TWI264103B - A 3D electronic packaging structure with enhanced grounding performance and embedded antenna - Google Patents

Abstract

This invention provides one kind of the 3D electronic packaging structure with enhanced grounding performance and embedded antenna. The packaging structure can be stacked thought the contact pads at the top and bottom surfaces. The grounding layers were fabricated at the bottom surface of the silicon wafer and facilitated the grounding for integrated circuit. Moreover, the packaging units could be fabricated as the wafer-level-packaging and reduce the fabrication cost. The signals from the packaged integrated circuits could also be carried by the patterned grounding layers. By using the through hole surrounding the integrated circuits, the electronic signals at the top and the bottom surfaces of the packaging can communicate. Therefore, the applications of the electronic packaging structure are improved. Besides, the interconnects formed in the grounding layers could have circular shape. By this method, the antenna can be embedded inside our electronic packaging structure with enhanced grounding performance.

Description

1264103 IX. Description of the Invention: [Technical Field] The present invention relates to an electronic package structure, and more particularly to a three-dimensional stacked package unit with enhanced grounding, characteristics and embedded antenna type, in which the sub-element is The back side of the substrate has a single or multiple layers of ground layers, and the multi-wafer stacking can be achieved by the telecommunication contacts on both sides of the package unit. Today's electronic products are aimed at miniaturization, high performance, high precision, high reliability, and south reactivity, so that the distribution density of circuit components is too high.

• The volume of the road is greatly reduced. However, the more compact the circuit of the electronic product, the more components will be formed in the tiny space, so the opportunity for telecommunication interference increases, affecting the stability of the electronic product signal; among them, electromagnetic interference (Electr) 〇magne^曰C lnt=rf leaves ence, EMI) and noise are the most common problems. The main cause of EMI suppression is that the knife is Radiant and Conducted electromagnetic interference. Fortunately, EMI is transmitted directly through the open space. It does not need to be shielded by any transmission. Grounding (Grounding) and other methods = decision, the enhanced grounding proposed by the present invention has a single or multiple layers of grounding layer to increase the 'gas characteristics' of the • 叠 降低 降低 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低Prior Art] 6, 387~2匕ί: exposed type, the crystal is mounted on the top surface of the U.S. Patent No.1, and the package is attached to a substrate 102 on the substrate 103 for wiring. The wafer 103' is formed on the first integrated circuit crystallized circuit chip (10), and electrically connected to the top surface of the first chip 103 to be coated with a reverse 102' connector, and the first integrated circuit is crystal-bonded. On the top surface, concentric ^ Q5, the second integrated circuit wafer 106 can be connected to the substrate 102 by a wire bonding operation and a plurality of soldering wires 107, and then the package substrate is used. On the m and all the components are covered, that is, complete a stack 'integration I order road closure wafer. Stacking the body circuit depends on two or two together and sharing a substrate, increasing the number of wafers, the space: however, because the internal signal transmission of the chip must be passed through the welding line dream surname 2 soil 1 It is easy to generate signal delay phenomenon. At the same time, due to the long path of the I and port structure, the application of high frequency electronic components is prone to noise and affect the telecommunications reliability of the electronic components. ', 曰国 in Tiger 6,236,115, reveals a high-density integrated circuit Γ ΐ, Γ: Γ 2; the package structure is still using the wafer stacking method to reduce I as the above using the wire as the signal between the transfer of the wafer The signal delay caused by the 积, the first integrated circuit crystal is formed in the wafer by a plurality of via holes, and the sturdy structure of the stalk can be shortened. However, due to the increase in the integrated electrical output _ & amps, the 干扰 晶 晶 # # 彼 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电曰上^ In the system integration of multi-microelectronic components stacked electronic t, to the frequency communication or actuating sensors and other electronic structure modules = the technical cost of the package, and to achieve a small package volume of 2 2 = high density, High structure and electrical reliability, simultaneous design, New Zhuang

I rely on the multi-microelectronics reversal K structure, which is the function of the flexible adjustment, which is an urgent problem to be solved. The clothing, the mouth, the mouth 1264103 [Invention content] Jian; electronic seal and shirt integration township microelectronic tree stacking group trend; to = ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The wafer-level sealing unit of the St素St-piece, its upper and lower surfaces and the connection and stacking of the package rate = the gift of the road cranes to enhance this pile of the other - the purpose is to provide - another kind of electricity - the purpose of bribery - The electronic county structure, the y-characteristic characteristics of the yoke, so low electromagnetic interference for the high-density electronic components to achieve the above purpose, the present invention proposed by the electronic I; " ί ^ ϊΓ ^ ^ ^ cloth around the aforementioned electronic components. Single or multiple layers of grounding 屛, ^ ^ domain points, the back side of the substrate. a single or a plurality of via holes' domains, and a material having a conductive property is filled in the via holes or in the hole walls, and the surface between the upper surface of the punching region and the ground layer has a telecommunication connection characteristic = a plurality of telecommunication channels, Formed on one side of the electronic package structure or a plurality of telecommunication contacts, formed at the end of the telecommunications channel, and 1 or one side or both sides of the electronic package structure. 77 is laid out in the foregoing 1264103.

^ t ® ^ T [Embodiment] A strong structure. Detailed ^, the tree cage out of a telecommunications contact to reach the multi-chip heart this package = 兀 can be as follows by the two sides, only the preferred embodiment ρ mouth 1, σ hai invention example to explain a mussel The conjugate example is not intended to limit the invention. The cross-sectional view of the package body 3〇0 of the ββ11 is also a combination of the material composition elements of the base material 318 of the primed tin tin rr electronic component, _=the element with the rotating body is formed in the electronic element _=== 2; ^^ cattle layer 313 passive lightning early cluster A, workmanship can be active electronic components, 13 electricity = for - buffer area (W is not special; in it, it is used in this 310 can be used to form an electrical communication path with a face; the second conductive hole is shaped by a hole, a dry-type rhyme or other suitable alloy of nickel, tantalum, tungsten or the like or a conductive material thereof The material is placed on the top of the contact pad 313 with the first contact pad and the second layer of the electronic component. The layer 4 is located on the side where it is suitable for the m, / ❻, and the riding 7 to extinguish the plating, electroplating or re-transfer. ^成: Asia will be located in the first and second contact 塾 (309, 306) electric ... knives cloth, the brother - cover layer 304 and the second cover layer 3 〇 5 can be combined to 8 1264103 process 3 high package unit surface The flatness can be used to enter the mouth of the system, and the circuit signal of the second wire is formed in the second wire to increase the applicability of the first hole 308 'strong. The clothing body 300 is formed on the stacked electronic component ground layer 311 formed in the first genus copper, iron, = gold = sub-component grounding #因士: the combination of the steep material 'the metal layer except the electric help g A good conductor of heat, with the characteristics of heat conduction, can be === the age of the layer 313. The electronic component: the way of drilling or other suitable for the first sealed unit body and the second circuit protective layer batch Shape "contact 315, brother four telecommunications contacts 316 bit two = one using screen printing, stencil printing sub = reading telecommunications joints or other suitable way to form "coating, lithography technology." Difficult to telecommunications (4) °Qnf』protect 4 layers (not shown on the special layer in Figure 3) to connect the first package = body 3〇JU aforementioned telecommunications contact protection signal. 才衣早兀体300 and other electronics The circuit between the devices can be transmitted as the circuit signal inside, the second via hole is the piece: the inner wire layer wins over the package unit body 3〇〇, and the second wire is connected to the surface of the package unit. Layer 317—the first telecommunications contact' ^—contacts the second inner part (the telecommunication of the fixed structure 301 of the first miscellaneous unit telecommunication transmission can be as before the electronic component layer plus the middle evil stacking and cutting; 9 1264103 is not intended to limit the present invention. / Figure 2B corresponds to Figure 3A. The first embodiment of the present invention can be described as a description. In this figure, the second circuit protection layer 312 in Figure 3A is omitted. After the formation 311 is patterned, a first-telecom channel 327 is formed. The first sub-j layer 313 of the upper surface 1 of the first package unit body 3 cannot be displayed in FIG. 3B, and thus is indicated by a broken line portion. 3== in the element layer 313 can be transmitted to the periphery of the electronic cell early body 300 via the third via hole 322, and can be utilized The third telecommunications channel commits 6 and the second electrical 7 314 are connected to achieve the purpose of configuring the location of the telecommunications contact. The electronic component ground sound=1 can also form a test of the fifth telecommunications contact 323 after the patterning process. The test domain of the internal electronic components of the i package structure is connected to each other, and the structure is formed by a t-shaped process; in addition, the deuteration process can form a wireless communication, and the receiving antenna 324' has a toroidal winding type electric channel unit/village age Bu 骑 骑 t t t t t t t t t 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳In the upper view, the wafer 4〇 is covered with a plurality of reinforced grounding characteristics three-dimensional stacked package unit, and the “fourth sub-reading layer 480” is enlarged, and the electronic component layers are like mechanical drilling, laser drilling, and dry seat.峨 other LSI: second guide side 2; first - electronic element two side = cycle; inner wire layer 4 〇 4 to second guide _ 士 之 匕 匕 ' 进行 进行 进行 进行 进行 进行 进行 进行 进行 进行 ' ' = Shou, the telecommunications inside the inner layer 460 can be used by the second contact 塾, = 1264103 as shown in Figure 3A In the example, the telecommunications contact configuration is described. The above-mentioned package unit body is completed, so that the cost of the single-sealing element body can be reduced, = the wafer side is cut, and the enhanced grounding characteristic of the present invention is completed. ΠΛ图ΠΛ对顾四A的放 A_,本发日(四)—The possible cross-section of the embodiment on the electronic component substrate. The electron has a thunder:;:1^ Strong early, use this buffer field, deduct the first The two-via hole relocation = partial wafer cutting is shown in the wafer dicing shed in the figure; the preferred embodiment structure described above is only for the purpose of illustration and is not intended to limit the invention. x Figure 5A is crystal The circular stacking diagram, the first wafer 5〇1盥 is provided with a plurality of grounding difficult vertical stacking of the present invention, and the division of the wafer can also be performed after the completion of the stacking process by the crystal; as shown in FIG. 5bgΪ二Ϊ: ϊίΐ A: a side view of the cutting process after stacking; Ϊ layer two electronic device layer 560 is located on the second wafer 502 501, an electronic component layer 55〇 and the third electronic component layer 57 The g signal can be transmitted by the fixed structure 5G5 of the first telecommunications transmission, the electronic component layer _ and the fourth electric The circuit signal of the component layer 5_ is transmitted with the structure 506 of the telecommunication transmission, and the wafer scriber 5 () 7 曰 is used for the i!!i circle and forms the three-dimensional stacked package structure of the enhanced grounding feature of the present invention, such as Not in Figure 6. Figure 6 is a schematic cross-sectional view showing a second embodiment of the present invention for stacking packages in the form of a package of the present invention. The first package unit body J has an electronic component layer 605. The second package unit body 62 has a second electrical 1264103 sub-layer 606, and the circuit telecommunications transmission is fixed in the two electronic component layers. The structure 604 transmits ^=6〇2, and the package unit body 62G and the substrate 6 are formed by the fixing structure I ^ of the first telecommunications transmission (31) forms a telecommunications guide into the figure. ^^^^^^^ 'For the hairpin package unit 710'

The locations all have telecommunication contacts, wherein the circuit signals between the two sides corresponding to the body 720 can be transmitted by the ^^ body = the second package of the second package, and the second package unit 7 is rushed and the 5 holes are transmitted. The structure access signal can be transmitted by the three-dimensional stacking and sealing 7G6 of the electrical strengthening grounding property of the package unit body 73. The patterned metal layer of the present invention = 3 =, the lower surface of the structure has

And the U 7〇2, using the first electrically-on substrate TM, having a _ 妾 fixed structure 704, can make the second package 703 and = two telecommunications transfer H third package unit body (four) state f = The purpose of the electric unit body 2 is to improve the package. ' Further up to = 705 can be applied to the telecommunications transmission: ^ I sin, the joint of the = =; the first package package 'body = 》 a group of early reading 820 use telecom transfer 12 1264103 : ίί 斗 805 Signal transmission is performed, and the first package unit body 810 and the second fixed transmission system 4 with the second telecommunications transmission have a telecommunication contact point _ the first telecom transmission enables the first package unit body 810 The second package unit reaches the stacking body 830 and the substrate 8〇1 to form a telecommunications conduction, and then detached; ifr is the same as the first embodiment, and is familiar with the art, not

The scope is even more. The spirit of the spirit can be used to make some changes, and the patent protection is more dependent on the scope of the application and the equivalent fields. [Simple description of the schema] The secrets of the following figure will be more detailed in the following description. Figure 1 is a schematic view of a conventional wafer-drilling structure. High-density integrated circuit chip package formed by hole mode

Figure 3B is a possible bottom view of the first embodiment of the present invention corresponding to Figure 3A'. The present invention relates to the possible distribution of electronic components. Example 4B is an enlarged area corresponding to the image of Fig. 48, and a possible wearing surface of the substrate of the present invention. Figure 5A is a schematic diagram of wafer stacking. Figure 5B is a side view of the cutting process performed after stacking the wafers corresponding to Figure 5a. 13 1264103 is carried out for the first embodiment. FIG. 7 is a cross-sectional view showing a third embodiment of the present invention, which is a package package using the sealed form of the present invention. Further, the eighth embodiment is a fourth embodiment of the present invention, which is a schematic cross-sectional view of a three-piece stacked package using the present invention.衣早【Main component symbol description】100 stacked integrated circuit chip package 102 substrate 103 first integrated circuit wafer 104 bonding wire 105 adhesive layer 106 second integrated circuit wafer 107 wire bonding adhesive 201 first integrated circuit chip 202 second integrated circuit chip 203 third integrated circuit chip 204 metallization line 205 fixed structure 206 via 300 first package unit body 3 电 1 with telecommunication transmission structure 302 first telecommunication contact 303 first Circuit protection layer 304 first cover layer 305 second cover layer 1264103

306 second contact pad 307 first inner conductor layer 308 first via hole 309 first contact pad 310 second via hole 311 electronic component ground layer 312 second circuit protection layer 313 first electronic component layer 314 second telecommunications contact 315 Third telecommunications contact 316 fourth telecommunications contact 317 second inner conductor layer 318 electronic component substrate 321 first telecommunications channel 322 third via hole 323 fifth telecommunications contact (test contact) 324 wireless signal receiving antenna 325 Second telecommunication channel 326 third telecommunication channel 327 fourth telecommunication channel 400 wafer 401 first contact pad 402 second via hole 403 wafer dicing street 404 first inner wire layer 405 fixed structure 406 with telecommunication transmission first telecommunication interface Point 407 electronic component substrate 408 buffer area 15 1264103

409 second contact pad 430 enlarged area 450 first electronic component layer 460 second electronic component layer 470 third electronic component layer 480 fourth electronic component layer 501 first wafer 502 second wafer 505 first telecommunications transmission solid Structure 506 second telecommunication transmission fixing structure 507 wafer cutting lane 550 first electronic component layer 560 second electronic component layer 570 third electronic component layer 580 fourth electronic component layer 601 substrate 602 telecommunications junction 603 first Fixing structure with telecommunication transmission 604 second fixing structure of telecommunication transmission 605 first electronic component layer 606 second electronic component layer 610 first package unit body 620 second package unit body 701 substrate 702 telecommunication contact 703 first Fixing structure with telecommunication transmission 704 second fixing structure of telecommunication transmission 705 bonding material 706 bonding material with telecommunication transmission 16 1264103 707 third fixing structure of telecommunication transmission 708 fixing structure of fourth telecommunication transmission 709 First telecommunications channel 710 first package unit body 720 second package unit body 730 third package unit body 801 substrate 802 telecommunications Contact 803 First telecommunication transmission fixing structure 804 Second telecommunication transmission fixing structure 805 Telecommunications transmission bonding material 810 First package unit body 820 Second package unit body 830 Third package unit body

17

Claims (1)

