TWI256148B - Process for the production of an optoelectronic semiconductor component and component produced in this way - Google Patents

Process for the production of an optoelectronic semiconductor component and component produced in this way

Info

Publication number
TWI256148B
TWI256148B TW91133358A TW91133358A TWI256148B TW I256148 B TWI256148 B TW I256148B TW 91133358 A TW91133358 A TW 91133358A TW 91133358 A TW91133358 A TW 91133358A TW I256148 B TWI256148 B TW I256148B
Authority
TW
Taiwan
Prior art keywords
bores
component
production
way
optoelectronic semiconductor
Prior art date
Application number
TW91133358A
Other languages
English (en)
Other versions
TW200301020A (en
Inventor
Bert Braune
Manfred Deisenhofer
Ekkehard Messner
Original Assignee
Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh filed Critical Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh
Publication of TW200301020A publication Critical patent/TW200301020A/zh
Application granted granted Critical
Publication of TWI256148B publication Critical patent/TWI256148B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW91133358A 2001-12-05 2002-11-14 Process for the production of an optoelectronic semiconductor component and component produced in this way TWI256148B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2001159544 DE10159544A1 (de) 2001-12-05 2001-12-05 Verfahren zur Herstellung eines optoelektronischen Halbleiter-Bauelementes und damit hergestelltes Bauelement

Publications (2)

Publication Number Publication Date
TW200301020A TW200301020A (en) 2003-06-16
TWI256148B true TWI256148B (en) 2006-06-01

Family

ID=7708006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91133358A TWI256148B (en) 2001-12-05 2002-11-14 Process for the production of an optoelectronic semiconductor component and component produced in this way

Country Status (3)

Country Link
EP (1) EP1318549A3 (zh)
DE (1) DE10159544A1 (zh)
TW (1) TWI256148B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013112723B4 (de) * 2012-11-27 2018-01-18 Hung-Wen Chang Duale Stecknuß für Kombischraubenschlüssel

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10317596A1 (de) 2003-04-16 2004-11-11 Epcos Ag Verfahren zur Erzeugung von Lotkugeln auf einem elektrischen Bauelement
DE102004057804B4 (de) * 2004-11-30 2010-04-08 Osram Opto Semiconductors Gmbh Gehäusekörper für einen Halbleiterchip aus gegossener Keramik mit reflektierender Wirkung und Verfahren zu dessen Herstellung
DE102005012398B4 (de) * 2004-11-30 2011-02-03 Osram Opto Semiconductors Gmbh Optischer Reflektor und Verfahren zu dessen Herstellung
TW201041193A (en) * 2009-05-07 2010-11-16 Anteya Technology Corp LED supporting frame structure
DE102010028776A1 (de) 2010-05-07 2011-11-10 Osram Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement
DE102010038554A1 (de) 2010-07-28 2012-02-02 Osram Ag Optoelektronisches Halbleiterbauelement und zugehöriges Herstellverfahren
DE102012210083A1 (de) 2012-06-15 2013-12-19 Osram Gmbh Optoelektronisches halbleiterbauelement
DE102013203664A1 (de) * 2013-03-04 2014-09-04 Osram Gmbh Substrat für Leuchtvorrichtung mit Keramikbereich

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3715636A (en) * 1972-01-03 1973-02-06 Gen Electric Silicon carbide lamp mounted on a ceramic of poor thermal conductivity
US3860847A (en) * 1973-04-17 1975-01-14 Los Angeles Miniature Products Hermetically sealed solid state lamp
DE3128187A1 (de) * 1981-07-16 1983-02-03 Joachim 8068 Pfaffenhofen Sieg Opto-elektronisches bauelement
JPS5866371A (ja) * 1981-10-15 1983-04-20 Toshiba Corp 発光ダイオ−ド
JPS6191976A (ja) * 1984-10-12 1986-05-10 Hakuyo Denkyu Kk 発光ダイオ−ドチップを用いた全周囲発光体
JPS61207085A (ja) * 1985-03-11 1986-09-13 Toshiba Corp 光半導体装置
DE3732075A1 (de) * 1987-09-23 1989-04-06 Siemens Ag Hermetisch dichtes glas-metallgehaeuse fuer halbleiterbauelemente und verfahren zu dessen herstellung
JPH04133480A (ja) * 1990-09-26 1992-05-07 Nec Corp 光半導体装置用ステム
DE4141980A1 (de) * 1991-12-19 1993-07-01 Sel Alcatel Ag Leuchtdiode mit einer umhuellung
JP3832877B2 (ja) * 1995-07-26 2006-10-11 日亜化学工業株式会社 セラミックスｌｅｄパッケージおよびその製造方法
JP3436009B2 (ja) * 1996-07-31 2003-08-11 住友電気工業株式会社 光半導体素子
CA2240776C (en) * 1997-07-18 2006-01-10 Image Guided Technologies, Inc. Improved optical tracking system
JP2001156338A (ja) * 1999-11-24 2001-06-08 Koha Co Ltd 可視光線発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013112723B4 (de) * 2012-11-27 2018-01-18 Hung-Wen Chang Duale Stecknuß für Kombischraubenschlüssel

Also Published As

Publication number Publication date
EP1318549A2 (de) 2003-06-11
DE10159544A1 (de) 2003-06-26
TW200301020A (en) 2003-06-16
EP1318549A3 (de) 2009-04-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees