TWI260749B - A ceramic substrate and breaking method thereof - Google Patents

Abstract

A ceramic substrate embedded with a plurality of circuit units. A plurality of identification dots are arranged around four top surface edges of the ceramic substrate and are corresponded to clearances between circuit units disposed in the ceramic substrate. A plurality of V-shaped grooves are formed in a bottom surface and between the circuit units. The area containing the identification dots on the top surface is defined as a first area, other area is defined as a second area. The breaking method of the ceramic substrate includes: (a) pasting tapes on the first area of the top surface; (b) molding plastic on the top surface; (c) tearing the tapes; (d) cutting the plastic according to the identification dots; (e) breaking the ceramic substrate along the grooves.

Description

1260749 IX. Description of the Invention: [Technical Field] The present invention relates to a ceramic package and a divided side cover for a semiconductor package, particularly for a sealant [Prior Art]. As we all know, the application of integrated circuits is Nikko

Equipment, household electrical, etc. are all self-extracting with the integrated circuit. The brain network and communication are constantly developing Wei, and the production of frequency Wei is greatly improved with the light, thin, short, small and multi-functional requirements of electronic manufacturing technology. In the 1C chip, the innovation is _ high yield rate. The sub-industry packaging technology does not process the yield, and the product product f is successful _^=^ slavery, which is separated and produced. ί: The first seal: the ceramic substrate of the compression molding adopts the cutting diagram, and the front view edge portion of the ======= corresponds to the respective circuit unit at the /, upper and lower surface sides 134 ^ 130 - the figure is not ceramic The board (10) Ε _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Since the identification point 134 of the ceramic f ίΪΠί is covered by the sealant 136, the circuit unit IS ^ on the ceramic surface 13 can only be separated according to the knowledge point 134. (4) In the fifteenth figure, a sectional view of the cutting tool 13 is cut for the cutting tool 138 as shown in the fourteenth drawing. Cutting tool 138 plate cutting ceramic line anti 13G, and then cutting the sealing compound ^ Kind = Θ Ρ US Patent No. 6, 42G, 244 announced on January 16 reveals that the second-level wafer size package (10) is L (10) & (5) p Scale method, its pattern The butterfly needle is also a paste cutter that cuts a substrate having a number of turns into a plurality of independent wafers. 1260749 The board has a hard and brittle character. The above-mentioned conventional ceramic substrate is easy to be introduced during cutting. (4) The substrate is cracked, the cutting speed is slow, and the production capacity is -2°177. Rate, increase production costs. , pro-sound swim = 'needs - can reduce the wear of cutting tools, improve cutting = avoid the cracking of the ceramic board caused by the cutting of the stone board, reduce the cost of the ceramic plate breaking [invention] In the pottery itdftf s lies in providing a ceramic The substrate breaking method 'can be implemented close to the i:FFr=^^ field. Correspondingly, the second region of the wire covering the H substrate is transferred. The method of the ceramic comprises the following steps: (a) cutting the sealed ceramic substrate at the position of the spot. /° It The split line on the lower surface of the substrate breaks the ceramic line, and JJ2 cuts the sealant when the identification point and the split piece are used. On the other hand, it also reduces the wear of the cutting tool, = two cuts, which greatly increases the cutting speed, cracks and reduces costs. Ceramic substrate caused by cutting ceramic substrate [Embodiment] Front view of the plate (10) = heart f"°. At the edge of the upper surface of the ceramic substrate 100 in the Taumanki early 102', the number of identification points iQ4, one corresponding In the gap between the complex circuit units (10)

Piece i ;===:; line _ 'and the above-mentioned split table: base;,: 'first' in the ceramic substrate circuit single brother two area potting glue 110, its role is to cover the plural to: (10) . The eighth picture is the second two: t thief glue 11 (3, forming the scribe line 112, the cut _ depth = the thickness of the line 〇β ^ Η 〇 。. Finally, along the plaque of the lower surface of the ceramic substrate 100 according to the pottery Break the H substrate 1 (10). For the depth of the W line 106, it can be (iv) Wei thickness design, generally the neon is still the current (four) ° please and the eleventh figure 100 ? F'^120 and the second area of the interface i The mm position is the first area of the upper surface at .124, 幵> into the cutting path eg, the depth of the cut is 1260749 娜] the thickness of the sealant 124. Then, the edge of the Tauman substrate 120 is removed, 1. The exit ceramic substrate The identification point of the upper surface of 120 obtains the effect of = as shown in the seventh figure. The subsequent step--the preferred implementation of the taste is also the silk - the better real money type _. Line 122, not the above-mentioned invention In accordance with the requirements of the invention patent, the patent application is filed according to law. The above description of the person in charge of the above is only the preferred embodiment of the present invention, and all the equivalent modifications or changes made in the spirit of the invention in the spirit of the present invention are as follows. Please refer to the patent scope.

BRIEF DESCRIPTION OF THE DRAWINGS = Figure 1 is a front view of a ceramic substrate of the present invention. The first death diagram is the A-Α cross-sectional view of the first figure. The ceramic plate breaking method is on the four sides of the surface of the ceramic recording board. ^ The picture is based on the front of the shouting method of the substrate, after shouting the inside of the tape. The fourth part of the sixth picture is the C-C cross-sectional view of the fifth figure. The fiber breaking method removes the surface of the ceramic plate. The eighth figure is the cross-sectional view of the D to d of the seventh figure. Only shouting the money, filling the surface on the (four) button. Tenth--the cross-sectional view of the four-side cutting and sealing of the board surface encapsulant according to the invention. The twelfth figure is a front view of a conventional ceramic substrate. Figure 13 is a cross-sectional view of the twelfth Figure 2E-E. 1260749 The fourteenth section is a cross-sectional view of a ceramic substrate breaking method according to the prior art, after potting on a ceramic substrate. The fifteenth drawing is a cross-sectional view of a ceramic substrate cutting method using a cutting tool to cut a ceramic substrate and a sealing material. [Description of main component symbols] Ceramic substrate 100, 120, 130 Circuit unit 102, 132 Identification point 104, 134 Split line 106, 122 Tape 108 Sealing 110, 124, 136 Cutting path 112, 126 Cutting tool 138

Claims (1)

1260749 X. Patent application scope: 1. Two kinds of ceramic plates having an upper surface and a surface of τ, the upper surface comprising a second region adjacent to the edge, the first region and the central portion, wherein the first region is distributed The plurality of cleavage lines are formed on the lower surface of the plurality of identification points, the cleavage lines are corresponding to the upper and lower sides of the identification, and the second area of the upper surface of the ceramic fiber is covered with the ceramic substrate, wherein the second substrate: the ceramic fiber 'Where is the secluded 1^ and the range! The ceramic board according to the item, wherein the compounding degree is greater than or equal to 1/5 of the thickness of the substrate. Η % 断 7 ' The porch panel includes an upper surface and a lower surface, the first region of the inner edge portion of the domain m and the second region of the central portion are cracked === discriminate the number of split lines, the following steps: <bit f Corresponding to the upper and lower, the breaking method includes: ja) shuffling the second area on the upper surface of the substrate; W cutting the seal according to the surface contact position on the ceramic substrate; 7 士. From the = rupture line on the lower surface of the substrate, the substrate is separated from the fiber, and the fiber is divided into four parts. (4) The substrate breaking method, wherein step U) ^1) Adhesive tape on the first surface of the upper surface; (a2) potting on the surface of the ceramic substrate; 10 1260749 (a3) Remove the tape. ^ Shen, the depth of the sealing seal in the ceramic board breaking according to item 6 of the patent scope is greater than or equal to the thickness of the sealant. ~ The middle step (7) 〇 如 apply the depth of the ceramic board as described in item 6 of the paste range is greater than or equal to 1/5 ceramic substrate thickness. - Medium splitting line 1 package = Please refer to the ceramic line described in the patent 6 item _ method, shooting step ceramic (all) on the surface of the ceramic substrate potting; =), the first area of the substrate and the second area at the junction cutting seal胶. The method for dividing the pottery substrate according to the item, wherein the depth of the sealing seal in the bovine step is greater than or equal to the thickness of the sealant. On the upper side, the upper surface and the lower surface, the first area of the second part of the domain and the second part of the central part, the Nell complex identification point, and the second area is distributed with plural兀 'the plural number _ corresponds to the gap position of each circuit unit, there are a plurality of split lines, the split line corresponds to the position of the identification point - the upper and lower parts, the breaking method includes the following steps · (=) in Tao Tape on the surface of the board surface; () potting on the surface of the ceramic substrate; (c) removing the tape; / cutting the sealant according to the position on the upper surface of the substrate; μα The ceramic substrate breaking method, wherein the depth of the step 15 glue is greater than or equal to the thickness of the sealant. (4) The method for dividing the ceramics and the substrate as described in Item 13 of the above, wherein the ice of the split line is greater than or equal to 1/5