1264103 X. Patent application scope: 1. An electronic package structure comprising at least: a single or multiple layers for forming a substrate of electronic components; a single or a plurality of electronic components, the total surface area formed on the electronic components being less than or equal to the aforementioned electrons The component is ^^^== The electronic single or a plurality of contact pads are disposed on the surface of the electronic component; the surface is known, single or plural buffer regions, and the buffer region is distributed in the front, and the electricity is: or? The number of layers connected to the 't-axis of the t-element substrate around the cow' single or multiple through-holes, formed in the front of the 冲 ' ' hole wall filling with conductive properties of the material, so that the above === or grounding layer with telecommunications The top surface of the nail and the aforementioned ίίΐΓΐ channel are formed on one side or the side of the electronic package structure; a single or a plurality of contact points are formed in the telecommunication channel—and the electronic package structure Single-sided or double-sided uκ channel material, and distributed in 2. If you apply to turn over the electronic package structure of item 1, the telecommunication channel on both sides of the package structure can use the above-mentioned conduction to be electronically transferred to make the electron The package structure _ the money channel formation path ^ telecommunications transmission ϊ ϊ = = = range of the first item of the electrical assembly structure, wherein the substrate for the μ - electronic components, the material composition of which can be Shi Xi, recorded A combination of elements on tin, tin, or a combination of elements of semiconductor properties. If the application is for the electronic county structure of the special type _〗, the material is the same as the substrate of the electronic component, and the substrate is not used to form (4) flipping the electronic component described in the first shot. 70 pieces 5. If the electronic dragon structure of the patent application model 5 is used, the projectile can be a combination of the front sub-component, the passive electronic component, the ❹! component, the test 18 1264103 MEMS wafer or the above electronic components. 6. The thunder of claim 1 of the patent scope can be a combination of a grounding layer and a conductive material as described in copper m idftH. 5 i is a material alloy or his species 7 · If the scope of the patent scope of the first item is also - the heat (four) body, with a guide structure, the grounding layer of the i-th electronic package structure, which The grounding layer, the telecommunications channel is in the rotten, #射钻钻 or other suitable way, the road described in the telecommunications outside the wireless signal transmission ^ =, 丄% under the 'telecom channel has ^Special fiber around the first item of the electronic difficult knot n-way described; the mechanical, f _ hole, dry and wet _ or other suitable 2, such as the electronic package structure, wherein the conduction Turn, smash, crane or above metal alloy or his species with electrical conductivity; The electronic package structure of the item, in which the telecom connection lithography technology is expected to be: Gao Ren:! , stencil printing, roller coating, inkjet coating, secondary /, he is suitable to form a telecommunication contact protection layer. 19 1264103 The electronic package structure of the third item of claim 2, wherein the electrical power is combined with the scream of the electronic component of the package to form a test package electronic package structure. & at least comprising =.. a reduced-single-reading stacked electronic package structure, a plurality of layers for forming a substrate of the electronic component; 稷, an electronic component formed on the electronic component = surface area smaller than the aforementioned electronic component a plurality of contact pads, which are disposed on the surface of the electronic component, and a plurality of buffer regions. The buffer region is distributed on the ground layer of the electronic layer, and is formed in the electronic component. a plurality of via holes formed in the buffer region and filled with a material having a conductive property to have a communication connection between the buffer region or the hole wall layer; - a surface and a grounding plurality of electrical channels formed in the foregoing The electronic seal of the nightmare is based on one or both sides of the electronic package structure; the cymbal and the knife are placed on the aforementioned plurality of fixed structures, formed in the aforementioned telecommunication contacts . 15. For the electronic package structure of the 14th item of the patent application, the three-dimensional stack of the body of the towel can use the above-mentioned through holes to electrically connect the telecommunication channels on both sides of the structure. $Transfer's the _ side of the telecommunications channel formation 16. For example, the material fiber _ 14 electronic package structure, which is a series of three-dimensional stacking fixed structure and via holes, on both sides of the telecommunication channel, inside the package unit Telecommunications: The media 隹 can be used as a single--, and can also provide a plurality of seals 20 1264103 between the body of the body, the internal electronic 侔 侔 于 读 电 电 电 。 。 。 。 。. Tin, carbon, or above: 3 ίί: combination with the element can be >5 锗, 锗 conductor characteristic element 17. As claimed in the patent scope f sub-package structure, the _ seal of the three-dimensional stacking into the element can be inflammatory π ^ ^ The basis of the electronic component is good, Gan 18. If you apply for the patent model, the ι4 f= package structure, the buffered three-dimensional stack is the same 'and the electric energy in the buffer area is difficult - electronic component base The first item of the material enclosure is 70 pieces of electronic components. 2 ♦ sensing element, test element, microcomputer ί; slice moving with sub-body three-dimensional stacking gold I Lu, drill, or above metal alloy or his kind of conductive 21 · as claimed in the scope of the 14th and structure The ground layer is also characterized by a three-dimensional stack heat of -Hg. ..., a good conductor, with a range of 14th item, a plurality of sealed orders - electronic package structure, wherein the grounding sound, J clothing early 7C body three-dimensional stacking class, laser drilling or other suitable Use such as machining, dry grounding. The X ' f33 channel is formed in the connection 1264103. 23. The strong channel of the third paragraph of the Shen Qing patent scope may have a ring-shaped surrounding type, and the surrounding telecommunication, the telecommunications described above, and the outside world wirelessly shout miscellaneous. ~, Lai channel has an electron-elements three-dimensional stacking of drilling, cognac or 丨 丨 # * Λ, A" and using a mechanical drilling, dry-wet etching or other suitable way to form a laser electronic package The three-dimensional stacking stencil printing of the sealing material body, the rolling ^2^ telecommunications contact' can be printed on the screen, forming a telecommunication contact protection layer. Hemo coating, lithography technology or other suitable side; 7·If the patent application scope w contact 'can be combined with the former sample-like structure', the electricity described therein... The test of a good piece of the ship Connected