TWI260084B - Method and fixture of detection for ink marking - Google Patents

Method and fixture of detection for ink marking Download PDF

Info

Publication number
TWI260084B
TWI260084B TW94110438A TW94110438A TWI260084B TW I260084 B TWI260084 B TW I260084B TW 94110438 A TW94110438 A TW 94110438A TW 94110438 A TW94110438 A TW 94110438A TW I260084 B TWI260084 B TW I260084B
Authority
TW
Taiwan
Prior art keywords
ink
printing
base
package
fixing member
Prior art date
Application number
TW94110438A
Other languages
Chinese (zh)
Other versions
TW200636967A (en
Inventor
Hung-Ching Hung
Wayni Tsai
Mao-Chuan Cheng
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94110438A priority Critical patent/TWI260084B/en
Application granted granted Critical
Publication of TWI260084B publication Critical patent/TWI260084B/en
Publication of TW200636967A publication Critical patent/TW200636967A/en

Links

Abstract

Method and fixture of detection for ink marking are provided. The fixture includes a base plate and a top cover covered on the base plate so that package devices to be marked already can be fixed between the base plate and the top cover, and the ink onto the package devices are exposed in an opening of the top cover. In addition, an adhesive tape is used to stick on the surface of the ink and then torn off to detect the adhesive force of the ink on the mark surface. As a result, the reliability of ink marking can be detected according to the test.

Description

1260084 16091twf.doc/g 九、發明說明: 【發明所屬之技術領域] 本發明是有關於-種檢測治具,且特別是有關於一種 油墨打印的檢測治具。 【先前技術】1260084 16091twf.doc/g IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a test fixture, and more particularly to a test fixture for ink printing. [Prior Art]

-般而言’半導體元件的封測流程包括將多數個切割 成型的晶片配置於—載板上,再施以打線—“ο—) 或覆晶接合(flip chip bonding)的步驟,以電性連接 及其對叙祕触。接著,將賴好·態雜由膠道 播入模具(mGld) +,娜體固化之後,開模取出封裝完 成之成品。最後’再施以切單成型(f〇rming)、油墨打印 (marking)或植球(planting)等步驟,即完成 件的生產作業。 m打印的生產作錢在半導體元件的膠體表 注明商品的規格及製造商的商標。而良好的印字也是 商^品質的—部份’因此在油墨打印的過程中,若因印字 ^:或字跡_而遭到退貨飾印字的情況,應力求改 更需對油 ^、、由^1使印字清晰且不易脫落,除了打印表面的清 =土、料用、印字的方式要特別注意之外, 1於打印表面上_著力進行可#度測試。 【發明内容】 且,的目的就是在提供—種油墨打印的檢測治 ^用以檢測油墨於打印表面上的附著力。 毛月的另一目的是提供一種油墨打印的檢測方 1260084 16091twfdoc/g 法,用以檢測油墨於打印表面上的附著力。 本电明提出一種油墨打印的檢測治具’其適用於盥一 膠帶檢測-封裝純之—油墨之崎力,該檢測治具包括 、底座以及至7固疋元件。該底座具有多數個凹槽,用 以放置打印&amp;成之封裝元件,其中每—封裝元件具有一打 印表面m域於該打印表社。此外,固定元件配 置於縫上,肋固定每—縣元件,麵露其打印表面。 士發明的較佳實施例所述,固定元件例如藉由至 &gt;'一鎖固件而固定於該底座上。 务明的較佳實施例所述,檢測 鏈,其分別樞接於底座與固定元件之間。 枯奴 、首,發!,佳實施例所述,檢測治具更包括二滑 ^ 0 &quot;^彳可稭由該二滑道之相互滑動而覆蓋於底座 板,:較佳實施例所述,固定元件例如為一 ΐ面開口’其對應顯露每-封裝元件之打: 表面。此外,開口斜虛細命Α 丁心打印 央區域或兩側區域其^之二㈤裝單70之打印表面的中 本發明提出—種油墨 驟:首先,提供—治具,包括下列步 多數個凹槽。接荽# Μ χ/σ7、匕括—底座,該底座且有 些凹槽中,上系=印^之多數個封裝元件= 後’固定這些封襄元件表面上。之 打印表面。錢,將—㈣㈣植件之 再將該膠帶撕 1260084 16091twf.d〇c/g 下,以檢測油墨於打印表面上的附著力。 糾,二本土明的較佳實施例所述,此檢測方法還包括担 供一固定元件,用以固定放置於底座上之每^^ 底座上。 错由至個件或—鉸鏈而固定於 依照本發_較佳實施例所述,固定 滑=相互滑動而覆蓋於底座上 該蓋板具有-開口’其對應顯露每-封裝4 本發日採訂述油墨打印的檢測治具及方法 數個封裝元件,以取代f知手動檢測封裝元件^ 工*此’除了能快速檢測油墨打印的可靠度之外,承 易於操作’且不易傷害或簡打印好的封裝元件。 為讓本發明之上述和其他目的、特徵和優點能更明顯 明如下y文特舉較佳實施例,並配合所附圖式,作詳細說 【實施方式】 打如=〜圖5分別緣示本發明一較佳實施例之一種油墨 打p的核測方法的流程示意圖。請先參 :檢測治具動’其包括-底板11G以及—固定元^;=: ,板110與固定元件120的材質例如是金屬、塑膠或陶 一專。其中,底板110具有多數個凹槽112〜115,其例如 /列於底板110之長度方向上’且凹槽112〜115的尺 又照待測物的大小來設計,以使待測物能容納於每一凹槽 1260084 16091 twf.doc/g 112〜115卜例如,待測物的形狀為四方形時,凹 〜115的形狀,好也是四方形,但其他形狀的凹槽^〜 115亦可具體實施,不受外型所限制。 在本實施财,待測物例如是由晶片及其線路载板所 、·且衣而成的絲封裝元件,或由電阻、t纽/或電容 成的被動封裝元件等。如圖2所示,以絲封裝元件· 為例’其油墨(或印字)204以打印的方式附著於膠體表 面202上,通常是在封裝元件2〇〇的上表面,以方便辨識 其規格。接著,將這些封裝元件依序放置於底板ΐι〇 之每一個凹槽112〜115中,且封裝元件2〇〇之打印表面 2〇2朝上配置,以顯露出打印完成的油墨2〇4。 —接著,請參考圖3,將固定元件12〇配置於底板UQ 與每一個封裝元件200上,而固定元件no例如是一蓋板, 而盍板具有一長條狀的開口 122,其對應顯露位於凹槽112 〜U5中的封裝元件200。此外,固定元件12〇例如藉由多 個鎖固件124而固定在底板110上,以壓合每一封裝元件 200於固疋元件12〇與底板no之間。在本實施例中,固 足元件120可施壓於每一封裝元件2〇〇的上方未打印的表 面上’並顯露出位於中央區域的油墨204。當然,封裝元 件200的油墨204不位於中央區域而是位於兩侧區域其中 之一時,固定元件120的開口位置亦可隨之改變,且固定 元件120的開口形狀不限定為長條狀或數量僅有一個,亦 可隨情況不同加以調整。 最後’請參考圖4,先將一膠帶130沿著固定元件12〇 8 1260084 16091twf.doc/g 之開口 122貼合至每一封裝元件2〇〇的油墨2〇4上,再將 膠帶130撕下如圖5所示,以檢測油墨(或印字)2⑽是 否能保持清晰且不會黏著於膠帶13〇上,或是印字黏著於 膠帶130上而破壞了油墨的清晰度。目此,藉由此種方式 來檢測油墨204於打印表面202上的黏著力’即可快速完 成多個封裝元件200的品質檢測,作為油墨2〇4打印可^ 度^參考依據。同時,利用上述的檢測治具1〇〇,不僅操 φ 作容易,且不易傷害或割傷打印好的封裝元件200。 在本實施例中,膠帶130的材質選用不限定其種類為 何’只要有適當的黏度值即可,或是以常用的測試膠帶130 進行檢測以提高公正性。 圖6〜圖8分別繪示本發明較佳實施例之三種檢測治 具的結構不意圖。請參考圖6,在组裝上,底板⑽與固 定元件120之間除了藉由多個鎖固件124固定之外,亦可 藉由一鉸鏈150樞接於底板11〇與固定元件12〇之間,以 方便·元件12G進行掀開或閉合的動作,而當固定元件 • 12G閉合時’則可扣合於底板11G上,使用上非常容易。 此外、’請參考圖7,底板110與固定元件uo之間亦可藉 由二滑道152、154的相互滑動而開啟或關閉,此二滑道 152、154分別配置於底板11〇與上蓋12〇的側緣,例如是 一上滑道152與-下滑道154之組合,以使底板ιι〇與固 定元件120相互卡合而固定,使用上非常容易。 另外,請參考圖8,固定元件22〇除了蓋板之設計外’ 還可以是多個獨立的扣件,其分別固定於底板21〇上,並 1260084 16091twf.doc/g 元件2〇0之邊緣或角落區域。因此,不* »又。十上述”有開口 122之蓋板,即 不而 些固定元件220最好以不傷 了當然,這 或配t適當的軟性材質達到應力、之材質為主, 系示上所述,本發明接φ _级 法’其包括-底板二及—固;元:墨:印的檢測治具及方 裝元件於底板與固定元件之間,且二=印:子的封 上。此外,利用膠帶貼合於油 /…土、於打印表面 以檢測油墨於打印表面A 1 X上’再撕下膠帶’ 的參考依據。此外作為油墨打印可靠度 檢測而傷害或割傷打印好的治具,可避免因手動 質。 ]丨㈣封I几件,進而提高封測的品 限定ίίί發明已崎佳實關揭露如上,然其並非用以 和範圍^此技藝者’在不麟本發明之精神 範圍术、w田了作二5午之更動與潤飾’因此本發明之保護 之中請專利範圍所界定者為準。 【圖式簡單說明】 圖1〜圖5分別繪示本發明一較佳實施例之一種油 打印的檢财邮流綠㈣。 具的結構示^t別繪不本發明較佳實施例之二種檢測治 【主要元件符號說明】 100 :檢測治具 11〇 :底板 1260084 16091twf.doc/g 112〜115 :凹槽 120 :固定元件 122 :開口 124 :鎖固件 130 :膠帶 150 :鉸鏈 152、154 :二滑道 200 :封裝元件 202 :打印表面 204 :油墨(或印字) 210 :底板 220 :固定元件Generally speaking, the process of encapsulating a semiconductor device includes the steps of disposing a plurality of die-cut wafers on a carrier, and applying a wire-------------- The connection and the pair of secrets are touched. Then, the Lai is mixed into the mold (mGld) + by the rubber channel, and after the body is solidified, the finished product is taken out by the mold opening. Finally, the singulation is performed again. 〇 rming), ink printing (planting), etc., that is, the production of finished parts. The production of m prints is indicated on the gel sheet of the semiconductor component and the manufacturer's trademark. The printing is also the quality of the quotient-partial part. Therefore, in the process of printing the ink, if the printed embossed word is returned due to the printing of the ^: or the writing _, the stress needs to be changed to the oil ^, and by ^1 Printing is clear and not easy to fall off, in addition to the printing surface of the clear = soil, materials, printing methods to pay special attention to, 1 on the printing surface _ focus on the # degree test. [Summary] and the purpose is to provide - Detection and treatment of ink printing ^ To detect the adhesion of the ink on the printing surface. Another purpose of Maoyue is to provide an ink printing detection method 1260084 16091twfdoc/g method for detecting the adhesion of the ink on the printing surface. The test fixture 'is suitable for the first tape test - the package is pure - the ink of the ink, the test fixture includes, the base and the 7-solid element. The base has a plurality of grooves for placing the print &amp; The package component, wherein each package component has a printing surface m field in the printing table. In addition, the fixing component is disposed on the slit, and the rib is fixed to each of the county components to expose the printing surface. For example, the fixing member is fixed to the base by, for example, a locking fastener. As described in the preferred embodiment, the detecting chain is pivotally connected between the base and the fixing member, respectively. , the first, the hair!, the preferred embodiment, the detection fixture further includes two sliding doors, and the two sliding channels cover each other to cover the base plate, as described in the preferred embodiment, fixed Component example For the opening of a facet, it corresponds to the surface of each of the packaged components: the surface of the printed surface of the printed circuit is printed on the surface of the central portion or the two sides of the printed circuit. Proposed - a kind of ink: First, provide the jig, including the following steps, most of the grooves. 荽 Μ Μ σ / σ7, 匕 — - base, the base and some grooves, the upper system = the majority of the printed ^ Package components = after 'fixing the surface of these seal components. Print surface. Money, will - (4) (4) implant the tape and tear the tape under 1260084 16091twf.d〇c / g to detect the adhesion of the ink on the printed surface According to a preferred embodiment of the method, the detection method further includes supporting a fixing component for fixing each of the bases placed on the base. The fault is fixed to a piece or hinge, and is fixed in accordance with the present invention. The fixed slip=sliding on each other covers the base. The cover has an opening-corresponding to the exposed each-package 4 Describe the inspection fixtures and methods of ink printing, and replace the package components to replace the manual inspection package components. In addition to the ability to quickly detect the reliability of ink printing, it is easy to operate and is not easy to damage or print. Good package components. The above and other objects, features, and advantages of the present invention will become more apparent from the description of the preferred embodiments of the invention. A schematic flow chart of a method for verifying ink p by a preferred embodiment of the present invention. Please refer to the following: test fixtures, which include - bottom plate 11G and - fixed element ^; =:, the material of the plate 110 and the fixing member 120 is, for example, metal, plastic or ceramic. The bottom plate 110 has a plurality of grooves 112 to 115, which are, for example, arranged in the length direction of the bottom plate 110 and the dimensions of the grooves 112 to 115 are designed according to the size of the object to be tested, so that the object to be tested can be accommodated. For each groove 1260084 16091 twf.doc/g 112~115, for example, when the shape of the object to be tested is square, the shape of the concave ~ 115 is preferably square, but the grooves of other shapes can also be The specific implementation is not limited by the appearance. In the present embodiment, the object to be tested is, for example, a wire package component made of a wafer and its wiring carrier, or a passive package component made of a resistor, a t-pole, or a capacitor. As shown in Fig. 2, the ink package (e.g., ink) 204 is attached to the gel surface 202 in a printed manner, usually on the upper surface of the package member 2'', to facilitate identification of the specifications. Then, the package components are sequentially placed in each of the recesses 112 to 115 of the bottom plate , 〇 , and the printing surface 2 〇 2 of the package component 2 is disposed upward to expose the printed ink 2 〇 4 . - Next, referring to FIG. 3, the fixing member 12 is disposed on the bottom plate UQ and each of the package members 200, and the fixing member no is, for example, a cover plate, and the seesaw has an elongated opening 122, which is correspondingly exposed. The package component 200 is located in the recesses 112 to U5. Further, the fixing member 12 is fixed to the base plate 110 by, for example, a plurality of fasteners 124 to press each of the package members 200 between the solid member 12 and the bottom plate no. In this embodiment, the securing member 120 can be pressed against the unprinted surface above each of the package members 2' and expose the ink 204 in the central region. Of course, when the ink 204 of the package component 200 is not located in the central area but in one of the two side regions, the opening position of the fixing component 120 may also change, and the opening shape of the fixing component 120 is not limited to a long strip or a quantity. There is one, and it can be adjusted depending on the situation. Finally, please refer to FIG. 4, first attaching a tape 130 along the opening 122 of the fixing member 12〇8 1260084 16091twf.doc/g to the ink 2〇4 of each package component 2,, and then tearing the tape 130 As shown in Fig. 5, it is determined whether the ink (or printing) 2 (10) can be kept clear and does not adhere to the tape 13 or the printing adheres to the tape 130 to break the clarity of the ink. Therefore, by detecting the adhesive force of the ink 204 on the printing surface 202 in this manner, the quality detection of the plurality of package components 200 can be quickly performed, and the ink can be printed as a reference for the ink. At the same time, by using the above-described detecting jig 1 〇〇, it is easy to operate φ, and it is not easy to damage or cut the printed package component 200. In the present embodiment, the material of the tape 130 is not limited to the type thereof, as long as the viscosity value is appropriate, or the test tape 130 is used to improve the fairness. 6 to 8 are schematic views showing the structure of three types of detecting tools in accordance with a preferred embodiment of the present invention. Referring to FIG. 6 , in addition to being fixed by the plurality of fasteners 124 , the bottom plate ( 10 ) and the fixing component 120 can be pivotally connected between the bottom plate 11 〇 and the fixing component 12 藉 by a hinge 150 . In order to facilitate the opening/closing action of the component 12G, and when the fixing component 12G is closed, it can be fastened to the bottom plate 11G, which is very easy to use. In addition, please refer to FIG. 7 , the bottom plate 110 and the fixing element uo can also be opened or closed by sliding the two slides 152 , 154 . The two slides 152 and 154 are respectively disposed on the bottom plate 11 上 and the upper cover 12 . The side edge of the crucible is, for example, a combination of an upper slide 152 and a glide path 154, so that the bottom plate ι and the fixing member 120 are engaged with each other and fixed, which is very easy to use. In addition, referring to FIG. 8, the fixing member 22 can be a plurality of independent fasteners, which are respectively fixed on the bottom plate 21〇, and 1260084 16091twf.doc/g, the edge of the component 2〇0, except for the design of the cover plate. Or a corner area. Therefore, not * » again. The above-mentioned "the cover plate having the opening 122", that is, the fixing member 220 is preferably not damaged, of course, or the material of the appropriate soft material is stressed, and the material is mainly described. φ _ level method 'includes - bottom plate two and - solid; yuan: ink: printed test fixture and square components between the bottom plate and the fixed component, and two = printed: sub-sealed. In addition, tape Combined with oil/... soil, on the printing surface to detect the ink on the printing surface A 1 X 're-tape the tape' reference basis. In addition, as the ink printing reliability detection damage or cut the printed fixture, can avoid Because of the quality of the manual.] 丨 (four) seal I several pieces, and then improve the product definition of the seal ί ί 发明 已 佳 佳 佳 佳 揭 揭 如上 , , , , , , , , , , , , , , , , , , , , , , , , , , , , ^ ^ </ br> </ br> </ br> </ br> </ br> </ br> </ br> </ br> One kind of oil printing checkout mail flow green (four). Two kinds of detection and treatment according to the preferred embodiment of the present invention [Description of main component symbols] 100: Inspection fixture 11: bottom plate 1260084 16091twf.doc/g 112~115: groove 120: fixing element 122: opening 124: lock Firmware 130: Tape 150: Hinge 152, 154: Two slides 200: Package component 202: Printed surface 204: Ink (or printing) 210: Backplane 220: Fixed component

1111

Claims (1)

1260084 16091twf.doc/g 十、申請專利範圍: 1.一種油墨打印的檢測治具,其適用於 一封裝元件之—油墨之附著力,該檢測治具包括^測 底座〃有夕數個凹槽,每一凹 成之該封裝元件’其中每—該封裝 該油墨形成於該打印表面上;以及 p表面, 些封ΐί件口 =該;:=底座上’ _定每-該 專利f圍第1項所述之油墨打印的_、# /、專至少—_件而固定於該底座上。 具 滑動而覆蓋於該底座上。 才互 其對應顯露每-該些封裝元該具有一開口, 且二t;=i請第5項所述之油墨打印的檢测治 中央區域°。”愧捕母—該些封料元之打印表面的 且,圍第5項所述之油墨打印的檢测治 兩側區域其^之—露每一該些封裝單元之打印表面的 12 1260084 16091 twf.doc/g 8·如申請專利範圍第5項所 具,其中該開口對應顯露每一該測治 9.如申請專利朗第 早就H墨。 具,其中該底座的材質為金屬:叹沾墨打印的檢測治 ^其中忒固疋7L件的材質為金屬。1260084 16091twf.doc/g X. Application Patent Range: 1. A printing fixture for ink printing, which is suitable for the adhesion of ink to a packaged component, the inspection fixture includes a plurality of grooves of the base , each recessed package element 'in each of the package, the ink is formed on the printing surface; and p surface, some seals 件 mouth = the;; = pedestal _ _ every patent - the patent The _, # /, and at least the _ printed ink of the item 1 is fixed on the base. Covered on the base with a sliding cover. Correspondingly, each of the corresponding package elements has an opening, and two t;=i, the ink printing detection central area ° described in item 5.愧 愧 母 — 该 该 — — — — — — 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该Twf.doc/g 8· As set forth in item 5 of the patent application, wherein the opening corresponds to revealing each of the measures. 9. If the patent application is long, H ink is used. The material of the base is metal: sigh Ink-printing inspection and treatment ^ Among them, the material of the 7L piece is made of metal. 重打㈣檢測方法,包括下列步驟: 凹槽;’、/σ’、具包括—底座,該底座具有多數個 且一 、、由黑if打,狀多數個封裝元件於該些凹槽中’ / ^係位於母一該些封裝元件之打印表面上; =以些封裝疋件於該底座上,且顯露&amp;每—該些封 展70件之打印表面;以及 ,以檢測 ^將一膠帶黏著於該油墨上,再將該膠帶撕下 该油墨於打印表面上的附著力。 法, 每一 如申請專魏圍第n項所述之油騎印的檢測方 逖包括提供一固定元件,用以固定放置於該底座上之 該些封裝元件。 一 1,申請專利範圍$ 12項所狀油墨打印的檢測方 忒’/、中該固定元件藉由至少一鎖固件而固定於該底座上。 如申請專利範圍第12項所述之油墨打印的檢測方 /,其中該固定元件藉由一鉸鏈樞接於該底座上。 、、I5·如申請專利範圍第12項所述之油墨打印的檢測方 法,其中該固定元件藉由二滑道之相互滑動而覆蓋於該底 13 1260084 16091twf.doc/g 座上。 16. 如申請專利範圍第12項所述之油墨打印的檢測方 法,其中該固定元件係為一蓋板,且該蓋板具有一開口, 其對應顯露每一該些封裝元件之該打印表面。 17. 如申請專利範圍第16項所述之油墨打印的檢測方 法,其中該開口對應顯露每一該些封裝單元之該油墨。The method of replaying (four) detection includes the following steps: a groove; ', /σ', including a base, the base having a plurality of ones, and a black if, a plurality of package components in the grooves / ^ is located on the printing surface of the mother-packed components; = on some of the package components on the base, and exposes each of the 70 printed surfaces; and, to detect a tape Adhesive to the ink and the tape is torn off the adhesion of the ink to the printing surface. The method of detecting an oil seal as described in item n of the Wei Weiwei includes providing a fixing member for fixing the package components placed on the base. A patent application for the printing of ink in the range of $12 is 忒'/, wherein the fixing member is fixed to the base by at least one fastener. The detecting unit of the ink printing described in claim 12, wherein the fixing member is pivotally connected to the base by a hinge. The method of detecting ink printing according to claim 12, wherein the fixing member covers the base 13 1260084 16091 twf.doc/g by sliding the two slides to each other. 16. The method of detecting ink printing according to claim 12, wherein the fixing member is a cover, and the cover has an opening corresponding to the printing surface of each of the package members. 17. The method of detecting ink printing according to claim 16, wherein the opening corresponds to exposing the ink of each of the packaging units.
TW94110438A 2005-04-01 2005-04-01 Method and fixture of detection for ink marking TWI260084B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94110438A TWI260084B (en) 2005-04-01 2005-04-01 Method and fixture of detection for ink marking

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94110438A TWI260084B (en) 2005-04-01 2005-04-01 Method and fixture of detection for ink marking

Publications (2)

Publication Number Publication Date
TWI260084B true TWI260084B (en) 2006-08-11
TW200636967A TW200636967A (en) 2006-10-16

Family

ID=37872626

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94110438A TWI260084B (en) 2005-04-01 2005-04-01 Method and fixture of detection for ink marking

Country Status (1)

Country Link
TW (1) TWI260084B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111426628A (en) * 2020-03-23 2020-07-17 Oppo广东移动通信有限公司 Method for testing adhesive force of printing ink

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI585933B (en) * 2015-07-29 2017-06-01 日月光半導體製造股份有限公司 Method and apparatus for ink marking

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111426628A (en) * 2020-03-23 2020-07-17 Oppo广东移动通信有限公司 Method for testing adhesive force of printing ink

Also Published As

Publication number Publication date
TW200636967A (en) 2006-10-16

Similar Documents

Publication Publication Date Title
DE102012208361B4 (en) Pressure measuring device and method for producing the same
EP2937897A3 (en) Device package and methods for the fabrication and testing thereof
WO2004111659A3 (en) Methods and apparatus for packaging integrated circuit devices
KR960704236A (en) REUSABLE DIE CARRIER FOR BURN-IN AND BURN-IN PROCESS
EP1484791A4 (en) Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film
TWI260084B (en) Method and fixture of detection for ink marking
WO2005065258A3 (en) Active wafer probe
TW493255B (en) Method for marking semiconductors
DK1237793T3 (en) Closing device for a test bag
JP2005535103A5 (en)
KR101032980B1 (en) Semiconductor testing socket
TW412584B (en) Cover tape for chip transportation and sealed structure
JP2003527609A (en) Integrated circuit test socket lid assembly
WO2006002334A3 (en) Intelligent probe chips/heads
TW200826221A (en) Chip scale package tray
TW201043966A (en) Probe card for testing film package
JP3610887B2 (en) Wafer level semiconductor device manufacturing method and semiconductor device
CN209365680U (en) One kind is affixed one&#39;s seal locating clip
TWI334028B (en) Test apparatus for chip strength
US20120109009A1 (en) Oral testing devices and methods
TWI253705B (en) Common change kit in test dandler for BGA packages
WO2005034178A3 (en) A low profile carrier for non-wafer form device testing
CN208289735U (en) Tweezers
JP3193806U7 (en)
JP2001035970A5 (en)