TWI254328B - Insulation packaging structure of small transformer and manufacturing method thereof - Google Patents

Abstract

This invention reveals an insulation packaging method of transformer. It wraps up transformer contents to generate the insulating effect. It also retains the exposed pins thereof. The packaging method comprises following procedures: firstly, it bonds contents (e.g. core, coil, etc.) and pins of a transformer with a lead wire. Further, it utilizes upper and lower molds to seal, and exposing a part of the lead wire. Finally, it fills an insulation material in a space encased by the molds. The main characteristic is that it extends a platform from the space sealed by molds to the direction of the transformer contents. The platform location is above the horizontal surface of the sealed place of two molds and is below the transformer contents. It wraps up the transformer contents, the lead wire and part of the pins with an insulation material to become an insulation layer after mold parting. Furthermore, it hollows out part of the insulated bottom surface. Moreover, it applies a layer of insulation binder with density lower than that of the insulation layer at the hollow-out place. During a surface mounting process of the transformer, it prevents from generating cracking phenomenon due to completely sealing.

Description

1254328

[Technical Field According to the Invention] In the small-sized transformer assembly of the present invention, the main constituent component of the present invention is that when the finished product is manufactured, the material must be insulatively packaged and exposed, and the package is to be discussed. technology. 'It is a kind of small-scale zero-usual use in the electronics industry, including the core, the coil and the multiple cores, the other part of the inner leg of the coil and the pin, and the connection with the external circuit refers to the insulation of the contents of the transformer. Technology] The general insulation packaging technology usually uses a mold to seal the contents, and then injects an insulating material (such as plastic or ceramic) into the space surrounded by the mold, so that the content is wrapped by a layer of insulating material. The conventional small-scale transformer and insulation packaging method is roughly 70% of the process disclosed in the first to third figures. First, a transformer (1 )) such as a core (1 1 ) is wound with a lead wire ( 12) Adhesive (welding) with a plurality of pins (丨3), positioning the pins (i 3) through the relevant fixtures, and applying a layer of shaping on the periphery of the core (丨丨) and the coil (丨〇) The glue (14) is fixed, and finally the contents are sealed by the upper and lower molds (15, 16). As shown in the second figure, only a part of the pin (丨3) (1 31) is exposed. Encapsulation. After the mold (15, 16) is molded, the insulating material is injected into the enclosed space (丨7) in the mold to the cooling release. See the third figure, the insulating material (丨8) completely wraps the inner grain. Up, only a part of the exposed pin (丨3丨) is connected to the external circuit; in addition, the pin (1 31) is convenient for connection with an external circuit', usually the exposed pin (1 31) is Tool processing makes it bend

1254328 V. Description of invention (2) —------ Discount. The transformer after molding is usually applied in the electronic diagram. The transformer (1) is soldered to a planned "such as the fourth board (19), which uses the exposed pins (131) /, circuit connection In the line SMT where the pin (131) and the circuit board (19) are connected, it must pass through a high temperature tin furnace (^ column

Solder between the board and board U9). _There is no A-connector pin (UU 2 small transformer (1) is very thin and limited in size, especially when the package layer is submerged, and the edge of the edge (SMT) is awkward. The bottom edge 'in the tin furnace is soaked and the insulation bursts, which leads to the difficulty of the difficult converter product yield. The well-known sleepy 1 makes this kind of problem, the traditional packaging process mentioned above. In the middle of the second: the contents of the transformer are placed in the center of the mold sealing space, and the content is collided and squeezed. The bean first 1 is free of the contents of the solid macro $ y , and the first must be shaped with the molding glue. Heart 81 2 determines the position of the display after 1 measurement, and the process is increased, 1罜 / 艮 艮 守 , , , , , , 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The inventor's special product is better than not only shortening the manufacturing work, but also making it possible to more positively improve the traditional transformer in the tin furnace when: y, the edge of the edge layer burst problem; this insulation package The main features of the method The largest area of the top surface of the mold, the space sealed from the mold

1254328 V. INSTRUCTIONS (3) After the mold of the mold seal in the inner transformer, the insulation is wrapped to become the hollow place where the tin furnace is not subjected to heat exchange, when it is on the platform of the package. , the contents are not subject to the main purpose of the fixing technology of the fixing edge of the fixing glue as described in the present invention and extend one below and below the pressure cooker 'this is absolutely lower than the upper mold place special for the transformer The wave acquisition platform, the transformer's contents, the bottom edge layer of the edge of the permeable, non-volatile content measurement and collision or cost significantly change the platform's content lead and the junction of most of the insulating glue, the effect, when The bursting can be directly calculated, and the extrusion will be carried out. In the meantime, the goodness of the material will be changed to the horizontal plane, and the material will become a layer of insulating layer. The density of the insulating layer is completely sealed. The detailed technical features of the generated questions and the contents of the better matching schemas are placed higher than the two 'vacant parts of the mold to be removed' and will be changed Feed temperature is in the Ge phenomenon; the same is disposed within the lower die can be determined and the transformer must be kept omitted system embodiment of the present invention, it is possible by the solution 'is hereby explained below. [Embodiment] The fifth to seventh figures mainly show that the present invention applies a method flow to the transformer, and the steps of the implementation thereof are as follows:

(1) See the fifth figure, first join the contents of the transformer, such as the center of the figure (20), the coil (21), etc. with the lead (2 2) and the plurality of pins (2 3); In the sixth figure, place the contents on the platform (3〇1) of the lower mold (3〇) and position the pins on both sides of the fixture (2 3 ); (3) See the seventh figure 'above the mold (31 ) is molded with the lower mold (3〇), and

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V. INSTRUCTIONS (4) Exposing a part (231) of the pin (23) to the outside, and injecting an insulating substance (4 〇) such as a plastic or ceramic material into the space where the mold is molded; : The mold platform (3 〇 1 ) below is extended in the largest area of the top surface of the lower mold, extending from the space (3〇2) of the mold sealing to the direction of the pressure transformation $ content, the platform (3〇 1) The position is higher than the horizontal plane of the seal of the two molds (30, 31) and lower than the contents of the transformer, so that after the mold (30, 31) is demolded, the insulating material (4〇) will be the transformer The contents (20, 21), the lead wires (22), and the pins (23) are wrapped to form an insulating layer. See the eighth and ninth views, the bottom surface of the insulating layer forms a depressed portion (401), and the transformer The bottom surface of the contents (20, 21) is exposed, and a layer of resin (4 〇 2 ) having a lower density than the insulating layer (40) is applied to the exposed surface, see the tenth figure 'Because of the resin (4 0 2 ) The density is low, and the contents of the transformer (20, 21) are higher than the distance between the pins (231) due to the formation of the recess (401). Therefore, it can produce the effect of ventilation (as indicated by the arrow), using the principle of heat exchange, so that the exposed pin (231) of the transformer (2) is soldered to the circuit board (50). In the case of the above, there is no phenomenon that the bottom of the insulating layer bursts due to high temperature shadow molding. In the above-mentioned process, since the contents of the transformer (2 〇, 2 1) can be directly placed on the platform (301) of the lower mold (30), it is possible to determine that the contents are not subjected to special measurement and calculation. It will be collided or squeezed by the upper mold (3 1) when it is molded, and the time wasted by fixing the position of the content by the fixing glue can be omitted. The problem caused by the conventional transformer insulation packaging technology is significantly improved. The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention.

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Page 9 1254328 Simple description of the diagram [Simple description of the diagram] The first to third diagrams show the manufacturing method and flow of the transformer insulation package. The fourth picture is a schematic diagram of the connection between the conventional transformer and the circuit board. The fifth to seventh figures are the manufacturing method and flow chart of the transformer insulating package of the present invention. Figure 8 is a side elevational cross-sectional view of the transformer of the present invention. The ninth drawing is a reference view of the appearance of the transformer of the present invention. The tenth figure is a schematic diagram of the connection of the transformer and the circuit board of the present invention. [Main component symbol description] (2 0) core (21) coil (22) lead (2 3 ) pin (30) lower mold (301) platform ( 30 2 ) mold sealing space (3 1 ) upper mold (4 0) Insulating material (4 0 1) recessed part (4 0 2 ) resin material (50) circuit board

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Claims (1)

1254328 1. A method for insulating and encapsulating a transformer by forming an upper and lower mold and then injecting an insulating material, the main steps of which include: ··, fruit mouth (1) the coil of the dust filter, with lead wires and plural pins (2) Put the coil of the transformer on the platform of the lower mold, and the pins on both sides; / the mouth (2) above the mold and the lower mold, and a part of the pin The outer portion is exposed, and an insulating material is injected into the space where the mold is molded; wherein the platform of the cookware is in the largest area of the top surface of the lower mold, and extends from the mold seal = the inner portion toward the coil of the transformer content, the platform The position of the sorghum is the level of the two mold seals, and is lower than the coil of the transformer, so that after the mold is released, the insulating material encapsulates the transformer coil, the lead and the pin of the pin to form an insulation. a layer, the bottom surface of the insulating layer and forming a concave portion, such that the bottom surface of the coil is exposed; @ (4) A layer of material having a lower density than the insulating layer is applied to the exposed portion of the coil. 2. An insulating package structure of a transformer, wherein an insulating layer is wrapped around a coil of the transformer, the main feature of which is that the bottom edge of the insulating layer has a recessed portion to heighten the distance between the coil and the pin, and the coil The bottom surface is exposed, and a resin material having a lower density than the insulating layer is applied to the exposed portion. Page 11