TWI264989B - Liquid-cooling type heat-dissipation module - Google Patents

Liquid-cooling type heat-dissipation module

Info

Publication number
TWI264989B
TWI264989B TW094105754A TW94105754A TWI264989B TW I264989 B TWI264989 B TW I264989B TW 094105754 A TW094105754 A TW 094105754A TW 94105754 A TW94105754 A TW 94105754A TW I264989 B TWI264989 B TW I264989B
Authority
TW
Taiwan
Prior art keywords
magnetic body
type heat
cooling type
dissipation module
base
Prior art date
Application number
TW094105754A
Other languages
English (en)
Other versions
TW200631489A (en
Inventor
Lee-Long Chen
Chien-Hsiung Huang
Shih-Ming Huang
Wen-Shi Huang
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW094105754A priority Critical patent/TWI264989B/zh
Priority to US11/189,869 priority patent/US20060191667A1/en
Priority to US11/189,870 priority patent/US7292438B2/en
Priority to JP2006019832A priority patent/JP2006237591A/ja
Priority to JP2006041473A priority patent/JP4244386B2/ja
Publication of TW200631489A publication Critical patent/TW200631489A/zh
Application granted granted Critical
Publication of TWI264989B publication Critical patent/TWI264989B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW094105754A 2005-02-25 2005-02-25 Liquid-cooling type heat-dissipation module TWI264989B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW094105754A TWI264989B (en) 2005-02-25 2005-02-25 Liquid-cooling type heat-dissipation module
US11/189,869 US20060191667A1 (en) 2005-02-25 2005-07-27 Liquid-cooled heat dissipation module
US11/189,870 US7292438B2 (en) 2005-02-25 2005-07-27 Liquid-cooling heat dissipation module
JP2006019832A JP2006237591A (ja) 2005-02-25 2006-01-27 液体冷却放熱モジュール
JP2006041473A JP4244386B2 (ja) 2005-02-25 2006-02-17 液冷式放熱モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094105754A TWI264989B (en) 2005-02-25 2005-02-25 Liquid-cooling type heat-dissipation module

Publications (2)

Publication Number Publication Date
TW200631489A TW200631489A (en) 2006-09-01
TWI264989B true TWI264989B (en) 2006-10-21

Family

ID=36930995

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105754A TWI264989B (en) 2005-02-25 2005-02-25 Liquid-cooling type heat-dissipation module

Country Status (3)

Country Link
US (1) US20060191667A1 (zh)
JP (1) JP4244386B2 (zh)
TW (1) TWI264989B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI572273B (zh) * 2015-12-21 2017-02-21 Man Zai Industrial Co Ltd Liquid cooling heat sink

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI274106B (en) * 2005-06-10 2007-02-21 Delta Electronics Inc Centrifugal pump with air venting design
CN100490618C (zh) * 2005-06-10 2009-05-20 鸿富锦精密工业（深圳）有限公司 散热装置
TWM284949U (en) * 2005-09-21 2006-01-01 Yen Sun Technology Corp Heat dissipating device for an electronic device
US7694721B2 (en) * 2006-08-31 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump
TW200815676A (en) * 2006-09-18 2008-04-01 Prolynn Technology Inc Pumping apparatus of a cooling system
US7729118B2 (en) * 2006-11-03 2010-06-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump
US8528628B2 (en) * 2007-02-08 2013-09-10 Olantra Fund X L.L.C. Carbon-based apparatus for cooling of electronic devices
JP5917816B2 (ja) * 2011-03-08 2016-05-18 株式会社ベルシオン 水車装置
KR20130061578A (ko) 2011-12-01 2013-06-11 현대자동차주식회사 자동차의 워터펌프
JP6331771B2 (ja) * 2014-06-28 2018-05-30 日本電産株式会社 ヒートモジュール
TW201634817A (zh) * 2015-03-30 2016-10-01 林聖梁 抽水馬達裝置
GB201809208D0 (en) * 2018-06-05 2018-07-25 Univ Brunel Thermal transfer loop
US10681841B2 (en) * 2018-08-08 2020-06-09 Evga Corporation Water-cooling heat dissipation device suitable for computer
CN113543577B (zh) * 2020-04-21 2022-12-27 华为数字能源技术有限公司 一种冷量分配单元及液冷系统
CN111562832B (zh) * 2020-05-17 2021-11-09 济南得德环保科技有限公司 采用半导体制冷片制冷的制冷装置及cpu散热器
KR102240223B1 (ko) * 2020-07-07 2021-04-14 주식회사 공공 파도형 소용돌이 공기 청정기
CN115503188A (zh) * 2022-10-12 2022-12-23 江苏康非特动力科技有限公司 一种健身器材表面塑料制品快速拔模制造模具
CN117905688A (zh) * 2023-12-27 2024-04-19 江苏迈庞普科技有限公司 一种微泵自动化液冷系统及其使用方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4644925A (en) * 1985-12-26 1987-02-24 Eaton Corporation Apparatus and method for compressive heating of fuel to achieve hypergolic combustion
DE4343854C2 (de) * 1993-12-22 1996-01-18 Munsch Kunststoff Schweistechn Magnetpumpe
US5441102A (en) * 1994-01-26 1995-08-15 Sun Microsystems, Inc. Heat exchanger for electronic equipment
US5561335A (en) * 1994-02-25 1996-10-01 Seagate Technology, Inc. Integrated passive magnetic bearing system and spindle permanent magnet for use in a spindle motor
US6056520A (en) * 1995-12-04 2000-05-02 Chemical Seal & Packing, Inc. Magnetic drive pump having encased magnets for pumping very low temperature fluids
US5779456A (en) * 1996-10-28 1998-07-14 Finish Thompson Inc. Magnetic drive
JP2000012751A (ja) * 1998-06-24 2000-01-14 Nippon Densan Corp 冷却ファン装置
US6208512B1 (en) * 1999-05-14 2001-03-27 International Business Machines Corporation Contactless hermetic pump
US6361271B1 (en) * 1999-11-19 2002-03-26 Capstone Turbine Corporation Crossing spiral compressor/pump
US6377458B1 (en) * 2000-07-31 2002-04-23 Hewlett-Packard Company Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump
JP3930243B2 (ja) * 2000-11-06 2007-06-13 本田技研工業株式会社 マグネットポンプ
GB0027806D0 (en) * 2000-11-15 2000-12-27 Secr Defence Low magnetic signature motor system
JP3913980B2 (ja) * 2000-12-22 2007-05-09 本田技研工業株式会社 車両用エンジンにおける磁力式ポンプ駆動装置
US20030124000A1 (en) * 2001-12-28 2003-07-03 Po-Jen Shih Heat dissipation fan
JP4034077B2 (ja) * 2002-01-30 2008-01-16 カルソニックカンセイ株式会社 キャンドポンプ
US6746212B2 (en) * 2002-03-22 2004-06-08 Intel Corporation High efficiency pump for liquid-cooling of electronics
US6600649B1 (en) * 2002-05-24 2003-07-29 Mei-Nan Tsai Heat dissipating device
JP3981628B2 (ja) * 2002-11-28 2007-09-26 株式会社東芝 冷却用ポンプ並びに電気機器及びパーソナルコンピュータ
US7048495B2 (en) * 2003-11-19 2006-05-23 Itt Manufacturing Enterprises, Inc. Rotating machine having a shaft including an integral bearing surface
US7101158B2 (en) * 2003-12-30 2006-09-05 Wanner Engineering, Inc. Hydraulic balancing magnetically driven centrifugal pump
JP4409976B2 (ja) * 2004-02-03 2010-02-03 山洋電気株式会社 電子部品冷却装置
US7137793B2 (en) * 2004-04-05 2006-11-21 Peopleflo Manufacturing, Inc. Magnetically driven gear pump
US7143820B2 (en) * 2004-12-31 2006-12-05 Intel Corporation Systems for improved heat exchanger
US7124811B2 (en) * 2004-12-31 2006-10-24 Intel Corporation Systems for integrated pump and cold plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI572273B (zh) * 2015-12-21 2017-02-21 Man Zai Industrial Co Ltd Liquid cooling heat sink

Also Published As

Publication number Publication date
TW200631489A (en) 2006-09-01
JP2006233966A (ja) 2006-09-07
US20060191667A1 (en) 2006-08-31
JP4244386B2 (ja) 2009-03-25

Similar Documents

Publication Publication Date Title
TWI264989B (en) Liquid-cooling type heat-dissipation module
TWI256876B (en) Liquid-cooling type heat dissipation module
TW200733856A (en) Composite heat-dissipating module
DE502004006730D1 (de) Fluidkühlvorrichtung
TW200708237A (en) Integrated liquid cooling system
AU2003293482A1 (en) Sealed and pressurized liquid cooling system for microprocessor
TW200706101A (en) Integrated liquid cooling system
WO2007021335A3 (en) Vertical annular separation and pumping system with integrated pump shroud and baffle
TW200643691A (en) Micro channel heat sink driven by hydromagnetic wave pump
DE602006009687D1 (de) Wärmeableiteinrichtung für ein batteriepack und batteriepack damit
WO2007002939A3 (en) System for liquid cooling of electrical components
TW200715949A (en) Systems for integrated pump and reservoir
DE502005005904D1 (de) Anordnung zur förderung von fluiden
TW200627133A (en) Chip-type heat sink module and heat dissipation method thereof
SE0500197L (sv) Styrväxelkylare
CN100533341C (zh) 泵
RU2009144368A (ru) Система жидкостного охлаждения статоров электрических машин
EP1696129A3 (en) Liquid-Cooled heat dissipation module
MY138510A (en) Using external radiators with electroosmotic pumps for cooling integrated circuits
WO2009026044A3 (en) Enhanced cooling for downhole motors
US20150097451A1 (en) Motor with cooling device
CN206575297U (zh) 一种基于新型端盖的电机
CN202836313U (zh) 一种散热片
CN203504948U (zh) 液体冷却装置
CN106981464B8 (zh) 一种用于大尺寸散热装置的均温装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees