TW200709404A - Structure and method for packaging an image sensor module - Google Patents

Structure and method for packaging an image sensor module

Info

Publication number
TW200709404A
TW200709404A TW094128807A TW94128807A TW200709404A TW 200709404 A TW200709404 A TW 200709404A TW 094128807 A TW094128807 A TW 094128807A TW 94128807 A TW94128807 A TW 94128807A TW 200709404 A TW200709404 A TW 200709404A
Authority
TW
Taiwan
Prior art keywords
image sensor
substrate
sensor chip
packaging
lens module
Prior art date
Application number
TW094128807A
Other languages
Chinese (zh)
Other versions
TWI270203B (en
Inventor
Jian-Cheng Chen
Cheng-Wei Huang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094128807A priority Critical patent/TWI270203B/en
Application granted granted Critical
Publication of TWI270203B publication Critical patent/TWI270203B/en
Publication of TW200709404A publication Critical patent/TW200709404A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

A structure for packaging an image sensor module is disclosed. The structure of packing the image sensor module comprises a substrate, an image sensor chip, a lens module and an equal-height structure. A plurality of contacts is disposed on the substrate. The image sensor chip is disposed on the substrate and electrically contacted to the contacts on the substrate. The lens module is disposed on the substrate and the equal-height structure is mounted between the image sensor chip and an inner plane of the holder of the lens module, herein two ends of the equal-height structure respectively and vertically contact to the image sensor chip and the inner plane of the holder, thereby making a len of the lens module parallel the the image sensor chip.
TW094128807A 2005-08-23 2005-08-23 Structure and method for packaging an image sensor module TWI270203B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094128807A TWI270203B (en) 2005-08-23 2005-08-23 Structure and method for packaging an image sensor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094128807A TWI270203B (en) 2005-08-23 2005-08-23 Structure and method for packaging an image sensor module

Publications (2)

Publication Number Publication Date
TWI270203B TWI270203B (en) 2007-01-01
TW200709404A true TW200709404A (en) 2007-03-01

Family

ID=38318579

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128807A TWI270203B (en) 2005-08-23 2005-08-23 Structure and method for packaging an image sensor module

Country Status (1)

Country Link
TW (1) TWI270203B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427392B (en) * 2009-01-09 2014-02-21 Hon Hai Prec Ind Co Ltd Holder, method for making same and camera module having same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427392B (en) * 2009-01-09 2014-02-21 Hon Hai Prec Ind Co Ltd Holder, method for making same and camera module having same

Also Published As

Publication number Publication date
TWI270203B (en) 2007-01-01

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