TWI256133B - Solid imaging device and method for manufacturing the same - Google Patents
Solid imaging device and method for manufacturing the sameInfo
- Publication number
- TWI256133B TWI256133B TW094105180A TW94105180A TWI256133B TW I256133 B TWI256133 B TW I256133B TW 094105180 A TW094105180 A TW 094105180A TW 94105180 A TW94105180 A TW 94105180A TW I256133 B TWI256133 B TW I256133B
- Authority
- TW
- Taiwan
- Prior art keywords
- imaging device
- solid imaging
- semiconductor substrate
- light
- light receiving
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title abstract 3
- 239000007787 solid Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 238000009416 shuttering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
- H01L27/14812—Special geometry or disposition of pixel-elements, address lines or gate-electrodes
- H01L27/14818—Optical shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14831—Area CCD imagers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004048254 | 2004-02-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200529420A TW200529420A (en) | 2005-09-01 |
| TWI256133B true TWI256133B (en) | 2006-06-01 |
Family
ID=34858204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094105180A TWI256133B (en) | 2004-02-24 | 2005-02-22 | Solid imaging device and method for manufacturing the same |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7244978B2 (zh) |
| CN (1) | CN1661806A (zh) |
| TW (1) | TWI256133B (zh) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4583115B2 (ja) * | 2004-09-08 | 2010-11-17 | 三洋電機株式会社 | 固体撮像素子 |
| US7598581B2 (en) | 2005-09-12 | 2009-10-06 | Crosstek Capital, LLC | Image sensor with decreased optical interference between adjacent pixels |
| JP2007220832A (ja) * | 2006-02-15 | 2007-08-30 | Matsushita Electric Ind Co Ltd | 固体撮像装置及びカメラ |
| US20070238035A1 (en) * | 2006-04-07 | 2007-10-11 | Micron Technology, Inc. | Method and apparatus defining a color filter array for an image sensor |
| KR100793369B1 (ko) * | 2006-07-06 | 2008-01-11 | 삼성전자주식회사 | 분해능이 향상되는 이미지 센서 및 이를 이용한 이미지감지 방법 |
| KR100929349B1 (ko) * | 2007-01-30 | 2009-12-03 | 삼성전자주식회사 | 유기물 컬러 필터를 포함하지 않는 컬러 픽셀, 이미지 센서, 및 컬러 보간방법 |
| US20070164196A1 (en) * | 2007-03-09 | 2007-07-19 | Tay Hiok N | Image sensor with pixel wiring to reflect light |
| JP2010027865A (ja) * | 2008-07-18 | 2010-02-04 | Nec Electronics Corp | 固体撮像装置 |
| JP5526592B2 (ja) * | 2009-04-24 | 2014-06-18 | ソニー株式会社 | 固体撮像装置、撮像装置および固体撮像装置の駆動方法 |
| US8263922B2 (en) * | 2009-12-15 | 2012-09-11 | Himax Imaging, Inc. | Image sensor |
| JP2013070030A (ja) * | 2011-09-06 | 2013-04-18 | Sony Corp | 撮像素子、電子機器、並びに、情報処理装置 |
| JP6168331B2 (ja) * | 2012-05-23 | 2017-07-26 | ソニー株式会社 | 撮像素子、および撮像装置 |
| CN104412582B (zh) * | 2012-07-06 | 2016-04-13 | 富士胶片株式会社 | 彩色摄像元件和摄像装置 |
-
2005
- 2005-02-06 CN CN200510008105.2A patent/CN1661806A/zh active Pending
- 2005-02-22 TW TW094105180A patent/TWI256133B/zh not_active IP Right Cessation
- 2005-02-23 US US11/064,538 patent/US7244978B2/en active Active
-
2007
- 2007-05-29 US US11/754,885 patent/US7537957B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN1661806A (zh) | 2005-08-31 |
| US20050185080A1 (en) | 2005-08-25 |
| US7537957B2 (en) | 2009-05-26 |
| TW200529420A (en) | 2005-09-01 |
| US20070224723A1 (en) | 2007-09-27 |
| US7244978B2 (en) | 2007-07-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |