TWI263260B - Conveyance apparatus of belt-like work-piece - Google Patents

Conveyance apparatus of belt-like work-piece

Info

Publication number
TWI263260B
TWI263260B TW092124116A TW92124116A TWI263260B TW I263260 B TWI263260 B TW I263260B TW 092124116 A TW092124116 A TW 092124116A TW 92124116 A TW92124116 A TW 92124116A TW I263260 B TWI263260 B TW I263260B
Authority
TW
Taiwan
Prior art keywords
work
belt
piece
sintered body
gas
Prior art date
Application number
TW092124116A
Other languages
Chinese (zh)
Other versions
TW200416817A (en
Inventor
Daisuke Takamatsu
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW200416817A publication Critical patent/TW200416817A/en
Application granted granted Critical
Publication of TWI263260B publication Critical patent/TWI263260B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Abstract

The purpose of the present invention is to provide a conveyance device for a belt-like work-piece, which is capable of preventing particles from adhering to the belt-like work-piece even if dry air (or nitrogen gas, or rare gas) for floating the belt-like work-piece is fed toward the belt-like work-piece from a work stage in the conveyance device, and is provided with the work stage forming a holding face of the belt-like work-piece by a porous sintered body. The invented conveyance device for the belt-like work-piece conveys the belt-like work-pieces sequentially and is featured with being provided with the followings: the work stage, in which the holding face of the belt-like work-piece is formed by the porous sintered body; a box body having the sintered body on its one side face; and a gas feeding port, which is provided in the sintered body or in the vicinity of the sintered body. Vacuum only is supplied into the box body, and gas is supplied into the gas feeding port.
TW092124116A 2002-10-09 2003-09-01 Conveyance apparatus of belt-like work-piece TWI263260B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002295894A JP2004131215A (en) 2002-10-09 2002-10-09 Conveyance device for beltlike workpiece

Publications (2)

Publication Number Publication Date
TW200416817A TW200416817A (en) 2004-09-01
TWI263260B true TWI263260B (en) 2006-10-01

Family

ID=32286014

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092124116A TWI263260B (en) 2002-10-09 2003-09-01 Conveyance apparatus of belt-like work-piece

Country Status (4)

Country Link
JP (1) JP2004131215A (en)
KR (1) KR100699785B1 (en)
CN (1) CN100412696C (en)
TW (1) TWI263260B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4582026B2 (en) * 2006-03-10 2010-11-17 セイコーエプソン株式会社 Discharge inspection device, droplet discharge device, and method of manufacturing electro-optical device
KR100828987B1 (en) * 2006-03-17 2008-05-14 주식회사 엔씨비네트웍스 Noncontact adsorbent plate
JP5610432B2 (en) * 2010-07-15 2014-10-22 株式会社ブイ・テクノロジー Film exposure equipment
JP5799181B1 (en) 2015-01-07 2015-10-21 住友化学株式会社 Method for manufacturing organic electronic device
JP6254108B2 (en) * 2015-01-07 2017-12-27 住友化学株式会社 Manufacturing method of organic EL panel

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5447580A (en) * 1977-09-22 1979-04-14 Hitachi Ltd Dislodging device of plate form objects
CH678164A5 (en) * 1988-06-09 1991-08-15 Robitron Ag
JP2777835B2 (en) * 1990-03-30 1998-07-23 ウシオ電機株式会社 Film exposure equipment
JP2585190B2 (en) * 1994-01-27 1997-02-26 株式会社島精機製作所 Apparatus and method for feeding dough-coated sheet to cutting machine
US6083451A (en) * 1995-04-18 2000-07-04 Applied Materials, Inc. Method of producing a polycrystalline alumina ceramic which is resistant to a fluorine-comprising plasma
JP3204137B2 (en) * 1996-12-25 2001-09-04 ウシオ電機株式会社 Projection exposure equipment for strip-shaped workpieces
JP3803487B2 (en) * 1998-05-08 2006-08-02 大日本スクリーン製造株式会社 Substrate cooling device and substrate cooling method

Also Published As

Publication number Publication date
CN1497354A (en) 2004-05-19
CN100412696C (en) 2008-08-20
KR100699785B1 (en) 2007-03-27
KR20040032747A (en) 2004-04-17
JP2004131215A (en) 2004-04-30
TW200416817A (en) 2004-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees