TWI262049B - Holding member with grounding functions - Google Patents

Holding member with grounding functions Download PDF

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Publication number
TWI262049B
TWI262049B TW94134828A TW94134828A TWI262049B TW I262049 B TWI262049 B TW I262049B TW 94134828 A TW94134828 A TW 94134828A TW 94134828 A TW94134828 A TW 94134828A TW I262049 B TWI262049 B TW I262049B
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TW
Taiwan
Prior art keywords
grounding
contact
holding
circuit board
module
Prior art date
Application number
TW94134828A
Other languages
Chinese (zh)
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TW200715951A (en
Inventor
Ching-Kuei Hsu
Tzu-Hao Lin
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Micro Star Int Co Ltd
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Application filed by Micro Star Int Co Ltd filed Critical Micro Star Int Co Ltd
Priority to TW94134828A priority Critical patent/TWI262049B/en
Application granted granted Critical
Publication of TWI262049B publication Critical patent/TWI262049B/en
Priority to DE200610046986 priority patent/DE102006046986B4/en
Publication of TW200715951A publication Critical patent/TW200715951A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A holding member with grounding functions is installed on a circuit board for holding a heat dissipation module on an electronic chip. The holding member with grounding functions includes a holding frame and a grounding module. The grounding module combines with the holding frame to form an integral body. When the holding frame is installed on a circuit board, the grounding module simultaneously contacts the grounding circuit of the circuit board. Thus, when the heat dissipation module is held on the holding frame, the heat dissipation module also contacts the grounding module to form a grounded state in order to produce anti-EMI effect and reduce EMI caused by high frequency operation of an electronic chip.

Description

1262049 九、發明說明： 【發明所屬之技術領域】 本發明係與散熱模組之固持裝置有關，特別是關於一種將 散熱模組固持於一設於電路板之電子晶片上方，同時將散熱模 組進行接地之具備接地功能之固持組件。 【先前技術】 高頻且高功率運作之電子晶片，例如一中央處理器 (CPU)’運作過程中會產生電磁輻射，而對其他電子元件產生 電磁干擾，因此為了降低電磁干擾對其他電子元件的影響，必 須對電子晶片進行電磁干擾遮蔽（EMI Shielding，1262049 IX. Description of the Invention: [Technical Field] The present invention relates to a holding device for a heat dissipating module, and more particularly to a method for holding a heat dissipating module on an electronic chip disposed on a circuit board, and simultaneously dissipating the heat dissipating module Grounding the holding component with grounding function. [Prior Art] High-frequency and high-power electronic chips, such as a central processing unit (CPU), generate electromagnetic radiation during operation and electromagnetic interference to other electronic components, so in order to reduce electromagnetic interference to other electronic components Impact, EMI Shielding must be performed on the electronic chip.

Electromagnetic Interference Shielding)，以降低對外發 散的電磁波強度。常見的電磁干擾遮蔽是以接地的金屬體放置 於電子晶片上，利用接地線路釋放電荷，使金屬體維持電位， 而達成效果。 由於南功率電子晶片之上都會裝設一散熱模組來進行散 熱’而且散熱池辭都是採用高祕導絲的金屬材料製 成，因此只要將散熱裝置與接地線路導通，就可以讓散熱裝置 發揮電磁干__额。由於散顯__裝置多為塑膠 射出件，不具備導電能力，且散熱模組都是在電子晶片裝設完 細/吏再以固持i置固定於電子晶片上，散熱裝置可能需要 ^性的拆裝’以更換不同的電子“，因此無法採用焊接導 。的方式來進彳讀地’必綱外_金屬件與散顏組接觸， 1262049 再瓖此一金屬件與接地線路導通。但是這種導電用的金屬件係 與固持裝置各自分離，在組裝時需要分別進行固定，同時必須 仔細调正金屬件’使其確實地與散熱模組以及電路板的接地線 路接觸。因此習知技術中以金屬件接地的方式，組裝程序上複 雜，仍有其改良空間。 【發明内容】 黎於以上㈣題，本發明的主要目的在於提供—種具備接 地力月b之固持組件’藉以簡化電子晶片之散熱模組的接地結 構，減少散_置之固持組件的組裝過程的難度。 因此’為達上述目的，本發明所揭露之一種具備接地功能 之固持組件，裝設於一電路板上，用以固持一散熱模組，同時 可使政熱衣置與電路板的接地線路導通，而使散熱模組具備電 =干擾遮蔽功能，阻擋電子晶片高頻運作產生的電磁波，降低 電子晶片對周遭電子元件的電磁干擾。 <别述電路板之接地線路具有接接點，接地接點可為獨立 °又置，亦可環繞於一鎖孔的周圍設置。 具備接地功能之固持組件包含一固持框架及一接地模 組，其中固持框架係裝設於電路板上，用以固持前述之散熱模 、、’使放熱模組緊雄接觸電子晶片以移除熱量，固持裝置具有 側邊框及延伸於侧邊框下侧邊緣的延伸底板。 接地模組係固定於延伸底板上，具有接觸彈片及接地部， 接地部其中接地部可與接地接雜觸，使接地池與接地線路 連接，當散熱模組被固持於固持框架上時，接觸彈片可與散熱 1262049 模組接觸，而使散熱模組接地， 電磁干擾遮蔽效果。 ❸立於令電位，而具備 其中，接地部可延伸至該延伸底板之τ側面，直接 =路板上之接地接點，何於__穿過接地部，再以螺Electromagnetic Interference Shielding) to reduce the intensity of electromagnetic waves that are diverging. Common electromagnetic interference shielding is placed on a metal wafer by a grounded metal body, and the grounding line is used to discharge the electric charge to maintain the potential of the metal body, thereby achieving an effect. Since the heat sink module is installed on the south power electronic chip to dissipate heat, and the heat sink is made of a metal material with a high secret guide wire, the heat sink can be made only by connecting the heat sink to the ground line. Play electromagnetic dry __ amount. Since the __ device is mostly a plastic injection member and does not have a conductive capability, and the heat dissipation module is mounted on the electronic chip and then fixed on the electronic wafer, the heat dissipation device may need to be Disassembly and assembly of 'to replace different electronic', so it is not possible to use the welding guide to enter the ground. 'The outer part of the metal part is in contact with the loose face group, 1262049 and then the metal part is connected to the grounding line. But this The conductive metal parts are separated from the holding device, and need to be separately fixed during assembly, and the metal piece must be carefully adjusted to make sure that it is in contact with the heat dissipation module and the grounding line of the circuit board. Therefore, in the prior art, In the way of grounding of metal parts, the assembly procedure is complicated, and there is still room for improvement. [Invention] In the above (4), the main purpose of the present invention is to provide a holding component with a grounding force month b, thereby simplifying the electronic chip. The grounding structure of the heat dissipating module reduces the difficulty in the assembly process of the dispersing component. Therefore, in order to achieve the above object, the present invention has one of the disclosed The ground function holding component is mounted on a circuit board for holding a heat dissipation module, and at the same time, the political hot clothes are placed on the grounding line of the circuit board, and the heat dissipation module has the electric interference interference function to block The electromagnetic wave generated by the high-frequency operation of the electronic chip reduces the electromagnetic interference of the electronic chip to the surrounding electronic components. <The grounding circuit of the circuit board has a connection point, and the grounding contact can be independent and can be surrounded by a lock. The holding component with the grounding function comprises a holding frame and a grounding module, wherein the holding frame is mounted on the circuit board for holding the heat dissipation mold, and the heat releasing module is tightly contacted with the electronic body. The holding device has a side frame and an extended bottom plate extending from the lower side edge of the side frame. The grounding module is fixed on the extended bottom plate, has a contact elastic piece and a grounding portion, and the grounding portion of the grounding portion can be connected with the grounding Touching, connecting the grounding pool to the grounding line. When the heat dissipation module is held on the holding frame, the contact spring piece can contact the heat sink 1262049 module, so that The thermal module is grounded and the electromagnetic interference is shielded. It stands at the potential, and the grounding portion can extend to the τ side of the extended bottom plate, directly = the grounding contact on the road board, and __ through the grounding portion Snail

、'.糸將固持框架鎖合於電路板上，使螺絲接觸電路板之鎖孔周圍 的接地接點，使接地模組雜地線路導通。 ’’、Q 埶本^明之功效在於，將接地模組結合於固持框架上，在散 ;、=，於_框架上時，就會直接與接地模組接觸導通， ^再進行細地體。且躺結合於 後，只要直接將固持框架固定於雷 、一 壯U L 即可同時完成接地 省去個別安裝接地模組所需的程序與 為賴本㈣的目的、構造、特徵、及其功能有進一步的 瞭角午，炫配合貫施例詳細說明如下。 【實施方式】 〇請參閱「第1圖」至「第3圖」所示，為本發明第一較佳 貝把例所提t、種具備接地功能之固持組件，係將二接地模组 H)裝設於-固持框架2Q上，_螺絲3()將固持框架2〇鎖固 電路板40 ’例如-電腦主機板，同時利用螺絲加導通接地 模組10與電路板40的接地線路（圖未示）。固持框架2〇的中 央有一裝設於電路板4Q上之電子晶片41，利持框架2〇 將-散熱模組50壓制於電子晶片41上方，使其與電子晶片 41 1'在接觸’將電子晶片41於運作過程中產生的熱量傳導至 1262049, '.糸Lock the holding frame to the circuit board so that the screw contacts the grounding contact around the locking hole of the circuit board to make the grounding module wiring. The effect of ’’ and Q 埶 ^ 明 在于 在于 在于 将 将 将 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 功效 接地 接地 接地 接地 接地 接地 接地 接地 接地After the lie is combined, as long as the fixing frame is directly fixed to the mine and the sturdy UL, the grounding can be completed at the same time. The procedures required for the individual installation of the grounding module and the purpose, structure, features, and functions of the lining (4) are Further, the corner noon, the dazzling and cooperating examples are explained in detail below. [Embodiment] Please refer to "1st" to "3rd" for the first preferred example of the present invention. The holding component having the grounding function is a two-grounding module H. Mounted on the - holding frame 2Q, the _screw 3 () will hold the frame 2 〇 the locking circuit board 40 ' for example - the computer motherboard, while using the screw to connect the grounding module 10 and the grounding line of the circuit board 40 (Figure Not shown). The center of the holding frame 2 has an electronic chip 41 mounted on the circuit board 4Q. The holding frame 2 presses the heat dissipation module 50 over the electronic chip 41 to make contact with the electronic chip 41 1 ' The heat generated by the wafer 41 during operation is conducted to 1262049

此一散熱模组50進行散熱。一般而言，高頻運作的電子晶片 41，例如-中央處理器（⑽，會產生強烈的電磁干擾，似 他電子元件絲干擾。於本發明第—難實_巾，散熱模組 5^)可同時接觸接地模㈣，使散錢㉟5q柯形成接地狀 使甩位固疋於令電位，產生電磁干擾遮蔽（EMI lelding ’ Electromagnetic Interference Shielding)效The heat dissipation module 50 performs heat dissipation. In general, the high-frequency operation of the electronic chip 41, for example, the central processing unit ((10), will generate strong electromagnetic interference, like his electronic component wire interference. In the present invention - difficult to implement _ towel, cooling module 5 ^) It can contact the grounding mold (4) at the same time, so that the loose money 355q Ke forms a grounding shape, so that the clamping position is fixed at the potential, and EMI lelding 'Electromagnetic Interference Shielding effect is produced.

果，避免高頻運作的電子晶片41與其他電子元件互相干擾， 亦可保護此—電子晶片4卜使其不受外部電軒擾或承受電 磁脈衝的破壞。以上所述者，為本㈣第—較佳實_之大致 兀件組成及運作原理，以下將再進—步詳述其細節。 接地模組10包含有二接觸彈片H及一接地部12，接地 :12呈現圓環型態，其中央具有—固定孔121，接觸彈片Η 王現狹長片狀型態’懸置於接地部12的邊緣，且接觸彈片η 的末端與接地部12形成一高度差。 7、另侧遠框^ 穴丁仞蚵日勺二侧透框21 的下側緣分卿成-底板22，各絲22上分職有一盲孔 221 ’盲孔221的底部開設一貫通底板22的穿孔222。固持框 架20可被狀於電路板4Q上，—晶片插座⑬固定於電路板 上對應於固持框架2〇環繞區域的中央，電子晶片μ係 插叹於日日片插座42上。接地模組1Q的接地部12篏人盲孔221 中，並使固定孔121與穿孔222重疊，而將接地模’㈣固定 於固持框架20上，從而使接地模㈣細極㈣結合為 一體。 1262049 麟ΓΙ’3電路板4Q上設有二對應於穿孔222之鎖孔43，電 私誠齡44鱗繞各飢43的週緣， 各接地接點44可與鎖固於各鎖孔43 氣連接狀態。 之接觸而形成電 =持框架2G放置於電路板4Q上，使穿麵對準 :累:崎她固定孔^ 使口持框术20被螺絲3〇鎖固於電路板 鎖孔43邊緣的接地接點44 =糸3°與 螺絲30可與電路板40的 接=料’進而使得接地模組10也可與接地線純導通。 / ^第4圖」所不，接著將散熱模組50放置於固 f上’细扣件（圖未示）與固持框架20結合，可對 月核組5。產生—_力量’從而將散熱模組 框架20上，同時緊宓貼人认U# 巧㈣" 電子晶片41的上表面。於此同時， 1接:了與接地模組10的接觸彈片11末端接觸，而 的亦即此時散熱模組50也可藉由螺賴 A '點44的接觸’電氣連接於電路板40的接地線路，呈 接地狀態。由於散熱模㈣可完整地遮擋於電子晶片41的 /面’ 阻擒電磁波’使散熱模組5() (腿Shielding)的作用。 札以 於本m錢辦，散減組μ在被 ::的同時就會接觸接地模組〗。，透過一 :、反40的接地線路導通。而接地模組1〇係以接地部以結 5於固持框架2G上，而成為固持框架別的一部份，因此_ 1262049 =〇2設於時，只需要直接以螺辑接地 仙上，㈣獅20顧於電路板 而接地;τέ ϊη ' & ’ Μ雜行辦的冑⑽接處理。If the electronic chip 41, which avoids high frequency operation, interferes with other electronic components, it can also protect the electronic chip 4 from external electrical interference or damage by electromagnetic pulses. The above is the general composition and operation principle of (4) the first and the best _, and the details will be further described below. The grounding module 10 includes two contact springs H and a grounding portion 12, and the grounding 12 has a ring-shaped shape, and has a fixing hole 121 at the center thereof, and the contact elastic piece is in a narrow and long chip shape. The edge of the contact elastic piece η forms a height difference with the ground portion 12. 7. The other side of the frame is the same as the lower edge of the two sides of the frame. The lower edge of the two sides of the frame 21 is divided into a bottom plate 22, and each wire 22 has a blind hole 221. The bottom of the blind hole 221 defines a bottom plate 22. Perforation 222. The holding frame 20 can be shaped on the circuit board 4Q, and the chip socket 13 is fixed on the circuit board corresponding to the center of the surrounding area of the holding frame 2, and the electronic chip μ is sighed on the Japanese chip socket 42. The grounding portion 12 of the grounding module 1Q is in the blind hole 221, and the fixing hole 121 is overlapped with the through hole 222, and the grounding mold '(4) is fixed to the holding frame 20, so that the grounding die (four) thin pole (four) is integrated. 1262049 Linyi '3 circuit board 4Q is provided with two keyholes 43 corresponding to the perforations 222, the electric private age 44 scales around the circumference of each hunger 43, each grounding joint 44 can be gas-locked to each of the locking holes 43 status. The contact is made to form electricity. The holding frame 2G is placed on the circuit board 4Q to align the wear surface: the tired: the fixing hole of the skin is fixed. The ground frame 20 is grounded by the screw 3 于 at the edge of the circuit board locking hole 43. The contact 44 = 糸 3 ° and the screw 30 can be connected to the circuit board 40 and thus the grounding module 10 can also be purely conductive to the ground line. / ^ Figure 4 is not, then the heat dissipation module 50 is placed on the solid f. The thin fastener (not shown) is combined with the holding frame 20 to be used for the moon core group 5. The -_force is generated so that the heat-dissipating module frame 20 is placed on the upper surface of the electronic chip 41. At the same time, 1 is connected to the end of the contact elastic piece 11 of the grounding module 10, and at this time, the heat dissipation module 50 can also be electrically connected to the circuit board 40 by the contact of the 'A' point 44. The grounding line is grounded. Since the heat-dissipating mold (4) can completely block the surface of the electronic chip 41, the electromagnetic wave is prevented from acting on the heat-dissipating module 5 (). Zhayi is in the m-money office, and the decentralized group μ will contact the grounding module at the same time as ::. Through a :, the anti-40 grounding line is turned on. The grounding module 1 is connected to the holding frame 2G by the grounding portion, and becomes a part of the holding frame. Therefore, when the _ 1262049 = 〇 2 is set, only the screw is directly grounded, (4) The lion 20 is grounded on the circuit board; τέ ϊ ' & ' The noisy 胄 (10) is connected.

框架要同時進行拆裝多個零散的小零件，使固持 t^衣作餘為容易，獨是生絲程巾的裝配作 功=後續維修時的拆裝作業，都可以有效提升作業人員的 卿第5A、5b圖」、「第6圖」及「第7圖」所示，The frame should be disassembled and disassembled at the same time, so that it is easy to hold the t-shirt, and the assembly work of the raw silk towel can be used to improve the operation of the operator. 5A, 5b, "6" and "7",

為本每明第二較佳實施例所提供之—種具備接地功能之固持 、讀其包含有-固持框架60及二接地模組7〇，其中固持框 木60具有四側邊框61，其姆的二側邊框μ的下側緣分別 开/成L伸底板62 ’延伸底板62的上側面設有複數個鉚柱 62卜前述之二侧邊框61的外側，分別設有一中空柱肋，中 空柱63的中央形成一穿孔63卜可供螺絲3〇穿過，再穿過設 於電路板40的鎖孔43之後，即可將固持框架6〇固定於電路 板40上。 接地杈組70具有一固持部71，固持部71係經彎折，夾 持於延伸底板62的一侧邊緣，而固持部71上設有複數個鉚孔 711 ’为別對應於延伸底板62的各鉚柱621，將鉚柱621結合 於相對應的鉚孔711中，可使接地模組固定於延伸底板β2 上。接地模組70還具有複數個接地部π，延伸於固持部71 對應於延伸底板62下侧面，其係對應於電路板4〇上接地線路 10 1262049 ^點^’透過接地部72與接地接點44的直接進行接 * :接她組7g與接鱗路導ϋ，而產生接地效果。 可將接地部72加大面積，^ 文果亦 721辦w* 叫開§又一開孔721，同時使開孔 錯人μ工 31重疊，透過螺絲30穿過穿孔631， ㈣上_U3，侧地_及螺絲 程序讀的接地接點44連接，亦可達成接地模組7〇的接地 複數:Γ對應於延伸底板62之上側面的部分，沖製形成 芯置且向上延伸的接觸彈片712，當一散熱模組50被 i口接角圖未示）㈣於固持框㈣上時，此—散熱模组50可 =觸彈片712互相接觸，而與接地線路導通。此時散熱· 模Π阻財子晶片41高頻運作時產生的電磁波’使散孰 ”備電磁干擾遮蔽⑽Shielding)的作用。 == 妾觸彈片73的末端確實地抵靠並接觸接地接點 女於延伸底板62的下側面，設有複數個突出之頂桿622， 各^=2之麵繼_議的末端，避免接觸彈 的末制外力向㈣度_產生永久變形，⑽ 地抵靠於電路板4〇上。 … 貝 加本毛明之發明精神在於，將接地模組與散熱模組的固持框 木、、口 口為體，在固持框架安裝於電路板的過程當中，就可以 ^接地模組直接與接地線路導通，不需要額外的安裝及接線作 業。而散熱模組被安裝於固持框架的同時，就可以同時盘接地 模組接觸，而使散熱模組接地，進行對電子晶片的電磁评遮 1262049 電磁波造成電磁干擾 蔽，有效降低電子晶片南頻運作時產生的 的問題。 ==發明以前述之較佳實補揭露如上，然其並非用以 .本„ ’任何熟習相像技藝者，在不脫離本發明之 =圍内’ §可作些許之更動與潤飾，因此本發明之專利保 圍須視本說明書所附之申請專利範騎界定者為準。 【圖式簡單說明】 ” 第1圖為本發明第一較佳實施例之分解圖； 第2圖為本發明第—較佳實施例之立體圖· 佳實施例農設於電路板之分解示意圖； 第5A日AT#彻麟路板之剖面示意圖； f5A圖為本新鄕二較佳實施例之分解圖； 圖林_第二錄實補部分元件 例裝設於電路板之分解：及 Ί—1 遺貫施例裝設於電路板之剖面 【主要元件魏朗】 ㈣不思圖。 10 接地模組 11 接觸彈片 12 接地部 121 固定孔 20 固持框架 21 侧邊框 1262049 盲孔 穿孔 螺絲 電路板 電子晶片 晶片插座 鎖孔 接地接點 散熱模組 固持框架 侧邊框 延伸底板 鉚柱 頂桿 中空柱 穿孔 接地模組 固持部 鉚孔 接觸彈片 接地部 開孔 13For the second preferred embodiment of the present invention, the grounding function is supported, and the read-and-hold frame 60 and the two grounding modules 7 are included, wherein the holding frame 60 has a four-sided frame 61. The lower side edges of the two side frames μ are respectively opened/formed into the L-shaped bottom plate 62. The upper side of the extending bottom plate 62 is provided with a plurality of rivets 62, the outer sides of the two side frames 61, respectively, and a hollow column rib, a hollow column The center of the 63 is formed with a through hole 63 for the screw 3 to pass through, and then passes through the locking hole 43 provided in the circuit board 40 to fix the holding frame 6 to the circuit board 40. The grounding cymbal group 70 has a holding portion 71. The holding portion 71 is bent and clamped to one side edge of the extending bottom plate 62, and the holding portion 71 is provided with a plurality of rivets 711' corresponding to the extending bottom plate 62. Each of the studs 621 is coupled to the corresponding riveting hole 711, and the grounding module can be fixed to the extending bottom plate β2. The grounding module 70 further has a plurality of grounding portions π extending from the holding portion 71 corresponding to the lower side of the extending bottom plate 62, which corresponds to the grounding line 10 1262049 of the circuit board 4, and the grounding portion 72 and the grounding joint are transmitted through the grounding portion 72. Direct connection of 44: Connect her group 7g and lead the road guide, and produce a grounding effect. The grounding portion 72 can be increased in area, and the result is also 721. w* is called § another opening 721, and at the same time, the opening is misplaced, and the through hole 631 is passed through the screw 30, (4) _U3, The ground contact _ is connected to the grounding contact 44 of the screw program, and the grounding complex of the grounding module 7 亦可 can also be achieved: Γ corresponds to the portion of the upper surface of the extended bottom plate 62, and the contact elastic piece 712 which is formed into a core and extends upward is punched out. When a heat dissipation module 50 is not shown by the i-port angle diagram (4) on the holding frame (4), the heat dissipation module 50 can be in contact with each other and be electrically connected to the ground line. At this time, the electromagnetic wave generated by the high-frequency operation of the heat-dissipating chip 104 is used to shield the electromagnetic interference (10) Shielding. == The end of the elastic piece 73 is surely abutted against the ground contact female On the lower side of the extension bottom plate 62, a plurality of protruding ejector pins 622 are provided, and the ends of each of the faces of the ^=2 are used to avoid the external force of the contact springs to produce permanent deformation, and (10) abut against The board is on the top of the board. ... The spirit of the invention is that the grounding module and the heat-dissipating module are fixed to the wood frame and the mouth is the body. During the process of mounting the frame on the circuit board, the grounding can be grounded. The module is directly connected to the grounding line, and no additional installation and wiring work is required. When the heat dissipation module is mounted on the holding frame, the disk grounding module can be contacted at the same time, and the heat dissipation module is grounded to perform the electronic chip. Electromagnetic evaluation cover 1262049 Electromagnetic waves cause electromagnetic interference shielding, effectively reducing the problems caused by the operation of the south frequency of the electronic chip. == The invention is disclosed in the above-mentioned preferred implementation, but it is not used. Xi alike in the art that the present invention without departing from the circumference = '§ it may make various modifications and variations of the present invention and the patent protection of the appended claims which are to be surrounded by the scope of the present specification and their equivalents ride. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded view of a first preferred embodiment of the present invention; FIG. 2 is a perspective view of a perspective view of a preferred embodiment of the present invention; Figure 5A is a schematic cross-sectional view of the AT# 彻麟路板; f5A图 is an exploded view of the preferred embodiment of the new ;2; Turin _ second recorded real component part of the component is installed in the circuit board decomposition: and Ί - 1 The residual application is installed on the cross section of the circuit board [main component Wei Lang] (4) Do not think about it. 10 Grounding module 11 Contact elastic piece 12 Grounding part 121 Fixing hole 20 Retaining frame 21 Side frame 1262049 Blind hole perforated screw circuit board electronics Wafer chip socket lock hole ground contact heat dissipation module retention frame side frame extension bottom plate riveting ejector hollow column perforated grounding module retaining part riveting contact spring piece grounding opening 13

Claims (1)

1262049 十、申請專利範圍： [-種具備接地功能之固持組件，裝設於_電路板上，用以固 持-散熱模組，其中該電路板上具有至少—鎖孔，該鎖孔之 邊緣係形成-接地線路之—接地接點，該具備接地功能之固 持組件包含有： 一固持框架，具有至少―盲孔，該盲孔之底部具有-穿 孔’用以供—螺絲穿過並通賴f路板之該鎖孔，接觸該接 地接點，並將細馳架翻_電路板；及 卜:接地模組，具有至少一接觸彈片及一接地部，該接地 系甘入入忒目孔中，固定該接地模組於該固持框架，並與該 螺絲接觸形成電氣連接；又，該接觸彈片係懸置於該接地部 之邊緣’與該接地部形成_個高度差，肋接觸該散熱模組 形成電氣導通。 2·如申請專利範圍第i項所述之具備接地功能之固持組件，其 中，接地部呈賴環聽，具有—固定孔，該_係穿過該 固定孔而與該固定孔接觸。 3 •如申請專利範圍第1項所述之具備接地功能之固持組件，其 中该固持框架具有至少一側邊框，該側邊框下側緣形成一延 伸底板’该盲孔係位於該延伸底板，該穿孔係|通該延伸底 才反。 一 1〜種具備接地功能之固持組件，裝設於一電路板上，用以固 放A、模組，其中该電路板上具有至少一接地接點，連接 於一接地線路，該具備接地功能之固持組件包含有： 14 1262049 -固持框架，具有至少—側邊框及—延伸底板；及 接地板組，具有一接觸部及—接地部，其中該接觸部 翻定於該延縣板，其具有至少—懸置且向上延伸的接觸 辦片，該接地部係延伸於該接觸部，肋接觸該接地接點。 5. 如申請專利範圍第4項所述之具備接地功能之固持組件，其 中挺伸底板設有至少—鉚柱，該接觸部設有至少—對應之 鉚孔，藉由該鉚柱結合於該鉚孔中，將該接地模組固定於該 延伸底板上。 6. 如申請專利範_ 4項所述之具_地功能之固持組件，其 中該接觸部係夹持於該延伸底板之一側邊緣，並覆蓋於該延 伸底板之上側面。 7. 如申請專利範圍第4項所述之賊接地功能之固持組件，立 中該固定框架更具有-中妹，該中空柱具有—穿孔，供；; 螺絲穿過以將該固定框架鎖固於該電路板上。 &如申請專利範圍第7項所述之具備接地功能之固持組件，其 中該接地部設-開孔，對應於該中空柱之該穿孔，供該螺絲 穿過，而鎖固於電路板。 9·如申明專利範圍第4項所述之具備接地功能之固持組件，其 中該延伸底板之下側面設有至少一頂桿，該頂桿之頂端對應 於該接地部之末端。 151262049 X. Patent application scope: [-- A holding component with grounding function is installed on the _ circuit board to hold the heat dissipation module, wherein the circuit board has at least a keyhole, and the edge of the keyhole is Forming a grounding contact for the grounding line, the holding component having the grounding function comprises: a holding frame having at least a "blind hole" having a bottom - a perforation for the screw to pass through and The locking hole of the circuit board contacts the grounding contact, and turns the fine frame to the circuit board; and the grounding module has at least one contact elastic piece and a grounding portion, and the grounding system is inserted into the eye opening hole. Fixing the grounding module to the holding frame and contacting the screw to form an electrical connection; further, the contact elastic piece is suspended at an edge of the grounding portion to form a height difference with the grounding portion, and the rib contacts the heat dissipation die The group forms electrical conduction. 2. A holding component having a grounding function as described in claim i, wherein the grounding portion is in the sense of a ring, and has a fixing hole through which the _ system passes in contact with the fixing hole. The holding member having the grounding function according to claim 1, wherein the holding frame has at least one side frame, and the lower side edge of the side frame forms an extending bottom plate. The blind hole is located on the extending bottom plate. Perforation system| A holding component having a grounding function is mounted on a circuit board for fixing A and a module, wherein the circuit board has at least one grounding contact connected to a grounding line, and the grounding function is provided The holding component comprises: 14 1262049 - a holding frame having at least a side frame and an extending bottom plate; and a grounding plate group having a contact portion and a grounding portion, wherein the contact portion is turned over to the Yanxian plate, which has At least a suspended and upwardly extending contact piece, the ground portion extending from the contact portion, the rib contacting the ground contact. 5. The holding component having the grounding function according to claim 4, wherein the extending bottom plate is provided with at least a stud, and the contact portion is provided with at least a corresponding riveting hole, by which the stud is coupled In the riveting hole, the grounding module is fixed on the extended bottom plate. 6. The holding member of the present invention as claimed in claim 4, wherein the contact portion is clamped to a side edge of the extended bottom plate and covers the upper side of the extended bottom plate. 7. The retaining component of the thief grounding function as claimed in claim 4, wherein the fixing frame further has a middle and a middle, the hollow column has a perforation for; the screw passes through to lock the fixing frame On the board. < A holding member having a grounding function as described in claim 7 wherein the grounding portion is provided with an opening corresponding to the perforation of the hollow post for the screw to pass through and to be locked to the circuit board. 9. The holding assembly having a grounding function according to claim 4, wherein at least one ram is disposed on a lower side of the extending bottom plate, and a top end of the ejector corresponds to an end of the grounding portion. 15
TW94134828A 2005-10-05 2005-10-05 Holding member with grounding functions TWI262049B (en)

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DE200610046986 DE102006046986B4 (en) 2005-10-05 2006-10-04 Holding component with integrated grounding for a heat sink module

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TW200715951A TW200715951A (en) 2007-04-16

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US6243265B1 (en) * 1999-10-06 2001-06-05 Intel Corporation Processor EMI shielding
DE20200214U1 (en) * 2002-01-08 2002-05-16 Asia Vital Components Co Ltd Device for eliminating interference from the central unit's electromagnetic waves
US6639800B1 (en) * 2002-04-30 2003-10-28 Advanced Micro Devices, Inc. Heat sink subassembly

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