1266852 九、發明說明： 【發明所屬之技術領域】 本創作紐供電子元件細之餘改& 為主體結構之環路式健馳。 认姻相變潛熱 【先前技術】 一隨著電子資訊產業的快速發展，電子產品釋 ^為使電子元件能夠正常的運作，避免昂貴的電子元件U愈= 對主要雜讀本綠產品祕進行有效且快騎躺。、又而 =顧整個散熱機制及製程，導熱管因體積小、利用相變潛敎作用 ii ίΐ熱^溫度，均勻、構造簡單、重量輕 '無需外加作 ίΓ::ί庵=二ί距傳輸等特性，符合目前電腦散熱模組的 需求’因此被廣泛用来解決散熱問題。 初期大多數減數的電職熱模組，主要係咖—料管、 =担ί搭散熱風扇的組合以進行散熱。然而，隨著電腦瓦數不 ，發熱量越來越多，散熱要求越來越高，傳統的設計已不能 ，足要求，因此相關業者汲汲於努力研究解決之道，如增加導熱管數 管的直#、增加散熱風扇數4及尺寸或增加散熱籍片數 ^及面積等♦。然而，上述種種方式並不能完全解決高瓦數電腦之散 …、問題’主要原因在於：在導熱管内之蒸汽流與液鱧流在同一管路内 ^逆向飢動’其液_>1介面曲率隨著吸、放熱效率差異而顯著變化，兩 者表面張力之差即成為輪送液體的毛細力，所以差異越大時其毛細力 越弱俄無法提供足夠的液態介質至蒸發部，以供汽化之用。因此將發 生夾帶限制（entraiiimemlimit)，造成剪切力而導致整體熱傳輸量的^ 低，當運用在高瓦數電腦上時其相互抵消的現象更加明顯，因此其散 熱效補比纖來得低。雖驗由改善散數量尺寸、風扇之風 壓與風量、散熱器本體基座與導熱管焊接方式等，仍無法達到理想的 散熱效率。 因此，業界有使用迴路熱管或環形熱管來解決高瓦數電腦的散熱 ，題。然而，迴路熱管或環形熱管在實際使用時仍有下列問題產生或 需要考慮事項··（1)導熱管操作角度效應；啟動問題；p)低瓦數時產 1266852 乾問題(。上果(4)操作-段時間造成塞流膽 致命的伽私财絲無法好，但目前這些 因此’如何有效改善目前迴 …& 環路式散熱模組，是相關《、學目點標及導入高性能 【發明内容】 散熱’本發明之實施例提供，路式 罩一端之風扇，該^換3 —導風罩及—裝設於導風 凝端之導祕部、至少—具有絲端及冷 毛细之冷凝部’該蒸發勒形成有"密封腔體，1266852 IX. Description of the invention: [Technical field to which the invention belongs] This creation provides a fine-grained improvement of the electronic components and the loop-type health care of the main structure. Affecting the latent heat of the phase change [previous technology] With the rapid development of the electronic information industry, the electronic product release enables the electronic components to operate normally, avoiding the expensive electronic components U-Yong = effective for the main miscellaneous green product secrets Ride fast. And the whole heat-dissipation mechanism and process, the heat-conducting tube is small in size, uses the phase change potential ii ΐ heat, temperature, uniform, simple structure, light weight 'no need to add ίΓ::ί庵=2 ί transmission Other features, in line with the current needs of computer cooling modules 'is therefore widely used to solve the heat problem. In the initial stage, most of the electric power modules of the reduction are mainly composed of a combination of a coffee-material tube and a cooling fan for heat dissipation. However, with the wattage of the computer, the heat is increasing, the heat dissipation requirements are getting higher and higher, and the traditional design is no longer sufficient. Therefore, the relevant industry is striving to study the solution, such as increasing the number of heat pipes. Straight #, increase the number of cooling fans 4 and size or increase the number of heat sinks ^ and area, etc. ♦. However, the above various methods can not completely solve the problem of high wattage computer... The main reason is that the steam flow and the liquid turbulent flow in the heat pipe are in the same pipeline, and the liquid _>1 interface The curvature changes significantly with the difference of suction and heat release efficiency. The difference between the surface tensions becomes the capillary force of the liquid. Therefore, the larger the difference, the weaker the capillary force. Russia cannot provide enough liquid medium to the evaporation part for the supply. For vaporization. Therefore, entrainment restriction (entraiiimemlimit) will occur, resulting in shear force and the overall heat transfer amount is low. When applied to a high wattage computer, the phenomenon of mutual offset is more obvious, so the heat dissipation ratio is lower than that of the fiber. Although the improvement in the number of scattered sizes, the wind pressure and air volume of the fan, the heat sink body base and the heat pipe welding method, etc., the ideal heat dissipation efficiency cannot be achieved. Therefore, the industry has used loop heat pipes or ring heat pipes to solve the heat dissipation problem of high wattage computers. However, the loop heat pipe or the ring heat pipe still has the following problems or need to be considered in actual use. (1) The operating angle effect of the heat pipe; the starting problem; p) The low number of watts produces 1266852 dry problems (. ) Operation - the time that caused the deadlock of the sputum can not be good, but at present these are so 'how to effectively improve the current back ... & loop-type thermal module, is related to, learning points and import high performance [Disclosed] The heat dissipation embodiment of the present invention provides a fan at one end of the road cover, the air exchange cover and the guide portion installed at the air guiding end, at least - having a wire end and a cold capillary The condensing portion 'the evaporation is formed with a "sealing cavity,
、、。冓‘真顧腔體從⑽其區隔為軸通道區與導管之冷凝端 相連’及汽相通道區與導管之蒸發端相連 I 轉之冷_錄纽風扇—端 之一侧^ 在本發明之實施例中，為有效將液態介質導入蒸發部，可在導管 之冷凝端設置毛細結構。 在本發明之實施例中，為更有效防止蒸發部加熱後產生的汽化工 貝逆流至導官之冷凝端，可於蒸發部上方對應液相通道區之位置 设置-散熱器’用以急速冷卻逆流之汽化工作介質，如此可保證低流 阻之汽相通道區與液相通道區趨動工作介質流動之壓差，避免塞流現 象的產生。 ’ 在本發明之實施例中，冷凝部上、下可各加裝一導風結構，有效 導引散熱風扇產生的氣流導引至冷凝部及蒸發部上之散熱器，從而提 高環路式散熱模組之散熱性能。 【實施方式】 第一圖為環路式散熱模組1之組合圖，第二圖為第一圖之立體分解 圖。該環路式散熱模組1主要包括一環路式之熱交換裝置10、一導風罩 60、一裝設於導風罩6〇—端之散熱風扇70 (圖中僅示該散熱風扇7〇之 扇框）、一導風擋板80、上、下導風結構90a、90b及一底座100。 請參第三圖，該熱交換裝置10包括一蒸發部20、二具有一蒸發端 1266852 31及-冷;|^33之導管3〇、及一冷凝部5〇。紐部2〇由上、下蓋板施' 20b組成-密封腔體，内含將腔體空間區隔為液相通道區與低流阻之汽 _ 相通道區之毛細結構2(fc ;導管30之蒸發端31及冷凝端33分別接於蒸發 部20之出、入口，於遠端串接形成一完整之熱交換裝置1〇。在本^施 例中，導管30係-體成型，且冷凝端33内設有毛細結構，❿蒸發端31 内可設或科毛細賴。冷凝部5Ό由套鎌導管觀複錄熱絲片組 成。在本實施例中，為防止蒸氣過早在導管3〇之蒸發端31冷卻，瀑 30之蒸發端31也可以不穿過冷凝部5〇。 ' 蒸發部2Q之下蓋板2〇b用於與發熱元件（圖未示）貼合接觸，工作 介質蘊藏於毛細結構20c内。工作時，下蓋板2〇b從發熱元件吸收熱量 加熱工作介質，當達到產生飽和蒸汽的熱量時，工作介質將迅速汽化 產生療’並往低流阻之汽相通道區流動；蒸汽流沿蒸發端31急速前 進，同時將大量熱能帶至冷凝部5〇，由冷凝部5〇之散熱錄片組及散熱 風扇70將熱能逸散至大氣。因放熱作用而冷凝之液態工作介質，經由 冷凝端33内之毛細結構快速回至液相通道區，以提供下一波汽化過程 , 所需之液態工作介質，依此循環不已。此外，為更有效防止下蓋板2〇b 加熱後產生的汽化工作介質逆流至冷凝端33，於上蓋板2〇a上方對應液 相通道區之位置設置一散熱器22，用以急速冷卻逆流之汽化工作介 質，如此可保證低流阻之汽相通道區與液相通道區趨動工作介質流動 之壓差，避免塞流現象的產生。散熱器22位於蒸發部20的上蓋板2〇a與 冷凝部50之間。 ^ • 請一並參閱第四圖及第五圖，冷凝部50上、下皆設有導引氣流用 之上、下導風結構90a、90b，每一導風結構90a、90b朝向散熱風扇7〇 之一端形成有至少一斜面，用以將散熱風扇7〇產生的氣流導引至冷凝 部50及貼设於蒸發部20之上蓋板20a的散熱器22，從而提高熱交換裝置 10之散熱效率。上、下導風結構90a、90b可藉由卡扣結構（圖未示） 鎖S於冷凝部50上，亦可藉由卡扣結構鎖固於導風罩60内。 蒸發部20係固設於底座1Q0上，該底座1〇〇係裝設於導風罩6〇上從 而將熱交換裝置10安裝於導風罩60内並與風扇70相對，導管之冷凝端 ， 33位於導風罩60内靠近風扇70之一端而導管30之蒸發端31位於導風罩 60内遠離風扇70之一端，該種設計有利於大部份之蒸汽在導管之冷凝 端40内迅速冷卻。底座1〇〇上設有複數固持孔102 (請參第二圖）。 8 1266852 導風罩60大致呈U型，其包括一頂板60a及一對側板60b。請一並參 閱第六圖，每一側板6Qb之底邊向外翻折形成折邊62，折邊62上設有複 數與底座100之爵持孔102相對應之卡筒64，卡筒64中央形成有一從折 邊62延伸之疋位柱66，卡筒64上開設有一對缺口64a。藉由複數爵定銷 110可將底座100固定於導風罩60上。s定銷11〇之一端形成有倒鉤 112，中央攻有一通孔114 (請參閱第二圖所示）。固定時，固定銷HQ 穿過底座100上對應之固.持孔102並進入導風罩60對應之卡筒64内，卡 筒64内之定位柱66對應插入至固定錆n〇之通孔114内，同時，固定銷 110上之倒釣112對應卡入卡筒64之缺口64a，從而將底座1〇〇固定至導 風罩60上。 導風稽板80裝設於導風罩6〇上。導風罩6〇之側板6〇b的折邊62之適 當位置各設一小凹槽63，此凹槽63外型尺寸與導風擋板80之結合構造 82相配合。在本實施例中，導風擋板8〇之結合構造似，係利用一似匸 型構，利用彈性變形直接卡扣於導風罩導風擋板8Q上設有複數 具有分流作用的孔洞84，亦設有縱向及橫向加強肋％、88用以強化導 風擋板80縱向及橫向結構，此等加強肋86、88可避免因散熱風扇7〇產 生之過大風壓而造成導風擋板8〇脫落。 在本實施例中，環路式散熱模組1於使用時，只需利用螺絲（圖未 示）將導風罩60鎖©於設有發熱元件之電路板上即可。 在本實施例中，散熱器22與底座1〇〇可以是鋁擠成型、鍛造成型、 機加成型或鑄造成型等任一方式成型，輔以機械加工後再與蒸發部2〇 之上蓋20a相配合’如第二圖所示；亦可為單獨加工成型散熱器22,後， 再以TIM(Thermal Interface Material)固著於底座1〇〇上，之後再將底座 100貼设於蒸發部20之上蓋20a，如第七圖所示，還可為在底座}⑻上開 设一開孔’再將散熱器22”穿過底座1〇〇之開孔而與蒸發部2〇之上蓋2〇a 相貼合’如第八圖所示。 如第九圖所示，為保有導風罩60上的定位柱66與固定銷no之間的 彈性變形裕度，及避免因間隙過大而造成鬆動，可縮小固定銷11〇之通 孔114於頭端之内徑並與定位柱66外徑相配合，以增加其穩固性。固定 銷110底端之倒鈎112亦可增加適當開槽116，以增加倒鈎n2之彈性變 形裕度。 在上述實施例中，蒸發部20内之毛細結構20c，可以是粉末燒結毛 1266852 細結構、金屬網袼毛細結構及纖維材料。 在上述實施例中，導管30之冷凝端33内之毛細結構，可以是粉末 燒結毛細結構、金屬網袼毛細結構、微細溝槽及纖維材料。 在上述實施例中，導管30的截面形狀可以是圓形、橢圓形、方形 及長方形。 在上述實施例中，導管30之金屬外殼材質可以是高熱傳導係數材 料，例如：鋼、鋁、銀及其合金。 在上述實施例中，熱交換裝置10内之工作介質可以是冷媒、水、 乙醇、甲醇、丙酮、庚烷、氨水及其混合物。 在上述實施例中，熱交換裝置1〇内的循環迴路可以是一組或一組 以上的管路〇 在上述實施例中，導風擋板8〇之材質可以是金屬或非金屬材料。 經由上述作用及實施，本環路式散熱模組i具有以下優點： (一） 環路式散熱模組1具有循環作用，同時由於液·汽分流的設計， 其散熱效能比傳統導熱管散熱模組高。 (二） 蒸發部20提供充足的待汽化之液態介質，可提高其最大熱傳量。 (三） 導管30之冷凝端33中之毛細結構，可有效將液態介質導入蒸發 部20，避免角度效應的產生。 … (四） 散熱風扇70及熱交換裝置裝設於導風罩60上從而形成一模組結 構’經由螺絲將導風罩60鎖固於電路板即可完成環路式散埶模组 裝，安裝便利。 …’ (五） 冷滅部50上、下各加裝導風結構9〇a、9〇b，有效導引散熱風扇 70產生的氣流導引至冷凝部5〇及蒸發部2〇上之散熱器22，提高^環路 式散熱模組1的散熱性能。 【圖式簡單說明】 第一圖為依本實施例之環路式散熱模組之組合圖。 第二圖為第一圖之立體分解圖。 第三圖為第觀式散賴組巾之熱交換裝置之域分解圖。 第四圖為第二圖之部分組合圖。 第五圖為第一圖之另一角度視圖。 第六®為第K再-角度賴且導職板鱗風罩相分離。 1266852 第七圖為依另一實施例之環路式散熱模組之散熱器與蒸發器之貼 合視圖。 第八圖為依再一實施例之環路式散熱模組之散熱器與蒸發器之貼 合視圖。 第九圖為依本實施例之環路式散熱模組之固定銷之立體圖。 【主要元件符號說明】 環路式散熱模組 1 缺口 64a 熱交換裝置 10 定位柱 66 蒸發部 20 散熱風扇 70 上蓋板 20a 導風擔板 80 下蓋板 20b 結合構造 82 毛細結構 20c 孔洞 84 散熱器 22 縱向加強肋 86 導管 30 橫向加強肋 88 蒸發端 31 底座 100 冷凝端 33 固持孔 102 冷凝部 50 上導風結構 90a 導風罩 60 下導風結構 90b 頂板 60a 固定銷 110 側板 60b 倒鉤 112 折邊 62 通孔 114 凹槽 63 開槽 116 卡筒 64 11,,.冓 'The real cavity is connected from (10) its axis is the shaft channel area to the condensation end of the conduit' and the vapor phase channel area is connected to the evaporation end of the conduit. I turn to the cold_recording fan-end one side ^ in the present invention In an embodiment, in order to effectively introduce the liquid medium into the evaporation portion, a capillary structure may be provided at the condensation end of the conduit. In the embodiment of the present invention, in order to more effectively prevent the vapor chemical produced by the evaporation portion from flowing back to the condensation end of the guide, a heat sink may be disposed at a position corresponding to the liquid phase passage region above the evaporation portion for rapid cooling. The countercurrent vaporization working medium can ensure the pressure difference between the vapor phase channel region and the liquid phase channel region of the low flow resistance to prevent the plug flow phenomenon. In the embodiment of the present invention, an air guiding structure can be added to the upper and lower sides of the condensing portion, and the airflow generated by the cooling fan is effectively guided to the radiator on the condensation portion and the evaporation portion, thereby improving the loop heat dissipation. The heat dissipation performance of the module. [Embodiment] The first figure is a combination diagram of the loop type heat dissipation module 1, and the second figure is an exploded perspective view of the first figure. The loop type heat dissipating module 1 mainly includes a loop type heat exchange device 10, an air guiding cover 60, and a cooling fan 70 installed at the end of the air guiding cover 6 (only the cooling fan 7 is shown in the figure) The fan frame), a wind deflector 80, upper and lower air guiding structures 90a, 90b and a base 100. Referring to the third drawing, the heat exchange device 10 includes an evaporation portion 20, a conduit 3 having an evaporation end 1266852 31 and a cooling unit, and a condensation portion 5A. The new part 2〇 consists of a top and a lower cover plate composed of '20b—a sealed cavity containing a capillary structure 2 that partitions the cavity space into a liquid phase channel region and a low flow resistance vapor phase channel (fc; conduit The evaporation end 31 and the condensation end 33 of the 30 are respectively connected to the outlet and the inlet of the evaporation portion 20, and are connected in series at the distal end to form a complete heat exchange device 1 . In the embodiment, the catheter 30 is body-formed, and The condensing end 33 is provided with a capillary structure, and the enthalpy evaporation end 31 can be provided with a fine capillary. The condensing portion 5 组成 is composed of a ferrule tube view and a thermal filament sheet. In the present embodiment, in order to prevent the vapor from being premature in the conduit 3 The evaporation end 31 of the crucible is cooled, and the evaporation end 31 of the waterfall 30 may not pass through the condensation portion 5'. The lower cover 2〇b of the evaporation portion 2Q is for contacting the heating element (not shown), the working medium It is contained in the capillary structure 20c. During operation, the lower cover 2〇b absorbs heat from the heating element to heat the working medium. When the heat of generating saturated steam is reached, the working medium will rapidly vaporize to generate a treatment and flow to the low flow resistance vapor phase. The passage area flows; the steam flow advances rapidly along the evaporation end 31 while bringing a large amount of heat energy to the condensation section 5〇, the heat-dissipating recording set and the cooling fan 70 of the condensing unit 5 dissipate heat to the atmosphere. The liquid working medium condensed by the exothermic action quickly returns to the liquid-phase passage area via the capillary structure in the condensing end 33. In order to provide the next wave of vaporization process, the required liquid working medium is circulated accordingly. In addition, in order to more effectively prevent the vaporization working medium generated after the heating of the lower cover 2〇b from flowing back to the condensation end 33, the upper cover 2 A radiator 22 is disposed at a position corresponding to the liquid phase channel region above the 〇a for rapidly cooling the vaporization working medium in the countercurrent flow, thereby ensuring a pressure difference between the vapor phase channel region of the low flow resistance and the flow medium working region of the liquid phase channel region To prevent the occurrence of a plug flow phenomenon, the heat sink 22 is located between the upper cover 2a of the evaporation portion 20 and the condensation portion 50. ^ • Please refer to the fourth and fifth figures together, the condensation portion 50 is upper and lower. The upper and lower air guiding structures 90a and 90b are provided with guiding airflow, and each of the air guiding structures 90a and 90b is formed with at least one inclined surface toward one end of the cooling fan 7〇 for guiding the airflow generated by the cooling fan 7〇. To the condensation section 50 and attached to the evaporation 20, the heat sink 22 of the upper cover 20a, thereby improving the heat dissipation efficiency of the heat exchange device 10. The upper and lower air guiding structures 90a, 90b can be locked to the condensation portion 50 by a snap structure (not shown). The air evaporating portion 20 is fixed to the air hood 60. The evaporating portion 20 is fixed on the base 1Q0, and the base 1 is mounted on the air hood 6 to mount the heat exchange device 10 on the guide. The windshield 60 is opposite to the fan 70. The condensation end of the duct 33 is located in the air guiding hood 60 near one end of the fan 70 and the evaporation end 31 of the duct 30 is located in the air guiding hood 60 away from one end of the fan 70. Most of the steam is rapidly cooled in the condensation end 40 of the conduit. The base 1 has a plurality of retaining holes 102 (see Figure 2). 8 1266852 The air hood 60 is generally U-shaped and includes a top plate 60a and a pair of side plates 60b. Referring to the sixth figure, the bottom edge of each side panel 6Qb is folded outward to form a flange 62. The flange 62 is provided with a plurality of cartridges 64 corresponding to the sockets 102 of the base 100, and the central portion of the cartridges 64 A clamping post 66 extending from the flange 62 is formed, and the cartridge 64 is provided with a pair of notches 64a. The base 100 can be secured to the air hood 60 by a plurality of yoke pins 110. One end of the spin pin 11 is formed with a barb 112, and the center taps a through hole 114 (refer to the second figure). When fixed, the fixing pin HQ passes through the corresponding fixing hole 102 of the base 100 and enters the corresponding cylinder 64 of the air guiding cover 60. The positioning post 66 in the cartridge 64 is correspondingly inserted into the through hole 114 of the fixed 锖n〇. At the same time, at the same time, the fishing 112 on the fixing pin 110 is correspondingly engaged with the notch 64a of the cartridge 64, thereby fixing the base 1 to the air guiding cover 60. The wind guide plate 80 is mounted on the air guiding cover 6〇. A small recess 63 is formed in each of the appropriate positions of the flanges 62 of the side panels 6〇b of the air deflector 6〇. The recess 63 has a size corresponding to the joint structure 82 of the air deflector 80. In this embodiment, the combination of the air guiding baffle 8 is similar to that of the wind deflector 8Q, and is directly buckled on the air guiding baffle baffle 8Q by elastic deformation, and a plurality of holes 84 having a splitting action are provided. The longitudinal and lateral reinforcing ribs %, 88 are also provided for reinforcing the longitudinal and lateral structures of the air guiding baffle 80. The reinforcing ribs 86, 88 can prevent the wind deflecting baffle caused by the excessive wind pressure generated by the cooling fan 7? 8 〇 shedding. In the present embodiment, when the loop type heat dissipation module 1 is in use, it is only necessary to lock the air hood 60 to a circuit board provided with a heat generating component by means of a screw (not shown). In this embodiment, the heat sink 22 and the base 1 can be formed by any means such as aluminum extrusion, forging, machining or casting, and then mechanically processed and then with the upper portion 20a of the evaporation portion 2 The combination is as shown in the second figure; the heat sink 22 can be separately formed, and then fixed to the base 1 by TIM (Thermal Interface Material), and then the base 100 is attached to the evaporation portion 20 The upper cover 20a, as shown in the seventh figure, may also be provided with an opening on the base (8) and then passing the heat sink 22" through the opening of the base 1 and the cover 2〇a of the evaporation portion 2 The fitting is as shown in the eighth figure. As shown in the ninth figure, in order to maintain the elastic deformation margin between the positioning post 66 on the air guiding cover 60 and the fixing pin no, and to avoid loosening due to excessive clearance, The inner diameter of the through hole 114 of the fixing pin 11 缩小 can be reduced and matched with the outer diameter of the positioning post 66 to increase the stability thereof. The barb 112 at the bottom end of the fixing pin 110 can also add a proper slot 116 to Increasing the elastic deformation margin of the barb n2. In the above embodiment, the capillary structure 20c in the evaporation portion 20 can be It is a powder sintered 1668852 fine structure, a metal mesh capillary structure and a fiber material. In the above embodiment, the capillary structure in the condensation end 33 of the conduit 30 may be a powder sintered capillary structure, a metal mesh capillary structure, a fine groove. In the above embodiment, the cross-sectional shape of the conduit 30 may be circular, elliptical, square, and rectangular. In the above embodiment, the metal casing material of the conduit 30 may be a high thermal conductivity material such as steel. Aluminum, silver and alloys thereof In the above embodiments, the working medium in the heat exchange device 10 may be a refrigerant, water, ethanol, methanol, acetone, heptane, ammonia, and a mixture thereof. In the above embodiment, the heat exchange device The circulation loop in one turn may be one or more than one set. In the above embodiment, the material of the air guide baffle 8 may be a metal or a non-metal material. Through the above functions and implementations, the loop type The heat dissipation module i has the following advantages: (1) The loop type heat dissipation module 1 has a circulation function, and at the same time, due to the design of the liquid and steam distribution, the heat dissipation performance ratio is transmitted. The heat pipe heat dissipation module is high. (2) The evaporation unit 20 provides sufficient liquid medium to be vaporized to increase the maximum heat transfer capacity. (3) The capillary structure in the condensation end 33 of the pipe 30 can effectively introduce the liquid medium. The evaporating portion 20 avoids the generation of the angle effect. (4) The heat dissipating fan 70 and the heat exchange device are mounted on the air guiding cover 60 to form a module structure. The wind deflector 60 can be locked to the circuit board via a screw. The loop type diverging die assembly is completed, and the installation is convenient. ...' (5) The air guiding structure 9〇a, 9〇b is installed on the upper and lower portions of the cold-extinguishing portion 50, effectively guiding the airflow guidance generated by the cooling fan 70 The heat sink 22 on the condensing portion 5 〇 and the evaporation portion 2 提高 improves the heat dissipation performance of the loop type heat dissipation module 1 . BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a combination diagram of a loop type heat dissipation module according to this embodiment. The second figure is an exploded perspective view of the first figure. The third figure is a domain exploded view of the heat exchange device of the first type of scatter towel. The fourth figure is a partial combination diagram of the second figure. The fifth figure is another angle view of the first figure. The sixth® is the Kth re-angle and the guide plate scale hood is separated. 1266852 FIG. 7 is a view showing a close-up view of a heat sink and an evaporator of a loop type heat dissipation module according to another embodiment. Figure 8 is a view showing a close-up view of a heat sink and an evaporator of a loop type heat dissipation module according to still another embodiment. The ninth drawing is a perspective view of the fixing pin of the loop type heat dissipation module according to the embodiment. [Main component symbol description] Loop type heat dissipation module 1 Notch 64a Heat exchange device 10 Positioning post 66 Evaporation part 20 Cooling fan 70 Upper cover 20a Air guide plate 80 Lower cover 20b Combined structure 82 Capillary structure 20c Hole 84 Heat dissipation 22 reinforced longitudinal ribs 86 conduit 30 transverse stiffening ribs 88 evaporation end 31 base 100 condensing end 33 retaining hole 102 condensing section 50 upper air guiding structure 90a air hood 60 lower air guiding structure 90b top plate 60a fixing pin 110 side plate 60b barb 112 Folding 62 through hole 114 groove 63 slot 116 card 64 11