodiment, the image sensing unit 320 is adhered and fixed on the substrate 31 by using the adhesive 35 ,, and then the wire 322 is electrically connected after baking. The circuit contacts 316 on the substrate 310, wherein the image sensing unit 32 is formed with an equal height structure 360. In this embodiment, the height structures 360 may be in a bump process, such as printing or plating. The bump structure is formed, for example, as a Cu piUar or a copper bump, and the number thereof is at least two or three. Then, the fixed lens module 33 is mounted on the substrate 3 10 to complete the image. The package structure of the sensing module, wherein the lens module 330 includes a lens barrel 332, a lens holder 334, a lens 336, an infrared filter 338, and a plurality of positioning pins 340. In addition, the positioning pin 340 of the lower end surface 344 of the step 12 1270203 of the fixed lens module 33 is inserted into the substrate 31. Then, the inner surface 335 of the lens holder 334 is vertically contacted, and then the lens holder 334 is attached by the adhesive 350. First, the positioning hole 3 1 8 on the lens holder 3 3 4 is adhered and fixed to the lower surface 344 of the height structure 360 on the substrate 31 (). In this embodiment, the inner surface 335 of the lens holder 3+34 is vertically contacted with the equal height structure 36〇, and then the lens module 330' is glued. Therefore, the lens module 33 is actually image sensing. /Assembled for the package reference plane, the parallel alignment is formed between the two by the height structure 360. At this time, even if the image sensing unit 320 is fixed on the substrate 300, the image sensing unit 320 is opposite to the substrate. The 300 slanting tilt does not affect the parallelism between the lens 336 of the lens module 330 and the image sensing unit 220, so that the image sensing quality degradation caused by the bonding and fixing process can be effectively avoided. Therefore, by using the method of the present invention, the parallelism between the image sensing unit 320 and the lens 336 of the lens module 33 can be effectively controlled' so that the image sensing quality can be ensured and the yield can be improved. Referring to Fig. 4, there is shown a cross-sectional view showing the structure of an image sensing module manufactured by a packaging method according to still another preferred embodiment of the present invention. First, a substrate 51 is provided. The substrate 51 has a first surface 512 and a second surface 514 opposite to the first surface 512. The first surface 512 is formed with a plurality of circuit contacts 516 and positioning holes 518. Then, the fixed image sensing unit 52 is mounted on the first surface 512 of the substrate 510. In this embodiment, the image sensing unit 520 is bonded and fixed on the substrate 510 by using an adhesive 55, and then the wire is baked. 522 is electrically coupled to circuit contacts 516 on substrate 510. Then, the lens module 530 is fixed on the substrate 510 to complete the package structure of the image sensing module. The lens module 530 includes at least a lens barrel 532, a lens holder 13 1270203 5 34, a lens 536, an infrared filter 538, a plurality of positioning pins 54A, and an equal height structure 560. In addition, the step of fixing the lens module 53 is first to position the positioning pin 540 of the lower end surface 544 of the lens holder 534 into the substrate 51.
孔518，接著，將鏡座534之内面535上的等高度結構56〇 之一端垂直地接觸影像感測單元52〇，最後，再用黏膠55〇 將鏡座534之下端面544黏貼固定在基板51〇上。在本實施 例中，鏡座534之内面535上的等高度結構560垂直接觸到 影像感測單元520之後才上膠固定鏡片模組53〇，所以鏡片 模組530實際上是以影像感測單元52〇為封裝基準面來進行 組裝，而不是以基板510為封裝基準面，所以影像感測單元 5 2 〇與鏡片模組5 3 0之鏡片5 3 6之間的平行度可以得到有效 的控制，因此可以確保影像感測品質而提升良率。在本實施 例中，鏡座534之内面535所形成的等高度結構56〇可以是 採用射出成型法形成的一環狀結構、方框結構、二個 三個頂塊，換言之，等高度結構560與鏡座534係一體成型。 簡言之，本發明之影像感測模組的封裝結構，其特徵在 於設置等高度結構於影像感測單元與鏡座之内面之間，其中 等高度結構之二端係分別垂直地接觸影像感測單元與鏡座 之内面，以使鏡座之内面與影像感測單元之間實質地保持相 等間隔’藉此達到鏡片模組之鏡片實質地平行於影像感測單 元的目的。此外，本發明之影像感測模組的封裝方法，因為 等向度結構的存在’使得鏡片模組在安裝時不再是以美板^ 封裝基準面，而是以影像感測單元為封裝基準自，二此二 來’可確保鏡片模組之鏡片與影像感測單元之間具有平行對 位和實質上相等間隔的焦距，避免了習知方法中鏡片與影像 I27〇2〇3 ^，太°^之間會有傾斜的問題。所以與習知的結構與方法相 間的光學路徑，Hi精確定位鏡片與影像感測單元之 芦 可大幅提升影像感測的品質，降低製程不 印屈:主：且本發明只需利用習知的方法，例如射出成型法、 印刷法或電鍵法，就可以形成等高度結構。 由上述本發明較佳實施例可知’應用本發明之影像感測 •的封裝、構’其優點在於只需加入一等高度結構’即可The hole 518, then, one end of the equal height structure 56〇 on the inner surface 535 of the lens holder 534 is perpendicularly contacted with the image sensing unit 52A, and finally, the lower end surface 544 of the lens holder 534 is pasted and fixed by the adhesive 55〇. The substrate 51 is on the top. In this embodiment, the equi-high height structure 560 on the inner surface 535 of the lens holder 534 is in contact with the image sensing unit 520 and then the lens module 53 is glued, so that the lens module 530 is actually an image sensing unit. 52〇 is the package reference surface for assembly, instead of the substrate 510 as the package reference plane, so the parallelism between the image sensing unit 52 2 and the lens module 5 3 0 of the lens module can be effectively controlled. Therefore, the image sensing quality can be ensured and the yield can be improved. In this embodiment, the equal height structure 56〇 formed by the inner surface 535 of the lens holder 534 may be an annular structure formed by injection molding, a square structure, two three top blocks, in other words, an equal height structure 560. It is integrally formed with the mirror base 534. Briefly, the package structure of the image sensing module of the present invention is characterized in that an equal height structure is disposed between the image sensing unit and the inner surface of the lens holder, wherein the two ends of the equal height structure respectively contact the image sense vertically The inner surface of the measuring unit and the lens holder are such that the inner surface of the lens holder and the image sensing unit are substantially equally spaced apart, thereby achieving the purpose that the lens of the lens module is substantially parallel to the image sensing unit. In addition, the packaging method of the image sensing module of the present invention, because the existence of the isotropic structure is such that the lens module is no longer installed as a reference surface, but the image sensing unit is used as a packaging reference. Since the second, it can ensure that the lens of the lens module and the image sensing unit have parallel alignment and substantially equal spacing, avoiding the lens and image I27〇2〇3 ^ in the conventional method. There will be a problem of tilt between °^. Therefore, with the optical path between the conventional structure and the method, the Hi precise positioning lens and the image sensing unit can greatly improve the quality of the image sensing, and reduce the process without inaccurate: Main: and the present invention only needs to utilize the conventional A method such as an injection molding method, a printing method, or a key method can form an equi-high structure. It will be apparent from the above-described preferred embodiments of the present invention that the package and structure of the image sensing application of the present invention has the advantage that only one height structure can be added.
達到鏡片與影像感測單元之間平行對位的目的，而且本發明 :景:像感測模組的封裝方法，其優點在於只需在生產鏡座之 衣私中改變射出成型模具的設計，或是在製作影像感測單元 的過程中增加凸塊製程，就可以得到精密尺寸的等高度結 構因此本發明之影像感測模組的封裝結構不僅解決了習知 結構在封裝製造過程中所產生傾斜㈣題，更能大幅提高影 像感測的品質及製程良率’進而降低製造的時間、能源和成 本0 雖然本發明已以數個較佳實施例揭露如上，然其並非用 以，定本發明’任何熟習此技藝者，在不脫離本發明之精神 和範圍内’當可作各種之更動與潤飾’因此本發明之保‘範 圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目❸、特徵、和優點能更明顯 易懂’下文特舉一較佳實施例，並s己合所附目式，作細說 明如下： =w 口 第1圖係緣示習知之影像感測模級封裝結構的剖面示 15 1270203 意圖； 第2圖係繪示根據本發明之一較佳實施例之影像感測 椒組封裝結構的剖面示意圖； 第3圖係繪示根據本發明之另一較佳實施例之影像感 測模組封裝結構的剖面示意圖；以及 第4圖係繪示根據本發明之又另一較佳實施例之封裝 方法所製得之影像感測模組結構的剖面示意圖。 【主要元件符號說明】 10 :基板 12 ·第一面 14 :第二面 1 6 :電路接點 20 :影像感測單元 22 :導線 30 ··鏡片模組 3 2 ·鏡筒 34 :鏡座 36 :鏡片 38 :紅外線濾光片 50 :黏膠 55 :容置室 110 :基板 11 2 ··第一面 114 :第二面 11 6 :電路接點 120 :影像感測單元 122 :導線 1 3 0 ·鏡片模組 134 :鏡座 135 :内面 136 :鏡片 138 :紅外線濾光片 142 ·上端面 144 :下端面 150 :黏膠 160 :等高度結構 310 :基板 312 :第一面 16 1270203The purpose of parallel alignment between the lens and the image sensing unit is achieved, and the invention: the method of packaging the image sensing module has the advantage that the design of the injection molding die can be changed only in the production of the lens holder. Or adding a bump process in the process of fabricating the image sensing unit, so that a high-precision structure of a precise size can be obtained. Therefore, the package structure of the image sensing module of the present invention not only solves the problem that the conventional structure is produced in the package manufacturing process. Tilt (4), can greatly improve the quality of image sensing and process yield' and thus reduce the time, energy and cost of manufacturing. Although the present invention has been disclosed above in several preferred embodiments, it is not intended to 'Anyone skilled in the art will be able to make various changes and modifications without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; =w port 1 is a cross-sectional view showing a conventional image sensing module package structure 15 1270203. FIG. 2 is a cross-sectional view showing an image sensing pepper package structure according to a preferred embodiment of the present invention. 3 is a cross-sectional view showing a package structure of an image sensing module according to another preferred embodiment of the present invention; and FIG. 4 is a view showing a package according to still another preferred embodiment of the present invention. A schematic cross-sectional view of the structure of the image sensing module prepared by the method. [Main component symbol description] 10: Substrate 12 · First surface 14 : Second surface 1 6 : Circuit contact 20 : Image sensing unit 22 : Wire 30 · · Lens module 3 2 · Lens barrel 34 : Mirror holder 36 : Lens 38 : Infrared filter 50 : Adhesive 55 : accommodating chamber 110 : Substrate 11 2 · First surface 114 : Second surface 11 6 : Circuit contact 120 : Image sensing unit 122 : Conductor 1 3 0 · Lens module 134: lens holder 135: inner surface 136: lens 138: infrared filter 142 · upper end surface 144: lower end surface 150: adhesive 160: equal height structure 310: substrate 312: first surface 16 1270203
314 :第二面 318 :定位孔 322 :導線 332 :鏡筒 335 :内面 3 3 8 :紅外線濾光片 342 :上端面 3 5 0 :黏膠 357 ··貫通之容室 5 1 0 :基板 51 4 ··第二面 51 8 :定位孔 522 :導線 532 :鏡筒 535 :内面 538 :紅外線濾光片 542 :上端面 550 :黏膠 557 :貫通之容室 31 6 :電路接點 320 :影像感測單元 330 :鏡片模組 334 :鏡座 336 :鏡片 340 :定位銷 344 :下端面 3 5 5 :容置室 360 ··等高度結構 512 :第一面 51 6 :電路接點 520 :影像感測單元 530 :鏡片模組 534 :鏡座 536 :鏡片 540 :定位銷 544 :下端面 555 :容置室 560 :等高度結構 17314 : second surface 318 : positioning hole 322 : wire 332 : lens barrel 335 : inner surface 3 3 8 : infrared filter 342 : upper end surface 3 5 0 : adhesive 357 · · through chamber 5 1 0 : substrate 51 4 ··2nd surface 51 8 : positioning hole 522 : wire 532 : lens barrel 535 : inner surface 538 : infrared filter 542 : upper end surface 550 : adhesive 557 : through chamber 31 6 : circuit contact 320 : image Sensing unit 330: lens module 334: lens holder 336: lens 340: positioning pin 344: lower end face 3 5 5 : accommodation chamber 360 · · equal height structure 512 : first surface 51 6 : circuit contact 520 : image Sensing unit 530: lens module 534: lens holder 536: lens 540: positioning pin 544: lower end surface 555: housing chamber 560: equal height structure 17