TWI264454B - Polishing pad and chemical mechanical polishing method - Google Patents

Polishing pad and chemical mechanical polishing method

Info

Publication number
TWI264454B
TWI264454B TW093111491A TW93111491A TWI264454B TW I264454 B TWI264454 B TW I264454B TW 093111491 A TW093111491 A TW 093111491A TW 93111491 A TW93111491 A TW 93111491A TW I264454 B TWI264454 B TW I264454B
Authority
TW
Taiwan
Prior art keywords
polishing
chemical mechanical
polishing pad
mass
mechanical polishing
Prior art date
Application number
TW093111491A
Other languages
English (en)
Other versions
TW200500431A (en
Inventor
Hiroshi Shiho
Takahiro Okamoto
Kou Hasegawa
Nobuo Kawahashi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200500431A publication Critical patent/TW200500431A/zh
Application granted granted Critical
Publication of TWI264454B publication Critical patent/TWI264454B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW093111491A 2003-04-25 2004-04-23 Polishing pad and chemical mechanical polishing method TWI264454B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003122731 2003-04-25

Publications (2)

Publication Number Publication Date
TW200500431A TW200500431A (en) 2005-01-01
TWI264454B true TWI264454B (en) 2006-10-21

Family

ID=32959723

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111491A TWI264454B (en) 2003-04-25 2004-04-23 Polishing pad and chemical mechanical polishing method

Country Status (7)

Country Link
US (1) US20040224616A1 (zh)
EP (1) EP1470893B1 (zh)
JP (1) JP2004343099A (zh)
KR (1) KR100661444B1 (zh)
CN (1) CN100548576C (zh)
DE (1) DE602004001268T2 (zh)
TW (1) TWI264454B (zh)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602005006326T2 (de) * 2004-02-05 2009-07-09 Jsr Corp. Chemisch-mechanisches Polierkissen und Polierverfahren
EP1739729B1 (en) * 2004-04-23 2012-03-28 JSR Corporation Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer
JP2008027971A (ja) * 2006-07-18 2008-02-07 Jsr Corp 化学機械研磨パッドおよび化学機械研磨方法
EP2083027B8 (en) 2008-01-24 2012-05-16 JSR Corporation Mechanical polishing pad and chemical mechanical polishing method
CN101946309A (zh) * 2008-02-18 2011-01-12 Jsr株式会社 化学机械研磨用水系分散体以及化学机械研磨方法
JP5189396B2 (ja) * 2008-04-01 2013-04-24 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
JP2011071303A (ja) * 2009-09-25 2011-04-07 Toshiba Corp 半導体装置の製造方法
JP2012056021A (ja) * 2010-09-09 2012-03-22 Jsr Corp 化学機械研磨パッドおよびそれを用いた化学機械研磨方法
US20120302148A1 (en) * 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
JP5889568B2 (ja) 2011-08-11 2016-03-22 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ 酸化タングステン膜形成用組成物およびそれを用いた酸化タングステン膜の製造法
FR2983758B1 (fr) 2011-12-13 2015-11-27 Saint Gobain Abrasives Inc Composition resinique aqueuse pour articles abrasifs et articles resultants.
FR2983759B1 (fr) * 2011-12-13 2014-08-01 Saint Gobain Abrasives Inc Composition resinique aqueuse pour articles abrasifs et articles resultants.
CN102775915B (zh) * 2012-06-25 2014-04-16 深圳市力合材料有限公司 一种可抑制颗粒沉积的硅晶片精抛光组合液及其制备方法
US9315636B2 (en) 2012-12-07 2016-04-19 Az Electronic Materials (Luxembourg) S.A.R.L. Stable metal compounds, their compositions and methods
US9201305B2 (en) 2013-06-28 2015-12-01 Az Electronic Materials (Luxembourg) S.A.R.L. Spin-on compositions of soluble metal oxide carboxylates and methods of their use
US9296922B2 (en) 2013-08-30 2016-03-29 Az Electronic Materials (Luxembourg) S.A.R.L. Stable metal compounds as hardmasks and filling materials, their compositions and methods of use
US9409793B2 (en) * 2014-01-14 2016-08-09 Az Electronic Materials (Luxembourg) S.A.R.L. Spin coatable metallic hard mask compositions and processes thereof
US9418836B2 (en) 2014-01-14 2016-08-16 Az Electronic Materials (Luxembourg) S.A.R.L. Polyoxometalate and heteropolyoxometalate compositions and methods for their use
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
KR20240015161A (ko) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP6743785B2 (ja) * 2017-08-30 2020-08-19 株式会社Sumco キャリアの製造方法およびウェーハの研磨方法
US11042091B2 (en) 2017-09-06 2021-06-22 Merck Patent Gmbh Spin-on inorganic oxide containing composition useful as hard masks and filling materials with improved thermal stability
CN108301037A (zh) * 2017-12-29 2018-07-20 上海驰声新材料有限公司 一种非晶合金等离子纳米抛光工艺
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6168508B1 (en) * 1997-08-25 2001-01-02 Lsi Logic Corporation Polishing pad surface for improved process control
JP3826702B2 (ja) * 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
JP2003100682A (ja) * 2001-09-25 2003-04-04 Jsr Corp 半導体ウエハ用研磨パッド

Also Published As

Publication number Publication date
CN1569399A (zh) 2005-01-26
TW200500431A (en) 2005-01-01
DE602004001268T2 (de) 2007-06-06
KR100661444B1 (ko) 2006-12-27
EP1470893A1 (en) 2004-10-27
KR20040093020A (ko) 2004-11-04
JP2004343099A (ja) 2004-12-02
US20040224616A1 (en) 2004-11-11
EP1470893B1 (en) 2006-06-21
CN100548576C (zh) 2009-10-14
DE602004001268D1 (de) 2006-08-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees