TWI250704B - Method of making an electrical connector - Google Patents

Method of making an electrical connector Download PDF

Info

Publication number
TWI250704B
TWI250704B TW093109453A TW93109453A TWI250704B TW I250704 B TWI250704 B TW I250704B TW 093109453 A TW093109453 A TW 093109453A TW 93109453 A TW93109453 A TW 93109453A TW I250704 B TWI250704 B TW I250704B
Authority
TW
Taiwan
Prior art keywords
mask
solder
electrical connector
view
connector
Prior art date
Application number
TW093109453A
Other languages
English (en)
Other versions
TW200501523A (en
Inventor
Victor Zaderej
Arindum Dutta
John E Lopata
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of TW200501523A publication Critical patent/TW200501523A/zh
Application granted granted Critical
Publication of TWI250704B publication Critical patent/TWI250704B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Description

1250704 第93109453號專利申請案說明書更正頁 95.03 利用，因為該遮罩42可以清洗以去除助熔劑；且焊料66可 以選擇性地分配至預定凹孔50中，因此如果該連接器20之 結構不需要它，則某些凹孔50就不必填充，如第17圖所示。 雖然已顯示與說明過本發明之較佳實施例，但是所屬 5 技術領域中具有通常知識者可在不偏離前述說明與以下申 請專利範圍之精神與範疇内進行各種修改。 I：圖式簡單說明】 第1圖是在本發明之方法中使用之連接器的立體圖； 第2圖是顯示在第1圖中之連接器的側視平面圖； 10 第2a圖是在本發明之方法中使用之連接器之另一實施 例之橫截面側視圖； 第3圖是在本發明之方法使用之遮罩的立體圖； 第4圖是沿線4-4所截取之第3圖所示之遮罩之部份橫 截面側視圖； 15 第5圖是在本發明之方法使用之構件的立體圖； 第6-13圖顯示實施本發明之方法，其中第6-7與10_13 圖是橫截面側視圖且其中第8與9圖是立體圖； 第14圖顯示由本發明之方法所形成之連接器，且該連 接器與一印刷電路板連接； 20 第15a-15d圖顯示以在本發明中使用且在第3-4圖所示 之遮罩的第二實施例來實施本發明之另一方法； 第16圖顯示以在本發明中使用且在第3-4圖所示之遮 罩的第二實施例之橫截面圖； 第17圖顯示具有僅選擇性地分配在該遮罩之凹孔之一 18 1250704 部份中之焊料之遮罩的橫截面圖； 第18a-18g圖是該端子之不同種類之接觸尾部的立體 圖，及 第19圖是用以實施本發明之方法之遮罩、連接器與構 件之另一實施例的立體圖。 【圖式之主要元件代表符號表】 20···連接器 54...凹部 22,22b…殼體 56. · ·孔 24…第一表面 58…隔熱構件 26...第二表面 60…第一表面 28···孔 62…第二表面 30...¾ 64...孔 32..·突起 65·.·孔 34…端部 66,66b...焊料 36,36b…端子 68···電氣連接器 37...凹孔 70…半月形凸面 38,38b…接觸尾部 Ή...凸柱 40···腿 72···組合物 41...端部 74…爐 42,42木421)...遮罩 74b…迴焊爐 44,44b...第一表面 76,76b..·焊料 46,46木4613.·.第二表面 77···散熱器 48...孔 78…印刷電路板 49...突起 80...盲孔 50,50a，50b...凹孔 82a，82b...印刷電路板層 52...側壁 84a，84b.··通道
19
TW093109453A 2003-04-07 2004-04-06 Method of making an electrical connector TWI250704B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/408,492 US20040198082A1 (en) 2003-04-07 2003-04-07 Method of making an electrical connector

Publications (2)

Publication Number Publication Date
TW200501523A TW200501523A (en) 2005-01-01
TWI250704B true TWI250704B (en) 2006-03-01

Family

ID=33097766

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093109453A TWI250704B (en) 2003-04-07 2004-04-06 Method of making an electrical connector

Country Status (4)

Country Link
US (1) US20040198082A1 (zh)
CN (2) CN101369691A (zh)
TW (1) TWI250704B (zh)
WO (1) WO2004093266A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2876243B1 (fr) * 2004-10-04 2007-01-26 Commissariat Energie Atomique Composant a protuberances conductrices ductiles enterrees et procede de connexion electrique entre ce composant et un composant muni de pointes conductrices dures
US7255601B2 (en) * 2004-12-21 2007-08-14 Fci Americas Technology, Inc. Cap for an electrical connector
US7264488B2 (en) * 2006-01-03 2007-09-04 Fci Americas Technology, Inc. Pickup cap for electrical connector
US8693203B2 (en) * 2011-01-14 2014-04-08 Harris Corporation Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
CN102509990A (zh) * 2011-10-19 2012-06-20 番禺得意精密电子工业有限公司 电连接器的成型方法
US9362699B2 (en) * 2013-09-20 2016-06-07 Tyco Electronics Corporation Ultrasonic transducers for terminal crimping devices
CN107482416A (zh) 2017-06-16 2017-12-15 得意精密电子(苏州)有限公司 电连接器的制造方法
CN108262542A (zh) * 2018-03-02 2018-07-10 安特(苏州)精密机械有限公司 漆包线用自切割焊接端子组件及其成型方法
EP4024621A1 (de) * 2021-01-01 2022-07-06 Rosenberger Hochfrequenztechnik GmbH & Co. KG Rucksack für einen steckverbinder
US11735849B2 (en) * 2021-08-12 2023-08-22 All Best Precision Technology Co., Ltd. Electrical connector manufacturing method

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244143A (en) * 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
US5211328A (en) * 1992-05-22 1993-05-18 International Business Machines Method of applying solder
US5585162A (en) * 1995-06-16 1996-12-17 Minnesota Mining And Manufacturing Company Ground plane routing
TW336371B (en) * 1995-07-13 1998-07-11 Motorola Inc Method for forming bumps on a substrate the invention relates to a method for forming bumps on a substrate
US5691041A (en) * 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
US6007348A (en) * 1996-05-07 1999-12-28 Advanced Intercommunications Corporation Solder ball terminal
US5909011A (en) * 1996-08-01 1999-06-01 International Business Machines Corporation Method and apparatus for modifying circuit having ball grid array interconnections
TW406454B (en) * 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
US6139336A (en) * 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface
US6293456B1 (en) * 1997-05-27 2001-09-25 Spheretek, Llc Methods for forming solder balls on substrates
US5984164A (en) * 1997-10-31 1999-11-16 Micron Technology, Inc. Method of using an electrically conductive elevation shaping tool
US6193143B1 (en) * 1998-08-05 2001-02-27 Matsushita Electric Industrial Co., Ltd. Solder bump forming method and mounting apparatus and mounting method of solder ball
US6214716B1 (en) * 1998-09-30 2001-04-10 Micron Technology, Inc. Semiconductor substrate-based BGA interconnection and methods of farication same
US6565364B1 (en) * 1998-12-23 2003-05-20 Mirae Corporation Wafer formed with CSP device and test socket of BGA device
US6299058B1 (en) * 1999-04-30 2001-10-09 Hon Hai Precision Ind. Co., Ltd. Positioning method for attaching a solder ball to an electrical connector and the connector using the same
JP3288654B2 (ja) * 1999-07-23 2002-06-04 ヒロセ電機株式会社 電気コネクタの製造方法
TW503546B (en) * 2000-10-13 2002-09-21 Ngk Spark Plug Co Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin
US6737750B1 (en) * 2001-12-07 2004-05-18 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
US6791845B2 (en) * 2002-09-26 2004-09-14 Fci Americas Technology, Inc. Surface mounted electrical components

Also Published As

Publication number Publication date
WO2004093266A1 (en) 2004-10-28
CN100420106C (zh) 2008-09-17
TW200501523A (en) 2005-01-01
WO2004093266B1 (en) 2005-01-13
CN101369691A (zh) 2009-02-18
US20040198082A1 (en) 2004-10-07
CN1792012A (zh) 2006-06-21

Similar Documents

Publication Publication Date Title
TW552483B (en) Printing mask having protrusions with through holes for printing solder paste on lands on printed circuit board, method of printing a solder paste, surface-mounted structural assembly and method of manufacturing the same
TWI250704B (en) Method of making an electrical connector
US6780028B1 (en) Solder reserve transfer device and process
WO2019012139A9 (fr) Carte électronique comprenant des cms brasés sur des plages de brasage enterrées
JP2007087960A (ja) フラットケーブルと配線回路体との接続部及びフラットケーブルと配線回路体との接続方法
US20060240684A1 (en) Soldering method & its applied circuit board
JP2008227272A (ja) プリント配線板および電子装置
JP2007220859A (ja) 抵抗器およびその製造方法
JP2008198814A (ja) 立ち基板の取付構造
TWM250423U (en) Electrical connector having contacts with anti-wicking means
US20070184688A1 (en) Interconnection device for a double-sided printed circuit board
DE102008002969B4 (de) Kontaktstift für Durchkontaktierungen
TW535334B (en) Manufacturing method of electrical connector
EP2688374A1 (en) Wiring substrate
JP2004128207A (ja) プリント基板
JP5961818B2 (ja) 配線基板
JPH0319241Y2 (zh)
JP2004200226A (ja) リード付き部品の実装構造およびその実装方法
WO2014118917A1 (ja) 部品内蔵基板の製造方法
JP2009200234A (ja) 金属ベース基板とその製造方法
EP1718139A3 (de) Verfahren zum Herstellen einer Leiterplatte
JP2004349413A (ja) 表面実装クランプ
JPH0383393A (ja) プリント配線板
JP2000277881A (ja) 回路基板の接続構造およびその接続方法
US7630210B2 (en) Lead(Pb)-free electronic component attachment

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees